Heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises a heat dissipation module, a first heat conduction sheet and a plurality of elastic sheets. The heat dissipation module comprises a first surface, and the first surface comprises a heat concentration part; the first heat conduction sheet is abutted against the heat concentration part; the first heat-conducting fin comprises a plurality of connecting parts which are annularly arranged on the edge of the first heat-conducting fin at intervals; the elastic sheets are in one-to-one correspondence with the connecting parts; the elastic sheet comprises a fixing part, and the fixing part is connected between the connecting part and the heat dissipation module; the fixing parts of any two adjacent elastic pieces are connected through a supporting piece, and the supporting piece and the at least two elastic pieces connected with the supporting piece are of an integrated structure. When each elastic piece is locked with the main board, the supporting piece can resist the elastic force of the two elastic pieces connected with the supporting piece, so that the heat dissipation module is prevented from being deformed, and the rigidity of the heat dissipation assembly can be improved. When the heat dissipation assembly is light and thin, the heat dissipation assembly can still bear the elastic force of 3 kg or above so as to meet the heat dissipation requirement.

Description

Technical Field

[0001] The present application relates to the technical field of terminal equipment, and in particular to a heat dissipation component and an electronic device. Background Art

[0002] As electronic devices realize more functions, more electronic components are included in them. During the operation of electronic devices, a large number of electronic components will generate a lot of heat. Among them, electronic components include but are not limited to motherboards, central processing units (CPUs), and memory.

[0003] To achieve heat dissipation, electronic devices include heat dissipation components, which are configured to dissipate heat generated by electronic components such as the CPU. The heat dissipation component and the CPU are combined by elastic pressure, and the elastic force must be above 3kg to meet the heat dissipation requirements.

[0004] However, as electronic devices become thinner and lighter, the heat dissipation components are thinner, which reduces the rigidity of the heat dissipation components. The heat dissipation components cannot withstand elastic forces above 3kg, causing the heat dissipation components to deform and fail to meet the heat dissipation requirements. Utility Model Content

[0005] The present application provides a heat dissipation component and an electronic device to solve the problem that the heat dissipation component has low rigidity and cannot meet the heat dissipation requirements.

[0006] In the first aspect, the present application provides a heat dissipation assembly, including: a heat dissipation module, a first heat conductive sheet, and a plurality of spring sheets. The heat dissipation module includes a first surface, the first surface includes a heat concentrating portion; the first heat conductive sheet abuts against the heat concentrating portion; the first heat conductive sheet includes a plurality of connecting portions, and the plurality of connecting portion spacers are arranged at the edge of the first heat conductive sheet; the spring sheets correspond to the connecting portions one by one; the spring sheets include a fixing portion, and the fixing portion is connected between the connecting portion and the heat dissipation module; the fixing portions of any two adjacent spring sheets are connected by a support sheet, and the support sheet and the at least two spring sheets connected thereto are an integral structure.

[0007] In the heat dissipation assembly provided in the embodiment of the present application, any two or more adjacent springs are integrally formed through the support sheet. When the springs are locked with the mainboard, the support sheet can resist the elastic force of the two springs connected thereto, thereby preventing the heat dissipation module from deforming, thereby improving the rigidity of the heat dissipation assembly. When the heat dissipation assembly is made thinner and lighter, the heat dissipation assembly can still withstand an elastic force of more than 3kg to meet the heat dissipation requirements.

[0008] In some implementations, the spring sheet further includes: a movable portion; the movable portion is bent relative to the fixed portion in a direction away from the first surface; the movable portion is configured to generate displacement when being fixed to apply elastic force to the fixed portion; the elastic force is configured to drive the first heat conductive sheet to generate displacement in a direction away from the heat dissipation module. In this way, the bending structure of the spring sheet can be used to apply elastic force to the first heat conductive sheet when being fixed, so that the first heat conductive sheet is pressed against the CPU below it to ensure the heat dissipation effect.

[0009] In some implementations, the first reinforcing sheet is also included, and the first reinforcing sheet is a sheet-like structure; the first reinforcing sheet is located on the first surface and at the edge of the first heat conductive sheet. In this way, the first reinforcing sheet can resist the elastic force of the spring sheet to prevent the heat dissipation module from being deformed, and also prevent the first heat conductive sheet from being deformed, so as to improve the rigidity of the heat dissipation component.

[0010] In some implementations, the heat dissipation module includes a second surface, the second surface is opposite to the first surface; and further includes: a second reinforcing sheet, the second reinforcing sheet is a strip structure; the second reinforcing sheet is located on the second surface and at the edge of the heat concentration portion. In this way, the second reinforcing sheet can resist the elastic force of the spring sheet to prevent the heat dissipation module from being deformed, and also prevent the first heat conductive sheet from being deformed, so as to improve the rigidity of the heat dissipation component.

[0011] In some implementations, the heat dissipation module includes a second surface, the second surface is opposite to the first surface; and further includes: a third reinforcing sheet, the third reinforcing sheet is a sheet-like structure; the third reinforcing sheet is located on the second surface, and is located in part or all of the heat concentration area. In this way, the third reinforcing sheet can resist the elastic force of the spring sheet to prevent the heat dissipation module from being deformed, and also prevent the first heat conductive sheet from being deformed, so as to improve the rigidity of the heat dissipation component.

[0012] In some implementations, the first heat conductive sheet further includes a first heat conductive sheet body and a third surface, the third surface is opposite to the first surface; a plurality of connection portion spacer rings are arranged on the edge of the first heat conductive sheet body, the connection portion is bent relative to the first heat conductive sheet body in a direction away from the heat dissipation module, and the extension direction of the connection portion is parallel to the extension direction of the first heat conductive sheet body; the connection portion includes a plurality of punching holes, and the ends of the punching holes protrude from the third surface of the connection portion along the direction of the heat dissipation module. In this way, a certain interval is provided between the connection portion and the heat dissipation module to facilitate the embedding of the fixing portion of the spring sheet, thereby realizing the connection between the heat dissipation module, the spring sheet and the first heat conductive sheet. The punching hole is turned outward relative to the third surface of the connection portion, and when the connection portion is connected to the fixing portion of the spring sheet, the bonding strength between the connection portion and the fixing portion of the spring sheet can be improved.

[0013] In some implementations, the fixing portion of the spring sheet includes a plurality of fixing holes, and the fixing holes correspond to the punching holes one by one; the punching holes are embedded in the corresponding fixing holes, and the outer diameter of the edge of the punching holes is larger than the inner diameter of the fixing holes. In this way, the punching holes and the fixing holes are interference fit to improve the bonding strength between the connecting portion of the first heat conducting sheet and the fixing portion of the spring sheet.

[0014] In some implementations, the first heat conducting sheet further includes a fourth surface, the fourth surface facing away from the third surface; the fourth surface includes a plurality of reinforcing ribs, and the plurality of reinforcing ribs are spaced apart and located at the bend of the connecting portion. In this way, the reinforcing ribs are used to support the connecting portion to prevent the connecting portion from being deformed by the elastic force of the elastic sheet after being connected to the elastic sheet, thereby improving the rigidity of the first heat conducting sheet, and further improving the rigidity of the heat dissipation assembly.

[0015] In some implementations, along the direction from the connection portion to the first heat conductive sheet body, the width of the end of the connection portion connected to the first heat conductive sheet body gradually increases. In this way, the strength of the connection portion can be improved to prevent deformation caused by the elastic force of the elastic sheet after it is connected to the elastic sheet, thereby improving the rigidity of the first heat conductive sheet and further improving the rigidity of the heat dissipation assembly.

