Heat dissipation device and heat conduction plate structure with agitating fluid

Abstract

The utility model relates to a heat dissipation device and a heat conduction plate structure with agitating type fluid. The heat dissipation device comprises the heat conduction plate structure and a heat pipe assembly. The heat-conducting plate structure comprises a heat-conducting plate and a piezoelectric assembly, and the heat pipe assembly is arranged on the heat-conducting plate. The heat conducting plate is provided with a plurality of outer plate surfaces and a plurality of inner plate surfaces, and accommodating chambers for accommodating fluid are formed among all the inner plate surfaces; the piezoelectric assembly is attached to one of the outer plate surface and the inner plate surface and is connected and conducted with the power supply, and the vibration of the piezoelectric assembly can make the fluid fluctuate in the containing chamber. Therefore, the fluid in the accommodating chamber can be driven by the piezoelectric component and is not stationary, so that the heat conduction effect and the heat dissipation effect of the heat conduction plate can be improved.

Description

Technical Field

[0001] The present application is related to heat dissipation, and in particular to a heat dissipation device and a heat conducting plate structure with agitated fluid. Background Art

[0002] The heat dissipation device mainly includes a heat sink and a heat pipe. The heat pipe is arranged and attached to the heat sink, and the heat pipe is also attached to the electronic heating component to quickly transfer the heat of the electronic heating component through one end of the heat pipe to the other end. The other end of the heat pipe can be provided with a heat dissipation fin.

[0003] In order to improve the heat conduction effect of the heat sink, liquid is also contained in the heat sink of the existing heat sink device.

[0004] However, even if liquid is contained in the existing heat sink, the liquid is stationary in the heat sink, and the heat from the electronic heating components is still concentrated in the same place of the heat sink. Therefore, the heat dissipation effect of the existing heat sink cannot be effectively improved, which has been criticized for a long time.

[0005] Therefore, how to improve the above-mentioned deficiencies of the prior art is a major issue that the inventors of this application are eager to solve. Utility Model Content

[0006] The purpose of the present application is to provide a heat dissipation device and a heat conduction plate structure with agitated fluid.

[0007] In order to achieve the above-mentioned objectives, the present application provides a heat conducting plate structure with an agitated fluid, comprising: a heat conducting plate having multiple outer plate surfaces and multiple inner plate surfaces, the heat conducting plate forming a chamber for accommodating the fluid between the multiple inner plate surfaces; and a piezoelectric component attached to one of the outer plate surface and the inner plate surface and connected to a power source, the piezoelectric component agitates the fluid to generate fluctuations in the chamber.

[0008] In one embodiment, the piezoelectric component is attached to one of the plurality of inner panels, one of the inner panels is provided with a positioning seat, and the piezoelectric component is disposed on the positioning seat.

[0009] In one embodiment, a spacing space is formed between the piezoelectric component and one of the inner plate surfaces.

[0010] In one embodiment, the power source includes a pair of conductive wires, and the pair of conductive wires pass through any inner panel surface and out of any outer panel surface.

[0011] In one embodiment, the piezoelectric component is attached to one of the plurality of outer panels.

[0012] In one embodiment, the heat conducting plate is provided with an input hole and an output hole, and both the input hole and the output hole are connected to the containing chamber.

[0013] The present application further provides a heat dissipation device for dissipating heat from an electronic heating component and comprises: a heat conducting plate structure with an agitated fluid as described above, the heat conducting plate being provided with a through opening, and the flat surface of the electronic heating component being exposed through the opening; and a heat pipe assembly, which is arranged on the heat conducting plate and is in contact with the flat surface.

[0014] In one embodiment, the heat conducting plate has at least a first plate and a second plate facing each other, and the opening passes through between the first plate and the second plate.

[0015] In one embodiment, the heat pipe assembly has a planar side, the first plate and the second plate both have inner and outer surfaces opposite to each other, the planar side is flat against the outer surface of the first plate or the second plate, and the planar side is also in contact with the flat surface.

