Deformation monitoring device
By designing a deformation monitoring device containing multiple communication modules and positioning modules, direct communication and ad hoc networking between multiple devices are realized, and the existing technology cannot be used in scenarios without mobile public network coverage or confidentiality requirements. The problem is that low power consumption and efficient deformation monitoring are achieved.
Patent Information
- Application Number
- CN202420685443.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-03
AI Technical Summary
The existing deformation monitoring devices cannot realize mutual communication between multiple deformation monitoring devices and cannot form an ad hoc network system, which makes them unsuitable in scenarios where there is no mobile public network coverage or confidentiality needs.
A deformation monitoring device is designed, including a control module, a first type of communication module (such as 4G communication module), a second type of communication module (such as LORA communication module), a positioning module and a power supply module, and multiple communication modules are realized through the second type of communication module. Direct communication between each deformation monitoring device forms an ad hoc network system.
Direct communication between multiple deformation monitoring devices is realized, forming an ad hoc network without information transfer, and is suitable for scenarios where there is no mobile public network coverage or confidentiality needs, while reducing the overall device power consumption through low-power design.
Smart Images
Figure CN222509544U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of deformation monitoring, and in particular, relates to a deformation monitoring device. Background Art
[0002] In the construction field, it is usually necessary to monitor the deformation of the roof of the building through GNSS (Global Navigation Satellite System), including the US GPS, Russia's Glonass, Europe's Galileo, and China's Beidou Satellite Navigation System. Deformation monitoring is to monitor the settlement of the roadbed and building and the deviation from the original position, and determine the cause of the deformation by obtaining deformation data.
[0003] Existing deformation monitoring devices often connect to the mobile public network by inserting an Internet of Things card, and upload the deformation data to the server for data analysis. The server sends the data of the deformation monitoring device to other deformation monitoring devices. It can be seen that the existing deformation monitoring devices cannot realize communication between multiple deformation monitoring devices to form an ad hoc network system. Therefore, in application scenarios without mobile public network coverage or with confidentiality requirements (not using mobile public network), the existing deformation monitoring devices are not applicable. Utility Model Content
[0004] Therefore, in view of the above defects in the prior art, the present application provides a deformation monitoring device, the purpose of which is to at least solve the problems existing in the prior art.
[0005] To achieve the above objectives, the present application provides a deformation monitoring device, which includes:
[0006] Control module,
[0007] A first type communication module is connected to the control module.
[0008] The second type of communication module is connected to the control module and is used for direct communication between different deformation monitoring devices.
[0009] A positioning module, comprising a first positioning module, the first positioning module is connected to the control module and is used to collect position information of the deformation monitoring device;
[0010] and a power supply module connected to the control module, the first communication module, the second communication module and the positioning module.
[0011] Preferably, the positioning module further includes: a second positioning module connected to the control circuit and used for collecting motion state information of the deformation monitoring device.
[0012] Preferably, the first positioning module is a GPS module, and the second positioning module is an inertial navigation module.
[0013] Preferably, the first type communication module is a 4G communication module.
[0014] Preferably, the second type communication module is a LORA communication module.
[0015] Preferably, the control module comprises a digital processing chip.
[0016] Preferably, the deformation monitoring device further comprises a level conversion circuit, and the level conversion circuit is connected to the digital processing chip, the first type communication module and the second type communication module.
[0017] Preferably, the power supply module is a switching power supply.
[0018] The present application discloses a deformation monitoring device, which includes: a control module; a first type of communication module, connected to the control module; a second type of communication module, connected to the control module and used for direct communication between two different deformation monitoring devices; a positioning module, including a first positioning module, the first positioning module is connected to the control module and is used to collect position information of the deformation monitoring device; and a power supply module, connected to the control module, the first communication module, the second communication module and the positioning module.