[0016] In some implementations, the method further includes: a plurality of solder bars; the plurality of solder bars are distributed on the third surface of the first heat conductive sheet, the fixing portion of the spring sheet, and the junction between the first heat conductive sheet and the fixing portion; the solder bars are configured to weld the first heat conductive sheet and the heat dissipation module. In this way, the bonding strength and reliability of the first heat conductive sheet and the heat dissipation module can be improved.

[0017] In some implementations, the spring sheet further includes: at least one overflow tin groove; the overflow tin groove is located between the fixed portion and the movable portion, and is located on the surface of the spring sheet facing the heat dissipation module. In this way, it can be prevented that when the first heat conductive sheet and the heat dissipation module are welded, the solder paste overflows outside the fixed portion, resulting in a smaller actual force arm, which affects the elastic pressure of the heat dissipation module, the first heat conductive sheet and the CPU.

[0018] In some implementations, the heat dissipation module further includes: two heat conducting parts, the two heat conducting parts are located on opposite sides of the heat concentrating part; and further includes: a second heat conducting sheet; the second heat conducting sheet is located between the heat concentrating part and the two heat conducting parts, the second heat conducting sheet is connected to the second surface of the heat dissipation module, and the second surface is opposite to the first surface. In this way, the second heat conducting sheet can be used to conduct the heat generated by other electronic components on the mainboard to the heat concentrating part, so as to facilitate efficient heat dissipation.

[0019] In some implementations, the second heat conducting sheet includes a hollow hole; the hollow hole is located near the heat concentrating portion of the second heat conducting sheet and is opposite to one of the spring sheets, and the hollow hole is configured to provide a movable space for the movable portion of the spring sheet. In this way, the spring sheet can be displaced when it is locked to the mainboard and exert elastic force on the heat dissipation module and the first heat conducting sheet.

[0020] In some implementations, the edge of the hollow hole adjacent to the heat concentrating portion includes an extension portion, and the extension portion is connected to the edge of the heat dissipation module. In this way, the contact area between the second skirt of the second heat conductive sheet and the first skirt of the heat dissipation module can be increased, thereby increasing the bonding strength between the second heat conductive sheet and the heat dissipation module and improving the rigidity of the heat dissipation assembly.

[0021] In a second aspect, the present application provides an electronic device, comprising a device body, a main board, and the heat dissipation assembly provided in the first aspect; the main board and the heat dissipation assembly are located in the device body; the main board comprises a plurality of devices, the heat dissipation assembly covers the plurality of devices, and the heat dissipation assembly is configured to dissipate heat generated by the plurality of devices.

[0022] The electronic device provided in the embodiment of the present application has a heat dissipation component that has a rigidity that meets the requirements while achieving lightweight development. In this way, when achieving lightweight development of the electronic device, the heat dissipation performance of the electronic device can be improved, and the long-term stability of the heat dissipation of the entire device can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the embodiments are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 2 It is a structural diagram of a heat dissipation system;

[0026] Figure 3 is a schematic diagram of the exploded structure of the heat dissipation assembly provided in an embodiment of the present application;

[0027] Figure 4 is a schematic diagram of the structure of the heat dissipation assembly and the mainboard 40 provided in an embodiment of the present application;

[0028] Figure 5 yes Figure 4 Schematic diagram of the local structure of the AA section;

[0029] Figure 6 is a schematic diagram of the structure of a heat dissipation assembly provided in an embodiment of the present application;

[0030] Figure 7 yes Figure 6 Schematic diagram of the local structure of the middle BB section;

[0031] Figure 8 is a schematic structural diagram of a spring piece 300 provided in an embodiment of the present application;

[0032] Fig. 9 It is a structural schematic diagram of the first reinforcement method provided in the embodiment of the present application;

[0033] Fig.10 It is a structural schematic diagram of a second reinforcement method provided in an embodiment of the present application;

[0034] Fig.11 yes Fig.10 Schematic diagram of the local structure of the middle DD section;

[0035] Fig.12 It is a structural schematic diagram of a third reinforcement method provided in an embodiment of the present application;

[0036] Fig.13 It is a structural schematic diagram of the fourth reinforcement method provided in the embodiment of the present application;

[0037] Fig.14 is a schematic structural diagram of a first heat conducting sheet 200 provided in an embodiment of the present application;

[0038] Fig.15 yes Fig.14 Schematic diagram of the local structure of the middle E area;

[0039] Fig.16 yes Figure 6 Schematic diagram of the local structure of the CC section;

[0040] Fig.17 1 is a first structural schematic diagram of the first heat conductive sheet 200 and the spring sheet 300 provided in an embodiment of the present application;

[0041] Fig.18 is a second structural schematic diagram of the first heat conductive sheet 200 and the spring sheet 300 provided in the embodiment of the present application;

[0042] Fig.19 Schematic diagram of the structure of the second heat conducting sheet 600 and the second copper sheet 53 provided in an embodiment of the present application.

[0043] Illustration Description:

[0044] 10-first body, 11-display screen, 20-second body, 21-keyboard, 22-touchpad, 30-shaft, 40-motherboard, 41-CPU, 42-other electronic components, 43-stud, 51-heat sink, 52-first copper sheet, 53-second copper sheet, 531-body, 532-skirt, 533-notch, 54-elastic member, 60-fan, 100-heat dissipation module, 101-first surface, 102-heat concentrating part, 103-second surface, 104-heat conducting part, 105-first skirt, 200-first heat conducting sheet, 201-connecting part, 201 a-transition connection part, 2011-stamping hole, 202-first heat conducting plate body, 203-third surface, 204-fourth surface, 205-reinforcement rib, 300-spring sheet, 301-fixing part, 3011-fixing hole, 302-supporting plate, 303-movable part, 3031-through hole, 304-overflow tin groove, 401-first reinforcement plate, 402-second reinforcement plate, 403-third reinforcement plate, 500-solder bar, 600-second heat conducting plate, 601-hollow hole, 602-extension part, 603-second heat conducting plate body, 604-second skirt, 700-TIM. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present application will be described clearly below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making creative work all belong to the protection scope of the present application.

[0046] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0047] In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the changes in the orientation of the components in the drawings.

[0048] The professional terms mentioned in the embodiments of the present application are explained below to facilitate understanding by those skilled in the art.

[0049] Thermal Interface Material (TIM) is a general term for materials used to coat heat sinks and heating devices to reduce the contact thermal resistance between them. The contact surfaces of heat sinks and heating devices are rough and uneven, and it is impossible for them to be in complete contact. There will always be air with very low thermal conductivity. Thermal interface materials can be used to fill this air gap, which can reduce the contact thermal resistance and improve the heat dissipation performance.

[0050] The budding process is to punch vertical edges on the pre-punched substrate to form vertical holes with a certain inner diameter, outer diameter and height. These holes can be used for riveting holes and tapping to meet assembly requirements.

[0051] The electronic device described in the embodiments of the present application includes but is not limited to a mobile phone, a notebook computer, a tablet computer, a laptop computer, a personal digital assistant or a wearable device, etc. The following description is made by taking the electronic device as a notebook computer.

[0052] Figure 1 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0053] like Figure 1 As shown, the electronic device includes a first body 10 and a second body 20. The first body 10 and the second body 20 can be connected and rotated by a shaft 30 or a hinge (not shown in the figure) so that the electronic device can be switched between an open state and a closed state. For example, the first body 10 can be used as a display side, and the second body 20 can be used as a host system side.

