Computer heat dissipation module

Abstract

The utility model relates to the technical field of heat dissipation modules, and discloses a computer heat dissipation module, which comprises a shell, a heat dissipation module, a heat dissipation module and a heat dissipation module, the heat dissipation fins are arranged on the back face of the shell, and side plates are installed on the two sides of the back face of the shell; and the mounting rods are arranged on the inner sides of the side plates, and cleaning pieces are evenly mounted between the mounting rods. Heat in a computer can be absorbed through the heat dissipation fins, air can be blown into the computer by starting the fan, the heat can be dissipated in a convection mode through the heat dissipation fins when the air is blown into the computer, and therefore heat dissipation treatment is conducted on the computer, and the cleaning piece can be driven to move by moving the mounting rod. According to the computer heat dissipation device, the cleaning pieces can be inserted into the gaps of the heat dissipation fins, so that dust in the gaps of the heat dissipation fins is cleaned, the surfaces of the heat dissipation fins cannot be covered by thick dust, and the heat dissipation fins can absorb heat in a computer more effectively.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation modules, in particular to a computer heat dissipation module. Background Art

[0002] The computer cooling module is a very important component of computer hardware. Its main function is to help core components such as processors and graphics cards dissipate heat to maintain the normal operation of the computer.

[0003] A common computer cooling module is generally composed of a casing, a fan and cooling fins. The fan blows the inhaled hot air to the surface of the cooling fins. After the cooling fins absorb the heat in the computer, they dissipate the heat by convection, thereby cooling the computer. However, after the cooling fins cool the computer for a long time, a large amount of dust will be absorbed on the surface of the cooling fins. Over time, the surface of the cooling fins will be covered with thick dust, causing the cooling fins to be hindered by the dust when absorbing the heat inside the computer, thereby reducing the cooling effect of the cooling module. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the utility model provides a computer heat dissipation module to solve the problem that the surface of the heat dissipation fins proposed in the above background technology will also absorb a large amount of dust. Over time, the surface of the heat dissipation fins will be covered with thick dust, causing the heat dissipation fins to be hindered by the dust when absorbing the heat inside the computer, thereby reducing the heat dissipation effect of the heat dissipation module.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical solution: a computer heat dissipation module, comprising:

[0008] A housing, wherein a fan is installed in an inner cavity of the housing;

[0009] A heat-conducting base is arranged at the bottom of the shell, and heat-conducting pipes are installed on both sides of the heat-conducting base, and the heat-conducting pipes are connected to the surface of the shell;

[0010] The heat dissipation fins are arranged on the back of the housing, and side panels are installed on both sides of the back of the housing;

[0011] The mounting rods are arranged on the inner side of the side plates, and cleaning sheets are evenly installed between the mounting rods.

[0012] Preferably, connecting rods are installed on the surface of the mounting rods, connecting plates are installed on both sides of the connecting rods, and pushing rods are installed on the surfaces of the connecting plates through hinge structures, so that the pushing rods can be folded, and the mounting rods can be pushed by the pushing rods, thereby driving the cleaning sheet to move.

[0013] Preferably, a clamping block is installed on the surface of the push rod, and a clamping groove is opened on the surface of the connecting rod. The clamping block cooperates with the clamping groove to clamp the push rod to the surface of the connecting rod.

[0014] Preferably, sliders are installed on the upper and lower surfaces of the mounting rod, and sliding grooves are opened on the surfaces of the side panels. The sliders are embedded in the inner cavity of the sliding grooves. The sliders cooperate with the sliding grooves to limit the mounting rod so that the mounting rod can move linearly.

[0015] Preferably, mounting plates are installed on both sides of the housing, and threaded rods are evenly screwed on the surface of the mounting plates, so that the mounting plates can be installed on the surface of the computer through the threaded rods, thereby installing the housing.

[0016] Preferably, fixing plates are installed on both sides of the back side of the heat sink fins, fixing holes are opened on the fixing plates and the surface of the shell, and fixing rods are screwed into the inner cavities of the fixing holes, and the fixing plates can be connected to the shell through the fixing rods, so as to install the heat sink fins.

[0017] Beneficial Effects

[0018] Compared with the prior art, the utility model provides a computer heat dissipation module, which has the following beneficial effects:

[0019] The computer heat dissipation module can absorb the heat in the computer through the heat dissipation fins. When the fan is started, the air can be blown into the computer. When blowing toward the computer, the air will pass through the heat dissipation fins and dissipate the heat in the form of convection, thereby performing heat dissipation treatment on the computer. The cleaning sheet can be driven to move by moving the mounting rod. The cleaning sheet can be inserted into the gap between the heat dissipation fins to clean the dust in the gap between the heat dissipation fins, so that the surface of the heat dissipation fins will not be covered with thick dust. The heat dissipation fins can absorb the heat inside the computer more effectively, thereby improving the heat dissipation effect of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the cross-sectional structure of the utility model;

[0022] Figure 3 It is an exploded stereogram of the utility model;

[0023] Figure 4 It is a schematic diagram of the connection structure of the connecting rod and the pushing rod of the utility model.