[0019] The device has the following beneficial effects:
[0020] It can realize direct communication between multiple different deformation monitoring devices and form an ad hoc network between the deformation monitoring devices without the need for information transfer. It can be applied in scenarios where there is no mobile public network coverage or there are confidentiality requirements. At the same time, by designing the deformation monitoring device with low power consumption, the power consumption of the overall device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of a deformation monitoring device provided by an embodiment of the utility model;
[0022] Figure 2 It is a specific circuit diagram of a first positioning module provided by an embodiment of the utility model;
[0023] Figure 3 It is a specific circuit diagram of a second positioning module provided by an embodiment of the utility model;
[0024] Figure 4 is a specific circuit diagram of a second type of communication module provided by an embodiment of the utility model;
[0025] Figure 5 It is a specific circuit diagram of a power module provided by an embodiment of the utility model. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.
[0027] In this article, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such temporal relationship or order between these entities or operations. In addition, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.
[0028] As described in the background technology, existing deformation monitoring devices often connect to the mobile public network by inserting an Internet of Things card, and upload deformation data to a server for data analysis. The server sends the data of the deformation monitoring device to other deformation monitoring devices. It can be seen that the existing deformation monitoring devices cannot realize communication between multiple deformation monitoring devices to form a self-organizing network system. Therefore, in application scenarios without mobile public network coverage or with confidentiality requirements (not using mobile public network), the existing deformation monitoring devices are not applicable. For this reason, the present application provides a deformation monitoring device.
[0029] Figure 1 Schematic diagram of a deformation monitoring device provided by an embodiment of the utility model. Figure 1 As shown, the deformation monitoring device comprises:
[0030] Control module,
[0031] The positioning module includes a first positioning module, the first positioning module is connected to the control module, the first positioning module is used to collect the position information of the deformation monitoring device and transmit the position information to the control module, optionally, the first positioning module is a GPS module; the second positioning module is connected to the control circuit, and is used to collect the motion state information of the monitoring device and transmit the motion state information to the control module, optionally, the second positioning module is an inertial navigation module, which can collect motion state information such as acceleration,
[0032] The control circuit transmits deformation data such as position information and motion state information to the first type communication module or the second type communication module, and the running track of the deformation monitoring device can be obtained according to the position information and motion state information of the deformation monitoring device. Specifically, when the deformation monitoring device suddenly deviates from the position, the deviation track of the device can be quickly obtained according to the interval time of the obtained position information and motion state information.
[0033] The first type of communication module is connected to the control module and is used for the deformation monitoring device to communicate with the mobile public network. Optionally, the first type of communication module is a 4G communication module, which transmits the deformation data to the gateway through the 4G mobile public network, and then uploads it to the server via the Internet to achieve communication with the server. When the current deformation monitoring device needs to communicate with other deformation monitoring devices, the deformation data collected by the current deformation monitoring device can be sent to other deformation monitoring devices through the server.
[0034] The second type of communication module is used for direct communication between multiple different deformation monitoring devices to form a self-organizing network system. The second type of communication module has at least a first pin, a second pin and a third pin. The first pin, the second pin and the third pin are all connected to the control module. The first pin is used to receive data transmitted by the control module, the second pin is used to send data to the control module, and the third pin is used to receive a status signal sent by the control module. The second type of communication module is in a sleep state or a wake-up state in response to the status signal. When the second type of communication module is not needed, the second type of communication module is in a sleep state to reduce the power consumption of the overall device. Optionally, the second type of communication module adopts a low-power wireless LAN module. Optionally, the second type of communication module is a LORA module, which has much less power consumption than a 4G communication module and can communicate directly with other deformation monitoring devices without a relay to realize point-to-point or point-to-multipoint self-organizing network. In addition, its maximum transmission distance can reach 10km, and its transmission bandwidth is 2.4K-15.2K, which can meet the deployment requirements in various complex monitoring scenarios. For example, it can meet the data transmission in the absence of a mobile public network or realize confidential transmission through the second type of communication module and other deformation monitoring devices in a self-organizing network.
[0035] The power module is connected to the control module, the first type communication module, the second type communication module and the positioning module, and is used to supply power to the control module, the positioning module, the first type communication module and the second type communication module.
[0036] In an optional implementation, the power module adopts a switching power supply design and uses Ti's 3-way synchronous buck conversion chip, which can output 3 different voltages at the same time to meet the power requirements of various modules. It has strong load capacity, high output accuracy, and high stability and reliability.