[0054] The first body 10 includes a display screen 11 , which is used to display images and videos, etc. The display screen 11 may be a flexible display screen or a rigid display screen.

[0055] The second body 20 includes a keyboard 21 and a touch pad 22, which are arranged on the surface of the second body 20 facing the display screen 11. The keyboard 21 is used to input instructions or data. One working mode of the touch pad 22 is to be used as a mouse, using the touch action of the user's finger (including swiping, clicking, etc.) to control the action of the cursor on the display screen 11 to perform mouse operations such as "cursor navigation", "selection" or "confirmation".

[0056] The second body 20 includes a plurality of electronic components, including but not limited to a motherboard, a central processing unit (CPU), and a memory (hard disk / solid state drive), etc. The motherboard may be a printed circuit board (PCB).

[0057] To facilitate the explanation of the positions of various components in an electronic device, the embodiment of the present application exemplarily establishes a three-dimensional coordinate system based on the electronic device, wherein the x-axis direction is the width direction of the electronic device, the y-axis direction is the length direction of the electronic device, and the z-axis direction is the thickness direction of the electronic device.

[0058] For example, Figure 1 A three-dimensional coordinate system established based on the second body 20 is shown, where the x-axis direction is the width direction of the second body 20 , the y-axis direction is the length direction of the second body 20 , and the z-axis direction is the thickness direction of the second body 20 .

[0059] As electronic devices realize more functions, more electronic components are included in them. During the operation of electronic devices, a large number of electronic components will generate a lot of heat. If this heat is not discharged in time, it will not only damage the electronic components, but may even cause forced shutdown or crash, reducing the life of the electronic device. Therefore, a good heat dissipation device is needed to discharge the heat.

[0060] Figure 2 It is a structural diagram of a heat dissipation system.

[0061] like Figure 2 As shown, a CPU 41 and other electronic components 42 are integrated on a mainboard 40 of the electronic device. To achieve heat dissipation of the electronic device, a heat dissipation system and a fan are usually used. Among them, other electronic components 42 include storage, memory, graphics card, sound card or battery, etc., and the corresponding structures are not shown in the figure.

[0062] The heat dissipation system includes a vapor chamber (VC) 51, a first copper sheet 52 and a second copper sheet 53. The first copper sheet 52 covers the CPU 41, and the second copper sheet 53 covers other electronic components 42. The vapor chamber 51 covers the first copper sheet 52 and is connected to the second copper sheet 53.

[0063] It should be noted that the first copper sheet 52 is located between the heat spreader 51 and the mainboard 40, the CPU 41 is located between the first copper sheet 52 and the mainboard 40, and the other electronic components 42 are located between the second copper sheet 53 and the mainboard 40. Figure 2 In the viewing angle shown, the first copper sheet 52, the CPU 41 and other electronic components 42 are not visible, and the corresponding structural areas are shown with dotted lines.

[0064] The electronic device also includes two fans 60, which are located on the mainboard 40 and on both sides of the CPU 41 and other electronic components 42. The two fans 60 are connected to both ends of the heat spreader 51. The heat generated by the CPU 41 and other electronic components 42 is first transferred from the first copper sheet 52 and the second copper sheet 53 to the heat spreader 51, and then transferred from the heat spreader 51 to the outlet of the fans 60, and then dissipated into the environment by the fans 60 in a forced convection manner, thereby achieving the purpose of heat dissipation and cooling of the electronic device. Figure 2 The path indicated by the arrow in the middle is the heat dissipation path, and the depth of the arrow color corresponds to the level of heat.

[0065] The heat dissipation system and the CPU 41 are combined by elastic pressing, that is, elastic parts 54 made of stainless steel are used to achieve elastic pressing. There are multiple elastic parts 54, and multiple elastic parts 54 exist independently. The first end of each elastic part 54 is welded between the heat spreader 51 and the first copper sheet 52, and the second end is spaced from the mainboard 40 when not locked. The CPU 41 is set on the mainboard 40. The second end of the elastic part 54 is locked with the mainboard 40 by screws (not shown in the figure), so that the second end of the elastic part 54 generates an elastic force toward the mainboard 40. Based on the principle of dynamic balance, the first end of the elastic part 54 gives the first copper sheet 52 an elastic force toward the mainboard 40, thereby causing the first copper sheet 52 to be displaced toward the mainboard 40 to be pressed with the CPU 41.

[0066] To improve the heat dissipation performance, a TIM (not shown in the figure) is provided between the first copper sheet 52 and the CPU 41. The TIM fills the air gap between the first copper sheet 52 and the CPU 41 to reduce the contact thermal resistance and improve the heat dissipation performance. The thinner the TIM is, the better the heat dissipation effect is. Therefore, the elastic force that the heat dissipation system can withstand needs to be above 3kg to press the TIM between the CPU 41 and the first copper sheet 52 to be thin enough so that the thermal resistance is small enough to improve the heat dissipation performance.

[0067] As electronic devices become thinner and lighter, the space that the heat dissipation system can occupy in the z-direction (thickness direction) is limited. In order to adapt to the reduction in the internal space of electronic devices, the heat dissipation systems are correspondingly thinned. For example, the thickness of the heat spreader 51 is less than 0.1 mm, and the thickness of the first copper sheet 52 is also less than 0.3 mm. According to the comprehensive stiffness evaluation, the heat dissipation system with reduced thickness can only withstand a snap-on force of 1.0 to 1.4 kg. The stiffness of the heat dissipation system is extremely low, so that the heat dissipation system is deformed when it is locked with the CPU 41 through the elastic member 54, resulting in a reduction in the locking force, poor TIM spreading effect, and affected heat conduction efficiency. The heat generated by the CPU 41 cannot be transferred to the heat dissipation system in time, affecting the performance release of the entire machine.

[0068] To this end, the embodiment of the present application provides a heat dissipation component that is lightweight and thin while having high rigidity and can withstand a spring force of more than 3kg. When locked with the CPU, the heat dissipation component will not deform, thereby increasing the locking force, thereby achieving a good TIM spreading effect and improving heat dissipation performance.

[0069] Figure 3 is a schematic diagram of the exploded structure of the heat dissipation assembly provided in an embodiment of the present application; Figure 4 It is a schematic diagram of the structure of the heat dissipation assembly and the mainboard 40 provided in an embodiment of the present application.

[0070] like Figure 3 and Figure 4 As shown, in some embodiments, the heat dissipation assembly is located on the mainboard 40. The heat dissipation assembly may include: a heat dissipation module 100, a first heat conductive sheet 200 and a plurality of spring sheets 300.

[0071] The heat dissipation module 100 may be a vapor chamber (VC), configured to achieve heat dissipation of each heat-generating device on the mainboard 40. The first heat-conducting sheet 200 may be a copper sheet, configured to conduct the heat generated by the heat-generating device to the heat dissipation module 100. The spring 300 may be made of stainless steel, configured to apply elastic force to the heat dissipation module 100 and the first heat-conducting sheet 200, so as to press the first heat-conducting sheet 200 and the heat-generating device together. The heat-generating device may include a CPU 41 and other electronic components 42.

[0072] Figure 5 yes Figure 4 Schematic diagram of the local structure of the AA section.

