Memory module
By welding wear-resistant parts on the conductive gasket of the memory module and setting up a storage space at the lower end of the circuit board, the problem of conductive gasket wear is solved, extending the module life and reducing the testing cost.
Patent Information
- Application Number
- CN202420100872.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-15
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-01-15
AI Technical Summary
The conductive gaskets of the memory module are prone to wear during multiple plug-ins and removal tests, which affects the module function and the safety of motherboard testing.
A memory module is designed to reduce the length of the conductive path by welding wear-resistant parts on the conductive gasket.
Effectively prevent conductive gasket wear, extend the service life of the memory module, reduce motherboard testing costs, and reduce signal loss in high-frequency tests.
Smart Images
Figure CN222508033U_ABST
Abstract
Description
[Technical field]
[0001] The utility model relates to a memory module, in particular to a memory module capable of preventing a conductive gasket from being worn. [Background technology]
[0002] The motherboard is a core component of electronic equipment. Its quality directly affects the overall performance of electronic equipment, and also affects the safety of electronic equipment. Therefore, after the motherboard is produced, in order to ensure that its quality and technical parameters meet the requirements, the motherboard needs to be functionally tested. Usually, the tester inserts the memory module into the memory slot on the motherboard for testing. The gold fingers of conventional memory modules are made of pure copper plated with gold, and their hardness is relatively low. During the motherboard test, the gold fingers of the memory module are easily worn after multiple insertions and removals, which in turn affects the function of the memory module.
[0003] Therefore, it is necessary to design a new memory module to overcome the above defects. [Utility Model Content]
[0004] The invention aims to provide a memory module which can prevent the conductive gasket from being worn.
[0005] In order to achieve the above-mentioned purpose, the memory module of the utility model adopts the following technical solutions:
[0006] A memory module includes: a circuit board having two side surfaces arranged opposite to each other in the front and rear directions, the two side surfaces being recessed toward each other to form two recessed areas, a plurality of conductive gaskets being arranged on each side surface, the conductive gaskets being located above the recessed areas; a plurality of conductive wear-resistant parts, each wear-resistant part having a greater wear resistance than the conductive gasket, each wear-resistant part including a contact portion fixed to the conductive gasket and a guide portion extending downwardly from the contact portion, the contact portion being used to insert a slot connector and contact the mating terminal of the slot connector, each guide portion extending into the recessed area but not exceeding the lower end of the circuit board downward.
[0007] Furthermore, the distance between the two side surfaces in the front-to-back direction is 1.17±0.10 mm.
[0008] Furthermore, the lower end of the circuit board has a first end face and a second end face located on the left and right sides of the first end face, the first end face is lower than the second end face, and the length of the conductive gasket and the wear-resistant part located directly above the first end face in the up and down direction is greater than the length of the conductive gasket and the wear-resistant part located directly above the second end face in the up and down direction.
[0009] Further, the thickness of the contact portion in the front-to-back direction is greater than the thickness of the conductive gasket.
[0010] Furthermore, a material connecting portion is formed by vertically extending downward from the guiding portion for connecting the material strip, and the width of the guiding portion in the left-right direction gradually decreases from top to bottom.
[0011] Further, the conductive pad is recessed relative to the corresponding side surface, and the contact portion is soldered to the conductive pad by solder.
[0012] Compared with the prior art, the memory module of the utility model fixes the wear-resistant part on the conductive gasket. When the memory module is plugged into the slot connector, the wear-resistant part contacts the docking terminal of the slot connector. The wear resistance of the wear-resistant part is greater than that of the conductive gasket, thereby improving the service life of the memory module and reducing the mainboard testing cost.
[0013] The utility model also includes a memory module, including: a circuit board, two locking parts are provided on the left and right sides of the circuit board, the locking parts are used to lock with the slot connector, a receiving space is recessed upward at the lower end of the circuit board, and a plurality of conductive pads are provided on the front and rear sides of the circuit board respectively above the receiving space; an adapter seat, which can be detachably assembled on the circuit board, includes a plastic body and two rows of terminals installed on the front and rear sides of the plastic body, the plastic body and the terminals are accommodated in the receiving space, the terminals include a conductive part conductively connected with the conductive pad, a fixing part matched with the plastic body, and a docking part for inserting the slot connector and plugging with the docking terminal of the slot connector; wherein the wear resistance of the terminal is greater than that of the conductive pad.
