Microwave combining switch module

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a microwave combiner switch module, which comprises a microwave shell, a microstrip piece, a glass insulator and a printed circuit board, the microwave shell is used for installing the microstrip piece and the printed circuit board, a boss is integrally formed at the outer bottom of the microwave shell, the boss is provided with a through hole A, and a through hole B is arranged in the through hole A; the through hole A is used for accommodating a glass insulator, a gap between the through hole A and the glass insulator is filled with tin-based alloy, the microstrip sheet is connected with the printed circuit board through the glass insulator, a heat conduction plate is tightly pressed on the boss, and a through hole B corresponding to the through hole A is formed in the heat conduction plate. The beneficial effects of the utility model are that the heated heat conduction plate uniformly and rapidly conducts heat to the bottom of the microwave cavity, so that tin-based alloys stacked on the ports of the through holes A are melted at the same time, thereby avoiding uneven heating caused by direct heating of the shell due to different thicknesses of all parts of the microwave shell, and improving the quality of the microwave shell. The tin-based alloy on each A through hole cannot be melted and solidified at the same time, and pseudo soldering is caused.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a microwave combining switch module. Background Art

[0002] In recent years, with the rapid development of the communications industry, microwave monolithic integrated circuits (MMICs) have become an important pillar for the development of various high-tech weapons and equipment, and are widely used in various advanced tactical missiles, electronic warfare, communication systems, and various advanced phased array radars.

[0003] The Chinese utility model patent (authorization announcement number: CN203746821U, name: a power semiconductor module that is easy to install) includes a direct copper-clad substrate, a power semiconductor chip, a shell, a power terminal assembly, and a chip coating material. The front copper layer of the direct copper-clad substrate is etched with a circuit pattern that flexibly forms different circuits according to different circuit requirements by a chemical etching method. The power semiconductor chip is connected to the etched circuit of the front copper layer of the direct copper-clad substrate through its upper welding surface by brazing; the non-welding surface on the upper surface of the power semiconductor chip and the etched circuit are connected by aluminum or copper bonding wires; and a temperature monitoring element is also connected to the etched circuit by brazing; the utility model is provided with a clamping structure that is convenient for PCB installation on the shell, and the PCB circuit board and the power semiconductor module are firmly combined in the form of a top column and a buckle that are mutually locked, so that the utility model has the characteristics of reasonable structure, convenient use and installation, and easy installation, but the glass insulator in the module is not enough in overall welding temperature due to the heat conductivity of the metal cavity, which is easy to be cold soldered. Utility Model Content

[0004] The utility model aims to provide a microwave combining switch module to overcome the shortcomings of the prior art.

[0005] The purpose of the utility model is achieved through the following technical solutions: a microwave combining switch module, comprising a microwave shell, a microstrip sheet, a glass insulator and a printed circuit board, the microwave shell is used to install the microstrip sheet and the printed circuit board, the outer bottom of the microwave shell is integrally formed with a boss, the boss is clamped between the microstrip sheet and the printed circuit board, the boss is provided with an A through hole, the A through hole is used to accommodate the glass insulator, the gap between the A through hole and the glass insulator is filled with a tin-based alloy, the microstrip sheet and the printed circuit board are connected through the glass insulator, the printed circuit board is located outside the microwave shell, a heat conducting plate is pressed against the boss, a B through hole corresponding to the A through hole is provided on the heat conducting plate, and the printed circuit board is fixed to the microwave shell through the heat conducting plate.

[0006] Preferably, a receiving groove is provided on the inner bottom surface of the microwave shell, the microstrip piece is installed in the receiving groove, and a pressing block is also installed in the microwave shell, the pressing block is used to press the microstrip piece flatly on the bottom of the receiving groove.

[0007] Preferably, the A through hole is a countersunk hole, the large end of the A through hole abuts against the boss, the glass insulator is stuck at the connection between the large end and the small end of the A through hole, and the inner diameter of the B through hole is smaller than the inner diameter of the large end of the A through hole.

[0008] Preferably, positioning columns are integrally formed at the four corners of the outer bottom of the microwave shell, threaded holes are provided on the positioning columns, and C through holes corresponding to the positioning columns are provided at the four corners of the printed circuit board, screws are installed in the C through holes, and the screws pass through the bosses and are screwed into the threaded holes.

[0009] Preferably, a cover plate is detachably mounted on the microwave housing, and the pressing block is fixed in the accommodating groove through the cover plate.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The heat is evenly and quickly conducted to the bottom of the microwave cavity through the heat conducting plate heated by the heating instrument, so that the tin-based alloys stacked on each A through-hole port are melted at the same time, and the heating is stopped after the tin-based alloys are bent and fused. At this time, the tin-based alloys flowing into the A through-holes solidify and fix the glass insulator in the A through-holes, avoiding uneven heating due to different thicknesses of the microwave shell in different places, which makes it impossible for the tin-based alloys on each A through-hole to melt and solidify at the same time, resulting in cold solder joints. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0013] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;

[0014] In the figure, 1-microwave housing, 2-microstrip sheet, 3-glass insulator, 4-printed circuit board, 5-boss, 6-heat conducting plate, 7-accommodating groove, 8-pressing block, 9-positioning column, 10-cover plate. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0017] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features thereof may be combined with each other.

