COB packaging structure of LED display screen
By using technical means such as down pressure parts, connecting barrels and cooling cycles in the COB package structure of the LED display screen, the problems of low packaging efficiency and colloidal offset in the prior art are solved, and efficient packaging and rapid cooling and shaping are achieved.
Patent Information
- Application Number
- CN202421083788.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-05-17
AI Technical Summary
The existing LED display COB packaging technology is inefficient, and the colloid is prone to offset during the packaging process.
A COB package structure of LED display screen is designed, using components such as pressing parts, connecting barrels and movable holes, which are fixedly connected to the discharge pipe through the connecting barrels, and cover the fixing chip with the pressing parts, and pass through the water inlet holes, heat dissipation holes and The hose forms a cooling cycle and quickly cools and shapes.
The efficiency of LED display COB packaging is improved, the colloid is avoided to shift during the packaging process, and the production efficiency is improved through rapid cooling and shaping.
Smart Images

Figure CN222485223U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of display screen packaging, and in particular relates to a COB packaging structure of an LED display screen. Background Art
[0002] At present, COB packaging is mostly used for packaging chips on LED display screens. The discharge pipe of the existing COB packaging needs to move back and forth on the chip surface to cover the chip surface with colloid, which greatly increases the single processing time and thus slows down the production efficiency. At the same time, since the colloid temperature is high and has not solidified, it is very easy to offset during the subsequent movement. Therefore, a COB packaging structure for LED display screens is designed to solve the problems of low efficiency and easy offset of the colloid during current display screen packaging. Utility Model Content
[0003] The utility model aims to provide a COB packaging structure for an LED display screen, so as to solve the problems in the above-mentioned background technology that the efficiency of current display screen packaging is low and the colloid is very easy to be offset.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a COB packaging structure of an LED display screen includes a discharge pipe and a lower pressure piece, a connecting tube is arranged on the top of the lower pressure piece, and the lower pressure piece and the discharge pipe are fixedly connected through the connecting tube, a groove is arranged at the bottom of the lower pressure piece, and the lower pressure piece is used to control the spraying range of the discharge pipe.
[0005] Preferably, a through hole is opened in the middle of the lower pressure piece, a through hole is opened at the bottom of the inner wall of the connecting tube, and a thread is arranged above the inner wall of the connecting tube, the through hole and the through hole are located on the same axis, the end of the discharge pipe passes through the connecting tube through the through hole, the connecting tube is sleeved on the end of the discharge pipe, and the connecting tube and the discharge pipe are fixedly connected by threads, and movable holes are symmetrically opened at equal intervals in the middle of the side wall of the connecting tube.
[0006] Preferably, the through hole and the through hole have the same diameter, the through hole is a Y-shaped hole, and the side with a larger opening of the through hole is away from the pressing piece.
[0007] Preferably, the end of the discharge pipe extends to the inside of the lower pressing piece through a through hole, water inlet holes are symmetrically opened on both sides of the outer wall of the lower pressing piece, a hose is sleeved on the outer wall of the water inlet hole, and an anti-stick coating is applied on the inner wall of the groove.
[0008] Preferably, the length of the water inlet hole is smaller than the distance between the through hole and the outer wall of the lower pressing member, and the two lower pressing members are connected by a plurality of heat dissipation holes, the heat dissipation holes are arc holes, and the heat dissipation holes are symmetrically installed at both sides of the water inlet hole with equal spacing.
[0009] Preferably, a sponge layer is symmetrically installed at an equal interval at the bottom of the pressing member and at the periphery of the groove, and the sponge layer is in contact with the processing table.
[0010] Compared with the prior art, the beneficial effects of the utility model are:
[0011] (1) The utility model is provided with a pressing member, a connecting tube and a movable hole. When in use, the connecting tube is sleeved on the discharge tube, and the connecting tube is rotated through the movable hole to make the connecting tube and the discharge tube threadedly connected, and the end of the discharge tube is forced to be embedded in the pressing member through the through hole. When in use, the pressing member is used to cover and fix the chip. At this time, it is only necessary to directly pour the colloid into the remaining space inside the pressing member without moving it multiple times. This can solve the problem of low efficiency and easy displacement of the colloid when packaging the current display screen.