[0014] Furthermore, it includes two first locking pieces located on the left and right sides of the circuit board; the left and right sides of the plastic body are recessed to form a first groove, and the left and right sides of the circuit board are provided with side parts below the locking part, and the accommodating space is located between the side parts. Each first locking piece includes a main body and two first protrusions. The main body covers the front and rear side surfaces and the outer side in the left and right directions of the side part. The main body also covers the front and rear sides of the plastic body to prevent the plastic body from moving forward and backward. The two first protrusions protrude toward each other from the two inner side surfaces in the front and rear directions of the main body and enter the first groove to prevent the plastic body from moving downward relative to the circuit board.
[0015] Furthermore, it includes a second locking piece fixed to the circuit board, a protrusion protruding upward from the plastic body, a second groove being provided on the protrusion, and an anti-idiot groove being recessed upward from the lower end of the plastic body, the anti-idiot groove being located directly below the protrusion; the second locking piece has a base and a second protrusion extending downward from the base, the base covers the circuit board and the protrusion, the second protrusion enters the second groove, and stops the plastic body from moving downward relative to the circuit board.
[0016] Furthermore, the plastic body is provided with a plurality of terminal slots for correspondingly accommodating terminals, and the left and right sides of each terminal slot include a positioning slot and a step, wherein the positioning slot is closer to the center plane of the front-to-back direction of the plastic body than the step, the positioning slot is used for positioning the fixing part, and the step is used for blocking the docking part.
[0017] Compared with the prior art, the present invention provides a transfer seat through the memory module, and the transfer seat is inserted into the slot connector for functional testing, thus avoiding the wear of the conductive gasket caused by repeated insertion and removal of the memory module, thereby causing damage to the memory module. In addition, by providing a receiving space concave upward at the lower end of the circuit board, the transfer seat is arranged in the receiving space, and the conductive path between the memory module and the mainboard is shorter than the conductive path of the memory module connected to the mainboard through the transfer seat without the receiving space. In this way, the loss of the signal during the transmission process will not increase during high-frequency testing while preventing the wear of the conductive gasket of the memory module.
Brief Description of the Drawings
[0018] Figure 1 It is a three-dimensional exploded view of the first embodiment of the memory module of the utility model;
[0019] Figure 2 for Figure 1 A front view of the memory module;
[0020] Figure 3 For along Figure 2 Sectional view along line AA;
[0021] Figure 4 for Figure 2 Enlarged view of area B in the middle;
[0022] Figure 5 It is a three-dimensional exploded view of the second embodiment of the memory module of the utility model;
[0023] Figure 6 for Figure 5 A three-dimensional composite diagram of the memory module;
[0024] Figure 7 for Figure 6 A front view of the memory module;
[0025] Figure 8 for Figure 7 A partial cross-sectional view along the CC line;
[0026] Fig. 9 for Figure 7 Partial cross-sectional view along line DD;
[0027] Fig.10 for Figure 7 Enlarged view of area E in the middle;
[0028] Fig.11 for Figure 7 Enlarged view of area F in the middle.
[0029] Description of the accompanying drawings for the specific implementation:
[0030] Memory modules 100, 100a Circuit board 1, 1a Side 10, 10a Depression area 11 The first end surface 12 Second end surface 13 Locking part 14 Side 15 Containment Space 16 Second mounting hole 17 Conductive gasket 2, 2a Solder Wear parts 3 Contact part 31 Guide portion 32 Continuous material section 33 Adapter 4 Plastic body 41 First groove 411 Bump 412 The second groove 4121 Foolproof slot 413 Terminal slot 414 Positioning slot 4141 Step 4142 Terminal 42 Conducting portion 421 Fixed portion 422 Docking section 423 First locking piece 5 Main body 51 first convex portion 52 Second locking piece 6 Base 61 second convex portion 62 First mounting hole 63 Screw fitting L Slot Connector 200 [Specific implementation method]
[0031] In order to facilitate a better understanding of the purpose, structure, features and functions of the present invention, the present invention is further described in conjunction with the accompanying drawings and specific implementation methods.
