Full-automatic ultrasonic cleaning machine for wafer surface

Abstract

The utility model discloses a full-automatic ultrasonic cleaning machine for the surface of a wafer, relates to the technical field of fixing of conveying belts, and solves the problems that stubborn stains are difficult to remove, the cleaning time is relatively long and the cleaning efficiency is relatively low only by ultrasonic cleaning in the prior art. A full-automatic ultrasonic cleaning machine for the surface of a wafer comprises a machine shell, a plurality of observation doors are connected to the peripheral side of the machine shell, a clamping device is connected to the top of the machine shell, and a cleaning groove is formed in the bottom in the machine shell; the clamping device comprises a sliding rail and a shell, a first driving motor drives the shell to slide on the sliding rail, a clamping jaw is connected into the shell in an up-down sliding mode, and a second driving motor drives the clamping jaw to slide up and down in the shell. An ultrasonic oscillator is arranged on the inner side wall of the cleaning tank, and the bottom of the cleaning tank is connected with a nitrogen bubbling device. The device has the beneficial effects that the cleaning quality can be effectively improved, and the cleaning time is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a fully automatic ultrasonic cleaning machine for wafer surfaces. Background Art

[0002] During the production process of chips, the surface will be contaminated with organic matter, particles, metal impurities, natural oxide layers, and pollutants from accessory containers such as quartz and plastic. In the semiconductor industry, chips are core components. These pollutants not only affect the performance of the chips, but may also cause the chips to fail during use. Therefore, after the chip processing is completed, the chip surface needs to be thoroughly cleaned. Ultrasonic cleaning machines are now often used to clean the chips in cleaning fluid, avoiding damage to the chips caused by mechanical contact and ensuring the integrity of the chips.

[0003] The structure of the current wafer surface cleaning machine is generally as described in a fully automatic ultrasonic cleaning machine for semiconductor products disclosed in the patent application number "CN201922101898.2", including a frame, on which a manipulator lifting mechanism, a manipulator translation mechanism, multiple material lifting manipulators, multiple cleaning tanks and a cleaning agent cooling system are provided. The manipulator lifting mechanism is used to drive the manipulator translation mechanism and multiple material lifting manipulators to lift and lower. The manipulator translation mechanism is used to drive multiple material lifting manipulators to move horizontally. The multiple material lifting manipulators are sequentially arranged on the manipulator translation mechanism, and are used to hook up the cleaning basket in the cleaning tank and drive the cleaning basket to translate or lift and lower. The multiple cleaning tanks are located below the material lifting manipulator, and an ultrasonic oscillator is provided on the outer wall of the bottom of the cleaning tank. However, this utility model only relies on ultrasonic cleaning, which is difficult to remove stubborn stains, and the cleaning time is long and the cleaning efficiency is low.

[0004] Therefore, the utility model proposes a fully automatic ultrasonic cleaning machine for wafer surface, which is used to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a fully automatic ultrasonic cleaning machine for wafer surfaces, which is used to solve the problems in the prior art that only ultrasonic cleaning is difficult to remove stubborn stains, the cleaning time is long, and the cleaning efficiency is low.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A fully automatic ultrasonic cleaning machine for wafer surfaces comprises a casing, a plurality of observation doors are connected to the periphery of the casing, a clamping device is connected to the top of the casing, and a cleaning tank is arranged at the bottom of the casing; the clamping device comprises a sliding track and a shell, a first driving motor drives the shell to slide on the sliding track, a clamping claw is connected to slide up and down in the shell, and a second driving motor drives the clamping claw to slide up and down in the shell; an ultrasonic oscillator is arranged on the inner side wall of the cleaning tank, a nitrogen bubbling device is connected to the bottom of the cleaning tank, the nitrogen bubbling device comprises a gas supply device, a gas delivery pipe and an aeration plate, and the aeration pipe is connected to the gas supply device through the gas delivery pipe.

[0008] By adopting the above technical solution, the cleaning quality can be effectively improved and the cleaning time can be shortened.

[0009] Furthermore, the gas supply device includes a nitrogen storage tank and a flow controller, the nitrogen storage tank is communicated with the flow controller, and the flow controller can control the switch and flow of nitrogen.

[0010] By adopting the above technical solution, the switch and flow of nitrogen can be controlled to avoid impact damage to the crystal caused by excessive nitrogen.

[0011] Furthermore, a protection net and a drain net are sequentially connected to the upper end of the cleaning tank, and the drain net is arranged at the upper end of the protection net.

[0012] By adopting the above technical solution, the protective net can support the cleaning basket containing the wafers and ensure the stability of the wafers. The drain net can quickly drain the cleaned wafers and then proceed to the next step.

[0013] Furthermore, a water inlet is provided at the upper end of the cleaning tank, and a water outlet is provided at the lower end of the cleaning tank.

[0014] By adopting the above technical solution, the cleaning liquid can be easily replaced, thereby ensuring the stability of wafer cleaning.

[0015] Furthermore, a filter screen is slidably connected in the cleaning tank, and the filter screen is arranged between the water inlet and the water outlet.

