Novel adjustable resistor and resistor module

Abstract

The utility model relates to a novel adjustable resistor and a resistor module. The novel resistor comprises a substrate, a left outer electrode, a right outer electrode, a left inner electrode, a right inner electrode, a left bonding pad, a right bonding pad and a plurality of metal wires, wherein the left outer electrode and the right outer electrode are placed on the outer side of the substrate, and the left inner electrode and the right inner electrode are placed on the inner side of the substrate; the left bonding pad is placed on the left inner electrode, and the right bonding pad is placed on the right inner electrode; the left inner electrode and the right inner electrode are connected through N metal wires and are integrally formed by adopting an SIP (Session Initiation Protocol) packaging process; according to the utility model, by adjusting the material and the number of the metal wires, a resistor with any resistance value within 0.5-999 M omega, any precision within + / -0.5%-+ / -10% and any power within 1 / 32W-10W can be obtained.

Description

Technical Field

[0001] The utility model relates to the technical field of resistors, and in particular to a novel adjustable resistor and a resistor module. Background Art

[0002] Resistors are one of the most common basic components in circuits. Their function is to limit the flow of current, reduce voltage, generate heat, and can be used to adjust circuit characteristics. In general, resistors play a role in controlling current and voltage in circuits.

[0003] At present, resistors on the market are divided into two types: chip resistors and precision resistors. However, both chip resistors and precision resistors have limited resistance values ​​and sizes. When we need a resistor with an unusual resistance value or package size, we cannot buy it directly, but need to customize a special resistor, which takes a lot of time and money.

[0004] Some circuit designs require thin resistors, but currently available resistors cannot meet the requirements of such circuit designs. Utility Model Content

[0005] In order to solve the above technical problems, the utility model proposes a new type of adjustable resistor and resistor module; its structure is exquisite, and the size, resistance value and power of the resistor can be changed through simple process adjustment, which meets the requirements of the size, resistivity and power of different resistors in circuit design.

[0006] In a first aspect, the utility model provides a novel adjustable resistor, comprising: the electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode.

[0007] The left outer electrode and the right outer electrode are respectively attached to two sides of one side of the substrate.

[0008] The left inner electrode and the right inner electrode are respectively attached to two sides of the other surface of the substrate and correspond to the positions of the left outer electrode and the right outer electrode.

[0009] The left inner electrode and the right inner electrode are connected by N metal wires and are integrally formed by a SIP packaging process; wherein N≥1.

[0010] Among them, the model parameters of each of the novel adjustable resistors are: the range of length*width is: 0.1mm*0.1mm~88.32mm*108mm; the range of thickness size is: 0.2mm~3mm.

[0011] In the above technical solution, metal wires are arranged to connect the inner electrodes. Through this design, the resistance value of the resistor can be adjusted by adjusting the number, material and length of the metal wires. The utility model can adjust the resistance value of the resistor through this design to meet the requirements of the resistance value in different circuits.

[0012] Furthermore, the pad length is equal to (N+1)*d, where d represents the spacing between each metal line.

[0013] In the above technical solution, a certain distance is set between each metal wire to prevent mutual interference between the metal wires. The metal wires are connected to the pads, so the length of the pads is sufficient to connect all the metal wires.

[0014] Furthermore, the material that can be used for the metal wire includes: any one of gold wire, silver wire, copper wire, silver alloy wire or copper alloy wire.

[0015] In the above technical solution, the material of the metal wire is specifically selected according to the resistance value.

[0016] Furthermore, the number of metal wires N=r / R, r is the resistance of the metal wire; R is the target resistance value;

[0017] The resistance of the metal wire depends on the wire diameter and wire length of the metal wire.

[0018] In the above technical solution, by adjusting the resistance value of a single metal wire, the number of metal wires can be adjusted, and then the size of the resistor can be adjusted.

[0019] Furthermore, the wire diameter of the metal wire is less than or equal to 0.0508 mm, and the wire length of the metal wire is less than or equal to 10 mm.

[0020] In the above technical solution, the wire diameter and wire length of the metal wire are specifically selected according to the resistance value.

[0021] Furthermore, the pad length is smaller than the package length of the target resistor. If not, the pad length value needs to be reduced. There are two methods at this time;

[0022] Method 1: Reduce the distance between metal wires by improving the manufacturing process.