[0012] (2) The utility model is provided with a water inlet hole, a heat dissipation hole and a hose. During operation, cooling water is connected to the interior of the lower pressing part through the hose, so that the cooling water forms a circulation through the water inlet hole and the heat dissipation hole. At the same time, the opening of the heat dissipation hole also increases the contact area between the cooling water and the lower pressing part. After the glue is filled, its heat is conducted through the lower pressing part and finally brought out by the cooling water, so as to achieve the purpose of rapid cooling and shaping, and solve the problem that the colloid is very easy to deviate when the current display screen is packaged. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the structure of the utility model;
[0014] Figure 2 It is a cross-sectional view of the lower pressing member of the utility model;
[0015] Figure 3 for Figure 1 A in the enlarged view;
[0016] In the figure: 1. discharge pipe; 2. movable hole; 3. sponge layer; 4. connecting tube; 5. through hole; 6. hose; 7. pressing piece; 8. through hole; 9. water inlet hole; 10. heat dissipation hole; 11. anti-stick coating. DETAILED DESCRIPTION
[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0018] See also Figure 1 and Figure 3As shown, the utility model provides the following technical solutions: a COB packaging structure of an LED display screen includes a discharge pipe 1 and a lower pressing piece 7, a connecting tube 4 is arranged on the top of the lower pressing piece 7, and the lower pressing piece 7 is fixedly connected to the discharge pipe 1 through the connecting tube 4, a groove is arranged at the bottom of the lower pressing piece 7, and the lower pressing piece 7 is used to control the spraying range of the discharge pipe 1, a through hole 8 is arranged in the middle of the lower pressing piece 7, a through hole 5 is arranged at the bottom of the inner wall of the connecting tube 4, and a thread is arranged above the inner wall of the connecting tube 4, the through hole 8 and the through hole 5 are located on the same axis, the end of the discharge pipe 1 passes through the connecting tube 4 through the through hole 5, the connecting tube 4 is sleeved on the end of the discharge pipe 1, and the connecting tube 4 and the discharge pipe 1 are fixedly connected by threads, active holes 2 are symmetrically arranged at equal intervals in the middle of the side wall of the connecting tube 4, the through hole 8 and the through hole 5 have the same diameter, the through hole 5 is a Y-shaped hole, and the side with the larger opening of the through hole 5 is away from the lower pressing piece 7, and sponge layers 3 are symmetrically installed at the bottom of the lower pressing piece 7 and located at the outer periphery of the groove at equal intervals, and the sponge layer 3 is in contact with the processing table.
[0019] Through the above technical scheme: when in use, the connecting tube 4 is sleeved on the discharge tube 1, and the connecting tube 4 is rotated through the movable hole 2 to make the connecting tube 4 and the discharge tube 1 threadedly connected, and force the end of the discharge tube 1 to be embedded in the lower pressure piece 7 through the through hole 5. Since the through hole 5 is a Y-shaped hole, the discharge tube 1 can be guided during the engagement to improve the installation efficiency. When in use, the discharge tube 1 drives the lower pressure piece 7 to move downward, forcing the end face of the lower pressure piece 7 to contact the substrate, and the chip is embedded in the groove of the lower pressure piece 7. The lower pressure piece 7 is used to cover and fix the chip. At this time, it is only necessary to pass the colloid through the discharge tube 1 and directly pour it into the remaining space inside the lower pressure piece 7. There is no need to move it multiple times, which can solve the problem of low efficiency and easy deviation of the colloid during current display screen packaging. In addition, the installed sponge layer 3 can effectively reduce the extrusion and wear of the lower pressure piece 7 on other equipment on the surface of the substrate, thereby ensuring the normal use of the LED display screen.