[0016] In one embodiment, the heat conducting plate is provided with a groove, the groove has an opening and has at least one groove inner wall, the heat pipe assembly is embedded in the groove and has at least one plane side, and the at least one plane side corresponds to and abuts against at least one groove inner wall.

[0017] In one embodiment, two heat dissipation fins are further included, and the heat pipe assembly has two ends, and each heat dissipation fin is attached to each end.

[0018] In one embodiment, two heat dissipation fans are further included, each heat dissipation fan is fixed to the heat conduction plate and blows or draws air corresponding to each heat dissipation fin.

[0019] Compared with the prior art, the present application has the following effects: the fluid in the heat conducting plate can be driven by the piezoelectric component instead of being in a static state, so that the heat is no longer concentrated in the same place, but will be carried to other places of the heat conducting plate by the fluid, thereby improving the thermal conductivity and heat dissipation effects of the heat conducting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic exploded perspective view of the first embodiment of the present application.

[0021] Figure 2 This application is based on Figure 1 Schematic diagram of the three-dimensional decomposition of the heat conduction plate structure and the heat pipe assembly.

[0022] Figure 3 This application is based on Figure 1 Schematic diagram of the three-dimensional decomposition of the heat conducting plate structure.

[0023] Figure 4 It is a cross-sectional schematic diagram of the first embodiment of the present application after assembly.

[0024] Figure 5 It is a three-dimensional schematic diagram of the heat conducting plate structure in the second embodiment of the present application.

[0025] Figure 6 It is a three-dimensional schematic diagram of the heat conducting plate structure in the third embodiment of the present application.

[0026] Figure 7 It is a three-dimensional schematic diagram of the heat conducting plate structure in the fourth embodiment of the present application.

[0027] Description of reference numerals:

[0028] 100: heat conducting plate structure;

[0029] 1: Heat conducting plate;

[0030] 1a: mask body;

[0031] 1b: seat body;

[0032] 11: first plate;

[0033] 12: second plate;

[0034] 13: Room;

[0035] 14: Open your mouth;

[0036] 15: groove;

[0037] 151: inner wall of the groove;

[0038] 16: positioning seat;

[0039] 171: first inner panel surface;

[0040] 172: second inner panel surface;

[0041] 173: third inner panel surface;

[0042] 181: input hole;

[0043] 182: output hole;

[0044] 191: first outer panel;

[0045] 192: second outer panel surface;

[0046] 193: third outer panel surface;

[0047] 2: Piezoelectric component;

[0048] 300: heat pipe assembly;

[0049] 3: Heat pipe;

[0050] 31: end;

[0051] 32: plane side;

[0052] 400: fin assembly;

[0053] 4: cooling fins;

[0054] 500: fan assembly;

[0055] 5: Cooling fan;

[0056] 6: Power supply;

[0057] 61: conductive wire;

[0058] 700: circuit board assembly;

[0059] 7: Circuit board;

[0060] 71: electronic heating component;

[0061] 711: Flat veneer. DETAILED DESCRIPTION

[0062] The detailed description and technical contents of the present application are described as follows in conjunction with the accompanying drawings. However, the attached drawings are only provided for reference and illustration and are not intended to limit the present application.

[0063] The present application provides a heat dissipation device and a heat conduction plate structure with agitated fluid, such as Figure 1 As shown, it is used to dissipate heat for at least one electronic heating component 71. The heat dissipation device includes: a heat conducting plate structure 100 with agitating fluid and a heat pipe assembly 300, and in one embodiment, also includes a fin assembly 400 and a fan assembly 500. Figures 1 to 4 The first embodiment of the present application is shown. Figure 5 The second embodiment is shown. Figure 6 and Figure 7 The third and fourth embodiments are shown respectively.