[0023] Method 2, reducing the number of metal wires; wherein the number of metal wires is equal to the target resistance of the new resistor divided by the resistance of a single metal wire. To reduce the number of metal wires, it is necessary to reduce the resistance of a single metal wire; to reduce the resistance of a single metal wire, this can be achieved by replacing a material with better conductivity, reducing the wire length, or increasing the diameter of the wire material.

[0024] Furthermore, the constituent materials of the substrate may include: glass fiber epoxy resin, thermoplastic synthetic resin, aluminum alloy and copper alloy.

[0025] Furthermore, the left outer electrode, the right outer electrode, the left inner electrode and the right inner electrode are made of copper, and the surface is processed by gold plating or gold immersion process.

[0026] Furthermore, the SIP packaging process uses epoxy resin molding material to injection-mold the left inner electrode, the right inner electrode and N metal wires through a molding device.

[0027] In the above technical solution, the SIP packaging process can better protect the circuit or structure inside the resistor, provide mechanical support and connect electrical signals.

[0028] In a second aspect, the utility model provides a resistor module, comprising:

[0029] Panel, electrodes, pads and N metal wires.

[0030] The electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode.

[0031] A plurality of pairs of left outer electrodes and right outer electrodes are arranged in a queue on one side of the puzzle board.

[0032] A plurality of left inner electrodes and right inner electrodes are arranged on the other side of the panel, and correspond one to one with the positions of the left outer electrode and the right outer electrode.

[0033] The plurality of pairs of left inner electrodes and right inner electrodes are connected via N metal wires.

[0034] The SIP packaging process is used to package the panel, the left inner electrode and the right inner electrode into an integrated resistor module.

[0035] The resistor module can be cut to obtain a plurality of resistor components, and the resistor components are new adjustable resistors.

[0036] Furthermore, a single new type of adjustable resistor in the panel is obtained by SAW cutting, milling cutter cutting or wire cutting.

[0037] In the above technical solution, a plurality of new adjustable resistors are obtained by manufacturing a resistor module, which significantly improves the production efficiency of the new adjustable resistors.

[0038] Compared with the prior art, the beneficial effects of the utility model are as follows: metal wires are arranged to connect the inner electrodes. Through this design, the resistance value and size of the resistor can be adjusted by adjusting the number, material and length of the metal wires; at the same time, a resistor module is proposed, which can simultaneously complete the production and packaging of multiple new adjustable resistors, significantly improving the production efficiency of the new adjustable resistors. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of a novel adjustable resistor structure shown in an embodiment of the utility model.

[0040] Figure 2 It is a schematic diagram of the resistor mold structure shown in an embodiment of the utility model.

[0041] 1 is a substrate, 2-1 is a left outer electrode, 2-2 is a right outer electrode, 3 is a metal wire, 4 is a SIP package, 5-1 is a left inner electrode, 5-2 is a right inner electrode, and 6 is a panel. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] Embodiment 1: Refer to the attached Figure 1 In a preferred embodiment, the novel adjustable resistor of the utility model includes: a substrate, an electrode, a pad and a metal wire.

[0044] Furthermore, the electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode.

[0045] The left outer electrode and the right outer electrode are respectively attached to two sides of one side of the substrate.

[0046] The left inner electrode and the right inner electrode are respectively attached to two sides of the other surface of the substrate and correspond to the positions of the left outer electrode and the right outer electrode.

[0047] The left inner electrode and the right inner electrode are connected by N metal wires and are integrally formed by using a SIP packaging process; wherein N≥1.

[0048] By adjusting the length, diameter, material and quantity of the metal wire, you can get any resistance value within 0.5mΩ~999MΩ, any accuracy within ±0.5%~±10%, and any power within 1 / 32W~10W.

[0049] In an embodiment of the utility model, optionally, the obtained resistance value is 1.5 mΩ, the package size is 3.68 mm*3.2 mm, and the package thickness is 0.5 mm.

[0050] Furthermore, the pad includes a left pad and a right pad; the metal wire is fixedly connected to the left inner electrode or the right inner electrode via the pad.

[0051] The pad length is equal to (N+1)*d, where d represents the spacing between each metal line.