[0073] like Figure 5 As shown, in some embodiments, the surface of the mainboard 40 facing the heat dissipation module 100 includes a CPU 41, other electronic components (not shown in the figure) and studs 43. Figure 2 The CPU 41 is located on one side of the other electronic components 42. The number of the studs 43 is equal to the number of the springs 300. The studs 43 correspond to the springs 300 one by one. The studs 43 are configured to fix the corresponding springs 300 so that the springs 300 generate elastic force.

[0074] The CPU 41 is opposite to the first heat conducting sheet 200 , and a TIM 700 is disposed between the CPU 41 and the first heat conducting sheet 200 . The TIM 700 can be used to quickly and efficiently conduct the heat generated by the CPU 41 to the first heat conducting sheet 200 .

[0075] Figure 6 It is a schematic diagram of the structure of the heat dissipation assembly provided in an embodiment of the present application.

[0076] Combination Figure 4 and Figure 6 As shown, in some embodiments, the heat dissipation module 100 includes a first surface 101 and a second surface 103 facing each other, wherein the first surface 101 faces the mainboard 40 and the second surface 103 faces away from the mainboard 40 .

[0077] The first surface 101 may include a heat concentrating portion 102 and two heat conducting portions 104. The heat concentrating portion 102 may be located in the middle area of ​​the first surface 101 and opposite to the heat generating devices on the main board 40. The heat concentrating portion 102 is configured to concentrate the heat generated by the heat generating devices on the main board 40. The two heat conducting portions 104 are located on opposite sides of the heat concentrating portion 102. Figure 2 The heat conducting portion 104 is configured to be connected to the fan 60 so as to conduct the heat conducted by the heat concentrating portion 102 to the outlet position of the fan 60 again through the heat conducting portion 104, and then dissipate the heat into the environment by forced convection by the fan 60, thereby achieving the purpose of dissipating heat and cooling the electronic equipment.

[0078] Figure 7 yes Figure 6 Schematic diagram of the local structure of the BB section.

[0079] Combination Figure 6 and Figure 7 As shown, in some embodiments, the first heat conductive sheet 200 is attached to the first surface 101 of the heat dissipation module 100 and abuts against the heat concentrating portion 102. Figure 5 The first heat conducting sheet 200 is arranged to be opposite to the CPU 41 on the main board 40 to conduct the heat generated by the CPU 41 to the heat concentrating portion 102 .

[0080] The first heat conducting sheet 200 may include a first heat conducting sheet body 202 and a plurality of connecting portions 201, wherein the plurality of connecting portions 201 are arranged at intervals on the edge of the first heat conducting sheet body 202. The connecting portion 201 is configured to be connected to one end of the spring sheet 300, and the plurality of spring sheets 300 correspond to the plurality of connecting portions 201 one by one. The spring sheets 300 are configured to realize elastic compression of the heat dissipation module 100, the first heat conducting sheet 200 and the CPU 41.

[0081] In one implementation, the number of the spring pieces 300 is at least 3. The plurality of connecting portions 201 may be arranged at equal intervals around the edge of the first heat conducting sheet body 202, so that at least three spring pieces 300 may be located at equal intervals on the edge of the first heat conducting sheet body 202. In this way, the center of gravity of the elastic force generated by at least three spring pieces 300 may be located at the center of the first heat conducting sheet 200, and the CPU 41 is located below the center of the first heat conducting sheet 200, thereby improving the elastic force pressing effect. Under the action of the elastic force, the first heat conducting sheet 200 can be in full contact with the CPU 41, thereby improving the heat conduction efficiency.

[0082] Combination Figure 5 and Figure 7 As shown, in some embodiments, the spring 300 may include a fixed portion 301 and a movable portion 303, the fixed portion 301 is connected between the connecting portion 201 of the first heat conductive sheet 200 and the heat dissipation module 100; the movable portion 303 extends in a direction away from the first heat conductive sheet 200 and is configured to be connected to the mainboard 40.

[0083] The movable portion 303 of the spring sheet 300 is bent relative to the fixed portion 301 in a direction away from the first surface 101, that is, the movable portion 303 is bent relative to the fixed portion 301 in a direction toward the second surface 103. The distance between the movable portion 303 and the main board 40 is greater than the distance between the fixed portion 301 and the main board 40, and the movable portion 303 extends above the corresponding stud 43. When the spring sheet 300 and the stud 43 are not locked, there is a first interval L1 between the movable portion 303 and the stud 43.

[0084] The movable portion 303 includes a through hole 3031, the stud 43 is opposite to the through hole 3031, and the movable portion 303 and the stud 43 are fixed by screws (not shown in the figure). The movable portion 303 is configured to generate displacement when being fixed to apply elastic force to the fixed portion 301, and the elastic force is configured to drive the first heat conducting sheet 200 to generate displacement in a direction away from the heat dissipation module 100.

[0085] When the movable part 303 and the stud 43 are screwed together, the first interval L1 between the movable part 303 and the stud 43 disappears, the movable part 303 is displaced toward the mainboard 40, and an elastic force (hereinafter referred to as the downward force) is generated toward the mainboard 40. Based on the principle of dynamic balance, in order to maintain the mechanical balance on the spring sheet 300, the fixed part 301 is subjected to an elastic force (hereinafter referred to as the upward force) in the direction away from the mainboard 40. The upward force is the force applied by the first heat conductive sheet 200 to the fixed part 301; similarly, in order to maintain the mechanical balance on the first heat conductive sheet 200, the fixed part 301 applies a downward force to the first heat conductive sheet 200, so that the first heat conductive sheet 200 is displaced toward the mainboard 40 to be pressed against the CPU 41.

[0086] Figure 8 is a schematic diagram of the structure of the spring piece 300 provided in the embodiment of the present application. Figure 8 (a) shows the structure of an independent shrapnel 300; Figure 8 (b) shows a three-dimensional view of the integrally formed spring piece 300 , in which the visible surface of the spring piece 300 in the current state is the surface facing away from the heat dissipation module 100 ; Figure 8 (c) shows a top view of the integrally formed spring piece 300 . In the current state, the visible surface of the spring piece 300 is the surface facing the heat dissipation module 100 .

[0087] like Figure 8 As shown, in some embodiments, the fixing portions 301 of any at least two adjacent elastic sheets 300 are connected via a supporting sheet 302 , and the supporting sheet 302 and the at least two elastic sheets 300 connected thereto are an integral structure.

[0088] like Figure 8 As shown in (a), for ease of installation and when the internal space of the electronic device is limited, there can be at least one independent spring piece 300 among the multiple spring pieces 300 .

[0089] like Figure 8 As shown in (b) and (c), when there is enough space, the fixing portions 301 of any at least two adjacent spring sheets 300 are integrally formed through the supporting sheet 302 to improve the reliability and stability of each spring sheet 300.

[0090] For example, when the number of the spring pieces 300 is greater than 3, two adjacent spring pieces 300 can be integrally formed through one supporting sheet 302, or three adjacent spring pieces 300 can be integrally formed through two supporting sheets 302 in sequence, and the other spring pieces 300 exist independently. When the number of the spring pieces 300 is 3 and there is enough space, the three spring pieces 300 are integrally formed through three supporting sheets 302 in sequence from head to tail. Compared with the elastic members that exist separately in the existing solution, the more the number of integrally formed spring pieces 300 is, the higher the reliability and stability of each spring piece 300 is.

[0091] That is to say, all the spring pieces 300 can be connected into an integrated structure through the corresponding multiple supporting pieces 302; or, there can be at least one independent spring piece 300 among all the spring pieces 300, and the remaining spring pieces 300 are connected into an integrated structure through the corresponding multiple supporting pieces 302.

