Chip mounting mechanism for electronic component production

Abstract

The utility model relates to the technical field of surface mounting of electronic components, and discloses a surface mounting mechanism for production of electronic components, which comprises a surface mounting table, a bracket is fixedly connected to the upper part of the surface mounting table, an electric telescopic rod is fixedly connected to the right side in the bracket, and a transverse plate is fixedly connected to the output end of the electric telescopic rod. The rear side of the exterior of the surface mounting table is fixedly connected with an extension plate, the left side of the upper part of the extension plate is fixedly connected with a fan, the input end of the fan is fixedly connected with an air inlet, the output end of the fan is fixedly connected with a filter box, and the upper part of the filter box is fixedly connected with a conveying pipe; the other end of the conveying pipe penetrates through the support and is fixedly connected with an air outlet. According to the utility model, dust attached to the upper part of the circuit board can be conveniently cleaned before the electronic component is mounted, so that the dust and impurities are prevented from influencing the mounting position and alignment of the electronic component, and the mounting precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component patch technology, in particular to a patch mechanism for electronic component production. Background Art

[0002] In today's electronics industry, the production of electronic components has become a highly automated and sophisticated process. In this process, the placement machine, as an important equipment, plays a key role. The placement machine greatly improves production efficiency and placement quality by automatically and accurately placing small electronic components on printed circuit boards.

[0003] Existing electronic component production placement mechanisms cannot clean the dust attached to the top of the printed circuit board before placing electronic components. Dust and impurities may affect the placement position and alignment of electronic components, resulting in reduced placement accuracy, thereby affecting the performance and stability of the circuit board. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a patch mechanism for electronic component production, aiming to improve the problem in the prior art that dust attached to the upper part of the printed circuit board cannot be cleaned before the electronic components are patched.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A patch mechanism for producing electronic components comprises a patch table, wherein the upper portion of the patch table is fixedly connected to a bracket, an electric telescopic rod is fixedly connected to the right side of the bracket, an output end of the electric telescopic rod is fixedly connected to a cross plate, a patch assembly is fixedly connected to the cross plate, an extension plate is fixedly connected to the rear side of the outside of the patch table, a fan is fixedly connected to the left side of the upper portion of the extension plate, an input end of the fan is fixedly connected to an air inlet, an output end of the fan is fixedly connected to a filter box, an upper portion of the filter box is fixedly connected to a delivery pipe, and the other end of the delivery pipe passes through the bracket and is fixedly connected to an air outlet.

[0007] Furthermore, the patch platform is fixedly connected with pillars on all sides of the upper part, and a plurality of the tops of the pillars are fixedly connected with mounting plates, the lower part of the mounting plate is fixedly connected with an electric push rod, the output end of the electric push rod is fixedly connected with a moving block, the outer part of the moving block is rotatably connected with connecting rods, the inner part of the mounting plate is provided with sliding grooves on all sides, and a plurality of sliders are slidably connected inside the sliding grooves, and the other ends of a plurality of connecting rods are slidably connected to the lower parts of a plurality of sliders, the upper parts of a plurality of sliders are fixedly connected with connecting rods, and the outer parts of a plurality of connecting rods are fixedly connected with positioning plates.

[0008] Furthermore, the patch assembly includes a cylinder, the cylinder is fixedly connected to the inside of the horizontal plate, the output end of the cylinder is fixedly connected to a mounting plate, and a suction nozzle is installed at the bottom of the mounting plate.

[0009] Furthermore, a filter screen is installed inside the filter box.

[0010] Furthermore, guide rods are fixedly connected to both sides of the interior of the bracket, and the transverse plate is slidably connected to the outside of the two guide rods.

[0011] Furthermore, mounting rods are fixedly connected to both sides of the upper portion of the air outlet, and the tops of the two mounting rods are fixedly connected to both sides of the lower portion of the transverse plate.

[0012] Furthermore, rubber pads are arranged inside the plurality of positioning plates.

