Rib cutting structure of semiconductor chip
By designing a semiconductor chip cutting structure including cutting blades, rectangular mounting frames and mounting piles, the problem of pins upturning and chip popping during cutting knife recycling is solved, ensuring that Stability and reliability of the rib cutting process.
Patent Information
- Application Number
- CN202420198134.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-27
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-27
AI Technical Summary
In the rib cutting process of semiconductor chips, the pins may rise due to friction during the cutting knife recycling, causing the chip to pop out of the fixed port, affecting the later process.
A cutting rib structure of a semiconductor chip is designed, including four sets of cutting rib blades, rectangular mounting frames and mounting piles. Through the chip fixed pressure frame, moving piles, springs and cross plates, the expansion and contraction of the cutting rib blade and the edge of the chip are realized. to prevent pins from rising and chip ejecting.
It effectively prevents upturn caused by friction on the cutting blade, avoids the chip from ejecting the fixed port, and ensures the smooth progress of the later process.
Smart Images
Figure CN222507539U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip production, in particular to a rib cutting structure of a semiconductor chip. Background Art
[0002] Semiconductor chips usually still need to go through a series of operations after the packaging process is completed, such as post-curing, rib cutting, molding and electroplating. The rib cutting process usually involves cutting off the pins on the outside of the semiconductor, and the rib cutting structure produced by semiconductor chips is often used to achieve aligned cutting of the pins.
[0003] When the existing semiconductor chip production cutting structure is cutting, the traditional fixing method is difficult to cope with the influence of friction on the pins when the cutter is retracted. The pins may be warped up due to the friction of the blade, thereby affecting the subsequent installation of the chip, which may cause poor contact of the pins and affect the chip performance, or cause the chip to pop out of the fixing port and fall aside, affecting the subsequent process. Utility Model Content
[0004] The utility model aims to solve the problem that when the cutter is retracted, the pins may be warped up due to the friction of the blade and cause the chip to pop out of the fixed port, and a semiconductor chip cutting rib structure is provided to solve the above problem.
[0005] In view of the above-mentioned deficiencies in the prior art, the utility model provides a rib cutting structure for a semiconductor chip, comprising four groups of rib cutting blades, a rectangular mounting frame and mounting piles, wherein the four groups of rib cutting blades are respectively fixedly mounted on the inner wall of the rectangular mounting frame, an L-shaped mounting piece is mounted on the upper side of the rib cutting blade, the L-shaped mounting piece is connected to the side wall of the mounting pile, the interior of the mounting pile is a hollow structure, a movable pile is slidably mounted on the lower inner side of the mounting pile, a cross plate is mounted on the middle inner side of the mounting pile, a plurality of groups of springs are mounted between the lower side of the cross plate and the upper side of the movable pile, and a chip fixing pressure frame is mounted on the outer lower side of the movable pile.
[0006] As an improvement: a mounting bolt is respectively installed through the four side walls of the rectangular mounting frame, and a threaded hole matching the mounting bolt is provided on the rib cutting blade.
[0007] As an improvement: two groups of limit strips are provided on one side of the rib cutting blade close to the rectangular installation frame, and two groups of limit grooves matching the limit strips are provided on the inner wall of the rectangular installation frame.
[0008] As an improvement: the L-shaped mounting piece is provided with a plurality of sets of mounting bolts 2 passing through it, and the mounting pile is provided with a plurality of sets of threaded holes 2 matching the mounting bolts 2.
[0009] As an improvement: a connection frame is integrally formed on the upper side of the chip fixing pressure frame, and the connection frame is sleeved on the outer side of the lower part of the installation pile. A plurality of sets of installation bolts are provided between the connection frame and the lower part of the installation pile for cooperative connection and installation.
[0010] As an improvement: a connecting plate is installed on the top of the installation pile.
[0011] As an improvement: the lower side of the chip fixing pressing frame passes through the lower side of the rib cutting blade.