[0024] In the figure: 1. casing; 2. fan; 3. heat-conducting base; 4. heat-conducting pipe; 5. heat-dissipating fins; 6. side panel; 7. mounting rod; 8. cleaning sheet; 9. connecting rod; 10. connecting plate; 11. pushing rod; 12. clamping block; 13. clamping groove; 14. slider; 15. slide groove; 16. mounting plate; 17. threaded rod; 18. fixing plate; 19. fixing rod; 20. fixing hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The utility model provides a technical solution, a computer heat dissipation module, see Figure 1 , comprising a housing 1, wherein a fan 2 is installed in the inner cavity of the housing 1;

[0027] A heat-conducting base 3 is arranged at the bottom of the housing 1, and heat-conducting pipes 4 are installed on both sides of the heat-conducting base 3, and the heat-conducting pipes 4 are connected to the surface of the housing 1;

[0028] The heat dissipation fins 5 are arranged on the back of the housing 1, and side panels 6 are installed on both sides of the back of the housing 1;

[0029] The mounting rods 7 are arranged on the inner side of the side plates 6. Cleaning sheets 8 are evenly installed between the mounting rods 7. The heat sink fins 5 can absorb the heat in the computer. The fan 2 can be started to blow air into the computer. When blowing toward the computer, the air will pass through the heat sink fins 5 and dissipate the heat in the form of convection, thereby performing heat dissipation treatment on the computer. The cleaning sheets 8 can be driven to move by moving the mounting rods 7. The cleaning sheets 8 will be inserted into the gaps between the heat sink fins 5, thereby cleaning the dust in the gaps between the heat sink fins 5, so that the surface of the heat sink fins 5 will not be covered with thick dust. The heat sink fins 5 can absorb the heat inside the computer more effectively, thereby improving the heat dissipation effect of the heat dissipation module.

[0030] See also Figure 3 , the surface of the mounting rod 7 is mounted with a connecting rod 9, see Figure 4, connecting plates 10 are installed on both sides of the connecting rod 9, and push rods 11 are installed on the surface of the connecting plate 10 through a hinge structure, so that the push rods 11 can be folded, and the installation rod 7 can be pushed by the push rods 11, thereby driving the cleaning sheet 8 to move;

[0031] The surface of the push rod 11 is provided with a clamping block 12, and the surface of the connecting rod 9 is provided with a clamping groove 13. The clamping block 12 cooperates with the clamping groove 13 to clamp the push rod 11 to the surface of the connecting rod 9;

[0032] See also Figure 2 Slide blocks 14 are installed on the upper and lower parts of the surface of the mounting rod 7, and slide grooves 15 are opened on the surface of the side plates 6. The slide blocks 14 are embedded in the inner cavity of the slide grooves 15. The slide blocks 14 cooperate with the slide grooves 15 to limit the mounting rod 7 so that the mounting rod 7 can move linearly;

[0033] See also Figure 1 , mounting plates 16 are installed on both sides of the housing 1, and threaded rods 17 are evenly screwed on the surface of the mounting plates 16, and the mounting plates 16 can be installed on the surface of the computer through the threaded rods 17, so as to install the housing 1;

[0034] See also Figure 3 Fixing plates 18 are installed on both sides of the back of the heat sink fins 5. Fixing holes 20 are opened on the surfaces of the fixing plates 18 and the shell 1. Fixing rods 19 are screwed into the inner cavities of the fixing holes 20. The fixing plates 18 can be connected to the shell 1 through the fixing rods 19, so that the heat sink fins 5 can be installed.

[0035] The device first connects the fixing plate 18 with the shell 1 through the fixing rod 19, thereby installing the heat sink fins 5, and the mounting plate 16 can be installed on the surface of the computer through the threaded rod 17, thereby installing the shell 1, and then the heat sink fins 5 can absorb the heat in the computer, and the fan 2 can be started to blow air into the computer. When blowing towards the computer, the air will pass through the heat sink fins 5, and the heat will be dissipated in the form of convection, thereby cooling the computer, and the cleaning sheet 8 can be driven to move by moving the mounting rod 7. The cleaning sheet 8 will be inserted into the gap between the heat sink fins 5, thereby cleaning the dust in the gap between the heat sink fins 5, so that the surface of the heat sink fins 5 will not be covered with thick dust, and the heat sink fins 5 can more effectively absorb the heat inside the computer, thereby improving the heat dissipation effect of the heat sink module, and finally the cleaning sheet 8 is pulled out from the heat sink fins 5, and the push rod 11 is folded.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer heat dissipation module, characterized in that: include: A housing (1), wherein a fan (2) is installed in an inner cavity of the housing (1); A heat-conducting base (3) is arranged at the bottom of the outer shell (1), and heat-conducting pipes (4) are installed on both sides of the heat-conducting base (3), and the heat-conducting pipes (4) are connected to the surface of the outer shell (1); Heat dissipation fins (5) are arranged on the back side of the housing (1), and side panels (6) are installed on both sides of the back side of the housing (1); The mounting rods (7) are arranged on the inner side of the side plate (6), and cleaning sheets (8) are evenly installed between the mounting rods (7).

2. A computer heat dissipation module according to claim 1, characterized in that: The surface of the installation rod (7) is installed with a connecting rod (9), both sides of the connecting rod (9) are installed with a connecting plate (10), and the surface of the connecting plate (10) is installed with a pushing rod (11) via a hinge structure.

3. A computer heat dissipation module according to claim 2, characterized in that: A clamping block (12) is installed on the surface of the push rod (11), and a clamping groove (13) is opened on the surface of the connecting rod (9).

4. A computer heat dissipation module according to claim 1, characterized in that: Slide blocks (14) are installed on the upper and lower parts of the surface of the installation rod (7), and slide grooves (15) are opened on the surface of the side plate (6), and the slide blocks (14) are embedded in the inner cavity of the slide grooves (15).

5. A computer heat dissipation module according to claim 1, characterized in that: Mounting plates (16) are mounted on both sides of the housing (1), and threaded rods (17) are evenly screwed onto the surfaces of the mounting plates (16).

6. A computer heat dissipation module according to claim 1, characterized in that: Fixing plates (18) are installed on both sides of the back of the heat dissipation fins (5), fixing holes (20) are opened on the surfaces of the fixing plates (18) and the shell (1), and fixing rods (19) are screwed into the inner cavities of the fixing holes (20).

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