[0032] For ease of understanding, the front-to-back direction is defined as X, the left-to-right direction is defined as Y, and the up-down direction is defined as Z. The front-to-back direction X, the left-to-right direction Y, and the up-down direction Z are perpendicular to each other.
[0033] like Figures 1 to 4 2 is a first embodiment of the memory module of the present invention. The memory module 100 includes a circuit board 1 , a plurality of conductive pads 2 disposed on the circuit board 1 , and a plurality of wear-resistant parts 3 fixed to the conductive pads 2 .
[0034] like Figures 1 to 4 As shown, the circuit board 1 includes two side surfaces 10 opposite to each other, the two side surfaces 10 are recessed toward each other to form two recessed areas 11, and each side surface 10 is provided with a plurality of conductive pads 2, and the conductive pads 2 are located above the recessed areas 11. The lower end of the circuit board 1 has a first end surface 12 and second end surfaces 13 located on the left and right sides of the first end surface 12, and the first end surface 12 is lower than the second end surface 13.
[0035] like Figure 3 As shown, each conductive pad 2 is recessed relative to the side surface 10 in the front-to-back direction toward the central plane P1 of the circuit board 1 , and the conductive pad 2 does not extend downward to the recessed area 11 .
[0036] like Figure 1 , Figure 3 and Figure 4 As shown, each wear-resistant part 3 includes a contact portion 31 fixed to the conductive pad 2, a guide portion 32 extending downward from the contact portion 31 and a connecting portion 33 extending vertically downward from the guide portion 32. The surface of the contact portion 31 facing the conductive pad 2 is soldered to the conductive pad 2 through solder S, and the surface of the contact portion 31 facing away from the conductive pad 2 is gold-plated. The contact portion 31 is used to connect to the slot connector 200 (see Figure 6) is electrically contacted with the docking terminal of the slot connector 200, and the thickness of the contact portion 31 in the front-to-back direction is greater than the thickness of the conductive gasket 2. Each guide portion 32 and the connecting portion 33 extend into the recessed area 11 but do not exceed the lower end of the circuit board 1 downward. The width of the guide portion 32 in the left-right direction gradually decreases from top to bottom. The guide portion 33 is used to guide the wear-resistant part 3 to contact with the docking terminal of the slot connector 200, and the connecting portion 33 is used to connect the material strip. In this embodiment, the material of the wear-resistant part 3 is made of copper alloy, and the material of the conductive gasket 2 is pure copper (of course, in other embodiments, the materials of the wear-resistant part 3 and the conductive gasket 2 are not limited to this). The hardness of pure copper is lower than that of copper alloy, so the wear resistance of the wear-resistant part 3 is greater than that of the conductive gasket 2. The length of the conductive gasket 2 and the wear-resistant part 3 located directly above the first end face 12 in the up-down direction is greater than the length of the conductive gasket 2 and the wear-resistant part 3 located directly above the second end face 13 in the up-down direction. The distance D between the two side surfaces 10 in the front-to-back direction is 1.17±0.10 mm, which is smaller than the distance between the front and rear side surfaces of a conventional memory module. Thus, after the conductive gasket 2 is welded with the wear-resistant part 3, the distance between the two wear-resistant parts 3 located on opposite side surfaces 10 in the front-to-back direction is the same as the distance between the two gold fingers located on opposite side surfaces of a conventional memory module. Thus, the memory module 100 of the present invention can be plugged into the same slot connector 200 as a conventional memory module.
[0037] like Figures 5 to 11 FIG. 1 is a second embodiment of the memory module of the present invention. The memory module 100a of the present embodiment includes a circuit board 1a, an adapter 4, and two first fasteners 5 and two second fasteners 6 for fixing the adapter 4 to the circuit board 1a. In other embodiments, the circuit board 1a and the adapter 4 can be fixed directly without the need for an additional third party to fix them.