[0013] Furthermore, a cabinet door is installed on the front side of the exterior of the patch platform, a handle is fixedly connected to the front side of the exterior of the cabinet door, and a leg is fixedly connected to the lower part of the patch platform.

[0014] The utility model has the following beneficial effects:

[0015] 1. In the utility model, by cooperating among the extension plate, the fan, the air inlet, the filter box, the filter screen, the conveying pipe, the air outlet and other structures, it is possible to clean the dust attached to the upper part of the circuit board before the electronic components are mounted, thereby preventing the dust and impurities from affecting the mounting position and alignment of the electronic components and improving the mounting accuracy.

[0016] 2. In the utility model, the electronic components that need to be patched are conveniently fixed by the coordination among the mounting plate, pillar, electric push rod, moving block, connecting rod, slide groove, slider, connecting plate, positioning plate, rubber pad and other structures. Fixing the electronic components can simplify the patch operation and reduce the time wasted due to adjusting the position of the components. This can improve production efficiency, shorten the production cycle and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional diagram of a patch mechanism for producing electronic components proposed in the utility model;

[0018] Figure 2 This is a schematic diagram of the upper structure of the extension plate of the patch mechanism for producing electronic components proposed by the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the filter box of the patch mechanism for electronic component production proposed by the utility model;

[0020] Figure 4 This is a schematic diagram of the lower structure of the mounting plate of the patch mechanism for producing electronic components proposed by the utility model;

[0021] Figure 5 for Figure 2 A magnified view of the structure in the middle.

[0022] Legend:

[0023] 1. Patch table; 2. Support legs; 3. Cabinet door; 4. Bracket; 5. Extension board; 6. Fan; 7. Air inlet; 8. Filter box; 9. Filter; 10. Delivery pipe; 11. Air outlet; 12. Mounting rod; 13. Pillar; 14. Mounting plate; 15. Electric push rod; 16. Moving block; 17. Connecting rod; 18. Slide; 19. Slider; 20. Connecting rod; 21. Positioning plate; 22. Rubber pad; 23. Electric telescopic rod; 24. Guide rod; 25. Cross plate; 26. Patch assembly; 2601. Cylinder; 2602. Mounting plate; 2603. Nozzle. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Reference Figure 1 , Figure 2 and Figure 3 The utility model provides an embodiment: a patch mechanism for producing electronic components, including a patch platform 1, a bracket 4 is fixedly connected to the upper part of the patch platform 1, an electric telescopic rod 23 is fixedly connected to the right side of the bracket 4, a horizontal plate 25 is fixedly connected to the output end of the electric telescopic rod 23, a patch assembly 26 is fixedly connected to the inside of the horizontal plate 25, an extension plate 5 is fixedly connected to the rear side of the outside of the patch platform 1, a fan 6 is fixedly connected to the left side of the upper part of the extension plate 5, an air inlet 7 is fixedly connected to the input end of the fan 6, a filter box 8 is fixedly connected to the output end of the fan 6, a conveying pipe 10 is fixedly connected to the upper part of the filter box 8, and the other end of the conveying pipe 10 passes through the bracket 4 and is fixedly connected to the air outlet 1 1. The patch assembly 26 includes a cylinder 2601, which is fixedly connected to the inside of the horizontal plate 25. The output end of the cylinder 2601 is fixedly connected to a mounting plate 2602, and a suction nozzle 2603 is installed at the bottom of the mounting plate 2602. A filter screen 9 is installed inside the filter box 8. Guide rods 24 are fixedly connected to both sides of the inside of the bracket 4. The horizontal plate 25 is slidably connected to the outside of the two guide rods 24. Mounting rods 12 are fixedly connected to both sides of the upper part of the air outlet 11. The tops of the two mounting rods 12 are fixedly connected to both sides of the lower part of the horizontal plate 25. A cabinet door 3 is installed on the front side of the outside of the patch table 1. A handle is fixedly connected to the front side of the outside of the cabinet door 3. The lower part of the patch table 1 is fixedly connected to a leg 2.

