Gauge for marking bad position on back surface of wafer

Abstract

The utility model belongs to a gauge for marking bad positions on the back of a wafer, which relates to the field of semiconductor integrated circuit manufacture and comprises an upper handle, a lower handle and a connecting ring, the upper handle and the lower handle are symmetrically provided with an upper handle gauge angle and a lower handle gauge angle, the length of the gauge angles is 3 / 4 of the diameter of a silicon wafer, and the upper handle gauge angle and the lower handle gauge angle are symmetrical in size. The front end of the upper handle compass angle and the front end of the lower handle compass angle are triangular, a marking head used for marking is arranged in the upper handle compass angle, an upper handle sleeve is arranged below the upper handle, and when the silicon wafer back metal defect area clamping device is used, the pressing cap is manually controlled, the upper handle sleeve of the upper handle is moved, the marking head is exposed, and a silicon wafer back metal defect area is horizontally clamped. And marking is correspondingly completed on the front surface of the silicon wafer, so that the positions of the bad core particles can be accurately marked, and the problems of inaccurate marking of the bad core particles, influence on production efficiency in the marking process and resource waste in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to a gauge for marking bad positions on the back side of a wafer, belonging to the field of semiconductor integrated circuit manufacturing. Background Art

[0002] In the process of manufacturing semiconductor chips, it is inevitable that some impurities will contaminate the metal layer on the back of the wafer. The core particles with contaminated metal layer may fail to be packaged or the thermal resistance will increase after packaging, and the parameters of the finished product will be invalid, depending on the degree of contamination. Therefore, it is necessary to manually remove the defective core particles before packaging. Since the packaging machine can only identify the ink dots on the front of the core particles, the core particles contaminated on the back need to be manually removed at the corresponding position on the front. The wafer is opaque, and the image mirror problem needs to be considered when marking the defective area on the back to the front. Therefore, it is not possible to mark accurately when marking the defective products, which affects the production speed of the wafer. When the defective core particles are found, they need to be clamped and manually marked with a marker pen. At the same time, it is easy to produce irregular marking, which increases the production steps and affects the production efficiency. When the existing equipment marks the defective products on the front, it will expand outward one more circle, and the more expanded part may be a qualified product, which is a waste of cost. Therefore, it is urgent to invent a gauge for marking the defective position on the back of the wafer to solve the problems in the prior art. Utility Model Content

[0003] The purpose of the utility model is to provide a gauge for marking the defective position on the back of a wafer. The utility model has a simple structure and is easy to use to solve the problems raised in the above background technology. It should be understood that this overview is not an exhaustive overview of the utility model. It is not intended to determine the key or important parts of the utility model, nor is it intended to limit the scope of the utility model. In order to achieve the above purpose, the utility model provides the following technical solutions:

[0004] A gauge for marking defective positions on the back side of a wafer, comprising: an upper handle, a lower handle and a connecting ring, wherein the upper handle and the lower handle are fixedly connected via the connecting ring, the upper handle comprising an upper handle gauge angle, an ink supply tube, an upper handle sleeve, a slide guard plate, a rubber cap, an elastic bin and an ink storage bin, the upper handle gauge angle being arranged at the front end of the upper handle, a marking head being arranged at the front end of the upper handle gauge angle, two ends of the ink supply tube being respectively connected to the marking head and the ink storage bin and being in conduction therewith, the upper handle sleeve being slidably connected to the bottom of the upper handle through the slide guard plate, the rubber cap being arranged above the upper handle sleeve, the elastic bin being arranged at the rear side of the rubber cap, a lower handle gauge angle being arranged at the front end of the lower handle, the upper handle gauge angle and the lower handle gauge angle both being in a triangular structure, and the upper handle gauge angle and the lower handle gauge angle being symmetrically arranged.

