Cross-layer laser processing device

Abstract

The utility model provides a cross-layer laser processing device, which relates to the technical field of circuit board processing and comprises a processing table and a laminate main body, a door-shaped support is bolted on the top surface of the processing table, a servo motor is bolted on the bottom surface of the top end of the door-shaped support, and an output shaft of the servo motor is connected with a reversing disc. Guiding air cylinders are symmetrically distributed on the two sides of the surface of the reversing disc, the movable ends of the guiding air cylinders are connected with punching motors, output shafts of the punching motors are connected with laser drill bits and micro positioning drill bits correspondingly, the surfaces of the laminates are preferentially positioned through the micro positioning drill bits, and then cross-layer drilling is conducted through the laser drill bits; compared with a traditional direct drilling mode, the mode that drilling is conducted after positioning is adopted, positioning is more accurate, meanwhile, compared with mechanical drilling, laser drilling is higher in efficiency, extrusion deformation between the laminate bodies is prevented, and nondestructive cross-layer drilling of the surfaces of the laminate bodies is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a cross-layer laser processing device. Background Art

[0002] In the field of electronic manufacturing, circuit boards are an indispensable part of various electronic devices. The holes on the circuit boards are important for installing electronic components and connecting wires. The traditional way of punching holes in circuit boards mainly relies on mechanical drilling technology, that is, using a drill to directly drill holes on the circuit board. However, with the continuous improvement of the requirements for precision and efficiency of electronic equipment, traditional mechanical drilling technology has gradually revealed some limitations.

[0003] First, the accuracy of mechanical drilling is affected by many factors, such as drill bit wear and mechanical vibration, which may cause the drilling position to shift and affect the quality and performance of the circuit board. Secondly, the heat and stress generated during the mechanical drilling process may cause damage to the circuit board, especially when drilling across multiple layers of a circuit board. Due to the differences in material properties and structures between layers, it is more likely to cause deformation or damage to the circuit board. In addition, the efficiency of mechanical drilling is relatively low, and it is difficult to meet the needs of large-scale, high-efficiency production.

[0004] The above patent documents and prior art technologies disclose that the heat and stress generated during mechanical drilling may cause deformation or damage to the circuit board, especially when drilling across layers, which is more likely to occur due to the differences in material properties and structures between layers. Utility Model Content

[0005] The utility model aims to solve the disadvantage of the prior art that the surface of the mechanically drilled layer plate is easily deformed or damaged, and proposes a cross-layer laser processing device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a cross-layer laser processing device, comprising a processing table and a layer plate body, the top surface of the processing table is bolted with a gate-type bracket, the bottom surface of the top end of the gate-type bracket is bolted with a servo motor, the output shaft of the servo motor is connected with a reversing disk, guide cylinders are symmetrically distributed on both sides of the reversing disk surface, the movable end of the guide cylinder is connected with a punching motor, the output shaft of the punching motor is respectively connected with a laser drill bit and a micro positioning drill bit, the top surface of the processing table is provided with a conveyor belt assembly, and the top surface of the conveyor belt assembly is provided with a clamping and positioning assembly.

[0007] Preferably, the top surfaces of the laser drill bit and the micro positioning drill bit are both provided with a drill bit connection seat, and the drill bit connection seat is threadedly connected to the output shaft of the drilling motor.

[0008] Preferably, the clamping and positioning assembly includes a positioning box and an L-shaped clamping plate, and telescopic bins are symmetrically provided on both sides of the top surface of the positioning assembly. The interior of the telescopic bins is slidably connected to the bottom end of the L-shaped clamping plate, and the L-shaped clamping plate is against the surface of the layer board body.

[0009] Preferably, a limit spring is vertically provided inside the telescopic bin, the movable end of the limit spring is connected to the bottom end of the L-shaped clamping plate, and a material guide bin is provided at the center of the top surface of the positioning box, and the material guide bin is a blind groove.

[0010] Preferably, the guide cylinders are bolted to the surface of the reversing disc, adjacent guide cylinders are independently controlled, and adjacent punching motors are independently controlled.

[0011] Preferably, the layer plate body is provided with three layers, and the adjacent layer plate bodies are of the same size, and the bottom surface of the layer plate body coincides with the top surface of the positioning box.

[0012] Preferably, the vertical center line of the servo motor and the vertical center line of the commutation disk coincide with each other, and the commutation disk is screw-connected to the output shaft of the servo motor.