[0092] When there are multiple support sheets 302, the multiple support sheets 302 surround the outer edge of the first heat conducting sheet 200, and the support sheets 302 and the first heat conducting sheet 200 do not overlap in the z-axis direction to avoid occupying the z-direction space and causing an increase in thickness.

[0093] When the elastic sheets 300 are used to realize the elastic compression of the heat dissipation module 100, the first heat conductive sheet 200 and the CPU 41, the support sheet 302 can resist the elastic force of the two elastic sheets 300 connected thereto, thereby preventing the heat dissipation module 100 from being deformed, and also preventing the first heat conductive sheet 200 from being deformed. The heat dissipation module 100 and the first heat conductive sheet 200 will not be deformed, and the rigidity of the heat dissipation module 100 and the first heat conductive sheet 200 can be improved, thereby improving the rigidity of the heat dissipation assembly.

[0094] In the heat dissipation assembly provided in the embodiment of the present application, any at least two adjacent spring sheets 300 are integrally formed through the support sheet 302. When the spring sheets 300 are locked with the mainboard 40, the heat dissipation assembly will not be deformed, thereby improving the rigidity of the heat dissipation assembly. When the heat dissipation assembly is made thinner and lighter, the heat dissipation assembly can still withstand an elastic force of more than 3kg. In this way, under the action of sufficient elastic force, the TIM 700 between the first heat conductive sheet 200 and the CPU 41 can be pressed thin enough, the TIM 700 has a good spreading effect, and the thermal resistance is small enough to ensure the long-term stability of the heat dissipation of the whole machine. The heat generated by the CPU 41 can be timely conducted to the first heat conductive sheet 200, and then to the heat dissipation module 100, thereby improving the heat dissipation performance and improving the performance release of the whole machine.

[0095] Fig. 9 This is a schematic diagram of the structure of the first reinforcement method provided in the embodiment of the present application. Fig. 9 Shows the partial structure of the heat dissipation component.

[0096] like Fig. 9 As shown, in some embodiments, the heat dissipation assembly may further include: a first reinforcing sheet 401, the first reinforcing sheet 401 is a sheet-like structure, and illustratively, the first reinforcing sheet 401 may be made of stainless steel.

[0097] The first reinforcing sheet 401 is located on the first surface 101 of the heat dissipation module 100 and outside the edge of the first heat conductive sheet 200. There can be multiple first reinforcing sheets 401, each of which surrounds the outside edge of the first heat conductive sheet body 202 of the first heat conductive sheet 200.

[0098] The ends of each first reinforcing sheet 401 along the length direction extend to the corresponding connecting portion 201, so that the first reinforcing sheet 401 is located between each spring sheet 300. The first reinforcing sheet 401 can further resist the elastic force of the spring sheet 300, thereby preventing the heat dissipation module 100 from being deformed, and also preventing the first heat conductive sheet 200 from being deformed. The heat dissipation module 100 and the first heat conductive sheet 200 will not be deformed, and the rigidity of the heat dissipation module 100 and the first heat conductive sheet 200 can be improved, thereby improving the rigidity of the heat dissipation assembly.

[0099] In this way, when the heat dissipation component is made thinner and lighter, the heat dissipation component can still have the rigidity to withstand an elastic force of more than 3kg, so that when the heat dissipation component is locked with the mainboard 40 through the spring pieces 300, the heat dissipation component will not be deformed, thereby improving the locking force and ensuring the heat dissipation effect.

[0100] Fig.10 It is a structural schematic diagram of a second reinforcement method provided in an embodiment of the present application; Fig.11 yes Fig.10Schematic diagram of the local structure of the DD section. Fig.10 Shows the partial structure of the heat dissipation component.

[0101] like Fig.10 and Fig.11 As shown, in some embodiments, the heat dissipation assembly may further include: a second reinforcing sheet 402, the second reinforcing sheet 402 is a strip structure, and illustratively, the second reinforcing sheet 402 may be made of stainless steel.

[0102] The second reinforcing sheet 402 is located on the second surface 103 of the heat dissipation module 100. The heat dissipation module 100 includes a first skirt 105, which is located on the outer edge of the heat dissipation module 100 body. One side surface of the first skirt 105 is coplanar with the first surface 101, and the other side surface has a height difference relative to the second surface 103. In other words, the thickness of the first skirt 105 is less than the thickness of the heat dissipation module 100 body.

[0103] The second reinforcing sheet 402 is attached to the surface of the first skirt 105 facing the second surface 103 and is located at the edge of the heat concentrating portion 102 .

[0104] The second reinforcing sheet 402 is located between two adjacent spring sheets 300. The second reinforcing sheet 402 can further resist the elastic force of the spring sheets 300, thereby preventing the heat dissipation module 100 from deforming, and also preventing the first heat conductive sheet 200 from deforming. The heat dissipation module 100 and the first heat conductive sheet 200 will not deform, and the rigidity of the heat dissipation module 100 and the first heat conductive sheet 200 can be improved, thereby improving the rigidity of the heat dissipation assembly.

[0105] It should be noted that the second reinforcing sheet 402 may also be attached to the first skirt 105 opposite to the connection position between the heat concentrating portion 102 and the second heat conducting sheet 600 to resist the elastic force of the spring sheet 300 adjacent to the second heat conducting sheet 600 .

[0106] In this way, when the heat dissipation component is made thinner and lighter, the heat dissipation component can still have the rigidity to withstand an elastic force of more than 3kg, so that when the heat dissipation component is locked with the mainboard 40 through the spring pieces 300, the heat dissipation component will not be deformed, thereby improving the locking force and ensuring the heat dissipation effect.

[0107] Fig.12 : is a schematic diagram of the structure of the third reinforcement method provided in the embodiment of the present application. Fig.12 Shows the partial structure of the heat dissipation component.

[0108] like Fig.12 As shown, in some embodiments, the heat dissipation assembly may further include: a third reinforcing sheet 403, the third reinforcing sheet 403 is a sheet-like structure, and illustratively, the third reinforcing sheet 403 may be made of stainless steel.

[0109] The third reinforcing sheet 403 is located on the second surface 103 of the heat dissipation module 100 and is located in a partial area of ​​the heat concentration portion 102. The third reinforcing sheet 403 is adjacent to two adjacent integrally formed spring sheets 300. The third reinforcing sheet 403 can further resist the elastic force of the spring sheets 300, thereby preventing the heat dissipation module 100 from being deformed, and also preventing the first heat conductive sheet 200 from being deformed. The heat dissipation module 100 and the first heat conductive sheet 200 will not be deformed, and the rigidity of the heat dissipation module 100 and the first heat conductive sheet 200 can be improved, thereby improving the rigidity of the heat dissipation assembly.

[0110] In this way, when the heat dissipation component is made thinner and lighter, the heat dissipation component can still have the rigidity to withstand an elastic force of more than 3kg, so that when the heat dissipation component is locked with the mainboard 40 through the spring pieces 300, the heat dissipation component will not be deformed, thereby improving the locking force and ensuring the heat dissipation effect.

[0111] Fig.13 : is a schematic diagram of the structure of the fourth reinforcement method provided in the embodiment of the present application. Fig.13 Shows the partial structure of the heat dissipation component.

