Domain control host

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a domain control host, and the host comprises a liquid cooling component which is provided with a liquid cooling flow channel; the liquid cooling component is also provided with a connecting inlet and a connecting outlet, and the connecting inlet and the connecting outlet are respectively communicated with the liquid cooling flow channel; the liquid cooling component is provided with a mounting part, and the circuit board is arranged on the mounting part; the circuit board is provided with an electronic component, the electronic component faces the liquid cooling flow channel, and a flow path limited by the liquid cooling flow channel passes through the electronic component; and the cover plate is connected with the liquid cooling component so as to fix the circuit board in the mounting part. According to the domain control host provided by the invention, the shell and the liquid cooling plate are combined and designed in structure and function, the liquid cooling component can play a role in packaging and protecting the internal circuit board and electronic components on the circuit board, and also can play a role in cooling the electronic components, so that the production cost of the domain control host is effectively controlled, and the production efficiency of the domain control host is improved. And lightweight setting of the domain control host is facilitated.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a domain control host. Background Art

[0002] At present, new energy vehicles are developing rapidly. With the development of intelligent vehicles, the integration of cabin-driving and cabin-parking domain control and vehicle-machine integration has high functional integration, and the required chip computing power has increased. The power consumption of the whole machine has been greatly improved compared with the original single cockpit domain control. The heat dissipation requirements of the vehicle-mounted SIP module chip are very high, and the fan heat dissipation efficiency is low, so water cooling is used to dissipate the heat of the main chip.

[0003] When developing the structure of a current liquid-cooled domain control car computer, the combination of a housing and a liquid cooling plate is generally used, which is costly and difficult to control in size. In addition, the inlet and outlet of the liquid cooling plate are designed to be threaded or welded, and the airtightness of the liquid cooling channel is poor and not stable enough. Utility Model Content

[0004] The purpose of this application is to provide a domain control host to solve the technical problems in the prior art that the existing cooling components that can be used for domain control vehicle computers are high in production cost and large in size.

[0005] The present application provides a domain control host, comprising: a liquid cooling component, the liquid cooling component is provided with a liquid cooling channel; the liquid cooling component is further provided with a connection inlet and a connection outlet, the connection inlet and the connection outlet are respectively connected to the liquid cooling channel;

[0006] A circuit board, the liquid cooling member is provided with a mounting portion, the circuit board is arranged on the mounting portion; the circuit board is provided with electronic components, the electronic components are arranged facing the outer wall surface of the liquid cooling channel, and the flow path defined by the liquid cooling channel passes through the electronic components;

[0007] A cover plate is connected to the liquid cooling component to fix the circuit board in the mounting portion.

[0008] In the above technical solution, further, the liquid cooling component includes:

[0009] Plate body;

[0010] A plurality of side walls, wherein the plurality of side walls are connected end to end in sequence and are disposed on the plate body;

[0011] The liquid cooling channel is arranged on one side of the plate body where the side wall is arranged, and the side wall is arranged around the liquid cooling channel;

[0012] The connection inlet and the connection outlet are arranged on the side wall.

[0013] In any of the above technical solutions, further, the connection inlet and the connection outlet are arranged at intervals on the same side wall;

[0014] A predetermined center distance is formed between the connection inlet and the connection outlet, and the predetermined center distance is not less than 45 mm.

[0015] In any of the above technical solutions, further, the domain control host further includes a plurality of heat-conducting bosses, the liquid-cooling channel protrudes relative to the surface of the board body, and the plurality of heat-conducting bosses are arranged at intervals on the outer wall surface of the liquid-cooling channel;

[0016] The number of the heat-conducting bosses is not less than the number of the electronic components, and each of the heat-conducting bosses is correspondingly bonded to one of the electronic components.

[0017] In any of the above technical solutions, further, a spoiler is provided in the liquid-cooling flow channel, and the number of the spoilers is multiple, and the multiple spoilers are arranged at intervals.