[0013] Beneficial Effects

[0014] In the utility model, a commutation disc is connected to the top of the processing table through a servo motor, and a micro-positioning drill bit and a laser drill bit are used to perform drilling processing on the surface of the layer body. The layer surface is preferentially positioned by the micro-positioning drill bit, and then cross-layer drilling is performed by the laser drill bit. Compared with the traditional direct drilling method, the present application adopts the method of positioning first and then drilling, which is more accurate in positioning. At the same time, laser drilling is more efficient than mechanical drilling, which prevents extrusion and deformation between the layer bodies and realizes damage-free cross-layer drilling on the surface of the layer body.

[0015] In the utility model, a micro positioning drill bit and a laser drill bit are used in combination to first position the surface of the main body of the layer plate and then drill holes, and a laser drilling method of drilling and positioning layer by layer is adopted during drilling. Compared with direct one-time drilling, this can effectively reduce the stress directly exerted on the surface of the layer plate. By first drilling one layer at a time and then drilling the next layer after cooling, cross-layer laser drilling is achieved, and the main body of the layer plate is protected during drilling to prevent deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0017] Figure 2 It is an axonometric drawing of the utility model;

[0018] Figure 3 It is a front cross-sectional view of the utility model;

[0019] Figure 4This is a diagram of the connection structure of the commutation disc of the utility model;

[0020] Figure 5 It is a drilling schematic diagram of the utility model.

[0021] Legend:

[0022] 1. Processing table; 2. Conveyor belt assembly; 3. Door-type bracket; 4. Shelf body; 5. Clamping and positioning assembly; 501. Positioning box; 502. Material guide bin; 503. Telescopic bin; 504. Limit spring; 505. L-shaped clamp; 6. Servo motor; 7. Reversing disc; 8. Guide cylinder; 9. Punching motor; 10. Laser drill bit; 11. Drill bit connector; 12. Micro positioning drill bit. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0024] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment one:

[0026] Reference Figure 1-4 A cross-layer laser processing device comprises a processing table 1 and a layer plate body 4. A gate-shaped bracket 3 is bolted to the top surface of the processing table 1. A servo motor 6 is bolted to the bottom surface of the top of the gate-shaped bracket 3. A reversing disc 7 is connected to the output shaft of the servo motor 6. Guide cylinders 8 are symmetrically distributed on both sides of the reversing disc 7. A drilling motor 9 is connected to the movable end of the guide cylinder 8. A laser drill 10 and a micro positioning drill 12 are respectively connected to the output shaft of the drilling motor 9. A conveyor belt assembly 2 is provided on the top surface of the processing table 1. A clamping and positioning assembly 5 is provided on the top surface of the conveyor belt assembly 2. The entire device is actually When in use, the micro positioning drill bit 12 and the laser drill bit 10 are mainly converted through the servo motor 6. The output shaft of the servo motor 6 is rotated 180 degrees to replace the laser drill bit 10 and the micro positioning drill bit 12 connected at the bottom. The drill bit angle is adjusted by the guide cylinder 8, and the punching motor 9 drives the laser drill bit 10 to rotate. While rotating and drilling, the guide cylinder 8 cooperates and extends to achieve drilling on the surface of the layer body 4. In actual use, it is selected to first use the micro positioning drill bit 12 to perform drilling positioning on the layer surface, and then use the laser drill bit 10 to perform drilling positioning.

[0027] To facilitate the disassembly of the laser drill bit 10 and the micro positioning drill bit 12, a drill bit connecting seat 11 is provided on the top surface of the laser drill bit 10 and the micro positioning drill bit 12, and the drill bit connecting seat 11 is threadedly connected to the output shaft of the drilling motor 9, which facilitates the disassembly of the laser drill bit 10 and the micro positioning drill bit 12 from the output shaft of the drilling motor 9.

[0028] In order to keep the layer body 4 stable and prevent it from sliding during use, a clamping and positioning component 5 is provided, including a positioning box 501 and an L-shaped clamping plate 505. Telescopic bins 503 are symmetrically provided on both sides of the top surface of the positioning component. The inside of the telescopic bins 503 is slidably connected to the bottom end of the L-shaped clamping plate 505. The L-shaped clamping plate 505 is against the surface of the layer body 4. A limit spring 504 is vertically provided inside the telescopic bin 503. The movable end of the limit spring 504 is connected to the bottom end of the L-shaped clamping plate 505. A material guide bin 502 is provided at the center of the top surface of the positioning box 501, and the material guide bin 502 is a blind groove, so that the L-shaped clamping plate 505 can pressurize and clamp the layer body 4 placed on the surface of the positioning box 501 after the limit spring 504 is extended, so as to keep the layer body 4 stable. By providing the material guide bin 502, waste chips generated during the drilling process can be stored for centralized processing.