[0038] like Figure 5 and Figure 7 As shown, the circuit board 1a is provided with two locking parts 14 on the left and right sides for locking with the slot connector 200, and two side parts 15 are provided below the locking parts 14. A receiving space 16 is recessed upward at the lower end of the circuit board 1a, and the receiving space 16 is located between the two side parts 15 in the left and right direction. The front and rear side surfaces 10a of the circuit board 1a are respectively provided with a plurality of conductive pads 2a above the receiving space 16, and the thickness of the side part 15 in the front and rear direction is less than the thickness of the locking part 14.
[0039] like Figure 5 and Figure 6 As shown, the adapter 4 includes a plastic body 41 and two rows of terminals 42 installed on the front and rear sides of the plastic body 41, and the plastic body 41 and the terminals 42 are accommodated in the accommodating space 16. In this embodiment, the lower end of the adapter 4 is flush with the lower end of the side portion 15, and in other embodiments, the lower end of the adapter 4 can be lower or higher than the lower end of the side portion 15.
[0040] like Figure 5 , Figure 8 and Fig. 9 As shown, the left and right sides of the plastic body 41 are recessed to form a first groove 411, the upper end of the plastic body 41 is provided with a protrusion 412, the protrusion 412 is provided with a second groove 4121, the lower end of the plastic body 41 is provided with an anti-mistake groove 413, the anti-mistake groove 413 is located directly below the protrusion 412, and the front and rear side surfaces 10a of the plastic body 41 are provided with a plurality of terminal grooves 414 for correspondingly accommodating the terminal 42, and the left and right sides of each terminal groove 414 include a positioning groove 4141 and a step 4142, and the positioning groove 4141 is closer to the center plane P2 of the front and rear direction of the plastic body 41 than the step 4142. The terminal 42 includes a conductive portion 421 conductively connected to the conductive gasket 2a, a fixed portion 422 fixedly matched with the plastic body 41, and a docking portion 423 for docking with the docking terminal of the slot connector 200. The wear resistance of the terminal 42 is greater than that of the conductive gasket 2a. The positioning groove 4141 positions the fixing portion 422 and defines the direction in which the slot connector 200 abuts against the docking portion 423 as the docking direction. The step 4142 is used to stop the docking portion 423 from moving along the docking direction and to stop the docking portion 423 from moving in the left and right directions.
[0041] like Figure 5 , Figure 7 and Fig.10 As shown, each first locking member 5 includes a main body 51 and two first protrusions 52. The main body 51 covers the front and rear side surfaces 10a and the outer side surfaces in the left and right directions of the side portion 15. The main body 51 also covers the front and rear sides of the plastic body 41 to prevent the plastic body 41 from moving forward and backward. The two first protrusions 52 protrude toward each other from the two inner sides of the main body 51 in the front and rear directions and enter the first groove 411 to prevent the plastic body 41 from moving downward relative to the circuit board 1a.
[0042] like Figure 5 , Figure 7 and Fig.11 As shown, each second locking member 6 has a base 61 and a second protrusion 62 extending downward from the base 61. The bases 61 of the two second locking members 6 cover the front and rear sides of the circuit board 1a and the protrusion 412. The second protrusion 62 enters the second groove to prevent the plastic body 41 from moving downward relative to the circuit board 1a. Two first mounting holes 63 are provided in the area where each base 61 covers the circuit board 1a. The circuit board 1a is provided with two second mounting holes 17. The screw member L passes through the first mounting hole 63 and the second mounting hole 17 to fix the two second locking members 6 to the circuit board 1a.
[0043] In summary, the memory module of the utility model has the following beneficial effects:
[0044] (1) Compared with the prior art, the present invention welds a wear-resistant part 3 on the conductive gasket 2. The wear resistance of the wear-resistant part 3 is greater than that of the conductive gasket 2. This increases the service life of the memory module 100 and reduces the mainboard testing cost.
[0045] (2) By forming a receiving space 16 recessed upward at the lower end of the circuit board 1a, the adapter 4 is disposed in the receiving space 16, and the conductive path between the memory module 100a and the mainboard is shortened compared to the conductive path of the memory module without the receiving space connected to the mainboard through the adapter. In this way, the conductive gasket 2a of the memory module 100a is prevented from being worn and the signal loss during the transmission process during high-frequency testing will not increase, thereby ensuring a good test effect.