[0052] Furthermore, the material that can be used for the metal wire includes: any one of gold wire, silver wire, copper wire, silver alloy wire or copper alloy wire.

[0053] Furthermore, the number of metal wires N=r / R, r is the resistance of the metal wire; R is the target resistance;

[0054] The resistance of the metal wire depends on the wire diameter and wire length of the metal wire.

[0055] Furthermore, the wire diameter of the metal wire is less than or equal to 0.0508 mm, and the wire length of the metal wire is less than or equal to 10 mm.

[0056] In the embodiment of the utility model, gold wire with a diameter of 0.0254 mm is optionally selected as the material of the metal wire, but it is not limited thereto, and metal wires of other diameters and materials may also be used as long as resistance matching is achieved.

[0057] In the embodiment of the utility model, optionally, the length of the metal wire is 450um; according to the calculation formula of the internal resistance of the wire R=ρ×L / S (the resistivity of gold is approximately in the range of 2.40 to 2.44×10^-8Ω·m at 25°C), L is the length of the wire, which is 450um, and S represents the cross-sectional area of ​​the wire. It is calculated that a gold wire with a length of 450um and a diameter of 0.0254mm has an internal resistance of R=0.02149Ω; to obtain the target value of 1.5mΩ, theoretically 14.328 wires are required, but in actual wire bonding, due to the limitation of the wire bonding accuracy, the wire diameter of the material itself is not absolutely uniform, so 16 wires are usually bonded; in actual production, the length of one or several wires is usually fine-tuned to fine-tune the resistance value of the resistor.

[0058] Furthermore, the length of the pad is shorter than the length of the substrate.

[0059] In the embodiment of the utility model, it is optional to ensure that the package length of the target resistor is greater than the pad length; if not, it is necessary to reduce the pad length, and there are two methods at this time; Method 1, by improving the process, reduce the spacing between each metal wire; Method 2, reduce the number of wires; to reduce the number of wires, it is necessary to reduce the resistance of a single metal wire; to reduce the resistance of a single metal wire, you can replace the material with better conductivity or reduce the length of the metal wire or increase the wire diameter.

[0060] In the embodiment of the utility model, optionally, the spacing between each metal wire is 0.05 mm, 16 wires are punched, and the required pad width is calculated to be 17*0.05=0.85 mm; the package length of the target resistor is 3.68 mm, which is greater than the required distance of 0.85 mm.

[0061] In the embodiment of the utility model, optionally, the constituent materials of the substrate may include: glass fiber epoxy resin, thermoplastic synthetic resin, aluminum alloy and copper alloy.

[0062] In the embodiment of the utility model, optionally, the constituent material of the left outer electrode, the right outer electrode, the left inner electrode and the right inner electrode is copper, and the surface is processed by gold plating or gold immersion process.

[0063] In the embodiment of the utility model, optionally, the SIP packaging process uses epoxy resin molding material to injection-mold and package the left inner electrode, the right inner electrode and N metal wires through molding equipment.

[0064] Embodiment 2: Refer to the attached Figure 2 In a preferred embodiment, the resistor mold of the utility model includes: a panel, an electrode, a pad and N metal wires.

[0065] The electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode.

[0066] Furthermore, a plurality of pairs of left outer electrodes and right outer electrodes are arranged in a queue on one side of the panel.

[0067] A plurality of left inner electrodes and right inner electrodes are arranged on the other side of the panel, and correspond one to one with the positions of the left outer electrode and the right outer electrode.

[0068] A plurality of pairs of left inner electrodes and right inner electrodes are connected through N metal wires.

[0069] The SIP packaging process is used to package the panel, the left inner electrode and the right inner electrode into an integrated resistor module.

[0070] The resistor module can be cut to obtain multiple resistor components, that is, a new type of adjustable resistor.

[0071] In the embodiment of the utility model, optionally, a new adjustable resistor is manufactured by using a SIP package, and the specific steps are as follows:

[0072] Step 1: According to the size of the new adjustable resistor, design the size of the substrate, the size of the outer electrode and the inner electrode and their position on the substrate; the length and width of the new adjustable resistor range from 0.1mm*0.1mm to 88.32mm*108mm; the thickness range is from 0.2mm to 3mm.