[0029] Other limiting structures of the entire device are as follows: the guide cylinder 8 is bolted to the surface of the reversing disc 7, adjacent guide cylinders 8 are independently controlled, adjacent punching motors 9 are independently controlled, the layer plate body 4 is provided with three layers, and adjacent layer plate bodies 4 are the same size, the bottom surface of the layer plate body 4 coincides with the top surface of the positioning box 501, the vertical center line of the servo motor 6 coincides with the vertical center line of the reversing disc 7, and the reversing disc 7 is screwed to the output shaft of the servo motor 6. Specific embodiment 2:

[0031] Reference Figure 1-4 In actual use, when the micro positioning drilling is drilling holes on the surface of the layer body 4, you can choose to drill through the top layer or not. Taking the three-layer layer body 4 as an example, you can choose to drill through the top layer with the micro positioning drill bit 12, and then use the servo motor 6 to cooperate with the reversing disk 7 to convert the laser drill bit 10 to drill the middle layer, or use the micro positioning drill bit 12 to locate the surface position without drilling through, and use the laser drill bit 10 to drill through the top layer. After a few seconds, continue to penetrate the middle layer. Select the drilling method according to the actual use requirements.

[0032] In summary:

[0033] 1. The top of the processing table 1 is connected to the reversing disc 7 through the servo motor 6, and the micro positioning drill bit 12 and the laser drill bit 10 are used to perform drilling processing on the surface of the layer plate body 4. The micro positioning drill bit 12 is used to preferentially position the surface of the layer plate, and then the laser drill bit 10 is used to perform cross-layer drilling. Compared with the traditional direct drilling method, the present application adopts the method of first positioning and then drilling, which is more accurate in positioning. At the same time, laser drilling is more efficient than mechanical drilling, which prevents extrusion deformation between the layer plate bodies 4 and realizes non-destructive cross-layer drilling on the surface of the layer plate body 4;

[0034] 2. Use a micro positioning drill bit 12 and a laser drill bit 10 to first position the surface of the layer body 4 and then drill holes. When drilling, use a laser drilling method that positions the holes layer by layer. Compared with direct one-time drilling, it can effectively reduce the stress directly exerted on the surface of the layer. By drilling holes layer by layer first and then drilling the next layer after cooling, cross-layer laser drilling is achieved, and the layer body 4 is protected during drilling to prevent deformation.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A cross-layer laser processing device, comprising a processing table (1) and a layer plate body (4), characterized in that: The top surface of the processing table (1) is bolted with a gate-shaped bracket (3), the bottom surface of the top end of the gate-shaped bracket (3) is bolted with a servo motor (6), the output shaft of the servo motor (6) is connected with a reversing disc (7), the two sides of the surface of the reversing disc (7) are symmetrically distributed with guide cylinders (8), the movable ends of the guide cylinders (8) are connected with a drilling motor (9), the output shafts of the drilling motor (9) are respectively connected with a laser drill bit (10) and a micro positioning drill bit (12), the top surface of the processing table (1) is provided with a conveyor belt assembly (2), and the top surface of the conveyor belt assembly (2) is provided with a clamping and positioning assembly (5).

2. A cross-layer laser processing device according to claim 1, characterized in that: The top surfaces of the laser drill bit (10) and the micro positioning drill bit (12) are both provided with a drill bit connection seat (11), and the drill bit connection seat (11) is threadedly connected to the output shaft of the drilling motor (9).

3. The cross-layer laser processing device according to claim 1, characterized in that: The clamping and positioning assembly (5) comprises a positioning box (501) and an L-shaped clamping plate (505), and telescopic bins (503) are symmetrically provided on both sides of the top surface of the positioning assembly. The interior of the telescopic bin (503) is slidably connected to the bottom end of the L-shaped clamping plate (505), and the L-shaped clamping plate (505) is against the surface of the layer board body (4).

4. The cross-layer laser processing device according to claim 3, characterized in that: A limit spring (504) is vertically arranged inside the telescopic bin (503), and the movable end of the limit spring (504) is connected to the bottom end of the L-shaped clamping plate (505). A material guide bin (502) is arranged at the center of the top surface of the positioning box (501), and the material guide bin (502) is a blind groove.

5. The cross-layer laser processing device according to claim 1, characterized in that: The guide cylinder (8) is bolted to the surface of the reversing disc (7), adjacent guide cylinders (8) are independently controlled, and adjacent punching motors (9) are independently controlled.

6. The cross-layer laser processing device according to claim 1, characterized in that: The layer plate body (4) is provided with three layers, and adjacent layer plate bodies (4) are of the same size, and the bottom surface of the layer plate body (4) coincides with the top surface of the positioning box (501).

7. The cross-layer laser processing device according to claim 1, characterized in that: The vertical center line of the servo motor (6) and the vertical center line of the commutation disc (7) coincide with each other, and the commutation disc (7) is screw-connected to the output shaft of the servo motor (6).

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