High-temperature-resistant printed circuit board structure for vacuum sealer

Abstract

The utility model discloses a high temperature resistant printed circuit board structure for a vacuum sealer, which comprises a protective shell, an installation groove and a printed circuit board body, the center of the top of the protective shell is provided with the installation groove, the printed circuit board body is embedded in the installation groove, the two sides of the installation groove are provided with movable cavities, and the movable cavities are arranged in the installation groove. Sliding strips are embedded in one side of the movable cavity, clamping blocks are arranged on the opposite sides of the two sets of sliding strips, ventilation openings are formed in the outer walls of the two sides of the protective shell, a first fan is arranged on the side, adjacent to the ventilation openings, of the outer wall of the side, and a controller is arranged on the inner wall of the bottom of the protective shell. The top of the printed circuit board body embedded in the mounting groove can be fixedly connected in an abutting mode through the clamping block, clamping can be canceled by pulling the pull block to achieve disassembly of the circuit board when disassembly needs to be conducted, the first fan or the second fan can be independently controlled by the controller to conduct heat dissipation, and therefore energy consumption can be saved while precise heat dissipation is conducted.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, in particular to a high-temperature resistant printed circuit board structure for a vacuum sealing machine. Background Art

[0002] A printed circuit board, also known as a printed circuit board, is a provider of electrical connections for electronic components. Printed circuit boards are often represented by "PCB". According to the number of layers of the circuit board, they can be divided into single-layer, double-layer, four-layer, six-layer and other multi-layer circuit boards. Printed circuit boards have developed from single-layer to double-layer, multi-layer and flexible boards, and are constantly developing towards high precision, high density and high reliability. The application number CN202122183911.0 is retrieved, which is a printed circuit board with high temperature resistance. A heat dissipation device is installed in the mounting groove, and connecting plates are installed at the bottom ends of the left and right sides of the second fixing plate. The connecting plates are provided with mounting holes. The provision of a heat dissipation device is beneficial to improving the high temperature resistance of the circuit board body.

[0003] Similar to the above-mentioned printed circuit board with high temperature resistance: although the heat dissipation device is provided to improve the high temperature resistance of the circuit board body, firstly, the circuit board needs tools to be disassembled for daily maintenance; secondly, the location where the heat is generated on the circuit board is not fixed, it depends on many factors, including the power consumption, layout, heat dissipation design and working environment of each component on the circuit board, etc. It does not have the function of dissipating heat and cooling the higher position of the heat.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a high temperature resistant printed circuit board structure for a vacuum sealer is proposed to achieve a more practical purpose. Utility Model Content

[0005] The purpose of the utility model is to provide a high temperature resistant printed circuit board structure for a vacuum sealer, so as to solve the problem that the printed circuit board with high temperature resistance mentioned in the above background technology firstly needs tools to be disassembled and assembled for daily maintenance, and secondly, the position where the circuit board is heated is not fixed, which depends on many factors, including the power consumption, layout, heat dissipation design and working environment of each component on the circuit board, and it does not have the function of cooling the heat at a higher position alone.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-temperature resistant printed circuit board structure for a vacuum sealing machine, comprising a protective shell, a mounting groove and a printed circuit board body, a mounting groove is arranged at the top center of the protective shell, the printed circuit board body is embedded in the mounting groove, electronic components are arranged on the surface of the printed circuit board body, active cavities are arranged on both sides of the mounting groove, a sliding bar is embedded on one side of the active cavity, and card blocks are arranged on one side of the two groups of sliding bars in opposite directions, the end of the card block away from the sliding bar passes through the active cavity and extends into the mounting groove, and the top of the card block is inclined.

[0007] Furthermore, a spring is arranged on one side of the slide bar away from the card block, and one end of the spring away from the slide bar abuts against the inner wall of the movable cavity. A connecting rod is arranged in the middle of multiple groups of springs, and one end of the connecting rod away from the slide bar passes through the protective shell and is connected to the pull block.

[0008] Furthermore, buffer mechanisms are provided at the four ends of the inner cavity of the protective shell, and the buffer mechanisms include a fixed cylinder, a movable column, a limit plate, a support spring and a damping ring. A movable column is embedded in the top inner wall of the fixed cylinder, and a limit plate is provided at the end of the movable column opposite to the fixed cylinder.

[0009] Furthermore, a supporting spring is arranged in the middle of the two groups of limit plates, a damping ring is connected to the outer wall of the bottom of the movable column, the outer wall of the damping ring is in contact with the inner wall of the fixed cylinder, and the damping ring is made of rubber.

[0010] Furthermore, a heat conducting plate is connected to the top of the multiple groups of buffer mechanisms, the top of the heat conducting plate is abutted against the bottom of the printed circuit board body, the bottom of the heat conducting plate is arranged with heat sinks, temperature sensors are arranged on both sides of the bottom of the heat conducting plate, and the temperature sensors are located at the intervals between the multiple groups of heat sinks.

