PDBS packaging straight pin patch bridge rectifier and frame structure thereof
By designing the PDBS packaged straight-pin patch rectifier bridge stack and its frame structure, the problem of cumbersome and easy to install the chip in the existing chip frame is solved, and the fast and accurate installation of the patch and the thin and light chip frame are achieved. Designed to improve production efficiency and chip emissions.
Patent Information
- Application Number
- CN202420640554.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-30
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-03-30
AI Technical Summary
The existing chip framework uses Haigu's foot chips, which are cumbersome to install and take up a large space, resulting in an increase in overall thickness and reduce the number of chip emissions. It is easy to have installation reverse and installation errors, and lack of anti-free design.
Design a PDBS packaged straight-lead patch rectifier bridge stack and its frame structure, including the patch package frame body, with patch installation grooves, anti-blind angles, telescopic shrapnel and limit blocks inside to ensure patch embedded Installation, prevent installation errors and reduce weight and thickness through hollow grooves.
The fast and accurate installation of the patch is achieved, the installation reverse and error problems are avoided, the thickness and weight of the chip frame is reduced, and the production efficiency and the emission amount of chip are improved.
Smart Images

Figure CN222507629U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of bridge stack frames, and in particular to a PDBS packaged straight pin patch rectifier bridge stack and a frame structure thereof. Background Art
[0002] As the chip carrier of the integrated circuit, the frame is a key structural component that uses bonding wires to achieve electrical connection between the internal circuit lead-out terminals of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect with external wires. Chip frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.
[0003] The authorization announcement number CN218602426U discloses a high-resistance and low-stress chip frame, wherein the upper sheet includes an upper frame body, a lower frame body and an upper sheet bridge stack, and the lower sheet includes an upper frame body, a lower frame body and a lower sheet bridge stack, and at least one of the upper sheet bridge stack and the lower sheet bridge stack is provided, and the upper sheet bridge stack and the lower sheet bridge stack are respectively arranged equidistantly on the upper sheet and the lower sheet, and the upper sheet bridge stack on the upper sheet is arranged correspondingly to the lower sheet bridge stack on the lower sheet; transverse reinforcement ribs are arranged at the middle position of the upper sheet and the lower sheet; a first welding part is arranged on both sides of the upper sheet bridge stack, and a second welding part is arranged on both sides of the lower sheet bridge stack, and the upper sheet bridge stack and the lower sheet bridge stack are fitted with a burr panel. The frame increases the number of core workstations, and more cores can be produced and processed at the same time. The structural strength of the frame is increased by means of the transverse reinforcement ribs, which can prevent distortion during processing and improve the stability of core placement, thereby improving the production efficiency of the frame.
[0004] However, in the above technical solution, a seagull-foot chip is used in the chip frame, and the seagull foot is L-shaped, which is cumbersome to install and occupies a large space, thereby increasing the overall thickness of the chip frame and reducing the number of chips that can be installed. In addition, the installation process is prone to reverse installation and incorrect installation, and there is a lack of fool-proof design. Therefore, it is necessary to design a PDBS packaged straight-pin chip rectifier bridge stack and its frame structure to solve the above problems. Utility Model Content
[0005] In view of the fact that the chip frame in the background technology uses seagull-foot chips, the seagull foot is L-shaped, the installation is cumbersome, and it takes up a large space, which increases the overall thickness of the chip frame and reduces the number of chips discharged. In addition, the installation process is prone to reverse installation and installation errors, and there is a lack of fool-proof design. A PDBS packaged straight-pin patch rectifier bridge stack and its frame structure are proposed.
[0006] The utility model proposes a PDBS package straight pin patch rectifier bridge stack and its frame structure, including a patch package frame body, the patch package frame body includes a lower stack bridge mounting plate and an upper stack bridge mounting plate, the inside of the patch package frame body is evenly provided with patch mounting grooves, the inside of the patch mounting grooves is provided with pins, and one side of the patch mounting groove is provided with an anti-fool bevel.