[0037] In an optional implementation, the control circuit is composed of a CPU and a peripheral circuit. The CPU adopts a small, low-power, high-efficiency Cortex-A5 core processor with strong performance and fast computing speed. The international mainstream operating system Linux is selected as the built-in operating system, and the software is powerful, which is a truly embedded control system. The CPU adopts a small, low-power, high-efficiency I.MX6ULL core board with strong performance and fast computing speed. The international mainstream operating system Linux is selected as the built-in operating system, and the software is powerful, which is a truly embedded control system.
[0038] In an optional implementation, the control module includes a digital processing chip, and the deformation monitoring device further includes a level conversion circuit, which is connected to the first type communication module and the second type communication module (not shown in the figure).
[0039] In an optional implementation manner, the specific circuit diagram of the first positioning module can be found in Figure 2 ,like Figure 2 As shown, the first positioning module includes a satellite positioning module M7, a resistor R48, a resistor R49, a resistor R48, a resistor R66, a resistor R67, a resistor R68, a resistor R69, a capacitor C54, a transistor Q3, and a radio frequency connector A2. Pin 7 of the satellite positioning module M7 is connected to pin 1 of the resistor R69, and pin 2 of the resistor R69 is connected to the serial port TX2 of the CPU. Pin 8 of the satellite positioning module M7 is connected to pin 1 of the resistor R68, and pin 2 of the resistor R68 is connected to the serial port RX2 of the CPU. Pin 11 of the satellite positioning module M7 is connected to pin 1 of the resistor R67, and pin 2 of the resistor R67 is connected to the serial port TX1 of the CPU. Pin 12 of the satellite positioning module M7 is connected to pin 1 of the resistor R66, and pin 2 of the resistor R66 is connected to the serial port RX1 of the CPU. Pin 9 of the satellite positioning module M7 is the positive terminal of the power supply, connected to pin 2 of the magnetic bead L5 of the power module, and connected to capacitor C54 for filtering. Pin 2 of satellite positioning module M7 is connected to RF connector A2, which is the GNSS antenna interface. Pins 5 and 6 of satellite positioning module M7 are connected to GND. Pin 10 of satellite positioning module M7 is connected to the c pole of transistor Q3, the b pole of transistor Q3 is connected to pin 2 of resistor R48 and pin 1 of resistor R49, and pin 2 of resistor R49 and the e pole of transistor Q3 are connected to GND. Pin 1 of resistor R48 is connected to IO port 3 of CPU to provide a reset signal to the GNSS module.
[0040] Among them, the satellite positioning module M7 adopts a high-precision chip-level positioning module, which supports multiple systems and multiple frequencies. The CPU communicates with the satellite positioning module M7 via the two serial ports TX1, RX1 and TX2, RX2, and reads the location information of the device every 15 seconds; when the positioning module works abnormally, the IO port 3 of the CPU can provide a reset signal to reset the positioning module.
[0041] In an optional implementation, the specific circuit diagram of the second positioning module can be found in Figure 3 ,like Figure 3 As shown, it includes an inertial navigation chip U11, a resistor R50, a resistor R51, a resistor R52, a resistor R57, a resistor R58, a capacitor C55, a capacitor C56, a capacitor C62, and a capacitor C63. Pins 1 and 16 of the inertial navigation chip U11 are power supply pins, connected to pin 2 of the magnetic bead L14 of the power module, and filter capacitors C55, C62, and C63 are added respectively. Pins 2, 3, 4, and 5 of the inertial navigation chip U11 are SPI interfaces, which are connected to the SPI interfaces SCK, SDO, SDI, and CS of the CPU through 0 ohm resistors R50, R51, R52, and R57 respectively. Pin 6 of the inertial navigation chip U11 is connected to the IO port INT1 of the CPU through a resistor R58. Pins 9, 10, 11, 12, and 13 of the inertial navigation chip U11 are connected to GND. Among them, the inertial navigation chip U11 uses a low-power and high-precision inertial navigation chip. The chip enters sleep mode when static and has extremely low power consumption.