[0011] Furthermore, ventilation holes are provided on the outer walls on both sides of the protective shell, and fan No. 1 is provided on one side of the outer wall of the protective shell adjacent to the ventilation hole, and fan No. 2 is provided on one side of fan No. 1, and the positions of fan No. 1 and fan No. 2 correspond to the two groups of temperature sensors. A controller is provided on the bottom inner wall of the protective shell, and the controller is connected to the temperature sensor through electric wires, and the controller is connected to fan No. 1 and fan No. 2 through electric wires.

[0012] Compared with the prior art, the utility model has the following beneficial effects: a high temperature resistant printed circuit board structure for a vacuum sealer, a clamp block can be used to fix and abut the top of the printed circuit board body embedded in the mounting groove, and when disassembly is required, the clamp block can be pulled to cancel the clamping to realize the disassembly of the circuit board, and a controller can be used to independently control the No. 1 fan or the No. 2 fan for heat dissipation, thereby achieving accurate heat dissipation and energy saving, and the specific contents are as follows:

[0013] The card block can fix and abut the top of the printed circuit board body embedded in the installation groove, thereby realizing the installation of the printed circuit board body. When the printed circuit board body needs to be disassembled, the pull block is pulled, and the pull block drives the connecting rod to move, thereby pulling the slide bar to move. The spring is compressed and contracts, and the movement of the slide bar drives the card block to move toward the active cavity, thereby canceling the engagement with the top of the printed circuit board body, making it easy to disassemble the printed circuit board body. When the temperature sensor detects that the heat dissipated by the heat conducting plate reaches a certain value, a digital signal can be transmitted to the controller, and the controller controls the No. 1 fan and the No. 2 fan to start and dissipate heat. The position where the circuit board heats up is not fixed. It depends on many factors, including the power consumption, layout, heat dissipation design and working environment of each component on the circuit board. When the temperature sensor on one side detects that the temperature is high, the No. 1 fan or the No. 2 fan can be controlled separately by the controller for heat dissipation, thereby achieving precise heat dissipation while saving energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a front view structural schematic diagram of a high temperature resistant printed circuit board structure for a vacuum sealing machine of the utility model;

[0015] Figure 2 This is a schematic diagram of the main structure of a high temperature resistant printed circuit board structure for a vacuum sealing machine of the utility model;

[0016] Figure 3 This is a schematic diagram of a buffer mechanism structure of a high temperature resistant printed circuit board structure for a vacuum sealing machine of the utility model;

[0017] Figure 4 The utility model is a schematic diagram of an active cavity structure of a high temperature resistant printed circuit board structure for a vacuum sealing machine.

[0018] In the figure: 1. protective shell; 2. mounting slot; 3. printed circuit board body; 301. electronic components; 4. movable cavity; 5. slide bar; 6. block; 7. spring; 8. connecting rod; 9. pull block; 10. buffer mechanism; 101. fixed cylinder; 102. movable column; 103. limit plate; 104. support spring; 105. damping ring; 11. heat conduction plate; 12. heat sink; 13. temperature sensor; 14. vent; 15. fan No. 1; 16. fan No. 2; 17. controller. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 4 The utility model provides a technical solution: a high temperature resistant printed circuit board structure for a vacuum sealing machine, comprising a protective shell 1, a mounting groove 2 and a printed circuit board body 3. The top center of the protective shell 1 is provided with a mounting groove 2, in which the printed circuit board body 3 can be installed, the printed circuit board body 3 is embedded in the mounting groove 2, and electronic components 301 are arranged on the surface of the printed circuit board body 3. Both sides of the mounting groove 2 are provided with active cavities 4, which play a limiting role. A slide bar 5 is embedded on one side of the active cavity 4, and the slide bar 5 can move translationally in the active cavity 4. A card block 6 is arranged on one side in the opposite direction of the two groups of slide bars 5, and one end of the card block 6 away from the slide bar 5 passes through the active cavity 4 and extends into the mounting groove 2. The top of the card block 6 is inclined, and the card block 6 can fix and abut the top of the printed circuit board body 3 embedded in the mounting groove 2, thereby realizing the installation of the printed circuit board body 3.