[0016] By adopting the above technical solution, impurities in the cleaning liquid can be collected uniformly, which is convenient for recycling the cleaning liquid and avoids blockage and damage to equipment during the cleaning liquid replacement process.

[0017] Furthermore, a first sealing strip is provided between the gas delivery pipe and the cleaning tank, and a second sealing strip is provided between the filter screen and the cleaning tank.

[0018] By adopting the above technical solution, leakage of the cleaning liquid can be avoided, and other impurities can be prevented from entering the cleaning tank through the connection, thereby ensuring the stability of the crystal cleaning process.

[0019] Furthermore, the material of the observation door is uniform visualization glass.

[0020] By adopting the above technical solution, the cleaning status of the wafer can be observed in real time during the cleaning process, and abnormal conditions can be discovered in time to avoid affecting the progress and product quality.

[0021] In summary, compared with the prior art, the utility model has the following beneficial effects:

[0022] The utility model can effectively remove pollutants on the surface of the wafer without destroying the surface characteristics of the wafer. The cleaning basket can be moved by the clamping claws. No manual operation is required during the wafer cleaning process. The utility model has a high degree of automation and is suitable for batch production. The consistency of cleaning quality is ensured. The automatic nitrogen bubbling device can effectively improve the cleaning quality and shorten the cleaning time.

[0023] The gas bubbling device can inject nitrogen into the cleaning liquid, thereby generating a large number of bubbles in the cleaning liquid, driving the cleaning liquid to flow, so that the cleaning liquid is more evenly distributed on the crystal surface, so that each part of the crystal can be fully cleaned, improving the overall cleaning quality, and enhancing the scouring force on the crystal surface. When the nitrogen bubbles burst on the crystal surface, a small impact force will be generated, which can shake off the stubborn stains attached to the crystal surface and effectively remove the pollutants on the crystal surface. At the same time, the nitrogen in the nitrogen bubble is an inert gas, which is not easy to react chemically, can reduce the oxygen content in the cleaning liquid, reduce the formation of oxides on the crystal surface, and protect the stability of the crystal. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a vertical schematic diagram of the utility model;

[0025] Figure 2 It is a top view of the utility model;

[0026] Figure 3 for Figure 2 AA cross-sectional diagram of ;

[0027] Figure 4 It is the front view of the utility model;

[0028] Figure 5 for Figure 4 BB cross-sectional diagram;

[0029] Figure 6 It is a partial cross-sectional schematic diagram of the right side view of the utility model;

[0030] In the figure: 1. casing; 2. observation door; 3. cleaning tank; 4. sliding track; 5. casing; 6. first drive motor; 7. clamping jaw; 8. second drive motor; 9. ultrasonic oscillator; 10. gas pipe; 11. aeration plate; 12. nitrogen storage tank; 13. flow controller; 14. protection net; 15. drain net; 16. water inlet; 17. drain outlet; 18. filter net; 19. first sealing strip; 20. second sealing strip. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In this application, the directions or positional relationships indicated by the terms "upper", "inner", "outer", "middle", etc. are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0033] like Figure 1 As shown, a fully automatic ultrasonic cleaning machine for wafer surface comprises a housing 1, and a plurality of observation doors 2 are connected to the periphery of the housing 1, and the material of the observation doors 2 is uniform visualization glass. Thus, the cleaning status of the wafer can be observed in real time during the cleaning process, and abnormal conditions can be discovered in time to avoid affecting the progress and product quality.

[0034] like Figure 2 and Figure 3 As shown, a clamping device is connected to the top of the casing 1, and the clamping device includes a sliding track 4 and a shell 5. The first drive motor 6 drives the shell 5 to slide on the sliding track 4. A clamping claw 7 is connected to the shell 5 for sliding up and down. The second drive motor 8 drives the clamping claw 7 to slide up and down in the shell 5. The cleaning basket can be moved by the sliding and up and down movement of the clamping claw 7. No manual operation is required during the wafer cleaning process. The system has a high degree of automation and is suitable for mass production, thereby ensuring the consistency of cleaning quality.

[0035] like Figure 3As shown, a cleaning tank 3 is provided at the bottom of the housing 1; the upper end of the cleaning tank 3 is connected with a protective net 14 and a drain net 15 in sequence, and the drain net 15 is provided at the upper end of the protection. The protective net 14 can support the cleaning basket for holding the wafers and ensure the stability of the wafers. The drain net 15 can quickly drain the wafers that have been cleaned and then proceed to the next step. A water inlet 16 is provided at the upper end of the cleaning tank 3, and a water outlet 17 is provided at the lower end of the cleaning tank 3. This facilitates the replacement of the cleaning liquid and ensures the stability of the wafer cleaning. A filter net 18 is slidably connected in the cleaning tank 3, and the filter net 18 is provided between the water inlet 16 and the water outlet 17. This enables the impurities in the cleaning liquid to be uniformly collected, which facilitates the recovery of the cleaning liquid and avoids blockage and damage to the equipment during the replacement of the cleaning liquid.