[0005] Furthermore, a compass sleeve is provided at the front of the upper handle sleeve, the compass sleeve is a triangular structure and a groove is provided at the front of the compass sleeve, the position of the groove corresponds to the position of the marking head, the depth of the groove corresponds to the thickness of the marking head, the middle part of the upper handle sleeve is a straight plate structure, the rear part of the upper handle sleeve is inclined upward at 30°, a U-shaped groove notch is provided at the inclined part at the rear of the upper handle sleeve, and the width of the U-shaped groove notch corresponds to the width of this section of the upper handle, a rubber cap is provided on the upper surface of the inclined part at the rear of the upper handle sleeve, the tail end of the upper handle sleeve is fixedly connected to the elastic bin, and the height of the tail end of the upper handle sleeve corresponds to the height of the elastic bin.

[0006] Furthermore, the ink supply tube is arranged inside the upper handle, the front end of the ink supply tube is fixedly connected to the marking head, and the rear end of the ink supply tube is fixedly connected to the ink storage bin.

[0007] Furthermore, the slide guard plate is two C-shaped grooves, and the slide guard plates are respectively arranged on both sides of the upper handle and fixedly connected to the upper handle. The left and right sides of the bottom surface of the upper handle sleeve are respectively overlapped with the two C-shaped grooves. The C-shaped grooves support the upper handle sleeve, and the upper handle sleeve can slide back and forth in the slide guard plate. The distance from the front end of the slide guard plate to the tail end of the upper handle angle corresponds to the length of the upper handle angle.

[0008] Furthermore, a group of symmetrically arranged springs are provided in the elastic chamber.

[0009] The beneficial effects of the utility model are:

[0010] The utility model solves the deficiencies in the prior art operation by setting a gauge for marking the bad position on the back of the wafer. The lengths of the upper handle gauge angle, the lower handle gauge angle and the gauge angle sleeve are all 3 / 4 of the diameter of the silicon wafer, and the upper handle gauge angle is symmetrical with the lower handle gauge angle in size. The front ends of the upper handle gauge angle and the lower handle gauge angle are triangular, which is convenient for accurately marking the position of the bad core particles. The gauge is made of Taifulong material, which has high electrical insulation and chemical stability, and meets the needs of wafer marking. When in use, the front end of the lower handle gauge angle points to the edge of the bad metal area on the back of the wafer. Since the upper and lower gauge angles are completely symmetrical, the front section of the upper handle gauge angle points to the surface of the core particle pattern on the front of the wafer. At the same time, the bad position is marked by the marking head, which reduces the steps of the marking operation, accurately marks the bad core particles, and the marking is standardized and accurate. The overall operation is done in one go, saving marking time.

[0011] The utility model adopts a symmetrical design, the equipment is simple, and the operation is convenient, which solves the problems in the prior art that the marking of bad core particles is inaccurate, the marking process affects the production efficiency, and there is a waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of the utility model;

[0013] Figure 2 This is a front view of the upper handle of the utility model;

[0014] Figure 3 It is a top view of the upper handle of the utility model;

[0015] Figure 4 It is a structural schematic diagram of the upper handle sleeve of the utility model;

[0016] Figure 5 It is a schematic diagram of the front end structure of the upper handle of the utility model.

[0017] Numbers in the figure: 1. upper handle, 2. lower handle, 3. upper handle angle gauge, 4. lower handle angle gauge, 5. angle gauge sleeve, 6. slide guard plate, 7. rubber cap, 8. elastic chamber, 9. ink storage chamber, 10. upper handle sleeve, 11. ink supply tube, 12. marking head, 13. connecting ring, 14. spring, 15. groove, 16. U-shaped groove notch, 17. C-shaped groove. DETAILED DESCRIPTION