[0064] It should be noted that the circuit board assembly 700 includes at least one circuit board 7, on which the electronic heating component 71 is arranged. The number of circuit boards 7 and electronic heating components 71 is not limited, for example, both can be two as shown in the figure. Each circuit board 7 is provided with each electronic heating component 71, and each electronic heating component 71 has a flat surface 711.

[0065] like Figures 1 to 4 As shown, the first embodiment of the heat conducting plate structure 100 (referred to as the heat conducting plate structure for short) with agitating fluid of the present application comprises: a heat conducting plate 1 and a piezoelectric component 2 .

[0066] The heat conducting plate 1 is hollow, so it has a chamber 13 for containing a fluid (not shown). The heat conducting plate 1 has a plurality of inner plate surfaces and a plurality of outer plate surfaces, and the chamber 13 is formed between all the inner plate surfaces. Figure 3The first inner panel 171 and the second inner panel 172 face each other and are spaced apart from each other, and a plurality of third inner panels 173 surround each other, and the plurality of third inner panels 173 surround the periphery of the first inner panel 171 and the second inner panel 172; the plurality of outer panels are as shown in FIG. Figure 2 The heat conducting plate 1 includes a first outer panel 191 and a second outer panel 192 facing each other and a plurality of third outer panel 193 surrounding each other, and the plurality of third outer panel 193 surrounds the periphery of the first outer panel 191 and the second outer panel 192. One of the outer panel surfaces of the heat conducting plate 1 (for example, the second outer panel 192 as shown in the figure) can be attached to the flat surface 711 of the electronic heating component 71.

[0067] The piezoelectric component 2 is attached to one of the inner plate surface and the outer plate surface and is connected to the power supply 6 to be turned on. In other words, the present application does not limit where the piezoelectric component 2 is attached to the heat conducting plate 1. In this embodiment, the piezoelectric component 2 is attached to any inner plate surface as an example. Figure 3 The one shown in the figure is that the piezoelectric component 2 is attached to the first inner plate surface 171. Figure 4 And with Figure 3 As shown, a spacing space (without component symbol) may be formed between the piezoelectric component 2 and the first inner plate surface 171 , but this spacing space may not be present, and this application does not limit this.

[0068] By this, Figure 1 and Figure 4 As shown, since the piezoelectric component 2 can generate continuous vibrations after being supplied with power by the power supply 6, when the piezoelectric component 2 is attached to any inner plate surface and vibrates in the chamber 13 containing the fluid, the fluid in the chamber 13 will be agitated to generate fluctuations, so that the fluid is no longer in a static state, so that the heat from the electronic heating component 71 is no longer concentrated in the same place, but will be carried to other places of the heat conducting plate 1 by the fluid, thus improving the heat conduction and heat dissipation effects of the heat conducting plate 1. Therefore, it should be particularly noted that the piezoelectric component 2 in this application is not used to separate the hollow chamber 13 in the heat conducting plate 1 as mentioned above, and the piezoelectric component 2 in this application is mainly used to generate fluctuations in the fluid in the chamber 13.

[0069] like Figure 2 As shown, the power source 6 is not limited in this application, and as shown in the figure, it can be a type including a pair of conductive wires 61, but it is not limited to this. Figure 2 The power is obtained by passing through the third inner panel 173 and out of the third outer panel 193 .

[0070] like Figure 3 and Figure 4As shown, the present application does not limit the fixing method of the piezoelectric component 2. In one embodiment, a positioning seat 16 can be provided in the chamber 13 of the heat conducting plate 1, so that the piezoelectric component 2 can be fixed by the positioning seat 16. Specifically, the positioning seat 16 is formed on any inner plate surface, and as shown in the figure, it is formed on the first inner plate surface 171 and away from the second inner plate surface 172.

[0071] In addition, the heat conducting plate 1 can be a single-piece structure (not shown) or a Figure 3 The multi-piece structure shown comprises a cover body 1a and a base body 1b which are combined with each other to form the aforementioned receiving chamber 13.