[0042] In an optional implementation manner, the specific circuit diagram of the second type communication module can be found in Figure 4 ,like Figure 4 As shown, it includes a wireless LAN module U9, a resistor R53, a resistor R54, a resistor R55, a resistor R56, a capacitor C58, a capacitor C59, a capacitor C60, a capacitor C66, a diode D8, and a radio frequency connector A3. Pin 2 of the wireless LAN module U9 is a power input, connected to L13 of the power module, and filter capacitors C60 and C66 are connected in parallel. Pin 9 (the third pin) of the wireless LAN module U9 is connected to pin 2 of the resistor R54, and pin 1 of the resistor R54 is connected to the I / O port of the CPU. Pin 12 of the wireless LAN module U9 is connected to pin 2 of the resistor R55, and pin 1 of the resistor R55 is connected to the serial port RX of the CPU. Pin 15 of the wireless LAN module U9 is connected to pin 1 of the resistor R53, and is also connected to pin 1 of the capacitor C58. Pin 2 of the resistor R53 is connected to pin 1 of the radio frequency connector A3, and is also connected to pin 1 of the capacitor C59 and the negative electrode of the diode D8. Pins 1, 13, 14, 16, 17, and 18 of the wireless LAN module U9, pin 2 of capacitor C58, pin 2 of capacitor C59, the positive electrode of diode D8, and pins 2, 3, 4, and 5 of RF connector A3 are connected to GND.
[0043] Among them, after the power module is powered on, it provides +3.3V power to the 2nd pin of the wireless LAN module U9, and the module U9 starts to work. The 11th pin (the first pin) and the 12th pin (the second pin) of U9 are UART communication ports, which interact with the CPU. The 15th pin is the RF input, which is connected to the antenna and can transmit RF signals with another device to complete the networking. The diode D8 is a transient suppression diode, which is used to protect the RF signal and avoid damage to the wireless LAN module due to external spike voltage.
[0044] In an optional embodiment, the specific circuit diagram of the power module is shown in Figure 5 ,like Figure 5 As shown, preferably, Figure 2 As shown, the power module includes a switching power supply chip U1, a gas discharge tube G1, a diode D1, a diode D2, a diode D3, a diode D4, a diode D5, a diode D9, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a resistor R15, a resistor R16, a resistor R17, a resistor R18, a resistor R19, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, and a capacitor C5 , capacitor C6, capacitor C7, capacitor C8, capacitor C9, capacitor C10, capacitor C11, capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor C16, capacitor C17, capacitor C18, capacitor C19, capacitor C20, capacitor C21, capacitor C22, capacitor C23, capacitor C39, capacitor C64, inductor L1, inductor L2, inductor L3, magnetic bead L4, magnetic bead L5, magnetic bead L6, magnetic bead L7, magnetic bead L8, magnetic bead L9, magnetic bead L10, magnetic bead L11, magnetic bead L12, magnetic bead L13, magnetic bead L14.