[0021] A spring 7 is arranged on one side of the slide bar 5 away from the card block 6. The spring 7 is compressed and shrinks and rebounds. The spring 7 can push the slide bar 5 to drive the card block 6 to engage with the top of the printed circuit board body 3. The end of the spring 7 away from the slide bar 5 abuts against the inner wall of the active cavity 4. A connecting rod 8 is arranged in the middle of the multiple groups of springs 7. The connecting rod 8 plays a connecting role. The end of the connecting rod 8 away from the slide bar 5 passes through the protective shell 1 and is connected to a pull block 9. When the printed circuit board body 3 needs to be disassembled, the pull block 9 is pulled. The pull block 9 drives the connecting rod 8 to move, thereby pulling the slide bar 5 to move. The spring 7 is compressed and shrinks, and the slide bar 5 moves and drives the card block 6 to translate toward the active cavity 4, thereby canceling the engagement with the top of the printed circuit board body 3, making it easy to disassemble the printed circuit board body 3.

[0022] Buffer mechanisms 10 are provided at the four ends of the inner cavity of the protective shell 1. The buffer mechanisms 10 play a buffering role to prevent the circuit board from being damaged due to failure to buffer after falling or colliding. The buffer mechanism 10 includes a fixed cylinder 101, a movable column 102, a limit plate 103, a support spring 104 and a damping ring 105. The movable column 102 is embedded in the top inner wall of the fixed cylinder 101, and a limit plate 103 is provided on the end of the movable column 102 opposite to the fixed cylinder 101.

[0023] A supporting spring 104 is arranged in the middle of the two groups of limiting plates 103, and a damping ring 105 is connected to the outer wall of the bottom of the movable column 102. The outer wall of the damping ring 105 abuts against the inner wall of the fixed cylinder 101. The damping ring 105 is made of rubber. When the circuit board falls or collides, the printed circuit board body pushes the limiting plate 103 to move downward, and the limiting plate 103 pushes the movable column 102 to translate into the fixed cylinder 101, and compresses the supporting spring 104 at the same time. The supporting spring 104 contracts under pressure to play a buffering role, and the supporting spring 104 rebounds after being compressed and contracted. The friction between the outer wall of the damping ring 105 at the bottom of the movable column 102 and the inner wall of the fixed cylinder 101 produces a certain damping effect, thereby offsetting the impact of the supporting spring 104 rebounding after being compressed, thereby playing a buffering role for the circuit board.

[0024] A heat conducting plate 11 is connected to the top of the multiple groups of buffer mechanisms 10. The top of the heat conducting plate 11 is in contact with the bottom of the printed circuit board body 3. The heat conducting plate 11 plays a heat conducting role and can conduct and export the heat generated by the circuit board body 3 when it is working. Heat sinks 12 are arranged at the bottom of the heat conducting plate 11. The heat sink 12 plays a heat dissipation role. Temperature sensors 13 are arranged on both sides of the bottom of the heat conducting plate 11. The model of the temperature sensor 13 is DS18B20. The DS18B20 model temperature sensor 13 can detect the temperature and export a digital signal. The temperature at different positions of the heat conducting plate 11 can be detected in real time through the temperature sensors 13 at different positions, and the temperature sensors 13 are located at the intervals between the multiple groups of heat sinks 12.

[0025] The outer walls on both sides of the protective shell 1 are provided with ventilating holes 14, which play a ventilation role and facilitate heat dissipation. A No. 1 fan 15 is provided on one side of the outer wall of the protective shell 1 adjacent to the ventilating hole 14, and a No. 2 fan 16 is provided on one side of the No. 1 fan 15. The positions of the No. 1 fan 15 and the No. 2 fan 16 correspond to the two groups of temperature sensors 13. The No. 1 fan 15 and the No. 2 fan 16 play a cooling role to accelerate the heat dissipation of the heat sink 12 so that the circuit board has high temperature resistance. A controller 17 is provided on the bottom inner wall of the protective shell 1. The controller 17 is connected to the temperature sensor 13 through wires, and the controller 17 is connected to the No. 1 fan 15. Fan 15 and No. 2 fan 16 are connected by wires. When the temperature sensor 13 detects that the heat extracted by the heat conducting plate 11 reaches a certain value, a digital signal can be transmitted to the controller 17. The controller 17 controls the No. 1 fan 15 and the No. 2 fan 16 to start cooling. The location where the circuit board generates heat is not fixed. It depends on many factors, including the power consumption, layout, cooling design and working environment of each component on the circuit board. When the temperature sensor 13 on one side detects that the temperature is high, the No. 1 fan 15 or the No. 2 fan 16 can be individually controlled by the controller 17 to cool. This can achieve precise cooling while saving energy.