[0018] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0019] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, or the positions or positional relationships commonly understood by those skilled in the art, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] like Figure 1 and2 As shown, a microwave combining switch module includes a microwave housing 1, a microstrip sheet 2, a glass insulator 3 and a printed circuit board 4. The microwave housing 1 is used to install the microstrip sheet 2 and the printed circuit board 4. A boss 5 is integrally formed on the outer bottom of the microwave housing 1. The boss 5 is sandwiched between the microstrip sheet 2 and the printed circuit board 4. A through hole A is opened on the boss 5. The through hole A is used to accommodate the glass insulator 3. The gap between the through hole A and the glass insulator 3 is filled with a tin-based alloy. The microstrip sheet 2 is connected to the printed circuit board 4 through the glass insulator 3. The printed circuit board 4 is located outside the microwave housing 1. A heat conducting plate 6 is pressed tightly on the boss 5. A through hole B corresponding to the through hole A is provided on the plate 6. The printed circuit board 4 is fixed on the microwave shell 1 through the heat conducting plate 6. The heat conducting plate 6 heated by the heating instrument conducts heat to the bottom of the microwave cavity evenly and quickly, so that the tin-based alloys stacked on the ports of each through hole A are melted at the same time. The heating is stopped after the tin-based alloys are bent and fused. At this time, the tin-based alloys flowing into the through hole A solidify and fix the glass insulator 3 in the through hole A, so as to avoid uneven heating of the microwave shell 1 due to different thicknesses at different places, so that the tin-based alloys on each through hole A cannot be melted and solidified at the same time, resulting in cold solder joints.

[0022] In this embodiment, if Figure 1 and 2 As shown, a receiving groove 7 is provided on the inner bottom surface of the microwave housing 1, and the microstrip sheet 2 is installed in the receiving groove 7. A pressing block 8 is also installed in the microwave housing 1, and the pressing block 8 is used to press the microstrip sheet 2 flatly on the bottom of the receiving groove 7. A cover plate 10 is detachably installed on the microwave housing 1 by bolts, and the pressing block 8 is fixed in the receiving groove 7 by the cover plate 10. The microstrip sheet 2 is flattened by the pressing force of the cover plate 10, which can solve the problem of cold solder joints caused by gaps when the microstrip sheet 2 is welded.

[0023] In this embodiment, if Figure 1 and 2 As shown, through hole A is a countersunk hole, the large end of through hole A is against the boss 5, the glass insulator 3 is stuck at the connection between the large end and the small end of through hole A, and the inner diameter of through hole B is smaller than the inner diameter of the large end of through hole A. Before welding, the glass insulator 3 can be firmly installed in the microwave housing 1 to avoid deviation from the set position during welding.

[0024] In this embodiment, if Figure 1 and 2 As shown, positioning columns 9 are integrally formed at the four corners of the outer bottom of the microwave housing 1, and threaded holes are provided on the positioning columns 9. C through holes corresponding to the positioning columns 9 are provided at the four corners of the printed circuit board 4, and screws are installed in the C through holes. The screws pass through the boss 5 and are screwed into the threaded holes. The structure is simple and easy to disassemble and assemble.

[0025] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A microwave combining switch module, comprising a microwave housing (1), a microstrip sheet (2), a glass insulator (3) and a printed circuit board (4), wherein the microwave housing (1) is used to mount the microstrip sheet (2) and the printed circuit board (4), a boss (5) is integrally formed on the outer bottom of the microwave housing (1), the boss (5) is sandwiched between the microstrip sheet (2) and the printed circuit board (4), a through hole A is formed on the boss (5), the through hole A is used to accommodate the glass insulator (3), a gap between the through hole A and the glass insulator (3) is filled with a tin-based alloy, the microstrip sheet (2) and the printed circuit board (4) are connected via the glass insulator (3), and is characterized in that: The printed circuit board (4) is located outside the microwave housing (1), a heat conducting plate (6) is pressed tightly onto the boss (5), a through hole B corresponding to the through hole A is formed on the heat conducting plate (6), and the printed circuit board (4) is fixed to the microwave housing (1) via the heat conducting plate (6).

2. A microwave combining switch module according to claim 1, characterized in that: A receiving groove (7) is provided on the inner bottom surface of the microwave housing (1), and the microstrip piece (2) is installed in the receiving groove (7). A pressing block (8) is also installed in the microwave housing (1), and the pressing block (8) is used to press the microstrip piece (2) flatly against the bottom of the receiving groove (7).

3. The microwave combining switch module according to claim 1, characterized in that: The A through hole is a countersunk hole, the large end of the A through hole abuts against the boss (5), the glass insulator (3) is clamped at the connection between the large end and the small end of the A through hole, and the inner diameter of the B through hole is smaller than the inner diameter of the large end of the A through hole.

4. The microwave combining switch module according to claim 1, characterized in that: Positioning columns (9) are integrally formed at the four corners of the outer bottom of the microwave housing (1), and threaded holes are formed on the positioning columns (9). C-through holes corresponding to the positioning columns (9) are formed at the four corners of the printed circuit board (4), and screws are installed in the C-through holes, and the screws pass through the bosses (5) and are screwed into the threaded holes.

5. The microwave combining switch module according to claim 2, characterized in that: A cover plate (10) is detachably mounted on the microwave housing (1), and the pressing block (8) is fixed in the containing groove (7) via the cover plate (10).

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