[0072] like Figure 5 , is a second embodiment of the heat conducting plate structure 100 of the present application. The second embodiment is substantially the same as the first embodiment, except that the heat conducting plate 1 of the second embodiment is further provided with an input hole 181 and an output hole 182 both connected to the chamber 13, and the input hole 181 and the output hole 182 are respectively used for fluid to flow into and out of the chamber 13. Of course, the second embodiment also has all the effects of the first embodiment.

[0073] like Figure 6 and Figure 7 The third and fourth embodiments of the heat conducting plate structure 100 of the present application are shown in FIG. The third and fourth embodiments are substantially the same as the first or second embodiment, with the only difference being that the piezoelectric component 2 in the third and fourth embodiments is attached to any outer plate surface, as described below.

[0074] like Figure 6 As shown, in the third embodiment, the piezoelectric component 2 is attached to one of the first outer plate surface 191 and the second outer plate surface 192. As shown in the figure, it is attached to the first outer plate surface 191; Figure 7 As shown, the piezoelectric component 2 in the fourth embodiment is attached to any third outer plate surface 193 , and as shown in the figure, two piezoelectric components 2 are attached to a third outer plate surface 193 .

[0075] like Figure 6 and Figure 7 As shown, when the piezoelectric component 2 is attached to any outer plate surface, the vibration of the piezoelectric component 2 will affect the attachment position of the heat conducting plate 1 and vibrate accordingly, so that the fluid in the chamber 13 can also fluctuate, thereby producing all the effects of the first embodiment described above.

[0076] like Figures 1 to 7 As shown, the heat dissipation device of the present application includes the aforementioned heat conducting plate structure 100 and the heat pipe assembly 300 as described above.

[0077] The heat conducting plate 1 in the heat conducting plate structure 100 may have at least one opening 14, and in this embodiment, two openings 14 are provided. The opening 14 is through-shaped, and the heat conducting plate 1 has at least a first plate 11 and a second plate 12 opposite to each other (see FIG. Figure 4 ), the through opening 14 is through between the first plate 11 and the second plate 12 (or can also be through between the first outer plate surface 191 and the second outer plate surface 192), so that the flat surface 711 of each electronic heating component 71 can be exposed through each opening 14. It should be noted that the first plate 11 and the second plate 12 respectively have a first inner plate surface 171 and a first outer plate surface 191 opposite to each other, and a second inner plate surface 172 and a second outer plate surface 192 also opposite to each other.

[0078] The heat pipe assembly 300 is disposed on the heat conducting plate 1 and passes through the top of each opening 14 . Since the flat surface 711 of each electronic heating element 71 is exposed through each opening 14 , the heat pipe assembly 300 will be directly attached to each flat surface 711 for heat conduction.

[0079] The heat pipe assembly 300 may be a single-tube structure (not shown) or a multi-tube parallel structure. In this embodiment, the heat pipe assembly 300 is described by taking two heat pipes 3 arranged side by side as an example. Figure 2 As shown, each heat pipe 3 has at least two planar sides 32 , which are opposite to each other. The heat pipe assembly 300 has the planar side 32 of each heat pipe 3 attached to both the first outer panel surface 191 (or the second outer panel surface 192 ) and the aforementioned planar surface 711 .

[0080] Specifically, the first plate outer surface 191 (or the second plate outer surface 192) of the heat conducting plate 1 may also be provided with a groove 15, which also passes through each opening 14 and has at least one groove inner wall 151. The heat pipe assembly 300 is embedded in the groove 15, so that the heat pipe assembly 300 conducts heat by contacting the flat side 32 of the heat pipe 3 with the groove inner wall 151.

[0081] In addition, the heat dissipation device of the present application further includes a fin assembly 400 and even a fan assembly 500 .

[0082] The fin assembly 400 includes two heat dissipation fins 4, and the heat pipe assembly 300 has Figure 2 The two ends 31 are shown, and each heat dissipation fin 4 is attached to each end 31 for heat conduction.