[0026] Working principle: When using a high temperature resistant printed circuit board structure for a vacuum sealer, the printed circuit board body 3 is embedded in the installation groove 2, and the top of the printed circuit board body 3 embedded in the installation groove 2 can be fixedly abutted by the clamping block 6, so as to realize the installation of the printed circuit board body 3. When the printed circuit board body 3 needs to be disassembled, the pull block 9 is pulled, and the pull block 9 drives the connecting rod 8 to move, thereby pulling the slide bar 5 to move, and the spring 7 is compressed and contracted, and the movement of the slide bar 5 drives the clamping block 6 to move in the direction of the active cavity 4, thereby canceling the clamping of the top of the printed circuit board body 3, so as to facilitate the disassembly of the printed circuit board body 3. When the circuit board falls or collides, the printed circuit board body pushes the limit plate 103 to move downward, and the limit plate 103 pushes the active column 102 to move in the fixed cylinder 101, and at the same time compresses the support spring 104, and the support spring 104 is compressed and contracted, so as to It plays a buffering role. The support spring 104 rebounds after being compressed and contracted. The friction between the outer wall of the damping ring 105 at the bottom of the movable column 102 and the inner wall of the fixed cylinder 101 produces a certain damping effect, thereby offsetting the impact of the support spring 104 rebounding after being compressed, thereby playing a buffering role on the circuit board. When the temperature sensor 13 detects that the heat conduction plate 11 has exported heat to a certain value, it can transmit a digital signal to the controller 17. The controller 17 controls the No. 1 fan 15 and the No. 2 fan 16 to start and dissipate heat. The position where the circuit board heats up is not fixed. It depends on many factors, including the power consumption, layout, heat dissipation design and working environment of each component on the circuit board. When the temperature sensor 13 on one side detects that the temperature is high, the No. 1 fan 15 or the No. 2 fan 16 can be controlled separately by the controller 17 to dissipate heat, thereby achieving precise heat dissipation while saving energy.

Claims

1. A high temperature resistant printed circuit board structure for a vacuum sealer, comprising a protective shell (1), a mounting groove (2) and a printed circuit board body (3), characterized in that: A mounting groove (2) is provided at the center of the top of the protective shell (1), the printed circuit board body (3) is embedded in the mounting groove (2), the surface of the printed circuit board body (3) is arranged with electronic components (301), both sides of the mounting groove (2) are provided with movable cavities (4), one side of the movable cavity (4) is embedded with a slide bar (5), and two groups of slide bars (5) are arranged on one side in opposite directions with a card block (6), one end of the card block (6) away from the slide bar (5) passes through the movable cavity (4) and extends into the mounting groove (2), and the top of the card block (6) is inclined.

2. A high temperature resistant printed circuit board structure for a vacuum sealer according to claim 1, characterized in that: A spring (7) is arranged on one side of the slide bar (5) away from the block (6); one end of the spring (7) away from the slide bar (5) abuts against the inner wall of the movable cavity (4); a connecting rod (8) is arranged in the middle of the plurality of groups of springs (7); one end of the connecting rod (8) away from the slide bar (5) passes through the protective shell (1) and is connected to a pull block (9).

3. The high temperature resistant printed circuit board structure for a vacuum sealer according to claim 1, characterized in that: The four ends of the inner cavity of the protective shell (1) are provided with a buffer mechanism (10), the buffer mechanism (10) comprising a fixed cylinder (101), a movable column (102), a limit plate (103), a support spring (104) and a damping ring (105), the top inner wall of the fixed cylinder (101) is embedded with the movable column (102), and the end of the movable column (102) opposite to the fixed cylinder (101) is provided with a limit plate (103).

4. The high temperature resistant printed circuit board structure for a vacuum sealer according to claim 3, characterized in that: A support spring (104) is arranged in the middle of the two groups of limit plates (103); a damping ring (105) is connected to the outer wall of the bottom of the movable column (102); the outer wall of the damping ring (105) abuts against the inner wall of the fixed cylinder (101); and the damping ring (105) is made of rubber.

5. The high temperature resistant printed circuit board structure for a vacuum sealer according to claim 3, characterized in that: A heat conducting plate (11) is connected to the top of the plurality of groups of buffer mechanisms (10), the top of the heat conducting plate (11) is in contact with the bottom of the printed circuit board body (3), heat sinks (12) are arranged at the bottom of the heat conducting plate (11), temperature sensors (13) are arranged on both sides of the bottom of the heat conducting plate (11), and the temperature sensors (13) are located at intervals between the plurality of groups of heat sinks (12).

6. A high temperature resistant printed circuit board structure for a vacuum sealer according to claim 5, characterized in that: The outer walls on both sides of the protective shell (1) are provided with ventilation holes (14); a No. 1 fan (15) is provided on one side of the outer wall of the protective shell (1) adjacent to the ventilation hole (14); a No. 2 fan (16) is provided on one side of the No. 1 fan (15); the positions of the No. 1 fan (15) and the No. 2 fan (16) correspond to the two groups of temperature sensors (13); a controller (17) is provided on the bottom inner wall of the protective shell (1); the controller (17) is connected to the temperature sensor (13) through electric wires; and the controller (17) is connected to the No. 1 fan (15) and the No. 2 fan (16) through electric wires.

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