Pouring diode junction box with novel structure
By designing the structure of exposed heat sink and inner shell in the diode junction box, the problem of low heat dissipation efficiency of high-voltage diode junction box is solved, and better heat dissipation effect and cost reduction are achieved.
Patent Information
- Application Number
- CN202421038090.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-05-13
AI Technical Summary
The heat generated by the high-voltage diode junction box when the diode is reversed is difficult to effectively dissipate heat, causing the internal temperature of the junction box to rise, which may damage the diode and junction box.
A new structure of diode junction box is designed. By installing a heat sink outside the junction box housing and installing the inner shell on the heat sink, external heat dissipation of diode heat is achieved.
The exposed heat sink guides the diode heat to the outside, significantly improving the heat dissipation effect, reducing the use of internal heat sinks, and reducing material and assembly costs.
Smart Images

Figure CN222484661U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diode junction boxes, in particular to a new structure cast diode junction box. Background Art
[0002] At present, both traditional junction boxes and smart junction boxes will generate a lot of heat when the hot spot effect of photovoltaic modules occurs and the diodes are reverse-conducted to protect the modules by bypassing. This part of the heat needs to be dissipated in time to avoid high temperature damage to the diodes, junction boxes and even the modules themselves. However, the module system voltage is usually 1000-1500V high voltage. For safety reasons, the charged conductive sheets and diodes inside the junction box need to ensure sufficient creepage distance from the outside world so that most of the diodes and conductive sheets are completely sealed inside by potting glue. Since the plastic material and potting glue used have low thermal conductivity, it is difficult to quickly conduct heat to the external environment. This problem greatly limits the development of high voltage and current junction boxes.
[0003] Although the existing junction box improves the heat dissipation efficiency of the junction box by increasing the conductive sheet and adding heat sinks, the heat generated by the diode is always trapped inside the junction box by the potting glue and the junction box body, and it is difficult to achieve a qualitative improvement in the heat dissipation efficiency. Utility Model Content
[0004] According to the above technical problems to be solved, a new structure cast diode junction box is provided.
[0005] To achieve the above-mentioned purpose, the utility model discloses a new structure cast diode junction box, including a junction box shell and a cover plate arranged on the top of the junction box shell, a diode conductive sheet and a heat sink are arranged in the junction box shell, the junction box shell includes an outer shell and an inner shell arranged in the outer shell, a first card block and a second card block protruding upward are arranged at the bottom of the outer shell, a support portion is also arranged at the bottom of the outer shell, the top of the heat sink is overlapped on the side walls of the outer shell and extends to the outside of the junction box shell, and the inner shell is overlapped on the outer shell and the heat sink.
[0006] Furthermore, a diode conductive sheet is installed on the inner shell, and the diode conductive sheet includes a first conductive sheet and a second conductive sheet. A cast diode structure as a solid area is provided in the position of the inner shell above the heat sink, and the first conductive sheet and the second conductive sheet are both connected to the diode in the cast diode structure.
[0007] Furthermore, the first conductive sheet is connected to the upper surface of the diode through a bending structure, and the second conductive sheet is connected to the lower surface of the diode.
[0008] Furthermore, the short sides of the inner shell are respectively clamped on the bottom of the first clamping block and the second clamping block, and the long sides of the inner shell are placed on the supporting part.
[0009] Furthermore, the heat sink is in a "X"-shaped structure, including a receiving section at the bottom for receiving the inner shell and an overlapping section at the top for fixing.
[0010] Furthermore, the inner shell is installed horizontally, and the bottom of the cast diode structure is in contact with the heat sink.
[0011] Furthermore, a slot is provided in the inner shell near the heat sink receiving section.
[0012] Compared with the prior art, the utility model has the following beneficial effects: the utility model discloses a new structure cast diode junction box, which leads the heat of the diode to the outside of the product through the exposed heat sink, achieves better heat dissipation, reduces the number of parts and product complexity, and reduces material costs and assembly costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0015] Figure 2 It is a structural schematic diagram of taking out the cover plate of the utility model.
[0016] Figure 3 It is a schematic diagram of the outer shell of the utility model.
[0017] Figure 4 This is a schematic diagram of the connection between the conductive sheet and the diode of the utility model.
[0018] Figure 5 It is a schematic diagram of the heat sink structure of the utility model.
[0019] Figure 6 It is a bottom view of the present utility model.
[0020] In the figure: 1 is the junction box shell; 11 is the outer shell; 111 is the first clamping block; 112 is the second clamping block; 113 is the supporting part; 12 is the inner shell; 121 is the clamping slot; 2 is the cover plate; 3 is the first conductive sheet; 4 is the thermal conductive sheet; 5 is the heat sink; 51 is the receiving section; 52 is the overlapping section; 6 is the cast diode structure; 60 is the diode. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.
[0022] An embodiment of the utility model, as Figure 1 , Figure 2 and Figure 6 As shown, the junction box housing 1 includes an outer shell 11 and an inner shell 12 arranged in the outer shell 11, and the bottom of the outer shell 11 is provided with a first card block 111 and a second card block 112 protruding upward, and the bottom of the outer shell 11 is also provided with a support portion 113, and the support portion 113 is located between the first card block 111 and the second card block 112, and the support portion 113 includes at least three groups of parallel ribs, and the top of the heat sink 5 is overlapped on the side walls of the outer shell 11 and extends to the outside of the junction box housing 1, and the inner shell 12 is overlapped on the outer shell 11 and the heat sink 5, and the heat of the diode 60 is led to the outside of the product through the exposed heat sink 5, so as to achieve better heat dissipation, reduce the number of parts and the complexity of the product, and reduce the material cost and assembly cost.