[0018] In any of the above technical solutions, further, the domain control host also includes a fixed bracket, and the fixed bracket is detachably connected to the liquid cooling component.

[0019] In any of the above technical solutions, further, the domain control host also includes a plurality of connectors, and the plurality of connectors are distributed on the side wall.

[0020] In any of the above technical solutions, further, the liquid cooling component is also provided with an antenna fixing part, and the number of the antenna fixing parts is at least two; at least part of the antenna fixing parts is provided with a protective cover.

[0021] In any of the above technical solutions, further, the connection inlet and the connection outlet have an integral structure with the liquid cooling component.

[0022] In any of the above technical solutions, further, the thickness of the side wall is not less than 7 mm.

[0023] Compared with the prior art, the beneficial effects of this application are:

[0024] The domain control host provided by the present application includes: a liquid cooling component, the liquid cooling component is provided with a liquid cooling flow channel; the liquid cooling component is also provided with a connection inlet and a connection outlet, and the connection inlet and the connection outlet are respectively connected to the liquid cooling flow channel; a circuit board, the liquid cooling component is provided with a mounting portion, and the circuit board is arranged on the mounting portion; the circuit board is provided with electronic components, the electronic components are arranged facing the liquid cooling flow channel, and the flow path defined by the liquid cooling flow channel passes through the electronic components; the cover plate is connected to the liquid cooling component to fix the circuit board in the mounting portion.

[0025] To sum up, the domain control host provided by the present application combines the shell and the liquid cooling plate in structure and function. The liquid cooling component can not only encapsulate and protect the internal circuit board and the electronic components on the circuit board, but also dissipate heat for the electronic components. It not only effectively controls the production cost of the domain control host, but also facilitates the lightweight setting of the domain control host.

[0026] In addition, the domain control host provided by the present application integrates the liquid cooling components, connection inlets, connection outlets and liquid cooling channels into an integrated design, which significantly improves the airtight reliability and stability of the cooling liquid supply and flow processes compared to the traditional disassembly and assembly method, while reducing the size of the domain control host and improving the versatility and platform nature of the upgrade. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 A schematic diagram of the structure of a domain control host provided in an embodiment of the present application;

[0029] Figure 2 Another structural diagram of a domain control host provided in an embodiment of the present application;

[0030] Figure 3 Another perspective diagram of the domain control host provided in the embodiment of the present application;

[0031] Figure 4 A schematic diagram of the structure of a circuit board of a domain control host provided in an embodiment of the present application;

[0032] Figure 5 A schematic diagram of the internal structure of the liquid cooling component of the domain control host provided in an embodiment of the present application.

[0033] Reference numerals:

[0034] 1-liquid cooling component, 101-board body, 102-side wall, 103-connecting column, 2-cover plate, 201-fixing hole, 3-circuit board, 301-electronic component, 4-liquid cooling channel, 401-spoiler, 402-cover, 5-connection inlet, 6-connection outlet, 7-heat conducting boss, 8-connector, 9-second antenna, 10-protective cover, 11-fixing bracket, 1101-first connecting part, 1102-second connecting part, 12-first antenna fixing part. DETAILED DESCRIPTION

[0035] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0036] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0037] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0038] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] Refer to the following Figures 1 to 5 A domain control host according to an embodiment of the present application is described.