[0112] like Fig.13 As shown, in some embodiments, the third reinforcing sheet 403 is located in the entire area of ​​the heat concentrating portion 102, that is, all over the entire area surrounded by each spring sheet 300. One end of the third reinforcing sheet 403 is adjacent to two adjacent integrally formed spring sheets 300, and the other end extends to the spring sheet 300 side adjacent to the second heat conducting sheet 600.

[0113] The third reinforcing sheet 403 can further resist the elastic force of each spring sheet 300, prevent the heat dissipation module 100 from being deformed, and also prevent the first heat conductive sheet 200 from being deformed. The heat dissipation module 100 and the first heat conductive sheet 200 will not be deformed, and the rigidity of the heat dissipation module 100 and the first heat conductive sheet 200 can be improved, thereby improving the rigidity of the heat dissipation assembly.

[0114] In this way, when the heat dissipation component is made thinner and lighter, the heat dissipation component can still have the rigidity to withstand an elastic force of more than 3kg, so that when the heat dissipation component is locked with the mainboard 40 through the spring pieces 300, the heat dissipation component will not be deformed, thereby improving the locking force and ensuring the heat dissipation effect.

[0115] It should be noted that the second reinforcing sheet 402 and the third reinforcing sheet 403 are both located on the second surface 103 of the heat dissipation module 100, and the difference is that the two are set at different positions. Therefore, the second reinforcing sheet 402 and the third reinforcing sheet 403 can be set separately or at the same time. Similarly, the first reinforcing sheet 401 and the second reinforcing sheet 402 and the third reinforcing sheet 403 are located on two opposite surfaces of the heat dissipation module 100, and the first reinforcing sheet 401, the second reinforcing sheet 402 and the third reinforcing sheet 403 can be set separately or at the same time. In this way, the heat dissipation module 100 can be further supported and the rigidity of the heat dissipation component can be improved.

[0116] Fig.14 It is a schematic diagram of the structure of the first heat conducting sheet 200 provided in an embodiment of the present application.

[0117] Combination Figure 7 and Fig.14 As shown, in some embodiments, the first heat conductive sheet 200 includes a third surface 203 , and the third surface 203 is opposite to the first surface 101 .

[0118] Each connecting portion 201 of the first heat conducting plate 200 is bent relative to the first heat conducting plate body 202 in a direction away from the heat dissipation module 100 , and an extending direction of the connecting portion 201 is parallel to an extending direction of the first heat conducting plate body 202 .

[0119] In this way, there is a certain distance between the connecting portion 201 and the heat dissipation module 100 , so as to facilitate the embedding of the fixing portion 301 of the spring sheet 300 , thereby achieving the connection between the heat dissipation module 100 , the spring sheet 300 and the first heat conducting sheet 200 .

[0120] Fig.15 yes Fig.14 Schematic diagram of the local structure of the E area. Fig.15 (a) shows the structure of the first heat conducting sheet 200 from the perspective of the third surface 203. Fig.15 (b) shows the side view structure of the first heat conducting sheet 200. Fig.15 (c) shows the structure of the first heat conductive sheet 200 from the perspective of the fourth surface 204 .

[0121] like Fig.15 As shown in (a) and (b), in some embodiments, the first heat conductive sheet 200 further includes a fourth surface 204 , and the fourth surface 204 faces away from the third surface 203 .

[0122] The connection part 201 may include a plurality of punching holes 2011, which may be made by a budding process. The punching holes 2011 penetrate the third surface 203 and the fourth surface 204, and the ends of the punching holes 2011 protrude from the third surface 203 of the connection part 201 and are coplanar with the third surface 203 of the first heat conducting sheet body 202.

[0123] In this way, the punching hole 2011 is turned outward relative to the third surface 203 of the connecting part 201. When the connecting part 201 is connected to the fixing part 301 of the spring sheet 300, the bonding strength between the connecting part 201 and the fixing part 301 of the spring sheet 300 can be improved to ensure reliability.

[0124] like Fig.15 As shown in (b) and (c), in some embodiments, the fourth surface 204 may include a plurality of reinforcing ribs 205 , and the plurality of reinforcing ribs 205 are spaced apart and located at the bends of the connecting portion 201 .

[0125] The reinforcing rib 205 includes an inclined surface (not shown) facing the fourth surface 204 , which transitionally connects the fourth surface 204 of the first heat conducting plate body 202 and the fourth surface 204 of the connecting portion 201 to form a triangular stable structure in a side view.

[0126] In this way, the reinforcing ribs 205 are used to support the connection part 201 to prevent the connection part 201 from being deformed by the elastic force of the elastic sheet 300 after being connected to the elastic sheet 300, thereby improving the rigidity of the first heat conducting sheet 200 and further improving the rigidity of the heat dissipation assembly.

[0127] In some embodiments, the width of the end of the connecting portion 201 connected to the first heat conducting plate body 202 gradually increases along the direction from the connecting portion 201 to the first heat conducting plate body 202. In other words, a transition connecting portion 201a may be formed at the connection between the connecting portion 201 and the first heat conducting plate body 202 to achieve a transition connection between the connecting portion 201 and the first heat conducting plate body 202.

[0128] In this way, compared with the structure in which the connecting part 201 is vertically connected to the first heat conducting plate body 202, the transition connection can further improve the strength of the connecting part 201, and avoid deformation caused by the elastic force of the spring piece 300 after it is connected to the spring piece 300, so as to improve the stiffness of the first heat conducting plate 200 and further improve the stiffness of the heat dissipation component.

[0129] Fig.16 yes Figure 6 Schematic diagram of the local structure of the CC section; Fig.17 It is a first structural schematic diagram of the first heat conductive sheet 200 and the spring sheet 300 provided in an embodiment of the present application.

[0130] Combination Figure 8 , Fig.16 and Fig.17 As shown, in some embodiments, the end of the punching hole 2011 protrudes from the third surface 203 of the connecting portion 201 toward the heat dissipation module 100 .

[0131] The fixing portion 301 of the spring piece 300 may include a plurality of fixing holes 3011 . The number of the fixing holes 3011 is the same as the number of the punching holes 2011 , and the fixing holes 3011 correspond to the punching holes 2011 one by one.

[0132] The punching hole 2011 is embedded in the corresponding fixing hole 3011 to realize the riveting of the first heat conducting sheet 200 and the spring sheet 300. The outer diameter of the edge of the punching hole 2011 is larger than the inner diameter of the fixing hole 3011, so that the punching hole 2011 and the fixing hole 3011 are interference fit to improve the bonding strength between the connecting portion 201 of the first heat conducting sheet 200 and the fixing portion 301 of the spring sheet 300.

[0133] In some embodiments, the fixing portion 301 of the spring 300 includes a welding surface (not shown) facing the heat dissipation module 100, and the welding surface is 0.03-0.05 mm lower than the sprouting surface, that is, the welding surface is 0.03-0.05 mm lower than the end of the punching hole 2011. The height difference is used as a reserved welding space to facilitate welding of the heat dissipation module 100 and the fixing portion 301 of the spring 300.

[0134] Fig.18 This is a second structural schematic diagram of the first heat conductive sheet 200 and the spring sheet 300 provided in the embodiment of the present application.

[0135] like Fig.18 As shown, in some embodiments, the heat dissipation assembly may further include: a plurality of solder bars 500, and the solder bars 500 may be formed of solder paste. Figure 7 As shown, the solder bar 500 is located between the first thermal conductive sheet 200 and the heat dissipation module 100 , and the solder bar 500 is configured to solder the first thermal conductive sheet 200 and the heat dissipation module 100 , and solder the spring sheet 300 and the heat dissipation module 100 .