[0007] Preferably, a hollow groove is symmetrically provided inside the patch mounting groove, a telescopic spring piece is provided inside the hollow groove, and a limiting block is provided on one side of the telescopic spring piece.
[0008] Preferably, the limiting block is in a truncated cone shape, and pitting is provided on the side where the two limiting blocks are close to each other.
[0009] Preferably, a heat dissipation groove is provided inside the patch mounting groove.
[0010] Preferably, the upper and lower ends of the lower stack bridge mounting plate and the patch mounting slot are both provided with positioning slots and mounting holes.
[0011] Preferably, hollow grooves are evenly formed inside the chip packaging frame body.
[0012] Preferably, the side thickness of the SMD packaging frame body is five millimeters.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] 1. The patch installation slot, anti-fool bevel and telescopic spring are provided. The patch installation slot is a flat-angle patch design slot, so that the patch can be embedded and installed. The anti-fool bevel adopts an anti-fool design to avoid the patch being installed incorrectly or reversely. The patch bevel must be installed correspondingly to achieve engagement. By squeezing the limit block, the limit block squeezes the internal telescopic spring. The two sides of the limit block directly act on the two sides of the patch to clamp it, which is convenient for welding the patch to prevent it from falling.
[0015] 2. By providing the heat dissipation slot and the hollow slot, the patch installation slot and the patch fit tightly together. The heat dissipation slot is on the back of the patch, which can help the patch dissipate heat on the one hand, and reduce the weight burden of the patch packaging frame body on the other hand. The positioning slot and the mounting hole facilitate the alignment and installation of the patch packaging frame body and the upper stack bridge mounting plate. The overall thickness of the patch packaging frame body becomes thinner due to the change in the shape of the patch, and does not take up space. At the same time, the hollow slot reduces the weight burden of the patch packaging frame body, and the evenly distributed hollow slots make the overall force of the patch packaging frame body uniform. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 It is a schematic back view of the structure of the utility model;
[0018] Figure 3 For the utility model Figure 1 A schematic diagram of the enlarged local structure at point A in the middle;
[0019] Figure 4 It is a schematic side view of the structure of the utility model.
[0020] In the figure: 110, SMD package frame body; 111, lower stack bridge mounting plate; 112, upper stack bridge mounting plate; 120, SMD mounting slot; 121, anti-fool angle; 122, telescopic spring; 123, hollow slot; 124, limit block; 125, heat dissipation slot; 130, positioning slot; 131, mounting hole; 140, hollow slot. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Embodiment 1
[0023] See also Figure 1-4 The utility model provides an embodiment: a PDBS package straight pin patch rectifier bridge stack and its frame structure, including a patch package frame body 110, the patch package frame body 110 includes a lower stack bridge mounting plate 111 and an upper stack bridge mounting plate 112, the patch package frame body 110 is evenly provided with patch mounting grooves 120 inside, the patch mounting grooves 120 are provided with pins inside, and one side of the patch mounting groove 120 is provided with an anti-fool bevel 121; the patch mounting groove 120 is a flat-angle patch design groove, so that the patch can be embedded and installed, and the anti-fool bevel 121 adopts an anti-fool design to avoid the patch from being installed incorrectly or reversely, and the patch bevels must be installed correspondingly to achieve the snap-in.
[0024] Embodiment 2
[0025] The utility model proposes a PDBS package straight pin patch rectifier bridge stack and its frame structure, compared with the first embodiment, please refer to Figure 3A hollow groove 123 is symmetrically provided inside the patch mounting groove 120, a telescopic spring piece 122 is provided inside the hollow groove 123, and a limiting block 124 is provided on one side of the telescopic spring piece 122; the limiting block 124 is truncated cone-shaped, and a pockmark is provided on one side where the two limiting blocks 124 are close to each other. By squeezing the limiting block 124, the limiting block 124 squeezes the internal telescopic spring piece 122, and the two sides of the limiting block 124 directly act on the two sides of the patch to clamp it, which is convenient for welding the patch and prevents it from falling.
