Liquid crystal display module and electronic equipment

Abstract

The utility model discloses a liquid crystal display module and electronic equipment, and belongs to the technical field of display. The liquid crystal display module comprises an upper iron frame, an FOG glass assembly, a middle frame, a backlight source and a lower aluminum alloy die casting. The lower aluminum alloy die casting is used for bearing a backlight source, and the back face of the lower aluminum alloy die casting is provided with a hollowed-out structure. The middle frame is used for fixing the backlight membrane material and bearing the FOG glass assembly; the lower aluminum alloy die casting is connected with the middle frame and the upper iron frame through buckles. According to the liquid crystal display module and the electronic equipment provided by the embodiment of the invention, the heat dissipation capability of the liquid crystal display module with medium and large sizes can be improved by improving the material and the structure, and the problems that a backlight LED light bar is lighted and emits heat, an element assembly on an FPC emits heat due to power consumption, and an LCD and an IC emit heat due to power consumption are solved; therefore, the problem of difficulty in heat dissipation of the large and medium-sized liquid crystal display module is solved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular relates to a liquid crystal display module and an electronic device. Background Art

[0002] Since medium and large-sized liquid crystal display modules are equipped with high-power backlight sources, a large amount of heat will be generated, which will have adverse effects on the entire device. Therefore, how to solve the heat dissipation problem of medium and large-sized liquid crystal display modules has become a topic to be studied by those skilled in the art. Utility Model Content

[0003] The present application provides a liquid crystal display module and an electronic device, which are used to solve the heat dissipation problem of medium and large-sized liquid crystal display modules.

[0004] In order to achieve the above application purpose, the technical solution adopted in this application is as follows:

[0005] The embodiment of the present application provides a liquid crystal display module, including: an upper iron frame, a FOG glass assembly, a middle frame, a backlight source and a lower aluminum alloy die casting;

[0006] The lower aluminum alloy die-casting is used to carry the backlight source, and a hollow structure is provided on the back of the lower aluminum alloy die-casting;

[0007] The middle frame is used to fix the backlight film material and carry the FOG glass components;

[0008] The lower aluminum alloy die-casting is connected to the middle frame and the upper iron frame through buckles.

[0009] In some embodiments, buckles are provided around the lower aluminum alloy die casting, first slots and avoidance slots cooperating with the buckles are provided around the middle frame, and second slots cooperating with the buckles are provided around the upper iron frame.

[0010] In some embodiments, the middle frame is made of black ABS plastic material.

[0011] In some embodiments, the upper iron frame is made of stainless steel.

[0012] In some embodiments, the backlight source includes: an FPC arranged on all sides and a PCB light strip evenly distributed on the FPC.

[0013] An embodiment of the present application provides an electronic device, comprising a liquid crystal display module provided by any of the above embodiments.

[0014] Compared with the prior art, the beneficial effects of the embodiments of the present application are:

[0015] A liquid crystal display module and electronic device provided in the embodiments of the present application can improve the heat dissipation capacity of medium and large-sized liquid crystal display modules by improving the material and structure, solve the heat generation problems caused by the backlight LED light bar lighting, the power consumption and heat generation of component assemblies on the FPC, and the power consumption and heat generation of the LCD and IC, thereby solving the heat dissipation problem of medium and large-sized liquid crystal display modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic diagram of the structure of a liquid crystal display module provided in an embodiment of the present application is shown;

[0018] Figure 2 An exploded view of a liquid crystal display module provided in an embodiment of the present application is shown;

[0019] Figure 3 A schematic structural diagram of a lower aluminum alloy die casting provided in an embodiment of the present application is shown;

[0020] Figure 4 A schematic diagram of the back structure of the lower aluminum alloy die casting provided in an embodiment of the present application is shown;

[0021] Figure 5 A schematic diagram of the structure of a backlight source provided in an embodiment of the present application is shown;

[0022] Figure 6 A schematic diagram of the structure of the middle frame provided in an embodiment of the present application is shown;

[0023] Figure 7 A schematic structural diagram of a FOG glass assembly provided in an embodiment of the present application is shown;

[0024] Figure 8 A schematic structural diagram of an upper iron frame provided in an embodiment of the present application is shown.

[0025] Illustration Description:

[0026] 10. LCD display module; 11. Lower aluminum alloy die-casting; 111. Buckle; 112. Hollow structure; 12. Backlight source; 13. Middle frame; 131. First slot; 132. Avoidance slot; 14. FOG glass assembly; 15. Upper iron frame; 151. Second slot. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In order to illustrate the technical solution described in this application, a specific embodiment is provided below for illustration.