[0136] A plurality of solder bars 500 may be distributed on the third surface 203 of the first heat conductive sheet 200, specifically on the third surface 203 of the first heat conductive sheet body 202, to improve the welding strength between the first heat conductive sheet body 202 and the heat dissipation module 100. The strength of the fixing portion 301 of the spring sheet 300 may be reduced after the fixing hole 3011 is opened due to the sprouting process. The solder bars 500 may be distributed on the welding surface of the fixing portion 301 of the spring sheet 300, specifically on the fixing hole 3011, to improve the welding strength between the fixing portion 301 and the heat dissipation module 100. The solder bars 500 may also be distributed at the junction of the first heat conductive sheet 200 and the fixing portion 301 (the root of the spring sheet 300) to further improve the bonding strength between the first heat conductive sheet 200 and the spring sheet 300.

[0137] In this way, after the first heat conductive sheet 200 is riveted to the spring sheet 300, solder paste solder joints are arranged on the third surface 203 of the first heat conductive sheet 200, the budding position and the root of the spring sheet 300, so that the first heat conductive sheet 200, the spring sheet 300 and the heat dissipation module 100 are welded together. Through the riveting + welding method, the spring sheet 300 can be firmly combined with the first heat conductive sheet 200 and the heat dissipation module 100 to improve the bonding strength of the first heat conductive sheet 200 and the heat dissipation module 100, thereby improving the rigidity of the heat dissipation assembly. The elastic force applied by the spring sheet 300 can be smoothly transmitted to the first heat conductive sheet 200, and the spring sheet 300 will not be separated from the heat dissipation module 100, resulting in the failure of the elastic force.

[0138] In some embodiments, the spring piece 300 may further include: at least one tin overflow groove 304. Each tin overflow groove 304 is located between the fixed portion 301 and the movable portion 303 of each spring piece 300, and is located on the surface of the spring piece 300 facing the heat dissipation module 100.

[0139] In this way, by using the overflow tin groove 304 to accommodate the overflowed tin paste, it is possible to prevent the tin paste from overflowing beyond the fixing part 301 (which serves as the force arm during elastic pressing) when the first heat conductive plate 200 and the heat dissipation module 100 are welded, resulting in a smaller actual force arm, thereby affecting the elastic pressing of the heat dissipation module 100, the first heat conductive plate 200 and the CPU 41.

[0140] See again Figure 6 As shown, in some embodiments, in the heat dissipation module 100, the two heat conducting parts 104 are offset and located on opposite sides of the heat concentrating part 102, so that the two heat conducting parts 104 and the heat concentrating part 102 form a groove area (not shown in the figure).

[0141] The heat dissipation module 100 may further include: a second heat conducting sheet 600, and the second heat conducting sheet 600 is located in the groove area. Figure 2 and Figure 5The second heat conducting sheet 600 is configured to be opposite to other electronic components 42 on the main board 40 to conduct heat generated by other electronic components 42 to the heat concentrating portion 102 .

[0142] Combination Figure 7 The second heat conducting sheet 600 includes a second heat conducting sheet body 603 and a second skirt 604. The second skirt 604 is located at the outer edge of the second heat conducting sheet body 603. The thickness of the second skirt 604 is less than the thickness of the second heat conducting sheet body 603. The remaining structural characteristics of the second heat conducting sheet body 603 and the second skirt 604 can be referred to Fig.11 The structural characteristics of the first heat conducting plate body 201 and the first skirt 105 are not described in detail here.

[0143] The second heat conducting sheet 600 is connected to the second surface 103 of the heat dissipation module 100 , and the second skirt 604 is overlapped on the first skirt 105 , so as to realize the connection between the second heat conducting sheet 600 and the heat dissipation module 100 without occupying the z-direction space.

[0144] Since the CPU 41 and other electronic components 42 have different materials and structures, the CPU 41 can withstand surface pressure, while other electronic components 42 cannot. Therefore, to improve heat dissipation performance, multiple thermal pads (not shown) are provided between the second thermal conductive sheet 600 and other electronic components 42.

[0145] A plurality of thermal pads may be distributed on the lower surface of the second thermal conductive sheet body 603 and the first surface 101 of the thermal conductive portion 104. The lower surface refers to the surface of the second thermal conductive sheet body 603 facing the main board 40.

[0146] The thermal pads correspond to other electronic components 42 one by one, and fill the gap between the second thermal conductive sheet 600 and other electronic components 42 to improve the heat dissipation performance. In addition, the thermal pads can also buffer the elastic force when the heat dissipation module 100, the first thermal conductive sheet 200 and the CPU 41 are pressed together, so as to avoid the second thermal conductive sheet 600 and other electronic components 42 from interfering with each other and damaging the other electronic components 42.

[0147] Fig.19 Schematic diagram of the structure of the second heat conducting sheet 600 and the second copper sheet 53 provided in the embodiment of the present application. Fig.19 (a) shows the structure of the second copper sheet 53, Fig.19 (b) shows the structure of the second heat conductive sheet 600 .

[0148] like Fig.19As shown in (a), the second copper sheet 53 includes a body 531 and a skirt 532, and the skirt 532 is located at the outer edge of the body 531. One position of the skirt 532 is disconnected and recessed into the body 531 by a certain distance, forming a notch 533. The notch 533 is adjacent to the heat spreader 51 and accommodates one of the elastic members 54 at the corresponding position.

[0149] The existence of the notch 533 reduces the rigidity of the second copper sheet 53 , and causes the second copper sheet 53 to be disconnected from the elastic member 54 , thereby affecting the rigidity of the heat dissipation assembly.

[0150] like Fig.19 As shown in (b), the second heat conductive sheet 600 includes a hollow hole 601; the hollow hole 601 is located at a position of the second heat conductive sheet 600 adjacent to the heat concentrating portion 102. The hollow hole 601 is adjacent to the second skirt 604, but does not disconnect the second skirt 604, so that the second skirt 604 can be formed continuously to improve the bonding strength between the second skirt 604 and the first skirt 105. In this way, the second heat conductive sheet 600 is connected with the heat dissipation module 100 and the fixing portion 301 of the spring sheet 300, which can resist the elastic force of the spring sheet 300, avoid deformation at the joint, and thus improve the rigidity of the heat dissipation assembly.

[0151] The hollow hole 601 is adjacent to the heat concentrating portion 102 and is opposite to one of the spring sheets 300 at the corresponding position. The hollow hole 601 is configured to provide a movable space for the movable portion 303 of the spring sheet 300 so that the spring sheet 300 can be displaced when locked to the mainboard 40 and apply elastic force to the heat dissipation module 100 and the first heat conductive sheet 200.

[0152] The edge of the hollow hole 601 adjacent to the heat concentrating portion 102 includes an extension portion 602 , and the extension portion 602 is connected to the edge of the heat dissipation module 100 , that is, the extension portion 602 is connected to the first skirt 105 .

[0153] The extension portion 602 is formed continuously with the second skirt 604, and extends a certain distance relative to the second skirt 604 toward the hollow hole 601, and the extension portion 602 is used to increase the width of the second skirt 604 at that location. Accordingly, the first skirt 105 may include an extension portion (not shown in the figure) at a position opposite to the extension portion 602, and the extension portion is opposite to the extension portion 602 and has a matching structure, so as to increase the contact area between the second skirt 604 and the first skirt 105, thereby increasing the bonding strength between the second heat conducting sheet 600 and the heat dissipation module 100, and increasing the rigidity of the heat dissipation assembly.