[0012] Compared with the prior art, the utility model has the following advantages: the chip fixing pressure frame can be extended and retracted inside the mounting pile by the cooperation of the moving pile, the spring and the cross plate; the four groups of rib cutting blades are mounted on the outside of the mounting pile; when the mounting pile moves downward, the edge of the semiconductor chip is pressed by the chip fixing pressure frame, and then the rib cutting is performed by the four groups of rib cutting blades; and after the rib cutting is completed, when the rib cutting blades move upward, the chip fixing pressure frame continues to press the edge of the semiconductor chip, so as to prevent the pins from rubbing on the rib cutting blades and causing them to warp downward, and also to prevent the chip from popping out of the fixing port and falling aside. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a three-dimensional structural schematic diagram of a cutting rib structure of a semiconductor chip of the utility model;
[0014] Figure 2 This is a schematic diagram of a rib cutting blade structure of a rib cutting structure of a semiconductor chip according to the utility model;
[0015] Figure 3 This is a schematic diagram of a rectangular installation frame structure of a semiconductor chip cutting structure of the utility model;
[0016] Figure 4 This is a schematic diagram of a mounting pile connection structure of a cutting rib structure of a semiconductor chip of the utility model;
[0017] Figure 5 It is a schematic diagram of the cross-sectional structure of a mounting pile of a cutting rib structure of a semiconductor chip of the utility model;
[0018] Reference table of reference numerals:
[0019] 1. Rib cutting blade; 2. Rectangular mounting frame; 3. Limiting strip; 4. Limiting groove; 5. Mounting bolt 1; 6. Threaded hole 1; 7. L-shaped mounting piece; 8. Mounting bolt 2; 9. Mounting pile; 10. Threaded hole 2; 11. Moving pile; 12. Horizontal plate; 13. Spring; 14. Chip fixing pressure frame; 15. Connecting frame; 16. Mounting bolt 3; 17. Connecting plate. DETAILED DESCRIPTION
[0020] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings.
[0021] like Figure 1 , Figure 2 , Figure 3 As shown, a rib cutting structure for a semiconductor chip comprises four groups of rib cutting blades 1, a rectangular mounting frame 2 and mounting piles 9, wherein the four groups of rib cutting blades 1 are respectively fixedly mounted on the inner wall of the rectangular mounting frame 2, and mounting bolts 5 are respectively passed through the four side walls of the rectangular mounting frame 2, and threaded holes 6 for matching the mounting bolts 5 are provided on the rib cutting blades 1, two groups of limiting strips 3 are provided on the side of the rib cutting blades 1 close to the rectangular mounting frame 2, and two groups of limiting grooves 4 for matching the limiting strips 3 are provided on the inner wall of the rectangular mounting frame 2, and the limiting strips 3 on the rib cutting blades 1 are placed inside the corresponding limiting grooves 4, and the rib cutting blades 1 are connected to the rectangular mounting frame 2 by mounting bolts 5, and the side of the rib cutting blades 1 is a bevel structure, and the edges of the four groups of rib cutting blades 1 are pressed tightly together, so that the four groups of rib cutting blades 1 form a closed rectangular structure.
[0022] An L-shaped mounting member 7 is installed on the upper side of the rib cutting blade 1, and the L-shaped mounting member 7 is connected to the side wall of the mounting pile 9. A plurality of groups of mounting bolts 8 are installed through the L-shaped mounting member 7, and a plurality of groups of threaded holes 10 matching the mounting bolts 8 are provided on the mounting pile 9. The rib cutting blade 1 and the rectangular mounting frame 2 of corresponding sizes are selected according to the size of the semiconductor chip. After the four groups of rib cutting blades 1 are connected to the rectangular mounting frame 2, an L-shaped mounting member 7 of a suitable size is selected so that the side wall of the L-shaped mounting member 7 can contact the side wall of the mounting pile 9. The L-shaped mounting member 7 is connected to the mounting pile 9 by matching the mounting bolts 8 with the threaded holes 10, so that the rib cutting blade 1 is installed on the outside of the mounting pile 9.
[0023] like Figure 1 , Figure 4 and Figure 5 As shown, a connecting plate 17 is installed on the top of the mounting pile 9, the interior of the mounting pile 9 is a hollow structure, a movable pile 11 is slidably installed on the lower inner part of the mounting pile 9, a transverse plate 12 is installed on the middle inner part of the mounting pile 9, a plurality of groups of springs 13 are installed between the lower side of the transverse plate 12 and the upper side of the movable pile 11, a chip fixing pressure frame 14 is installed on the outer side of the lower part of the movable pile 11, and a connecting frame 15 is integrally formed on the upper side of the chip fixing pressure frame 14, and the connecting frame 15 is sleeved on the mounting pile 9, a plurality of sets of mounting bolts 3 16 are provided between the connecting frame 15 and the lower part of the mounting pile 9 for connection and installation. The lower side of the chip fixing pressing frame 14 passes through the lower side of the rib cutting blade 1. A chip fixing pressing frame 14 of suitable size is selected so that the outer side of the chip fixing pressing frame 14 contacts the inner wall of the four sets of rib cutting blades 1. The connecting frame 15 is sleeved on the connecting frame 15. The connecting frame 15 is installed on the outer side of the connecting frame 15 by means of a plurality of sets of mounting bolts 3 16, so that the chip fixing pressing frame 14 is stably installed on the lower part of the mounting pile 9.
