Wafer grinding machine convenient for slurry recovery

Abstract

The utility model discloses a wafer grinding machine convenient to recycle slurry, which relates to the technical field of wafer grinding and comprises a grinding workbench, and two sides of the top surface of the grinding workbench are jointly provided with supporting arms for assisting in supporting and assisting in generating a grinding function. And a grinding disc capable of assisting the wafer to be placed on the surface and generating a grinding effect is arranged on the top surface of the grinding workbench. The four wafer grooves formed in the grinding disc are used for placing wafers, then the blades arranged at the bottom of the top cutter head are used for grinding the wafers, and slurry generated in the process passes through the small leak holes and the large leak holes and then enters the recycling cabinet through the recycling opening. According to the slurry recycling device for the wafer grinding machine, the situation that most wafer grinding machines still adopt a manual sweeping method when slurry is recycled is avoided, the generated slurry can be automatically recycled, the recycling work time is saved, the wafer grinding accuracy is improved, and the working efficiency of the grinding machines is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding, in particular to a wafer grinding machine which is convenient for recovering slurry. Background Art

[0002] As a light-transmitting device of imaging equipment, the wafer needs to be ground and polished during the processing. When grinding and polishing the wafer, a grinder is usually required. A wafer grinder is a machine used to process semiconductor wafers. Its principle is to grind the wafer surface through the friction between the abrasive and the wafer and the impact of the processing fluid, so as to achieve the processing and modification of the wafer.

[0003] After searching, the applicant found that a Chinese patent disclosed a "wafer grinder" with a publication (announcement) number of "CN203077070U", which includes a base and an upper grinding mechanism, the upper grinding mechanism includes an upper grinding disc, and is characterized in that a lower grinding mechanism is provided on the base, and the lower grinding mechanism includes a lower grinding disc; a limit plate is provided between the upper grinding mechanism and the lower grinding mechanism, the limit plate is arranged above the lower grinding disc, a limit device for fixing the position of the limit plate in the horizontal direction is provided on the base, and a plurality of transparent limit openings for placing wafers are provided on the limit plate, and these limit openings are located within the grinding surface range of the lower grinding disc;

[0004] However, most existing wafer grinders are not good enough at recovering the slurry produced after grinding, and some even use other tools to clean it manually, resulting in excessive mixture of abrasive and processing fluid on the surface of the grinding disk. Once accumulated on the surface of the grinding disk, it will cause errors in the grinding of the wafer, greatly reducing the grinding accuracy of the wafer. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer grinder that is convenient for recovering slurry, so as to solve the problem mentioned in the above background technology that most of the existing wafer grinders are not perfect in recovering the slurry generated after grinding, and even use other tools to clean it manually, resulting in excessive generation of a mixture of abrasive and processing fluid on the surface of the grinding disk. Once accumulated on the surface of the grinding disk, it will cause errors in the grinding of the wafer, resulting in greatly reduced grinding accuracy of the wafer.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer grinder that is convenient for recovering slurry, comprising a grinding workbench, both sides of the top surface of the grinding workbench are jointly provided with support arms for auxiliary support to help produce the grinding function, the top surface of the grinding workbench is provided with a grinding disk that can assist the wafer placement surface and produce a grinding effect, one side of the surface of the grinding workbench is provided with a storage box that can store water and spray it onto the surface of the grinding disk for wetting, and one side of the surface of the grinding workbench is provided with a recovery cabinet that can recover the slurry.

[0007] Preferably, the support arm is fixedly connected to both sides of the top surface of the grinding workbench, a motor is provided at the center of the top surface of the support arm, and the output end of the motor passes through the interior of the support arm.

[0008] Preferably, the bottom surface of the support arm is rotatably connected to an electric telescopic rod, the top surface of the electric telescopic rod is fixedly connected to the bottom end of the motor output end, the bottom end of the electric telescopic rod is fixedly connected to a cutter disc, and the bottom surface of the cutter disc is provided with a plurality of blades.