[0018] The utility model is a gauge for marking defective positions on the back of a wafer. The technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] A gauge for marking a defective position on the back of a wafer, comprising: an upper handle 1, a lower handle 2 and a connecting ring 13, wherein the upper handle 1 and the lower handle 2 are fixedly connected by the connecting ring 13, and the positions of the upper handle 1 and the lower handle 2 are symmetrical, so as to facilitate the wafer to be clamped and marked, the upper handle 1 comprises an upper handle gauge angle 3, an ink delivery tube 11, an upper handle sleeve 10, a slideway guard plate 6, a rubber cap 7, an elastic chamber 8 and an ink storage chamber 9, the upper handle gauge angle 3 is arranged at the front end of the upper handle 1, a marking head 12 is arranged at the front end of the upper handle gauge angle 3, and the two ends of the ink delivery tube 11 are respectively connected to the marking head 12 and the ink storage chamber 9 And it is connected with it, the ink delivery tube 11 transports ink in the ink storage tank 9 to the marking head 12, the upper handle sleeve 10 is slidably connected to the bottom of the upper handle 1 through the slide guard plate 6, and the upper handle sleeve 10 can slide under the upper handle 1 under the action of the slide guard plate 6. The rubber cap 7 is arranged above the upper handle sleeve 10 to increase friction, and the thumb can easily manipulate the forward and backward movement of the upper handle sleeve 10. The elastic bin 8 is arranged on the rear side of the rubber cap 7, and the front end of the lower handle 2 is provided with a lower handle angle 4. The front ends of the upper handle angle 3 and the lower handle angle 4 are both triangular, and the upper handle angle 3 and the lower handle angle 4 are symmetrically arranged.

[0020] In some embodiments, the front portion of the upper handle sleeve 10 is a guide sleeve 5, the guide sleeve 5 is a triangular structure and a groove 15 is provided at the front portion of the guide sleeve 5, the position of the groove 15 corresponds to the position of the marking head 12, and the depth of the groove 15 corresponds to the thickness of the marking head 12, which is convenient for covering the marking head 12, the middle portion of the upper handle sleeve 10 is a straight plate structure, the rear portion of the upper handle sleeve 10 is inclined upward at 30°, a U-shaped groove notch is provided at the rear portion of the upper handle sleeve 10, and the width of the U-shaped groove notch corresponds to the width of this section of the upper handle 1, which is convenient for this section of the upper handle 1 to pass through the U-shaped groove notch at the rear portion of the upper handle sleeve 10, a rubber cap 7 is provided on the upper surface of the rear portion of the upper handle sleeve 10, the rear end of the upper handle sleeve 10 is fixedly connected to the elastic bin 8, and the height of the rear end of the upper handle sleeve 10 corresponds to the height of the elastic bin 8, so that the upper handle sleeve 10 can partially enter the elastic bin 8.

[0021] In some embodiments, the ink supply tube 11 is disposed inside the upper handle 1, the front end of the ink supply tube 11 is fixedly connected to the marking head 12, and the rear end of the ink supply tube 11 is fixedly connected to the ink storage tank 9. The ink storage tank 9 continuously provides ink to the marking head 12 through the ink supply tube 11 to ensure that the marking head 12 marks the wafer.

[0022] In some embodiments, the slide guard plate 6 is two C-shaped grooves 17, and the slide guard plate 6 is respectively arranged on both sides of the upper handle 1 and fixedly connected to the upper handle 1. The left and right sides of the bottom surface of the upper handle sleeve 10 are respectively overlapped with the two C-shaped grooves 17. The upper handle sleeve 10 is in the slide guard plate 6, and the C-shaped grooves 17 support the upper handle sleeve 10. The upper handle sleeve 10 slides back and forth in the slide guard plate. The distance from the front end of the slide guard plate 6 to the tail end of the upper handle angle 3 corresponds to the length of the upper handle angle 3, so that the guard plate slide 6 has enough sliding space.

[0023] In some embodiments, a group of symmetrically arranged springs 14 are provided in the elastic chamber 8. When the rubber cap 7 is pressed to compress the elastic chamber 8, the spring 14 contracts, and the upper handle sleeve 10 compresses the spring 14. When the rubber cap 7 is released, the spring 14 recovers, pushing the upper handle sleeve 10 to move forward, driving the rubber cap 7 to return to its original position.

[0024] In some embodiments, the lengths of the upper handle angle 3, the lower handle angle 4 and the angle sleeve 5 are all 3 / 4 of the diameter of the silicon wafer, which can accurately mark the metal bad area on the back of the wafer, making it convenient to accurately mark the bad area on the back of the wafer at the corresponding position on the front of the wafer.

[0025] In some embodiments, the gauge is made of Taifulong material, which has high electrical insulation, chemical stability and corrosion resistance, and can effectively meet the usage requirements of the wafer marking process.