[0041] See also Figures 1 to 5As shown, an embodiment of the present application provides a domain control host, which includes a liquid cooling component 1, a circuit board 3 and a cover plate 2, wherein the liquid cooling component 1 is provided with a liquid cooling channel 4 and a connecting inlet 5 and a connecting outlet 6 connected to the liquid cooling channel 4, the connecting inlet 5 is used to inject cooling liquid into the liquid cooling channel 4, and the connecting outlet 6 is used to flow out the cooling liquid in the liquid cooling channel, so that the cooling liquid can circulate in the liquid cooling channel 4, and the electronic components 301 such as chips on the circuit board 3 are cooled in a liquid cooling manner. The liquid cooling component 1 is provided with a mounting portion, and the circuit board 3 is arranged in the mounting portion so that the circuit board 3 and the liquid cooling component 1 remain fixed. A plurality of electronic components 301 are arranged on the circuit board 3, and the plurality of electronic components 301 are arranged on the side of the circuit board 3 facing the liquid cooling channel 4, so that each electronic component 301 can contact the outer wall surface of the liquid cooling channel 4, and the coolant flows along the flow path defined by the liquid cooling channel 4. During the flow of the coolant, the coolant exchanges heat with the electronic components 301 through the wall surface of the liquid cooling channel 4, thereby absorbing the heat of each electronic component 301. The cover plate 2 is connected to the liquid cooling component 1, so that the circuit board 3 is encapsulated in the mounting portion, which ensures the stability between the circuit board 3 and the liquid cooling component 1 on the one hand, and protects the circuit board 3 on the other hand.

[0042] Further, the liquid-cooling component 1 specifically includes a plate body 101 and a plurality of side walls 102, wherein the number of the side walls 102 is preferably four, the four side walls 102 are connected end to end in sequence to form a four-sided ring structure, the plate body 101 has a rectangular flat plate structure, the four side walls 102 are arranged at the edge of the plate body 101, and the four side walls 102 and the plate body 101 together form a structure of a trough body with an opening. Definition: The plate body 101 is provided with four side walls 102, one side surface of which is the inner surface, and the side facing away from the inner surface is the outer surface, the liquid-cooling channel 4 is arranged on the inner surface of the plate body 101, and the liquid-cooling channel 4 is protruding relative to the inner surface of the plate body 101, preferably, the four side walls 102, the plate body 101 and the liquid-cooling channel 4 are integrally processed and formed, and have an integral structure, to ensure the structural strength of the liquid-cooling component 1, as well as the sealing of the liquid-cooling channel 4 itself and between the liquid-cooling channel 4 and the plate body 101.

[0043] Furthermore, the cover plate 2 is preferably a stamped aluminum plate, and a plurality of fixing holes 201 for inserting fasteners are provided on the cover plate 2. A plurality of connecting columns 103 are provided on the inner surface of the plate body 101 at positions avoiding the liquid cooling channel 4. The fasteners pass through the fixing holes 201 and the avoidance holes on the circuit board 3 to be threadedly connected with the connecting columns 103, thereby fixing the cover plate 2, the fixing part and the liquid cooling component 1.

[0044] Furthermore, the connection inlet 5 and the connection outlet 6 are both tubular, and the connection inlet 5 and the connection outlet 6 are respectively arranged on the side wall 102 of the liquid cooling component 1. Preferably, the connection inlet 5 and the connection outlet 6 are integrally formed with the liquid cooling component 1, and the processing method can be but is not limited to stamping, so that the connection inlet 5 and the connection outlet 6 have better sealing with the liquid cooling component 1, thereby improving the overall sealing of the liquid cooling channel 4, and further improving the liquid cooling effect and stability of the entire domain control host.

[0045] Preferably, the connection inlet 5 and the connection outlet 6 are arranged on the same side wall 102, and the connection inlet 5 and the connection outlet 6 are arranged at intervals. Preferably, a predetermined center distance is formed between the connection inlet 5 and the connection outlet 6, and the predetermined center distance here is the distance between the axis of the connection inlet 5 and the axis of the connection outlet 6, and the predetermined center distance is greater than or equal to 45 mm. Such a setting method reserves sufficient installation position and space for the connector 8 described below, and is convenient for adapting to the space layout of different vehicle models, which can reduce the space layout of the entire vehicle, and at the same time can extend the length of the flow channel, thereby controlling the flow rate and flow resistance of the coolant in the flow channel, and ensuring the heat dissipation effect of the electronic components 301.