[0009] Preferably, the grinding disc is fixedly connected to the center of the top surface of the grinding workbench, the bottom surface of the grinding disc is provided with a large hole, a lining tray is fixedly connected to the center of the bottom surface of the grinding disc, the bottom surface of the lining tray is provided with a small hole, a plurality of wafer loading platforms are fixedly connected to the bottom surface of the lining tray, and wafer grooves are opened inside the plurality of wafer loading platforms.

[0010] Preferably, the storage box is fixedly connected to one side of the surface of the grinding workbench, a liquid injection port is provided on one side of the surface of the storage box, a storage cavity is provided inside the storage box, and a water pump is fixedly connected to the top surface of the inner wall of the storage cavity.

[0011] Preferably, a partition plate is provided on both sides of the inner wall of the storage cavity, a telescopic hose is fixedly connected to the interior of the partition plate, and the bottom end of the telescopic hose extends to the bottom surface of the storage cavity and is fixedly connected to a gravity block, and the input end of the water pump is fixedly connected to the top of the telescopic hose.

[0012] Preferably, a transmission pipe is fixedly connected to one side of the surface of the storage box, two nozzles are provided on one side of the transmission pipe, and one side of the transmission pipe extends to the top of the storage cavity and is fixedly connected to the output end of the water pump.

[0013] Preferably, a recovery port is opened inside the grinding workbench at the bottom surface of the grinding disc, and slide rails are provided on both sides of the inner wall of the bottom of the recovery port. Both sides of the recovery cabinet are slidably connected to the opposite sides of the two slide rails, and a sealing plug is provided on one side of the recovery cabinet.

[0014] The technical effects and advantages of the utility model are as follows: the utility model utilizes the four wafer slots provided inside the grinding disc to place the wafer inside, and then grinds the wafer through the blade provided at the bottom of the top knife disc. The slurry generated in the process will pass through the small holes and the large holes and then enter the interior of the recycling cabinet through the recovery port, avoiding the manual sweeping method adopted by most wafer grinders when recycling the slurry, so that the slurry generated can be automatically recycled, saving the time of recycling work, improving the accuracy of wafer grinding, and improving the working efficiency of the grinder. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model.

[0016] Figure 2 It is a schematic diagram of the overall front structure of the utility model.

[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the grinding disc of the utility model.

[0018] Figure 4 It is a schematic diagram of the front cross-sectional structure of the storage box of the present utility model.

[0019] Figure 5 It is a schematic diagram of the front cross-sectional structure of the grinding workbench of the utility model.

[0020] In the figure: 1. grinding workbench; 2. support arm; 3. grinding disc; 4. storage box; 5. recovery cabinet; 6. recovery port; 201. motor; 202. electric telescopic rod; 203. cutter disc; 204. blade; 301. large hole; 302. lining tray; 303. small hole; 304. carrying platform; 305. wafer slot; 401. storage cavity; 402. water pump; 403. partition plate; 404. telescopic hose; 405. gravity block; 406. transmission pipe; 407. nozzle; 408. injection port; 502. sealing plug; 601. slide rail. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] The utility model provides Figure 1-5The wafer grinder shown is convenient for recovering slurry, comprising a grinding table 1, both sides of the top surface of the grinding table 1 are jointly provided with support arms 2 for auxiliary support to help produce the grinding function, the top surface of the grinding table 1 is provided with a grinding disc 3 that can assist the wafer placement surface and produce a grinding effect, one side of the surface of the grinding table 1 is provided with a storage box 4 that can store water and spray it onto the surface of the grinding disc 3 for wetting, and one side of the surface of the grinding table 1 is provided with a recovery cabinet 5 that can recover the slurry. The utility model utilizes four wafer slots 305 provided inside the grinding disc 3 to place the wafer inside, and then uses the blade 204 provided at the bottom of the top knife disc 203 to grind the wafer. The slurry generated in the process will pass through the small hole 303 and the large hole 301 and then enter the interior of the recovery cabinet 5 through the 6 recovery port, avoiding the manual sweeping method used by most wafer grinders when recovering the slurry, so that the slurry generated can be automatically recovered, saving the time of the recovery work, improving the accuracy of wafer grinding, and improving the working efficiency of the grinder.