[0024] During the specific implementation of the utility model, the semiconductor chip is installed in the limiting groove dedicated to the workbench, so that the semiconductor chip is placed on the lower side of the rib cutting blade 1, and the rib cutting structure is connected to the external hydraulic lifting device through the connecting plate 17. The mounting pile 9 is pushed downward by the external hydraulic lifting device to make the lower side of the chip fixing pressure frame 14 contact the semiconductor chip first and press the semiconductor chip tightly. As the mounting pile 9 continues to move downward, the movable pile 11 moves toward the inside of the mounting pile 9 to compress the multiple groups of springs 13 until the rib cutting blade 1 cuts off the edge of the semiconductor chip. After the rib cutting is completed, the mounting pile 9 moves upward, and the rib cutting blade 1 is driven away from the semiconductor chip by the mounting pile 9. At this time, the chip fixing pressure frame 14 continues to press on the edge of the semiconductor chip to prevent the pin from rubbing on the rib cutting blade 1 and causing it to warp up. The chip fixing pressure frame 14 also prevents the chip from popping out of the limiting groove and falling aside, which affects the later process.
[0025] The above description is only a preferred embodiment of the present utility model patent and is not intended to limit the present utility model patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model patent shall be included in the protection scope of the present utility model patent.
Claims
1. A semiconductor chip cutting structure, comprising four sets of cutting blades (1), a rectangular mounting frame (2) and mounting piles (9), characterized in that: The four groups of rib cutting blades (1) are respectively fixedly mounted on the inner wall of the rectangular mounting frame (2); an L-shaped mounting member (7) is mounted on the upper side of the rib cutting blade (1); the L-shaped mounting member (7) is connected to the side wall of the mounting pile (9); the interior of the mounting pile (9) is a hollow structure; a movable pile (11) is slidably mounted on the lower inner side of the mounting pile (9); a transverse plate (12) is mounted on the middle inner side of the mounting pile (9); a plurality of groups of springs (13) are mounted between the lower side of the transverse plate (12) and the upper side of the movable pile (11); and a chip fixing pressure frame (14) is mounted on the outer lower side of the movable pile (11).
2. A semiconductor chip cutting rib structure according to claim 1, characterized in that: The four side walls of the rectangular installation frame (2) are respectively provided with installation bolts (5) passing through them, and the rib cutting blade (1) is provided with a threaded hole (6) matching the installation bolt (5).
3. The cutting rib structure of a semiconductor chip according to claim 1, characterized in that: Two groups of limiting strips (3) are provided on one side of the rib cutting blade (1) close to the rectangular installation frame (2), and two groups of limiting grooves (4) cooperating with the limiting strips (3) are provided on the inner wall of the rectangular installation frame (2).
4. The cutting rib structure of a semiconductor chip according to claim 1, characterized in that: The L-shaped mounting member (7) is provided with a plurality of sets of mounting bolts (8) passing through it, and the mounting pile (9) is provided with a plurality of sets of threaded holes (10) matching the mounting bolts (8).
5. The cutting rib structure of a semiconductor chip according to claim 1, characterized in that: A connection frame (15) is integrally formed on the upper side of the chip fixing pressure frame (14), and the connection frame (15) is sleeved on the outer side of the lower part of the installation pile (9). A plurality of sets of installation bolts (16) are provided between the connection frame (15) and the lower part of the installation pile (9) for cooperative connection and installation.
6. The cutting rib structure of a semiconductor chip according to claim 1, characterized in that: A connecting plate (17) is installed on the top of the installation pile (9).
7. The cutting rib structure of a semiconductor chip according to claim 1, characterized in that: The lower side of the chip fixing pressing frame (14) passes through the lower side of the rib cutting blade (1).