[0023] like Figure 4 As shown, a diode conductive sheet is installed on the inner shell 12, and the diode conductive sheet includes a first conductive sheet 3 and a second conductive sheet 4. As a preferred embodiment of the present application, a rivet groove is provided on the side of the first conductive sheet 3 away from the heat sink 5 for easy connection. The inner shell 12 is located above the heat sink 5 and is provided with a cast diode structure 6 as a solid area. The first conductive sheet 3 and the second conductive sheet 4 are both connected to the diode 60 in the cast diode structure 6. The first conductive sheet 3 is connected to the upper surface of the diode 60 through a bending structure, and the second conductive sheet 4 is connected to the lower surface of the diode 60. After the first conductive sheet 3, the second conductive sheet 4 and the diode 60 are connected, liquid material is filled into the area, and the cast diode structure 6 is formed after solidification, and the structure is stable. As a preferred embodiment of the present application, the liquid material can be epoxy resin, which effectively reduces the material cost.
[0024] like Figure 2 As shown, the first card block 111 and the second card block 112 are both provided with buckles, the short sides of the inner shell 12 are respectively snapped onto the bottom of the buckles of the first card block 111 and the second card block 112, and the long sides of the inner shell 12 are placed above the support portion 113 to ensure the installation stability of the inner shell 12.
[0025] like Figure 5As shown, the heat sink 5 is in a "J"-shaped structure, including a receiving section 51 at the bottom for receiving the inner shell and a lap section 52 at the top for fixing. The receiving section 51 and the supporting portion 113 in the outer shell 11 provide support for the inner shell to ensure that the inner shell 12 is installed horizontally. The bottom of the cast diode structure 6 fits the heat sink 5 to transfer the heat generated by the diode 60 to the heat sink 5. The lap sections 52 on both sides of the heat sink 5 are snap-fitted and overlapped on the side walls of the outer shell 11 to provide force points for the heat sink 5 to ensure that it can receive the inner shell 12.
[0026] Neiru Figure 4 As shown, the housing 12 is provided with a slot 121 near the receiving section 51 of the heat sink 5 to position the bottom of the heat sink 5. The heat sink 5 is locked with the slot 121 to prevent the heat sink 5 from sliding along the length direction of the junction box.
[0027] The working principle of this embodiment: the diode junction box guides the heat generated by the diode chip during operation to the air outside the junction box through the exposed heat sink structure, which significantly improves the heat dissipation effect, reduces the use of internal heat sinks, and reduces production and assembly costs.
[0028] Several points that need to be explained are: First, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, and can be mechanical or electrical connections, or internal connectivity between two elements, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative position relationships. When the absolute position of the object being described changes, the relative position relationship may change; secondly, in this article, relational terms such as first and second, etc. are only used to distinguish one entity from another, and do not necessarily require or imply that there is any such actual relationship or order between these entities.
[0029] The above examples are merely illustrative of the present utility model and do not constitute a limitation on the protection scope of the present utility model. All designs that are identical or similar to the present utility model fall within the protection scope of the present utility model.
Claims
1. A new structure cast diode junction box, comprising a junction box housing (1) and a cover plate (2) arranged on the top of the junction box housing (1), wherein a diode conductive sheet and a heat sink (5) are arranged in the junction box housing (1), characterized in that: The junction box housing (1) comprises an outer housing (11) and an inner housing (12) arranged in the outer housing (11); a first clamping block (111) and a second clamping block (112) protruding upward are arranged at the bottom of the outer housing (11); a supporting portion (113) is also arranged at the bottom of the outer housing (11); the top of the heat sink (5) is overlapped on the side walls of both sides of the outer housing (11) and extends to the outside of the junction box housing (1); and the inner housing (12) is overlapped on the outer housing (11) and the heat sink (5).
2. A new structure cast diode junction box according to claim 1, characterized in that: A diode conductive sheet is mounted on the inner shell (12), the diode conductive sheet comprising a first conductive sheet (3) and a second conductive sheet (4); a cast diode structure (6) as a solid area is provided at a position above the heat sink (5) of the inner shell (12); the first conductive sheet (3) and the second conductive sheet (4) are both connected to a diode (60) in the cast diode structure (6).
3. A new structure cast diode junction box according to claim 2, characterized in that: The first conductive sheet (3) is connected to the upper surface of the diode (60) through a bent structure, and the second conductive sheet (4) is connected to the lower surface of the diode (60).
4. A new structure cast diode junction box according to claim 2, characterized in that: The short sides of the inner shell (12) are respectively clamped on the bottom of the first clamping block (111) and the second clamping block (112), and the long sides of the inner shell (12) are placed on the support portion (113).
5. A new structure cast diode junction box according to claim 1, characterized in that: The heat sink (5) is in an "X"-shaped structure, comprising a receiving section (51) at the bottom for receiving the inner shell, and an overlapping section (52) at the top for fixing.
6. A new structure cast diode junction box according to claim 1, characterized in that: The inner shell (12) is installed horizontally, and the bottom of the cast diode structure (6) is fitted with the heat sink (5).
7. A new structure cast diode junction box according to claim 1, characterized in that: The inner shell (12) is provided with a slot (121) at a position close to the receiving section (51) of the heat sink (5).