[0083] The fan assembly 500 includes two heat dissipation fans 5 . Each heat dissipation fan 5 is fixed to the heat conducting plate 1 and blows or draws air corresponding to each heat dissipation fin 4 .

[0084] In this way, the heat dissipation device of the present application can also make the fluid in the heat conductive plate 1 no longer be in a static state, so that the heat from the electronic heating component 71 is no longer concentrated in the same place, but will be carried to other places of the heat conductive plate 1 by the fluid, thereby also improving the thermal conductivity and heat dissipation effects of the heat conductive plate 1. When the heat pipe assembly 300, the fin assembly 400 and the fan assembly 500 are added, it will have a better heat dissipation effect.

[0085] In summary, the heat dissipation device of the present application and its heat conducting plate structure with agitated fluid can indeed achieve the expected purpose of use, solve the deficiencies of the conventional ones and achieve the desired effects, and therefore a patent application is filed.

[0086] The above is only the preferred feasible embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the description and drawings of the present application are also included in the scope of the rights of the present application and are hereby stated.

Claims

1. A heat conducting plate structure with agitating fluid, characterized in that: include: The heat conducting plate has a plurality of outer plate surfaces and a plurality of inner plate surfaces, wherein the heat conducting plate forms a chamber for containing a fluid between the plurality of inner plate surfaces; as well as A piezoelectric component is attached to one of the outer plate surface and the inner plate surface and is connected to a power source. The piezoelectric component agitates the fluid to generate fluctuations in the chamber.

2. The heat conducting plate structure with agitating fluid according to claim 1, characterized in that: The piezoelectric component is attached to one of the plurality of inner plate surfaces, one of the inner plate surfaces is provided with a positioning seat, and the piezoelectric component is arranged on the positioning seat.

3. The heat conducting plate structure with agitating fluid according to claim 2, characterized in that: A spacing space is formed between the piezoelectric component and one of the inner plate surfaces.

4. The heat conducting plate structure with agitating fluid according to claim 2, characterized in that: The power source includes a pair of conductive wires, and the pair of conductive wires pass through any of the inner panels and out of any of the outer panels.

5. The heat conducting plate structure with agitating fluid according to claim 1, characterized in that: The piezoelectric component is attached to one of the plurality of outer panels.

6. The heat conducting plate structure with agitating fluid according to claim 1, characterized in that: The heat conducting plate is provided with an input hole and an output hole, and both the input hole and the output hole are connected to the containing chamber.

7. A heat dissipation device, characterized in that: Used to dissipate heat from electronic heating components and includes: The heat conducting plate structure with agitating fluid as claimed in any one of claims 1 to 6, wherein the heat conducting plate is provided with a through opening, and the flat surface of the electronic heating component is exposed through the opening; and The heat pipe assembly is arranged on the heat conducting plate, and the heat pipe assembly is attached to the flat surface.

8. The heat dissipation device according to claim 7, characterized in that: The heat conducting plate at least comprises a first plate and a second plate opposite to each other, and the opening passes through between the first plate and the second plate.

9. The heat dissipation device according to claim 8, characterized in that: The heat pipe assembly has a planar side, the first plate and the second plate both have the inner plate surface and the outer plate surface opposite to each other, the planar side is flatly attached to the outer plate surface of the first plate or the second plate, and the planar side is also attached to the flat surface.

10. The heat dissipation device according to claim 7, characterized in that: The heat conducting plate is provided with a groove, the groove passes through the opening and has at least one groove inner wall, the heat pipe assembly is embedded in the groove and has at least one plane side, and the at least one plane side corresponds to and abuts against the at least one groove inner wall.

11. The heat dissipation device according to claim 7, characterized in that: It also includes two heat dissipation fins. The heat pipe assembly has two ends, and each of the heat dissipation fins is attached to each of the ends.

12. The heat dissipation device according to claim 11, characterized in that: It also includes two heat dissipation fans, each of which is fixed to the heat conduction plate and blows or draws air corresponding to each of the heat dissipation fins.

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