[0045] The positive input end of the power supply of the deformation monitoring device is connected to the positive electrode of the diode D1, and the negative electrode of the diode D1 is connected to the 12th, 13th, 30th, and 31st pins of the switching power chip U1, and is also connected to the 1st pin of the resistor R1, the 1st pin of the gas discharge tube G1, the negative electrode of the diode D2, the positive electrode of the capacitor C1, the positive electrode of the capacitor C39, the 1st pin of the capacitor C2, the 1st pin of the capacitor C64, the 1st pin of the resistor R3, the 1st pin of the resistor R4, and the 1st pin of the resistor R5. The 2nd pin of the resistor R1 is connected to the 1st pin of the resistor R2 and the negative electrode of the diode D9, and is also connected to the AD port 1 of the CPU. The 2nd pin of the resistor R2, the positive electrode of the diode D9, the 2nd pin of the gas discharge tube G1, the positive electrode of the diode D2, the negative electrode of the capacitor C1, the negative electrode of the capacitor C39, the 2nd pin of the capacitor C2, and the 2nd pin of the capacitor C64 are connected to GND. The 2nd pin of the resistor R3 is connected to the 1st pin of the resistor R6, and is also connected to the 2nd pin of the switching power chip U1. Pin 2 of resistor R4 is connected to pin 1 of resistor R7 and pin 4 of switching power chip U1, and is also connected to IO port 1 of CPU for control. Pin 2 of resistor R5 is connected to pin 1 of resistor R8 and pin 5 of switching power chip U1, and is also connected to IO port 2 of CPU for control. Pin 2 of resistor R6, pin 2 of resistor R7, and pin 2 of resistor R8 are connected to GND. Pin 1 of switching power chip U1 is connected to pin 1 of capacitor C3, and pin 2 of capacitor C3 is connected to GND. Pin 17 of switching power chip U1 is connected to pin 1 of capacitor C4, pin 24 of switching power chip U1 is connected to pin 1 of capacitor C5, and pin 2 of capacitors C4 and C5 are connected to GND. Pin 20 of switching power chip U1 is connected to pin 1 of resistor R10, and pin 2 of resistor R10 and pin 33 of switching power chip U1 are connected to GND. Pin 25 of the switching power chip U1 is connected to pin 1 of capacitor C6, and pin 2 of capacitor C6 is connected to pins 28 and 29 of the switching power chip U1, and is also connected to pin 1 of inductor L1. Pin 22 of the switching power chip U1 is connected to pin 1 of resistor R12, and is also connected to pin 1 of resistor R11 and pin 1 of capacitor C7. Pin 2 of resistor R11 is connected to pin 2 of capacitor C7, and is also connected to the cathode of diode D3, pin 1 of capacitor C8, pin 1 of capacitor C9, pin 1 of capacitor C10, magnetic beads L4, magnetic beads L5, magnetic beads L6, magnetic beads L7, magnetic beads L8, magnetic beads L13, and pin 1 of magnetic beads L14. Pin 2 of resistor R12, the anode of diode D3, pin 2 of capacitor C8, pin 2 of capacitor C9, and pin 2 of capacitor C10 are connected to GND. Pin 23 of the switching power chip U1 is connected to pin 1 of resistor R13, and is also connected to pin 1 of capacitor C11. Pin 2 of resistor R13 is connected to pin 1 of capacitor C12, and pin 2 of capacitor C12 and pin 2 of capacitor C11 are connected to GND. Pin 9 of switching power chip U1 is connected to pin 1 of capacitor C13, and pin 2 of capacitor C13 is connected to pin 11 of switching power chip U1, and pin 1 of inductor L2. Pin 6 of switching power chip U1 is connected to pin 1 of resistor R15, and pin 1 of resistor R14 and pin 1 of capacitor C14.Pin 2 of resistor R14 is connected to pin 2 of capacitor C14, and is also connected to the cathode of diode D4, pin 1 of capacitor C15, pin 1 of capacitor C16, magnetic bead L9, and pin 1 of magnetic bead L10. Pin 2 of resistor R15, the anode of diode D4, pin 2 of capacitor C15, and pin 2 of capacitor C16 are connected to GND. Pin 7 of switching power chip U1 is connected to pin 1 of resistor R16, and is also connected to pin 1 of capacitor C17. Pin 2 of resistor R16 is connected to pin 1 of capacitor C18, and pin 2 of capacitor C18 and pin 2 of capacitor C17 are connected to GND. Pin 16 of switching power chip U1 is connected to pin 1 of capacitor C19, and pin 2 of capacitor C19 is connected to pin 14 of switching power chip U1, and is also connected to pin 1 of inductor L3. Pin 19 of switching power chip U1 is connected to pin 1 of resistor R18, and is also connected to pin 1 of resistor R17 and pin 1 of capacitor C20. Pin 2 of resistor R17 is connected to pin 2 of capacitor C20, and is also connected to the cathode of diode D5, pin 1 of capacitor C21, magnetic bead L11, and pin 1 of magnetic bead L12. Pin 2 of resistor R18, the anode of diode D5, and pin 2 of capacitor C21 are connected to GND. Pin 18 of switching power chip U1 is connected to pin 1 of resistor R19, and is also connected to pin 1 of capacitor C22. Pin 2 of resistor R19 is connected to pin 1 of capacitor C23, and pin 2 of capacitor C23 and pin 2 of capacitor C22 are connected to GND. Pins 10, 15, 21, 26, and 27 of switching power chip U1 are connected to GND. Pins 2 of magnetic beads L4 to L14 supply power to different devices respectively.