[0026] Embodiment 3
[0027] The utility model proposes a PDBS package straight pin patch rectifier bridge stack and its frame structure, compared with the first embodiment, please refer to Figure 3 A heat dissipation groove 125 is opened inside the patch mounting groove 120. The patch mounting groove 120 and the patch are tightly fitted. The heat dissipation groove 125 is on the back of the patch. On the one hand, it can help the patch to dissipate heat, and on the other hand, it can reduce the weight burden of the patch packaging frame body 110.
[0028] Embodiment 4
[0029] The utility model proposes a PDBS package straight pin patch rectifier bridge stack and its frame structure, compared with the first embodiment, please refer to Figure 4 The upper and lower ends of the lower stack bridge mounting plate 111 and the patch mounting groove 120 are both provided with positioning grooves 130 and mounting holes 131; the interior of the patch packaging frame body 110 is evenly provided with hollow grooves 140; the side thickness of the patch packaging frame body 110 is five millimeters; the positioning grooves 130 and the mounting holes 131 facilitate the alignment and installation of the patch packaging frame body 110 and the upper stack bridge mounting plate 112. The overall thickness of the patch packaging frame body 110 becomes thinner due to the change in the shape of the patch, and does not take up space. At the same time, the hollow grooves 140 reduce the weight burden of the patch packaging frame body 110, and the evenly distributed hollow grooves 140 make the overall force of the patch packaging frame body 110 uniform.
[0030] The working principle of the utility model is as follows: the patch installation slot 120 is a flat-angle patch design slot, so that the patch can be embedded and installed. The anti-foolproof bevel 121 adopts an anti-foolproof design to avoid the patch from being installed incorrectly or reversely. The patch bevels must be installed in a corresponding manner to achieve engagement. By squeezing the limit block 124, the limit block 124 squeezes the internal telescopic spring 122, and the two sides of the limit block 124 directly act on the two sides of the patch to clamp it, which is convenient for welding the patch and prevents it from falling.
[0031] The patch mounting groove 120 fits tightly with the patch, and the heat dissipation groove 125 is on the back of the patch, which can help the patch dissipate heat on the one hand, and reduce the weight burden of the patch packaging frame body 110 on the other hand. The positioning groove 130 and the mounting hole 131 facilitate the alignment and installation of the patch packaging frame body 110 and the upper stack bridge mounting plate 112. The overall thickness of the patch packaging frame body 110 becomes thinner due to the change in the shape of the patch, and does not occupy space. At the same time, the hollow groove 140 reduces the weight burden of the patch packaging frame body 110, and the evenly distributed hollow grooves 140 make the overall force of the patch packaging frame body 110 uniform.
[0032] The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The content not described in detail in this specification belongs to the prior art known to professional and technical personnel in this field.
[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A PDBS package straight pin patch rectifier bridge stack and its frame structure, characterized in that: The invention comprises a patch packaging frame body (110), wherein the patch packaging frame body (110) comprises a lower bridge mounting plate (111) and an upper bridge mounting plate (112), the patch packaging frame body (110) is evenly provided with patch mounting grooves (120) inside, pins are provided inside the patch mounting grooves (120), and a foolproof bevel (121) is provided on one side of the patch mounting grooves (120).
2. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 1, characterized in that: A hollow groove (123) is symmetrically provided inside the patch installation groove (120), a telescopic spring piece (122) is provided inside the hollow groove (123), and a limiting block (124) is provided on one side of the telescopic spring piece (122).
3. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 2, characterized in that: The limiting block (124) is in the shape of a truncated cone, and pitting is provided on one side of the two limiting blocks (124) that are close to each other.
4. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 1, characterized in that: A heat dissipation groove (125) is provided inside the patch mounting groove (120).
5. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 1, characterized in that: The upper and lower ends of the lower stack bridge mounting plate (111) and the patch mounting groove (120) are both provided with positioning grooves (130) and mounting holes (131).
6. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 1, characterized in that: The inside of the patch packaging frame body (110) is evenly provided with hollow grooves (140).
7. A PDBS package straight pin patch rectifier bridge stack and its frame structure according to claim 1, characterized in that: The side thickness of the SMD packaging frame body (110) is five millimeters.