[0036] like Figure 4 and Figure 5 As shown, the inner wall of the cleaning tank 3 is provided with an ultrasonic oscillator 9, and the bottom of the cleaning tank 3 is connected with a nitrogen bubbling device, which includes a gas supply device, a gas pipe 10 and an aeration plate 11, and the aeration pipe is connected to the gas supply device through the gas pipe 10. The gas supply device includes a nitrogen storage tank 12 and a flow controller 13, and the nitrogen storage tank 12 is connected to the flow controller 13, and the flow controller 13 can control the switch and flow of nitrogen. First, the ultrasonic oscillator 9 drives the cleaning liquid to clean the surface of the wafer, and then the flow controller 13 controls the switch and flow of nitrogen. Nitrogen is injected into the cleaning liquid through the gas pipe 10 and the aeration plate 11, and then a large number of bubbles are generated in the cleaning liquid, which drives the cleaning liquid to flow, so that the cleaning liquid is more evenly distributed on the crystal surface, so that each part of the crystal can be fully cleaned, the overall cleaning quality is improved, and the scouring force on the crystal surface is enhanced. The nitrogen bubble breaks on the crystal surface, which will produce a small impact force, which can shake off the stubborn stains attached to the crystal surface and effectively remove the pollutants on the crystal surface. At the same time, the nitrogen in the nitrogen bubbling is an inert gas and is not easy to react chemically. It can reduce the oxygen content in the cleaning solution, reduce the formation of oxides on the crystal surface, and protect the stability of the crystal.

[0037] like Figure 6 As shown, a first sealing strip 19 is provided between the gas delivery pipe 10 and the cleaning tank 3, and a second sealing strip 20 is provided between the filter screen 18 and the cleaning tank 3. This prevents leakage of the cleaning liquid and prevents other impurities from entering the cleaning tank 3 through the connection, thereby ensuring the stability of the crystal cleaning process.

[0038] The working process of the utility model is:

[0039] First, the cleaning basket can be moved by sliding and moving up and down the clamping jaws 7, and the cleaning basket is placed on the protective net 14. Then the ultrasonic oscillator 9 drives the cleaning liquid to clean the surface of the wafer. Then the flow controller 13 controls the switch and flow of nitrogen. Nitrogen is injected into the cleaning liquid through the gas pipe 10 and the aeration plate 11, and then a large number of bubbles are generated in the cleaning liquid, which drives the cleaning liquid to flow, so that the cleaning liquid is more evenly distributed on the crystal surface, so that each part of the crystal can be fully cleaned, and then the cleaning basket is placed on the draining net 15 by sliding and moving up and down the clamping jaws 7.

Claims

1. A fully automatic ultrasonic cleaning machine for wafer surfaces, comprising a housing (1), wherein a plurality of observation doors (2) are connected to the periphery of the housing (1), wherein: The top of the casing (1) is connected to a clamping device, and the bottom of the casing (1) is provided with a cleaning tank (3); the clamping device comprises a sliding track (4) and a shell (5); a first drive motor (6) drives the shell (5) to slide on the sliding track (4); a clamping claw (7) is connected to the shell (5) for sliding up and down; a second drive motor (8) drives the clamping claw (7) to slide up and down in the shell (5); an ultrasonic oscillator (9) is provided on the inner side wall of the cleaning tank (3); a nitrogen bubbling device is connected to the bottom of the cleaning tank (3); the nitrogen bubbling device comprises a gas supply device, a gas delivery pipe (10) and an aeration plate (11); the aeration plate is connected to the gas supply device via the gas delivery pipe (10).

2. The fully automatic ultrasonic cleaning machine for wafer surface according to claim 1, characterized in that: The gas supply device comprises a nitrogen storage tank (12) and a flow controller (13); the nitrogen storage tank (12) is in communication with the flow controller (13); and the flow controller (13) is capable of controlling the switch and flow of nitrogen.

3. A fully automatic ultrasonic cleaning machine for wafer surface according to claim 2, characterized in that: The upper end of the cleaning tank (3) is connected in sequence to a protection net (14) and a drain net (15), and the drain net (15) is arranged at the upper end of the protection net.

4. A fully automatic ultrasonic cleaning machine for wafer surface according to claim 3, characterized in that: The upper end of the cleaning tank (3) is provided with a water inlet (16), and the lower end of the cleaning tank (3) is provided with a water outlet (17).

5. A fully automatic ultrasonic cleaning machine for wafer surface according to claim 4, characterized in that: A filter screen (18) is slidably connected in the cleaning tank (3), and the filter screen (18) is arranged between the water inlet (16) and the water outlet (17).

6. A fully automatic ultrasonic cleaning machine for wafer surface according to claim 5, characterized in that: A first sealing strip (19) is provided between the gas delivery pipe (10) and the cleaning tank (3), and a second sealing strip (20) is provided between the filter screen (18) and the cleaning tank (3).

7. The fully automatic ultrasonic cleaning machine for wafer surface according to claim 1, characterized in that: The material of the observation door (2) is uniform visual glass.

Images