[0073] The second step: panelization, placing multiple products on a large substrate; the size of the substrate can be adjusted according to actual conditions, the length and width range: 0.01m*0.01*~1.2m*1.2m; the substrate thickness range: 0.05mm~3.0mm.

[0074] Step 3: The board factory will produce the designed panels.

[0075] Step 4: Metal wire process, select the appropriate metal wire and wire bonding quantity according to the target resistance value.

[0076] Step 5: SIP process: Use molding equipment and plastic packaging materials to plasticize the entire panel.

[0077] Step 6: Cut the boards; the cutting methods usually include SAW cutting, milling cutter cutting, wire cutting, etc. to obtain a single new type of adjustable resistor in the puzzle board.

[0078] In the embodiment of the utility model, optionally, 25 new adjustable resistors are placed on each panel.

[0079] In summary, the utility model connects metal wires between the inner electrodes. Based on this design, the resistance value and size of the resistor can be adjusted by adjusting the number, material and length of the metal wires. At the same time, a resistor module is proposed, which can simultaneously complete the production and packaging of multiple new adjustable resistors, significantly improving the production efficiency of the new adjustable resistors.

[0080] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0081] In the description of the present invention, it is necessary to understand that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0082] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0083] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0084] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A new type of adjustable resistor, comprising: A substrate, an electrode, a pad and N metal wires, characterized in that, The electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode; The left outer electrode and the right outer electrode are respectively attached to two sides of one side of the substrate; The left inner electrode and the right inner electrode are respectively attached to two sides of the other surface of the substrate and correspond to the positions of the left outer electrode and the right outer electrode; The left inner electrode and the right inner electrode are connected by N metal wires and are integrally formed by a SIP packaging process; wherein N≥1; Among them, the model parameters of each of the novel adjustable resistors are: the range of length*width is: 0.1mm*0.1mm~88.32mm*108mm; the range of thickness size is: 0.2mm~3mm.

2. A novel adjustable resistor according to claim 1, characterized in that: The pads include a left pad and a right pad; the metal wire is fixedly connected to the left inner electrode or the right inner electrode via the pads; The pad length is equal to (N+1)*d, where d represents the spacing between each metal line.

3. A novel adjustable resistor according to claim 2, characterized in that: The metal wire may be made of any of gold wire, silver wire, copper wire, silver alloy wire or copper alloy wire.

4. A novel adjustable resistor according to claim 3, characterized in that: Also includes: The number of metal wires N=r / R, where r is the resistance of the metal wire; R is the target resistance; The resistance of the metal wire depends on the wire diameter and wire length of the metal wire.

5. A novel adjustable resistor according to claim 4, characterized in that: The wire diameter of the metal wire is less than or equal to 0.0508 mm, and the wire length of the metal wire is less than or equal to 10 mm.

6. A novel adjustable resistor according to claim 5, characterized in that: The length of the pad is smaller than the length of the novel adjustable resistor.

7. A novel adjustable resistor according to claim 6, characterized in that: The constituent material of the substrate may include any one of glass fiber epoxy resin, thermoplastic synthetic resin, aluminum alloy or copper alloy.

8. A novel adjustable resistor according to claim 7, characterized in that: The left outer electrode, the right outer electrode, the left inner electrode and the right inner electrode are made of copper, and their surfaces are processed by gold plating or gold immersion process.

9. A novel adjustable resistor according to claim 8, characterized in that: The SIP packaging process uses epoxy resin molding material to injection-mold the left inner electrode, the right inner electrode and N metal wires through molding equipment.

10. A resistor module, comprising: A panel, an electrode, a pad and N metal wires, characterized in that: The electrodes include a left outer electrode, a right outer electrode, a left inner electrode and a right inner electrode; A plurality of pairs of left outer electrodes and right outer electrodes are arranged in a queue on one side of the puzzle plate; A plurality of left inner electrodes and right inner electrodes are arranged on the other side of the panel, and the positions of the electrodes correspond one to one with the left outer electrodes and the right outer electrodes; The plurality of pairs of left inner electrodes and right inner electrodes are connected by N metal wires; The SIP packaging process is used to package the panel, the left inner electrode and the right inner electrode into an integrated resistor module; The resistor module can be cut to obtain a plurality of resistor components, and the resistor components are the novel adjustable resistors described in any one of claims 1-9.

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