[0046] Among them, the 12V power input is rectified by diode D1 and input to the input end of the switching power chip U1, and three different voltages are output, namely Vout1_3V3, Vout2_4V, and Vout3_5V. After filtering by magnetic beads L4~L14, it supplies power to other modules. In order to reduce power consumption, the two outputs of Vout2_4V and Vout3_5V can be output through software control. The IO port 1 of the CPU and the IO port 2 of the CPU give control signals to the 4th pin (EN_4V) and the 5th pin (EN_5V) of the switching power chip U1. The high level enables the output, and the low level prohibits the output. At the same time, after the 12V power input is rectified by the diode D1, it passes through the voltage divider circuit of the resistor R1, the resistor R2 and the diode D9, and the voltage signal VOL_CHK is input to the AD port 1 of the CPUCPU. The voltage value is calculated by the software, and the power supply voltage of the deformation monitoring device is monitored. When the voltage value is lower or higher than the set value, the CPU drives the indicator light to alarm locally, and sends the alarm information to the server through the first type communication module or the second type communication module.
[0047] The present application discloses a deformation monitoring device, which includes: a control module; a first type of communication module connected to the control module; a second type of communication module connected to the control module for direct communication between two different deformation monitoring devices, a positioning module including a first positioning module connected to the control module for collecting position information of the deformation monitoring device; and a power module connected to the control module, the first communication module, the second communication module and the positioning module. The deformation monitoring device provided by the present application can realize direct communication between multiple different deformation monitoring devices to form a self-organizing network between the deformation monitoring devices without information transfer, and can be applied in scenarios where there is no mobile public network coverage and confidentiality requirements.
[0048] The contents described in this specification are merely examples of the present invention. Technicians in the technical field to which the present invention belongs can make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the contents of the present invention specification or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.
Claims
1. A deformation monitoring device, characterized in that: include: Control module, The first type of communication module is connected to the control module and is used for the deformation monitoring device to communicate with the mobile public network. The second type of communication module is used for direct communication between a plurality of different deformation monitoring devices to form a self-organizing network system. The second type of communication module has at least a first pin, a second pin and a third pin. The first pin, the second pin and the third pin are all connected to the control module. The first pin is used to receive data transmitted by the control module, the second pin is used to send data to the control module, and the third pin is used to receive a status signal sent by the control module. The second type of communication module is in a dormant state or a wake-up state in response to the status signal. The positioning module includes a first positioning module and a second positioning module. The first positioning module is connected to the control module and is used to collect the position information of the deformation monitoring device and transmit it to the control module. The second positioning module is connected to the control circuit and is used to collect the motion state information of the deformation monitoring device and transmit the motion state information to the control module. The control circuit is used to transmit the position information and motion state information of the deformation monitoring device to the first type communication module or the second type communication module. and a power supply module connected to the control module, the first communication module, the second communication module and the positioning module.
2. The deformation monitoring device according to claim 1, characterized in that: The first positioning module is a GPS module, and the second positioning module is an inertial navigation module.
3. The deformation monitoring device according to claim 1 or 2, characterized in that: The first type of communication module is a 4G communication module.
4. The deformation monitoring device according to claim 1, 2 or 3, characterized in that: The second type of communication module is a LORA communication module.
5. The deformation monitoring device according to claim 1, characterized in that: The control module includes a digital processing chip.
6. The deformation monitoring device according to claim 5, characterized in that: The deformation monitoring device further includes a level conversion circuit, and the level conversion circuit is connected to the digital processing chip, the first type communication module and the second type communication module.
7. The deformation monitoring device according to claim 1, characterized in that: The power supply module is a switching power supply.