[0026] First, before the electronic components are mounted, the circuit board must be firmly fixed on the upper part of the mounting plate 14. This step is to ensure that the circuit board will not move or shake during the cleaning process, thereby ensuring the cleaning effect. Next, the fan 6 is started to inhale the external air through the air inlet 7. The inhaled air is then transported to the inside of the filter box 8. The filter box 8 is the core part of the cleaning process. It has a built-in high-efficiency filter 9 for filtering the air. This filter 9 can effectively remove impurities and tiny particles in the air to ensure that the air blown to the circuit board is clean. The air filtered by the filter 9 is transported to the air outlet 11 through the delivery pipe 10. The design of the air outlet 11 is very important. It can ensure that the clean air is evenly blown to the surface of the circuit board, thereby thoroughly cleaning the dust and impurities on the circuit board. Finally, the clean air blown out by the air outlet 11 cleans the surface of the circuit board placed on the upper part of the mounting plate 14, so that before the electronic components are mounted, it is convenient to clean the dust attached to the upper part of the circuit board, avoid dust and impurities affecting the placement position and alignment of electronic components, and improve the placement accuracy.

[0027] Reference Figure 2 , Figure 4 and Figure 5 The upper part of the patch platform 1 is fixedly connected with pillars 13 all around, and a mounting plate 14 is fixedly connected to the top of multiple pillars 13. An electric push rod 15 is fixedly connected to the lower part of the mounting plate 14. A moving block 16 is fixedly connected to the output end of the electric push rod 15. The outer side of the moving block 16 is rotatably connected with connecting rods 17 all around. Slide grooves 18 are opened all around the inner side of the mounting plate 14. Slide blocks 19 are slidably connected inside the multiple slide grooves 18. The other ends of the multiple connecting rods 17 are slidably connected to the lower parts of the multiple slide blocks 19. The upper parts of the multiple slide blocks 19 are fixedly connected with connecting rods 20. The outer sides of the multiple connecting rods 20 are fixedly connected with positioning plates 21, and rubber pads 22 are arranged inside the multiple positioning plates 21.

[0028] In the process of electronic component patching, we first need to place the circuit board on the upper part of the mounting plate 14. It can fit perfectly with the circuit board to ensure the stability and accuracy of the circuit board. Next, we start the electric push rod 15 to push the moving block 16. This moving block 16 not only moves itself, but is also connected to four sliders 19 through the connecting rod 17. When the moving block 16 moves, the four sliders 19 will move relatively inside the slide slot 18, and as the slider 19 moves, the four connecting rods 20 will also move relatively. The four connecting rods 20 move with the external fixed positioning plate 21. The role of the positioning plate 21 is to fix the circuit board to ensure that the circuit board will not shift during the patch process. Inside the positioning plate 21, four rubber pads 22 are set. These rubber pads 22 are soft and elastic. They can fit the circuit board tightly to prevent the circuit board from vibrating or shifting during the patch process, making it easy to fix the electronic components that need to be patched. Fixing electronic components can simplify the patch operation and reduce the time waste caused by adjusting the position of components. This can improve production efficiency, shorten production cycle and reduce production costs.