[0046] The above detailed description is only an explanation of the preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Therefore, all equivalent technical changes made by using the description and illustrations of this creation are included in the patent scope of this creation.
Claims
1. A memory module, characterized in that: include: A circuit board has two side surfaces arranged opposite to each other, the two side surfaces are recessed towards each other to form two recessed areas, each side surface is provided with a plurality of conductive pads, and the conductive pads are located above the recessed areas; A plurality of wear-resistant parts having electrical conductivity, each of which has a greater wear resistance than the conductive gasket, each of which includes a contact portion fixed to the conductive gasket and a guide portion extending downwardly from the contact portion, the contact portion being used to insert the slot connector and contact the docking terminal of the slot connector, and each guide portion extending into the recessed area but not exceeding the lower end of the circuit board downward.
2. The memory module according to claim 1, wherein: The distance between the two side surfaces in the front-to-back direction is 1.17±0.10mm.
3. The memory module according to claim 1, wherein: The lower end of the circuit board has a first end face and a second end face located on the left and right sides of the first end face, the first end face is lower than the second end face, and the length of the conductive gasket and the wear-resistant part located directly above the first end face in the vertical direction is greater than the length of the conductive gasket and the wear-resistant part located directly above the second end face in the vertical direction.
4. The memory module according to claim 1, wherein: The thickness of the contact portion in the front-to-back direction is greater than the thickness of the conductive pad.
5. The memory module according to claim 1, wherein: A material connecting portion is formed by vertically extending downward from the guiding portion for connecting the material strip, and the width of the guiding portion in the left-right direction gradually decreases from top to bottom.
6. The memory module according to claim 1, wherein: The conductive pad is recessed relative to the corresponding side surface, and the contact portion is welded to the conductive pad by solder.
7. A memory module, characterized in that: include: The circuit board has two locking parts on its left and right sides, the locking parts are used to lock with the slot connector, the lower end of the circuit board is recessed upward to form a receiving space, and the front and rear sides of the circuit board are respectively provided with a plurality of conductive pads above the receiving space; The adapter can be detachably assembled on the circuit board, including a plastic body and two rows of terminals installed on the front and rear sides of the plastic body. The plastic body and the terminals are accommodated in a receiving space. The terminals include a conducting portion that is connected to a conductive gasket, a fixing portion that cooperates with the plastic body, and a docking portion for inserting a slot connector and plugging into a docking terminal of the slot connector; wherein the wear resistance of the terminals is greater than that of the conductive gasket.
8. The memory module according to claim 7, wherein: It further includes two first locking members located on the left and right sides of the circuit board; the left and right sides of the plastic body are recessed to form a first groove, and the left and right sides of the circuit board are provided with two side parts below the locking part, and the receiving space is located between the two side parts. Each first locking member includes a main body and two first protrusions. The main body covers the front and rear side surfaces and the outer side in the left and right directions of the side part. The main body also covers the front and rear sides of the plastic body to prevent the plastic body from moving forward and backward. The two first protrusions extend toward each other from the two inner side surfaces in the front and rear directions of the main body and enter the first groove to prevent the plastic body from moving downward relative to the circuit board.
9. The memory module according to claim 7, wherein: It further includes a second locking piece fixed to the circuit board, a bump protruding upward from the plastic body, a second groove being provided on the bump, an anti-mistake groove being recessed upward from the lower end of the plastic body, and the anti-mistake groove being located directly below the bump; the second locking piece has a base and a second protrusion extending downward from the base, the base covers the circuit board and the bump, the second protrusion enters the second groove, and stops the plastic body from moving downward relative to the circuit board.
10. The memory module according to claim 7, wherein: The plastic body is provided with a plurality of terminal slots for correspondingly accommodating terminals. The left and right sides of each terminal slot include a positioning slot and a step. The positioning slot is closer to the center plane of the front-to-back direction of the plastic body than the step. The positioning slot is used to position the fixing part, and the step is used to stop the docking part.