[0046] Furthermore, a plurality of spoilers 401 are provided in the liquid-cooling channel 4, each spoiler 401 having a columnar structure, and the plurality of spoilers 401 are arranged at intervals. Preferably, the plurality of spoilers 401 are concentratedly arranged within the range of the liquid-cooling channel 4 covering the plurality of electronic components 301, so as to increase the local spoiler effect of the liquid-cooling channel 4, thereby enhancing the heat dissipation effect of each electronic component 301, and the plurality of spoilers 401 are concentratedly arranged without affecting the flow velocity and flow rate of the coolant flowing in and out.

[0047] It should be noted that the liquid-cooling channel 4 has a groove structure formed by being recessed toward the inside of the liquid-cooling component 1. During the processing, the liquid-cooling channel 4 may form an opening on the plate body 101 of the liquid-cooling channel 4. A cover 402 is provided at the opening. The cover 402 is sealed and connected to the opening, so that the liquid-cooling channel 4 forms a closed space to avoid liquid leakage. Preferably, the cover 402 and the plate body 101 are connected by stir friction welding, so as to effectively block the opening of the liquid-cooling channel 4.

[0048] Furthermore, the domain control host also includes a plurality of heat-conducting bosses 7, and the plurality of heat-conducting bosses 7 are arranged in the liquid-cooling component 1. Specifically, as mentioned above, the liquid-cooling channel 4 protrudes relative to the inner surface of the board body 101, and the surface of the liquid-cooling channel 4 facing the circuit board 3 is the bottom surface of the liquid-cooling channel 4. Some of the plurality of heat-conducting bosses 7 are arranged at intervals on the outer surface of the bottom surface of the liquid-cooling channel 4, and this part of the heat-conducting bosses 7 protrudes outward relative to the bottom surface of the liquid-cooling channel 4. Another part of the plurality of heat-conducting bosses 7 are arranged at intervals along the circumference of the liquid-cooling channel 4, and this part of the heat-conducting bosses 7 also protrudes relative to the outer surface of the bottom surface of the liquid-cooling channel 4. After the circuit board 3 is placed on the mounting portion, the heat-conducting bosses 7 protrude toward the circuit board 3 and can be close to or in contact with electronic components 301 with heat dissipation requirements such as chips on the circuit board 3, so that heat exchange can be efficiently performed between the heat-conducting bosses 7 and the electronic components 301.

[0049] It should be noted that the number of thermal conductive bosses 7 is the same as the number of electronic components 301 with heat dissipation requirements, or is more than the number of electronic components 301. The distribution positions of the multiple thermal conductive bosses 7 are determined according to the layout of the electronic components 301. Each electronic component 301 is correspondingly provided with a corresponding thermal conductive boss 7, and the surface area and shape of the thermal conductive boss 7 for fitting with the electronic component 301 are adapted to the shape of the electronic component 301, so as to fully dissipate the heat of the electronic component 301.

[0050] Preferably, the area of ​​the heat-conducting boss 7 that contacts the electronic component 301 is coated with a heat-conducting gel, which can enhance the stability between the electronic component 301 and the heat-conducting boss 7 and further improve the heat exchange efficiency between the heat-conducting boss 7 and the electronic component 301. Figure 5 As shown, most of the heat-conducting bosses 7 and electronic components 301 are concentrated in the range covered by the liquid-cooling channel 4, so that the coolant can pass through the electronic components 301 with high power consumption and heat dissipation requirements when flowing in the liquid-cooling channel 4, thereby improving the local heat dissipation capacity and efficiency of the domain control host.

[0051] Furthermore, the domain control host also includes multiple connectors 8, and the multiple connectors 8 can realize multiple functions accordingly. The multiple connectors 8 are distributed on multiple side walls 102. Preferably, in this embodiment, among the four side walls 102 of the liquid cooling component 1, part of the multiple connectors 8 are arranged on the same side wall 102 as the connection inlet 5 and the connection outlet 6, and another part of the multiple connectors 8 are arranged on a side wall 102 facing the connection inlet 5 and the connection outlet 6. The domain control host provided in this embodiment regularly distributes the whole machine connectors 8 on both sides of the product, and places the water inlet and outlet on the same side, which is convenient for adapting to the spatial layout of different vehicle models and expanding the scope of application of the domain control host.