[0029] Working principle: before mounting electronic components, first fix the circuit board on the upper part of the mounting plate 14, then start the fan 6, inhale the external air through the air inlet 7, then transport the inhaled air to the inside of the filter box 8, then filter the air through the filter 9 to remove impurities in the air, then transport it through the delivery pipe 10, and finally blow the air out through the air outlet 11, and clean the surface of the circuit board placed on the upper part of the mounting plate 14, so that before mounting electronic components, it is convenient to clean the dust attached to the upper part of the circuit board, avoid dust and impurities affecting the mounting position and alignment of electronic components, and improve the mounting accuracy. Then, when mounting electronic components, first place the circuit board on the upper part of the mounting plate 14, then start the electric push rod 15, and the electric push rod 15 is fixed with the output end The connected moving block 16 moves, and the connecting rod 17 connected to the moving block 16 by rotating around the outside moves together. When the four connecting rods 17 move, the four sliders 19 connected by rotating at the other end move relatively inside the four slide slots 18. When the four sliders 19 move relatively, the four connecting rods 20 fixedly connected on the upper part move relatively. The four connecting rods 20 move relatively and the four positioning plates 21 fixedly connected on the outside move relatively. The four positioning plates 21 move relatively and the four rubber pads 22 set inside move relatively. The circuit board placed on the upper part of the mounting plate 14 can be fixed by the relative movement of the four rubber pads 22, so that the electronic components that need to be patched can be fixed conveniently. Fixing the electronic components can simplify the patch operation and reduce the time waste caused by adjusting the position of the components. This can improve production efficiency, shorten the production cycle, and reduce production costs.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip placement mechanism for producing electronic components, comprising a chip placement table (1), characterized in that: The patch platform (1) is fixedly connected to a bracket (4) on the upper part, an electric telescopic rod (23) is fixedly connected to the right side of the bracket (4), the output end of the electric telescopic rod (23) is fixedly connected to a horizontal plate (25), the horizontal plate (25) is fixedly connected to a patch assembly (26), the rear side of the patch platform (1) is fixedly connected to an extension plate (5), the upper left side of the extension plate (5) is fixedly connected to a fan (6), the input end of the fan (6) is fixedly connected to an air inlet (7), the output end of the fan (6) is fixedly connected to a filter box (8), the upper part of the filter box (8) is fixedly connected to a delivery pipe (10), the other end of the delivery pipe (10) passes through the bracket (4) and is fixedly connected to an air outlet (11).

2. The chip placement mechanism for electronic component production according to claim 1, characterized in that: The patch platform (1) is fixedly connected with pillars (13) on all sides of the upper part, and a plurality of the tops of the pillars (13) are fixedly connected with a mounting plate (14), and the lower part of the mounting plate (14) is fixedly connected with an electric push rod (15), and the output end of the electric push rod (15) is fixedly connected with a moving block (16), and the outer part of the moving block (16) is rotatably connected with a connecting rod (17), and the inner part of the mounting plate (14) is provided with a sliding groove (18) on all sides, and a plurality of the sliding grooves (18) are slidably connected with a slider (19), and the other ends of the plurality of connecting rods (17) are slidably connected to the lower part of the plurality of sliders (19), and the upper part of the plurality of sliders (19) is fixedly connected with a connecting rod (20), and the outer part of the plurality of connecting rods (20) is fixedly connected with a positioning plate (21).

3. The chip placement mechanism for electronic component production according to claim 1, characterized in that: The patch assembly (26) comprises a cylinder (2601), wherein the cylinder (2601) is fixedly connected to the inside of the horizontal plate (25), and the output end of the cylinder (2601) is fixedly connected to a mounting plate (2602), and a suction nozzle (2603) is installed at the bottom of the mounting plate (2602).

4. The chip placement mechanism for electronic component production according to claim 1, characterized in that: A filter screen (9) is installed inside the filter box (8).

5. The chip placement mechanism for electronic component production according to claim 1, characterized in that: Guide rods (24) are fixedly connected to both sides of the interior of the bracket (4), and the transverse plate (25) is slidably connected to the outside of the two guide rods (24).

6. The chip placement mechanism for electronic component production according to claim 1, characterized in that: Both sides of the upper part of the air outlet (11) are fixedly connected with mounting rods (12), and the tops of the two mounting rods (12) are fixedly connected to both sides of the lower part of the transverse plate (25).

7. The chip placement mechanism for electronic component production according to claim 2, characterized in that: Rubber pads (22) are arranged inside the plurality of positioning plates (21).

8. The chip placement mechanism for electronic component production according to claim 1, characterized in that: A cabinet door (3) is installed on the front side of the exterior of the patch platform (1), a handle is fixedly connected to the front side of the exterior of the cabinet door (3), and a support leg (2) is fixedly connected to the lower part of the patch platform (1).

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