[0026] Example

[0027] See also Figure 1 - Figure 4 , the utility model provides a technical solution:

[0028] A gauge for marking the defective position on the back side of a wafer. When in use, the defective position on the back side of a defective core particle needs to be determined first. After locking the defective position, the handheld gauge is extended horizontally toward the contaminated wafer, and the upper handle 1 is kept above the wafer and the lower handle 2 is kept below the wafer. The position of the lower handle 2 is adjusted so that the triangular lower handle angle 4 can accurately find the position of the impurity contamination. When in use, because the upper handle angle 3 and the lower handle angle 4 are completely symmetrical up and down, that is, the position corresponding to the upper handle angle 3 is the front side of the wafer contaminated by impurities, at this time, the thumb is used to press the rubber cap 7 backwards, and the rubber cap 7 is pressed into the elastic chamber 8 to compress the spring 14, driving the upper handle sleeve 10 to move backwards along the slide guard plate 6, and the angle sleeve 5 moves backwards to expose the marking head 12, and the upper handle 1 and the lower handle 2 are pressed, and the marking head 12 marks the front side of the wafer, that is, the front side marking of the waste product in the defective metal area on the back side is completed.

[0029] A gauge for marking defective positions on the back of a wafer. The gauge is made of Taifulong material and has high electrical insulation and chemical stability. When simple clamping does not require marking, the gauge can be used for clamping by holding an upper handle 1 and a lower handle 2 without pressing a rubber cap 7.

[0030] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A gauge for marking defective positions on the back side of a wafer, characterized in that: include: An upper handle, a lower handle and a connecting ring, wherein the upper handle and the lower handle are fixedly connected via a connecting ring, the upper handle comprising an upper handle angle, an ink supply tube, an upper handle sleeve, a slide guard plate, a rubber cap, an elastic bin and an ink storage bin, the upper handle angle being arranged at the front end of the upper handle, a marking head being arranged at the front end of the upper handle angle, two ends of the ink supply tube being respectively connected to the marking head and the ink storage bin and being in conduction therewith, the upper handle sleeve being slidably connected to the bottom of the upper handle through the slide guard plate, the rubber cap being arranged above the upper handle sleeve, the elastic bin being arranged at the rear side of the rubber cap, a lower handle angle being arranged at the front end of the lower handle, the upper handle angle and the lower handle angle both being in a triangular structure, and the upper handle angle and the lower handle angle being symmetrically arranged.

2. A gauge for marking defective positions on the back side of a wafer according to claim 1, characterized in that: A compass sleeve is provided at the front of the upper handle sleeve, the compass sleeve is a triangular structure and a groove is provided at the front of the compass sleeve, the position of the groove corresponds to the position of the marking head, the depth of the groove corresponds to the thickness of the marking head, the middle part of the upper handle sleeve is a straight plate structure, the rear part of the upper handle sleeve is inclined upward at 30°, a U-shaped groove notch is provided at the inclined part at the rear of the upper handle sleeve, and the width of the U-shaped groove notch corresponds to the width of this section of the upper handle, a rubber cap is provided on the upper surface of the inclined part at the rear of the upper handle sleeve, the tail end of the upper handle sleeve is fixedly connected to the elastic bin, and the height of the tail end of the upper handle sleeve corresponds to the height of the elastic bin.

3. A gauge for marking defective positions on the back side of a wafer according to claim 1, characterized in that: The ink delivery tube is arranged inside the upper handle, the front end of the ink delivery tube is fixedly connected to the marking head, and the rear end of the ink delivery tube is fixedly connected to the ink storage bin.

4. A gauge for marking defective positions on the back side of a wafer according to claim 1, characterized in that: The slide guard plate is two C-shaped grooves, and the slide guard plates are respectively arranged on both sides of the upper handle and fixedly connected to the upper handle. The left and right sides of the bottom surface of the upper handle sleeve are respectively overlapped with the two C-shaped grooves. The C-shaped grooves support the upper handle sleeve, and the upper handle sleeve can slide back and forth in the slide guard plate. The distance from the front end of the slide guard plate to the tail end of the upper handle angle corresponds to the length of the upper handle angle.

5. A gauge for marking defective positions on the back side of a wafer according to claim 1, characterized in that: A group of symmetrically arranged springs are arranged in the elastic chamber.

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