Silicon wafer cutting refrigerating fluid recycling mechanism

Abstract

The utility model relates to the field of silicon wafer cutting, and particularly discloses a silicon wafer cutting refrigerating fluid recycling mechanism which comprises a cutting machine, the cutting machine comprises a first roller body and a second roller body, a recycling mechanism is arranged between the first roller body and the second roller body and located in the cutting machine, and the recycling mechanism comprises a precipitation arc plate and a recycling arc plate. A magnetic suction supporting column is connected between the precipitation arc plate and the recovery arc plate, an anti-overflow plate is installed at the upper end of the precipitation arc plate, discharge holes are formed in the positions, located on the upper surface of the precipitation arc plate, of one side of the anti-overflow plate in an annular array mode, the lower end of the recovery arc plate is connected with a recovery liquid pipe, and the position, located on the outer side of the cutting machine, of one end of the recovery liquid pipe is connected with a cooling liquid recovery bin. After the cooling liquid is flushed into the precipitation arc plate, hard impurities in the cooling liquid can be precipitated in the precipitation arc plate, and meanwhile when the liquid level rises, supernate can fall into the recovery arc plate from the position of a discharge hole and then is discharged into a cooling liquid recovery bin through a recovery liquid pipe.

Description

Technical Field

[0001] The utility model relates to the field of silicon slice cutting, in particular to a silicon slice cutting freezing liquid recovery mechanism. Background Art

[0002] When existing single crystal silicon rods are cut into single crystal silicon wafers, the single crystal silicon rods are generally ground by a free sand wire cutting method. Due to the high hardness of silicon material, coolant is required to cool the cutting during cutting to ensure the service life of the cutting wire.

[0003] However, since coolant needs to be used for flushing during cutting, the used coolant needs to be used. The cooling effect is easily affected by the impurities contained in the cooling after use. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a silicon wafer cutting refrigerant recovery mechanism, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical solutions: a silicon wafer cutting freezing liquid recovery mechanism, including a cutting machine, the cutting machine including: a first roller body, a second roller body, a recovery mechanism is arranged between the first roller body and the second roller body inside the cutting machine, the recovery mechanism includes: a sedimentation arc plate, a recovery arc plate, a magnetic suction support is connected between the sedimentation arc plate and the recovery arc plate, an anti-overflow plate is installed at the upper end of the sedimentation arc plate, one side of the anti-overflow plate is located on the upper surface of the sedimentation arc plate and a ring array is provided with discharge holes, the lower end of the recovery arc plate is connected to a recovery liquid pipe, one end of the recovery liquid pipe is located on the outside of the cutting machine and is connected to a cooling liquid recovery bin.

[0006] As a further solution of the utility model: cooling tube brackets are installed above the cutting machine at positions corresponding to the first roller body and the second roller body, a liquid spray nozzle is installed inside the cooling tube bracket, and a ratchet gear is installed on the outside of the cooling tube bracket via a rotating shaft. A sliding guide block is installed at the lower end of the cooling tube bracket, and a movable guide rail is installed on the upper surface of the cutting machine below the sliding guide block.

[0007] As a further solution of the utility model: steel wires are arranged on the outer sides of the first roller body and the second roller body, a lifting frame is installed on one side of the cutting machine, and a silicon rod clamping frame is arranged inside the lifting frame above the recycling mechanism.

[0008] As a further solution of the utility model: the outer diameter length of the sedimentation arc plate is greater than the outer diameter length of the recovery arc plate, and a filter is installed inside the discharge hole.

[0009] As a further solution of the utility model: the silicon rod clamping frame is movably connected to the lifting frame.

[0010] As a further solution of the utility model: a bellows is connected between the liquid spray nozzle and the coolant recovery bin, and the cooling pipe bracket is movably connected to the movable guide rail through the sliding guide block.

[0011] As a further solution of the utility model: the recovery liquid pipe is connected with the recovery arc plate through, and the sedimentation arc plate is connected with the recovery arc plate by magnetic adsorption through the magnetic support.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] After the coolant falls into the sedimentation arc plate, the hard impurities in the coolant will settle in the sedimentation arc plate. At the same time, when the liquid level rises, the supernatant will fall from the discharge hole into the inside of the recovery arc plate and then be discharged into the coolant recovery tank through the recovery liquid pipe.