[0052] Furthermore, the domain control host also includes an antenna. The types of antennas can be but are not limited to two, such as a BT antenna / WIFI antenna. As described above, among the four side walls 102 of the liquid cooling component 1, two side walls 102 are provided with connectors 8, one of the antennas is defined as a first antenna, and the other antenna is defined as a second antenna 9. The first antenna and the second antenna 9 are separately arranged on the two side walls 102 mentioned above that are not provided with connectors 8.

[0053] A first antenna fixing portion 12 is provided on a side wall 102 of the liquid-cooling component 1. The first antenna fixing portion 12 is a notch formed by partially recessing the side wall 102 toward the inside of the liquid-cooling component 1. The first antenna is provided on the first antenna fixing portion 12, and the first antenna is electrically connected to the circuit board 3. It should be noted that the first antenna can specifically be a finished electronic device.

[0054] A second antenna fixing portion is provided on the other side wall 102 of the liquid-cooling component 1. The first antenna fixing portion 12 is a notch formed by a local depression on the side wall 102 toward the inside of the liquid-cooling component 1. The second antenna 9 is provided in the second antenna fixing portion. The second antenna 9 is specifically an "F"-shaped structure or an "inverted F"-shaped structure made of copper. A portion of the circuit board 3 extends through the side wall 102 to the second antenna 9 mounting portion, and the second antenna 9 is provided on the circuit board 3 and electrically connected to the circuit board 3. It can be seen that the domain control host provided in this embodiment arranges the two antennas separately on both sides of the liquid-cooling component 1, and the antenna and the connector 8 are also located on different walls to reduce signal interference.

[0055] Preferably, the domain control host further includes a protective cover 10. Of the first antenna fixing portion 12 and the second antenna fixing portion, at least the first antenna fixing portion 12 is provided with a protective cover 10. The protective cover 10 can prevent environmental factors such as dust and humidity from affecting or even damaging the antenna. More preferably, the protective cover 10 and the first antenna fixing portion 12 are fixed by means of a snap-fit ​​coupling and screw fastening.

[0056] Furthermore, the domain control host also includes a fixing bracket 11, which is used to fix the domain control host to a designated position. The fixing bracket 11 includes a first connection part 1101 and a second connection part 1102. The first connection part 1101 and the second connection part 1102 have an integrated structure, and the two are arranged at an angle. Preferably, the first connection part 1101 and the second connection part 1102 both have a flat plate structure. The first connection part 1101 and the second connection part 1102 are arranged vertically and are distributed in an L shape. The first connection part 1101 is connected to the side wall 102 of the liquid cooling component 1, and the second connection part 1102 is used to connect to the designated position, thereby fixing the domain control host to the designated position. It should be noted that the designated position here is specifically the designated position of the vehicle using the domain control host.

[0057] The first connection part 1101 is provided with a first connection hole, and a fastener such as a screw can be used to penetrate the first connection hole and fix the fastener to the side wall 102 of the liquid cooling component 1, so as to complete the connection between the first connection part 1101 and the liquid cooling component 1. Preferably, the number of the first connection holes is at least two. The second connection part 1102 is provided with a second connection hole, so that the second connection part 1102 can be connected to the specified position using a fastener, so as to fix the domain control host to the specified position through the fixing bracket 11.

[0058] Preferably, the thickness of the side wall 102 of the liquid-cooled component 1 is not less than 7 mm, and threaded holes are reserved on the side wall 102 to facilitate the connection of fasteners. Moreover, since the wall thickness of the liquid-cooled component 1 is thick enough, screw holes are reserved so that the fasteners can be directly connected to the side wall 102 of the liquid-cooled component 1, thereby eliminating the need to provide connecting ears on the liquid-cooled component 1.