[0023] like Figure 1-3 As shown, the support arm 2 is fixedly connected to both sides of the top surface of the grinding workbench 1, and a motor 201 is arranged at the center of the top surface of the support arm 2. The output end of the motor 201 runs through the interior of the support arm 2, and the bottom surface of the support arm 2 is rotatably connected to an electric telescopic rod 202. The electric telescopic rod 202 will automatically move downward during grinding, so as to reach the top surface of the grinding disc 3 and contact the internal wafer, and can be controlled to retract when the grinding is finished or the wafer is placed, and the top surface of the electric telescopic rod 202 is fixedly connected to the bottom end of the output end of the motor 201, and the bottom end of the electric telescopic rod 202 is fixedly connected to The cutter disc 203 has a plurality of blades 204 on its bottom surface, the grinding disc 3 is fixedly connected to the center of the top surface of the grinding workbench 1, a large hole 301 is provided on the bottom surface of the grinding disc 3, a lining tray 302 is fixedly connected to the center of the bottom surface of the grinding disc 3, a small hole 303 is provided on the bottom surface of the lining tray 302, a plurality of wafer loading platforms 304 are fixedly connected to the bottom surface of the lining tray 302, a plurality of wafer loading platforms 304 are provided with wafer grooves 305 inside, the opening of the wafer grooves 305 can facilitate the wafers to be ground to be placed inside better and more stably, so as to carry out the grinding work normally.

[0024] like Figure 1 , Figure 2 and Figure 4As shown, the storage box 4 is fixedly connected to one side of the surface of the grinding workbench 1, a liquid injection port 408 is provided on one side of the surface of the storage box 4, a storage cavity 401 is provided inside the storage box 4, a water pump 402 is fixedly connected to the top surface of the inner wall of the storage cavity 401, a partition plate 403 is provided on both sides of the inner wall of the storage cavity 401, a telescopic hose 404 is fixedly connected to the interior of the partition plate 403, and the bottom end of the telescopic hose 404 extends to the bottom surface of the storage cavity 401 and is fixedly connected to a gravity block 405, and the gravity block 405 The arrangement enables the telescopic hose 404 to be always at the bottom of the storage cavity 401, so that the mixture of abrasive and processing fluid can be normally extracted from the inside. The input end of the water pump 402 is fixedly connected to the top of the telescopic hose 404. One side of the surface of the storage box 4 is fixedly connected to a transmission pipe 406. Two nozzles 407 are provided on one side of the transmission pipe 406. One side of the transmission pipe 406 extends to the top of the storage cavity 401 and is fixedly connected to the output end of the water pump 402. The transmission pipe 406 is arranged to output the mixture of abrasive and processing fluid.

[0025] like Figure 1 , Figure 2 and Figure 5 As shown, a recovery port 6 is provided inside the grinding workbench 1 at the bottom surface of the grinding disc 3, and slide rails 601 are provided on both sides of the inner wall at the bottom of the recovery port 6. The slide rails 601 facilitate the pulling and pulling of the recovery cabinet 5. The two sides of the recovery cabinet 5 are slidably connected to the opposite sides of the two slide rails 601. A sealing plug 502 is provided on one side of the recovery cabinet 5. The setting of the sealing plug 502 can make the internal recovery work sealed. When the slurry is too little, the recovery cabinet 5 can be pulled out for recovery through the slide rails 601 on both sides, otherwise the sealing plug 502 can be pulled out for release and recovery.

[0026] Working principle of the utility model: when using the utility model, firstly, the wafer to be ground is placed in the lining tray 302 inside the grinding disc 3, and four loading platforms 304 are arranged inside the lining tray 302, and then when the wafer is placed in the wafer slot 305 opened inside, the motor 201 is immediately turned on, and the output end of the motor 201 will drive the electric telescopic rod 202 to rotate, and the electric telescopic rod 202 will be extended to the top of the grinding disc 3, and then the knife disc 203 with the blade 204 arranged on the bottom surface of the electric telescopic rod 202 can start the grinding operation. During the grinding process, the storage box 4 will store a mixture of abrasive and processing liquid, which is extracted from the bottom by the telescopic hose 404 arranged at the input end of the water pump 402, and then the transmission pipe 406 arranged at the output end is used to spray from two nozzles 407 to the surface of the grinding disc 3 being ground, so as to perform auxiliary work;

[0027] Finally, the slurry generated by the abrasive and the processing fluid will first pass through the small hole 303 and the large hole 301 to enter the inside of the recovery port 6, and finally reach the inside of the recovery cabinet 5. If the slurry is too little, it can be pulled out of the recovery cabinet 5 through the slide rails 601 on both sides for recovery. If the slurry is too much, the sealing plug 502 can be pulled out for release and recovery.