[0031] See also Figures 1 to 8 As shown, the embodiment of the present application provides a liquid crystal display module 10, including: an upper iron frame 15, a FOG glass assembly 14, a middle frame 13, a backlight source 12 and a lower aluminum alloy die-casting 11.

[0032] In the embodiment of the present application, the lower aluminum alloy die-casting 11 is used to carry the backlight source 12 . The lower aluminum alloy die-casting 11 has better heat dissipation function than the traditional stainless steel material, and can improve the heat dissipation capacity of the liquid crystal display module 10 .

[0033] Furthermore, a hollow structure 112 is provided on the back of the lower aluminum alloy die casting 11 , which can enhance the heat dissipation function of the surface and further improve the heat dissipation capacity of the liquid crystal display module 10 .

[0034] The middle frame 13 is used to fix the film material of the backlight source 12 and to carry the FOG glass assembly 14. As an example, the FOG glass assembly 14 includes an LCD, a POL, an FPC and an IC.

[0035] Furthermore, the middle frame 13 is made of black ABS plastic material, and the black color can shield excess light leakage.

[0036] In the embodiment of the present application, the lower aluminum alloy die casting 11 is connected to the middle frame 13 and the upper iron frame 15 by a buckle 111. Among them, the lower aluminum alloy die casting 11 is connected to the middle frame 13 by a buckle 111, so that the soft to hard can solve the abnormal shaking between products.

[0037] In some embodiments, buckles 111 are provided around the lower aluminum alloy die casting 11, first clamping grooves 131 and avoidance grooves 132 that cooperate with the buckles 111 are provided around the middle frame 13, and second clamping grooves 151 that cooperate with the buckles 111 are provided around the upper iron frame 15. In this way, the upper iron frame 15 is connected to the lower aluminum alloy die casting 11 through the cooperation of the buckles 111 and the second clamping grooves 151, and is wrapped and fixed together with the middle frame 13 in the middle.

[0038] As an example, a window is opened in the middle visible area of ​​the upper iron frame 15, and the upper POL surface of the FOG glass assembly 14 is designed to be sunken below the surface of the iron frame, which can prevent crushing during transportation.

[0039] As an example, the upper iron frame 15 is made of stainless steel, for example, the stainless steel is specifically SUS 304.

[0040] In some embodiments, the backlight source 12 includes: FPCs arranged around and PCB (using FR4 hard substrate) light strips evenly distributed on the FPCs. For example, the light strips may use high-power LEDs to meet brightness requirements.

[0041] To sum up, a liquid crystal display module 10 provided in an embodiment of the present application can improve the heat dissipation capacity of medium and large-sized liquid crystal display modules 10 by improving the material and structure, solve the heat generation caused by the backlight LED light bar, the power consumption and heat generation of the components on the FPC, and the power consumption and heat generation of the LCD and IC, thereby solving the heat dissipation problem of medium and large-sized liquid crystal display modules 10.

[0042] In some other embodiments of the present application, an electronic device is provided, comprising the liquid crystal display module 10 provided in any of the above embodiments. For example, the electronic device is a vehicle-mounted display device.

[0043] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A liquid crystal display module, characterized in that: include: Upper iron frame, FOG glass assembly, middle frame, backlight source and lower aluminum alloy die casting; The lower aluminum alloy die-casting is used to carry the backlight source, and a hollow structure is provided on the back of the lower aluminum alloy die-casting; The middle frame is used to fix the backlight source film material and carry the FOG glass component; The lower aluminum alloy die casting is connected to the middle frame and the upper iron frame through buckles.

2. The liquid crystal display module according to claim 1, characterized in that: The buckle is arranged around the lower aluminum alloy die casting, the first clamping groove and the avoidance groove matched with the buckle are arranged around the middle frame, and the second clamping groove matched with the buckle is arranged around the upper iron frame.

3. The liquid crystal display module according to claim 1, characterized in that: The middle frame is made of black ABS plastic material.

4. The liquid crystal display module according to claim 1, characterized in that: The upper iron frame is made of stainless steel.

5. The liquid crystal display module according to claim 1, characterized in that: The backlight source includes: FPCs arranged around the periphery and PCB light strips evenly distributed on the FPCs.

6. An electronic device, characterized in that: A liquid crystal display module comprising any one of claims 1 to 5.

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