[0059] Preferably, in this embodiment, there are multiple fixing brackets 11, and each fixing bracket 11 is detachably connected to the liquid cooling component 1, eliminating the setting of the traditional fixed connecting ear, so that the domain control host has a higher degree of freedom in connection with the designated position, is applicable to more vehicle models, and improves the versatility of the domain control host.

[0060] To sum up, the domain control host provided by the present application combines the shell and the liquid cooling plate in structure and function. The liquid cooling component 1 can not only encapsulate and protect the internal circuit board 3 and the electronic components 301 on the circuit board 3, but also dissipate heat for the electronic components 301. It not only effectively controls the production cost of the domain control host, but also facilitates the lightweight setting of the domain control host.

[0061] In addition, the domain control host provided in the present application integrates the liquid cooling component 1, the connection inlet 5, the connection outlet 6 and the liquid cooling channel 4 into an integrated design, which significantly improves the sealing reliability and stability of the cooling liquid supply and flow processes compared to the traditional disassembly and assembly method, while reducing the size of the domain control host and improving the versatility and platform nature of the upgrade.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A domain control host, characterized in that: include: A liquid cooling component, wherein the liquid cooling component is provided with a liquid cooling channel; the liquid cooling component is also provided with a connecting inlet and a connecting outlet, wherein the connecting inlet and the connecting outlet are respectively connected to the liquid cooling channel; A circuit board, the liquid cooling member is provided with a mounting portion, the circuit board is arranged on the mounting portion; the circuit board is provided with electronic components, the electronic components are arranged facing the outer wall surface of the liquid cooling channel, and the flow path defined by the liquid cooling channel passes through the electronic components; A cover plate is connected to the liquid cooling component to fix the circuit board in the mounting portion.

2. The domain control host according to claim 1, characterized in that: The liquid cooling component comprises: Plate body; A plurality of side walls, wherein the plurality of side walls are connected end to end in sequence and are disposed on the plate body; The liquid cooling channel is arranged on one side of the plate body where the side wall is arranged, and the side wall is arranged around the liquid cooling channel; The connection inlet and the connection outlet are arranged on the side wall.

3. The domain control host according to claim 2, characterized in that: The connection inlet and the connection outlet are arranged at intervals on the same side wall; A predetermined center distance is formed between the connection inlet and the connection outlet, and the predetermined center distance is not less than 45 mm.

4. The domain control host according to claim 2, characterized in that: The domain control host further includes a plurality of heat-conducting bosses, the liquid-cooling channel protrudes relative to the surface of the board body, and the plurality of heat-conducting bosses are arranged at intervals on the outer wall surface of the liquid-cooling channel; The number of the heat-conducting bosses is not less than the number of the electronic components, and each of the heat-conducting bosses is correspondingly bonded to one of the electronic components.

5. The domain control host according to claim 1, characterized in that: A spoiler is arranged in the liquid cooling channel, and the number of the spoilers is multiple, and the multiple spoilers are arranged at intervals.

6. The domain control host according to claim 1, characterized in that: The domain control host also includes a fixing bracket, and the fixing bracket is detachably connected to the liquid cooling component.

7. The domain control host according to claim 2, characterized in that: The domain control host also includes a plurality of connectors, and the plurality of connectors are distributed on the side wall.

8. The domain control host according to claim 1, characterized in that: The liquid cooling component is also provided with an antenna fixing part, and the number of the antenna fixing parts is at least two; at least part of the antenna fixing parts is provided with a protective cover.

9. The domain control host according to claim 2, characterized in that: The thickness of the side wall is not less than 7 mm.

10. The domain control host according to any one of claims 1 to 9, characterized in that: The connection inlet and the connection outlet have an integral structure with the liquid cooling component.

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