[0014] The cooling pipe bracket as a whole is adjusted in position above the movable guide rail by using a sliding guide block, and the flushing and cooling position of the spray nozzle on the steel wire is adjusted by rotating the control ratchet gear, thereby ensuring the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a silicon wafer cutting cryogen recovery mechanism;

[0016] Figure 2 A cross-sectional view of a cutting machine in a silicon wafer cutting cryogen recovery mechanism;

[0017] Figure 3 It is a structural schematic diagram of a recovery mechanism in a silicon wafer cutting cryogen recovery mechanism;

[0018] Figure 4 It is a structural schematic diagram of a cold extraction pipe support in a silicon wafer cutting cryogen recovery mechanism;

[0019] Figure 5 A top view of a cutting machine in a silicon wafer cutting cryogen recovery mechanism.

[0020] In the figure: 1. cutting machine; 2. first roller body; 3. second roller body; 4. silicon rod clamping frame; 5. cooling pipe bracket; 6. coolant recovery bin; 7. lifting frame; 8. recovery mechanism; 201. steel wire; 501. ratchet gear; 502. liquid spray nozzle; 503. liquid injection pipe; 504. sliding guide block; 505. moving guide rail; 601. bellows; 602. liquid recovery pipe; 801. sedimentation arc plate; 802. anti-overflow plate; 803. discharge hole; 804. recovery arc plate; 805. magnetic support. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-5 As shown, this embodiment provides a silicon wafer cutting cryogen recovery mechanism, including a cutting machine 1, the cutting machine 1 includes: a first roller body 2, a second roller body 3, a recovery mechanism 8 is arranged inside the cutting machine 1 between the first roller body 2 and the second roller body 3, the recovery mechanism 8 includes: a sedimentation arc plate 801, a recovery arc plate 804, the outer diameter of the sedimentation arc plate 801 is greater than the outer diameter of the recovery arc plate 804, a magnetic suction support 805 is connected between the sedimentation arc plate 801 and the recovery arc plate 804, and the sedimentation arc plate 801 is connected to the recovery arc plate 804. An anti-overflow plate 802 is installed at the upper end of 01, and the sedimentation arc plate 801 is magnetically connected to the recovery arc plate 804 through a magnetic support 805. One side of the anti-overflow plate 802 is located on the upper surface of the sedimentation arc plate 801 and a ring array is provided with discharge holes 803. A filter is installed inside the discharge hole 803. The lower end of the recovery arc plate 804 is connected to a recovery liquid pipe 602. The recovery liquid pipe 602 is through-connected with the recovery arc plate 804. One end of the recovery liquid pipe 602 is located on the outside of the cutting machine 1 and is connected to a coolant recovery bin 6.

[0023] like Figure 2-5 As shown, in this embodiment, cooling tube brackets 5 are installed at positions above the cutting machine 1 corresponding to the first roller body 2 and the second roller body 3, a liquid spray nozzle 502 is installed inside the cooling tube bracket 5, a bellows 601 is connected between the liquid spray nozzle 502 and the coolant recovery bin 6, the liquid spray nozzle 502 is located on the outside of the cooling tube bracket 5 through a rotating shaft and a ratchet gear 501 is installed, a sliding guide block 504 is installed at the lower end of the cooling tube bracket 5, a movable guide rail 505 is installed on the upper surface of the cutting machine 1 below the sliding guide block 504, the cooling tube bracket 5 is movably connected to the movable guide rail 505 through the sliding guide block 504, a steel wire 201 is arranged on the outside of the first roller body 2 and the second roller body 3, a lifting frame 7 is installed on one side of the cutting machine 1, a silicon rod clamping frame 4 is arranged inside the lifting frame 7 above the recovery mechanism 8, and the silicon rod clamping frame 4 is movably connected to the lifting frame 7.