[0020] See also Figure 1-Figure 2 As shown, the end of the discharge pipe 1 extends to the inside of the lower pressing piece 7 through the through hole 8, and water inlet holes 9 are symmetrically opened on both sides of the outer wall of the lower pressing piece 7. A hose 6 is sleeved on the outer wall of the water inlet hole 9, and an anti-stick coating 11 is applied on the inner wall of the groove. The length of the water inlet hole 9 is smaller than the distance between the through hole 8 and the outer wall of the lower pressing piece 7, and the two lower pressing pieces 7 are connected by a plurality of heat dissipation holes 10. The heat dissipation holes 10 are arc-shaped holes, and the heat dissipation holes 10 are symmetrically installed on both sides of the water inlet hole 9 with equal intervals.
[0021] Through the above technical scheme: during operation, the cooling water is connected to the lower pressing part 7 through the hose 6, so that it forms a circulation through the water inlet hole 9 and the heat dissipation hole 10. At the same time, the opening of the heat dissipation hole 10 also increases the contact area between the cooling water and the lower pressing part 7, so that after the glue is filled, its heat is conducted through the lower pressing part 7 and gradually absorbed by the cooling water, and finally the heat is synchronously taken out by the circulating cooling water, so as to achieve the purpose of rapid cooling and shaping. The applied anti-stick coating 11, while ensuring uniform heat diffusion and improving the cooling and solidification efficiency, also reduces the problem of direct adhesion of the colloid to the inside of the lower pressing part 7, thereby improving production efficiency and simultaneously solving the problem that the colloid is very easy to offset during the current display screen packaging.
[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A LED display COB packaging structure, characterized by: The invention comprises a discharge pipe (1) and a pressing piece (7), wherein a connecting tube (4) is arranged on the top of the pressing piece (7), and the pressing piece (7) and the discharge pipe (1) are fixedly connected via the connecting tube (4), a groove is arranged on the bottom of the pressing piece (7), and the pressing piece (7) is used to control the spraying range of the discharge pipe (1).
2. The LED display COB packaging structure according to claim 1, characterized in that: A through hole (8) is provided in the middle of the lower pressing member (7), a through hole (5) is provided at the bottom of the inner wall of the connecting tube (4), and a thread is provided on the upper part of the inner wall of the connecting tube (4), the through hole (8) and the through hole (5) are located on the same axis, the end of the discharge pipe (1) passes through the connecting tube (4) through the through hole (5), the connecting tube (4) is sleeved on the end of the discharge pipe (1), and the connecting tube (4) and the discharge pipe (1) are fixedly connected by threads, and movable holes (2) are symmetrically provided at equal intervals in the middle of the side wall of the connecting tube (4).
3. The LED display COB packaging structure according to claim 2, characterized in that: The through hole (8) and the through hole (5) have the same diameter, the through hole (5) is a Y-shaped hole, and the side with a larger opening of the through hole (5) is away from the pressing piece (7).
4. The LED display COB packaging structure according to claim 1, characterized in that: The end of the discharge pipe (1) extends to the interior of the lower pressing piece (7) through a through hole (8), and water inlet holes (9) are symmetrically opened on both sides of the outer wall of the lower pressing piece (7). A hose (6) is sleeved on the outer wall of the water inlet hole (9), and an anti-stick coating (11) is applied on the inner wall of the groove.
5. The LED display COB packaging structure according to claim 4, characterized in that: The length of the water inlet hole (9) is smaller than the distance between the through hole (8) and the outer wall of the lower pressing piece (7), and the two lower pressing pieces (7) are connected via a plurality of heat dissipation holes (10), wherein the heat dissipation holes (10) are arc-shaped holes, and the heat dissipation holes (10) are symmetrically installed at equal intervals on both sides of the water inlet hole (9).
6. The LED display COB packaging structure according to claim 4, characterized in that: A sponge layer (3) is symmetrically installed at equal intervals at the bottom of the pressing member (7) and outside the groove, and the sponge layer (3) is in contact with the processing table.