[0154] See again Figure 1 and Figure 4 An embodiment of the present application also provides an electronic device, including a device body, a main board 40, and a heat dissipation component provided in any of the aforementioned embodiments, wherein the main board 40 and the heat dissipation component are located in the device body.

[0155] The device body may include a first body 10 and a second body 20, and a mainboard 40 and a heat dissipation assembly are located in the second body 20. The mainboard 40 includes a plurality of devices, and the heat dissipation assembly covers the plurality of devices, and the heat dissipation assembly is configured to dissipate heat generated by the plurality of devices. The devices may include a CPU 41 and other electronic components 42.

[0156] It should be noted that the structures of the electronic device and the heat dissipation component, the relative position relationship between the heat dissipation component and the mainboard 40, and the heat dissipation method can all refer to the corresponding contents of the aforementioned embodiments and will not be repeated here.

[0157] The electronic device provided in the embodiment of the present application has a heat dissipation component that has a rigidity that meets the requirements while achieving lightweight development. In this way, when achieving lightweight development of the electronic device, the heat dissipation performance of the electronic device can be improved, and the long-term stability of the heat dissipation of the entire device can be ensured.

[0158] It should be noted that those skilled in the art will readily come up with other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope of the present application is indicated by the following claims.

[0159] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A heat dissipation component, characterized in that: include: A heat dissipation module (100) comprises a first surface (101), wherein the first surface (101) comprises a heat concentrating portion (102); A first heat conducting sheet (200) is in contact with the heat concentrating portion (102); the first heat conducting sheet (200) comprises a plurality of connecting portions (201), and the plurality of connecting portions (201) are arranged at intervals on the edge of the first heat conducting sheet (200); A plurality of spring sheets (300), wherein the spring sheets (300) correspond to the connecting portions (201) one by one; the spring sheets (300) include a fixing portion (301), and the fixing portion (301) is connected between the connecting portion (201) and the heat dissipation module (100); The fixing portions (301) of any adjacent at least two of the spring sheets (300) are connected via a support sheet (302), and the support sheet (302) and the at least two spring sheets (300) connected thereto form an integral structure.

2. The heat dissipation assembly according to claim 1, characterized in that: The spring piece (300) further includes: a movable portion (303); The movable portion (303) is bent relative to the fixed portion (301) in a direction away from the first surface (101); The movable portion (303) is configured to generate displacement when being fixed, so as to apply elastic force to the fixed portion (301); The elastic force is configured to drive the first heat conducting sheet (200) to move in a direction away from the heat dissipation module (100).

3. The heat dissipation assembly according to claim 1, characterized in that: It also includes: a first reinforcing sheet (401), wherein the first reinforcing sheet (401) is a sheet-like structure; The first reinforcing sheet (401) is located on the first surface (101) and at the edge of the first heat conducting sheet (200).

4. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (100) comprises a second surface (103), wherein the second surface (103) is opposite to the first surface (101); as well as, It also includes: a second reinforcing sheet (402), wherein the second reinforcing sheet (402) is a strip-shaped structure; The second reinforcing sheet (402) is located on the second surface (103) and at the edge of the heat concentrating portion (102).

5. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (100) comprises a second surface (103), wherein the second surface (103) is opposite to the first surface (101); as well as, It also includes: a third reinforcing sheet (403), wherein the third reinforcing sheet (403) is a sheet-like structure; The third reinforcing sheet (403) is located on the second surface (103) and is located in a partial or entire area of ​​the heat concentration portion (102).

6. The heat dissipation assembly according to claim 1, characterized in that: The first heat conducting sheet (200) further comprises a first heat conducting sheet body (202) and a third surface (203), wherein the third surface (203) is opposite to the first surface (101); A plurality of spacer rings of the connection portion (201) are arranged on the edge of the first heat conducting plate body (202); the connection portion (201) is bent relative to the first heat conducting plate body (202) in a direction away from the heat dissipation module (100); and the extension direction of the connection portion (201) is parallel to the extension direction of the first heat conducting plate body (202); The connecting portion (201) comprises a plurality of punching holes (2011), and ends of the punching holes (2011) protrude from the third surface (203) of the connecting portion (201) along the direction of the heat dissipation module (100).

7. The heat dissipation assembly according to claim 6, characterized in that: The fixing portion (301) of the spring sheet (300) comprises a plurality of fixing holes (3011), and the fixing holes (3011) correspond one-to-one to the punching holes (2011); The punching hole (2011) is embedded in the fixing hole (3011) corresponding thereto, and the outer diameter of the edge of the punching hole (2011) is greater than the inner diameter of the fixing hole (3011).

8. The heat dissipation assembly according to claim 6, characterized in that: The first heat conductive sheet (200) further comprises a fourth surface (204), wherein the fourth surface (204) faces away from the third surface (203); The fourth surface (204) comprises a plurality of reinforcing ribs (205), and the plurality of reinforcing ribs (205) are spaced apart and located at the bending portion of the connecting portion (201).

9. The heat dissipation assembly according to claim 6, characterized in that: Along the direction from the connecting portion (201) to the first heat conducting plate body (202), the width of one end of the connecting portion (201) connected to the first heat conducting plate body (202) gradually increases.

10. The heat dissipation assembly according to claim 6, characterized in that: Also included: a plurality of solder bars (500); A plurality of solder bars (500) are distributed on the third surface (203) of the first heat conducting sheet (200), the fixing portion (301) of the spring sheet (300), and the junction between the first heat conducting sheet (200) and the fixing portion (301); The solder bar (500) is configured to solder the first heat conducting sheet (200) and the heat dissipation module (100).

11. The heat dissipation assembly according to claim 2, characterized in that: The spring piece (300) further includes: at least one overflow tin groove (304); The tin overflow groove (304) is located between the fixed portion (301) and the movable portion (303), and is located on the surface of the spring sheet (300) facing the heat dissipation module (100).

12. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation module (100) further comprises: two heat conducting parts (104), the two heat conducting parts (104) being located on opposite sides of the heat concentrating part (102); and, Also includes: a second heat conducting sheet (600); The second heat conducting sheet (600) is located between the heat concentrating portion (102) and the two heat conducting portions (104), and the second heat conducting sheet (600) is connected to the second surface (103) of the heat dissipation module (100), and the second surface (103) faces away from the first surface (101).

13. The heat dissipation assembly according to claim 12, characterized in that: The second heat conducting sheet (600) comprises a hollow hole (601); The hollow hole (601) is located at a position of the second heat conducting plate (600) adjacent to the heat concentrating portion (102) and opposite to one of the spring sheets (300), and the hollow hole (601) is configured to provide a movable space for the movable portion (303) of the spring sheet (300).

14. The heat dissipation assembly according to claim 13, characterized in that: The edge of the hollow hole (601) adjacent to the heat concentrating portion (102) comprises an extension portion (602), and the extension portion (602) is connected to the edge of the heat dissipation module (100).

15. An electronic device, characterized in that: It comprises a device body, a mainboard, and a heat dissipation assembly as claimed in any one of claims 1 to 14; The mainboard and the heat dissipation component are located in the device body; The mainboard includes a plurality of devices, the heat dissipation assembly covers the plurality of devices, and the heat dissipation assembly is configured to dissipate heat generated by the plurality of devices.

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