[0028] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer grinding machine for facilitating slurry recovery, comprising a grinding table (1), characterized in that: Support arms (2) for assisting in the grinding function are provided on both sides of the top surface of the grinding workbench (1); a grinding disc (3) for assisting in placing a wafer on the top surface and producing a grinding effect is provided on the top surface of the grinding workbench (1); a storage box (4) for storing water and spraying it onto the surface of the grinding disc (3) for wetting is provided on one side of the surface of the grinding workbench (1); and a recovery cabinet (5) for recovering slurry is provided on one side of the surface of the grinding workbench (1).

2. A wafer grinding machine for facilitating slurry recovery according to claim 1, characterized in that: The support arm (2) is fixedly connected to two sides of the top surface of the grinding workbench (1); a motor (201) is provided at the center of the top surface of the support arm (2); and an output end of the motor (201) passes through the interior of the support arm (2).

3. A wafer grinding machine for facilitating slurry recovery according to claim 2, characterized in that: The bottom surface of the support arm (2) is rotatably connected to an electric telescopic rod (202), the top surface of the electric telescopic rod (202) is fixedly connected to the bottom end of the output end of the motor (201), the bottom end of the electric telescopic rod (202) is fixedly connected to a knife disc (203), and the bottom surface of the knife disc (203) is provided with a plurality of blades (204).

4. A wafer grinding machine for facilitating slurry recovery according to claim 1, characterized in that: The grinding disc (3) is fixedly connected to the center of the top surface of the grinding workbench (1); a large hole (301) is provided on the bottom surface of the grinding disc (3); a lining tray (302) is fixedly connected to the center of the bottom surface of the grinding disc (3); a small hole (303) is provided on the bottom surface of the lining tray (302); a plurality of wafer mounting platforms (304) are fixedly connected to the bottom surface of the lining tray (302); and wafer grooves (305) are provided inside the plurality of wafer mounting platforms (304).

5. A wafer grinding machine for facilitating slurry recovery according to claim 1, characterized in that: The storage box (4) is fixedly connected to one side of the surface of the grinding workbench (1); a liquid injection port (408) is provided on one side of the surface of the storage box (4); a storage cavity (401) is provided inside the storage box (4); and a water pump (402) is fixedly connected to the top surface of the inner wall of the storage cavity (401).

6. A wafer grinding machine for facilitating slurry recovery according to claim 5, characterized in that: A partition plate (403) is provided on both sides of the inner wall of the storage cavity (401); a telescopic hose (404) is fixedly connected to the interior of the partition plate (403); the bottom end of the telescopic hose (404) extends to the bottom surface of the storage cavity (401) and is fixedly connected to a gravity block (405); and the input end of the water pump (402) is fixedly connected to the top end of the telescopic hose (404).

7. A wafer grinding machine for facilitating slurry recovery according to claim 6, characterized in that: A transmission pipe (406) is fixedly connected to one side of the surface of the storage box (4), two nozzles (407) are provided on one side of the transmission pipe (406), and one side of the transmission pipe (406) extends to the top of the storage cavity (401) and is fixedly connected to the output end of the water pump (402).

8. A wafer grinding machine for facilitating slurry recovery according to claim 1, characterized in that: A recovery port (6) is provided inside the grinding workbench (1) at the bottom surface of the grinding disc (3), and slide rails (601) are provided on both sides of the inner wall at the bottom of the recovery port (6). The two sides of the recovery cabinet (5) are slidably connected to the opposite sides of the two slide rails (601), and a sealing plug (502) is provided on one side of the recovery cabinet (5).

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