[0024] The working principle of the utility model is as follows: when in use, after the silicon rod to be cut is fixed as a whole inside the silicon rod clamping frame 4, the first roller body 2 and the second roller body 3 are driven as a whole to rotate in one direction to drive the high-speed rotation of the steel wire 201, and the lifting frame 7 is used to control the silicon rod clamping frame 4 to move downward as a whole, so that the silicon rod contacts the steel wire 201 and is cut. According to the width size of the cut silicon rod, the cooling tube bracket 5 is adjusted as a whole above the moving guide rail 505 by using the sliding guide block 504 to control the distance between the two cooling tube brackets 5 and the silicon rod clamping frame 4, and at the same time, the control rod 7 is used to adjust the position of the cooling tube bracket 5 as a whole above the moving guide rail 505. The gear 501 rotates to adjust the flushing and cooling position of the steel wire 201 by the liquid spray nozzle 502, thereby ensuring the cooling effect. After the coolant is flushed and falls into the interior of the sedimentation arc plate 801, the hard impurities in the coolant will be precipitated in the sedimentation arc plate 801. At the same time, when the liquid level rises, the supernatant will fall from the position of the discharge hole 803 into the interior of the recovery arc plate 804 and then be discharged into the coolant recovery bin 6 through the recovery liquid pipe 602. After the recovered coolant is precipitated again in the coolant recovery bin 6, it is drained by the bellows 601 to the liquid spray nozzle 502 for reuse.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cutting cryogen recovery mechanism, comprising a cutting machine (1), characterized in that: The cutting machine (1) comprises: a first roller body (2) and a second roller body (3); a recovery mechanism (8) is arranged between the first roller body (2) and the second roller body (3) and located inside the cutting machine (1); the recovery mechanism (8) comprises: a sedimentation arc plate (801) and a recovery arc plate (804); a magnetic support (805) is connected between the sedimentation arc plate (801) and the recovery arc plate (804); an anti-overflow plate (802) is installed at the upper end of the sedimentation arc plate (801); one side of the anti-overflow plate (802) is located on the upper surface of the sedimentation arc plate (801) and is provided with discharge holes (803) in a circular array; the lower end of the recovery arc plate (804) is connected to a recovery liquid pipe (602); one end of the recovery liquid pipe (602) is located outside the cutting machine (1) and is connected to a coolant recovery bin (6).

2. A silicon wafer cutting refrigerant recovery mechanism according to claim 1, characterized in that: A cooling tube bracket (5) is installed above the cutting machine (1) at positions corresponding to the first roller body (2) and the second roller body (3); a liquid spray nozzle (502) is installed inside the cooling tube bracket (5); a ratchet gear (501) is installed on the outside of the cooling tube bracket (5) via a rotating shaft; a sliding guide block (504) is installed at the lower end of the cooling tube bracket (5); and a movable guide rail (505) is installed on the upper surface of the cutting machine (1) below the sliding guide block (504).

3. A silicon wafer cutting refrigerant recovery mechanism according to claim 1, characterized in that: Steel wires (201) are arranged on the outside of the first roller body (2) and the second roller body (3), a lifting frame (7) is installed on one side of the cutting machine (1), and a silicon rod clamping frame (4) is arranged inside the lifting frame (7) above the recovery mechanism (8).

4. A silicon wafer cutting refrigerant recovery mechanism according to claim 1, characterized in that: The outer diameter length of the sedimentation arc plate (801) is greater than the outer diameter length of the recovery arc plate (804), and a filter screen is installed inside the discharge hole (803).

5. The silicon wafer cutting refrigerant recovery mechanism according to claim 3, characterized in that: The silicon rod clamping frame (4) is movably connected to the lifting frame (7).

6. A silicon wafer cutting refrigerant recovery mechanism according to claim 2, characterized in that: A bellows (601) is connected between the liquid spray nozzle (502) and the coolant recovery bin (6), and the cooling pipe bracket (5) is movably connected to the movable guide rail (505) via the sliding guide block (504).

7. The silicon wafer cutting refrigerant recovery mechanism according to claim 1, characterized in that: The recovery liquid pipe (602) is connected to the recovery arc plate (804), and the sedimentation arc plate (801) is connected to the recovery arc plate (804) by magnetic attraction via the magnetic attraction support (805).

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