Chemical mechanical polishing device

Abstract

The utility model provides a chemical mechanical polishing device. The chemical mechanical polishing device comprises a device body and a detection unit, the device body comprises a polishing head, and a plurality of pressure elements are arranged in the polishing head and used for applying pressure to a to-be-polished structure. The detection unit is movably connected with the device body; the detection unit comprises a plurality of pressure sensors, and when the pressure of the pressure elements is detected, the pressure sensors are connected with the pressure applying faces of the pressure elements so as to detect the pressure output by each pressure element. Therefore, the chemical mechanical polishing device provided by the utility model is additionally provided with the detection unit, so that the pressure output by each pressure element and the distribution condition are directly detected by utilizing the contact between the pressure sensor and the pressure applying surface of the pressure element, the detection precision is high, the polishing head does not need to be disassembled and detected, the operation is simple and convenient, and the efficiency is high. The detection efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a chemical mechanical polishing device. Background Art

[0002] Chemical Mechanical Polishing (CMP) is one of the important processes in integrated circuit manufacturing. Figure 1 As shown, the CMP process utilizes the polishing head 10 and polishing pad 11 in the CMP equipment to achieve physical friction on the silicon wafer, and utilizes the polishing liquid 12 to achieve chemical treatment of the silicon wafer, thereby improving the flatness of the silicon wafer surface. Therefore, in the practical production process, many parts in the CMP equipment are extremely easy to wear out and have a limited service life. In response to this, the existing process will regularly perform preventive maintenance (PM) on the CMP equipment. After PM, there may be maintenance failures, and the status of the CMP equipment needs to be detected to determine the cause of the failure. Among them, the pressure detection in the polishing head area is one of the PM detection items.

[0003] like Figure 1 and Figure 2 As shown, a fluid channel 100a is provided in the housing 100 of the polishing head 10, which is used to pass gas or liquid into each pressure membrane chamber 101 in the polishing head 10 to adjust the pressure applied by the pressure membrane 102 to the silicon wafer W. The polishing head area pressure detection is the detection of the output pressure of the pressure membrane 102. The existing detection scheme is to feedback the pressure condition of the polishing head area by detecting the flow rate of gas or liquid in the fluid channel 100a. However, based on the different batches of pressure membranes 102 used in CMP equipment, the authenticity of the detection results obtained by the existing detection method is limited. Because the performance of the pressure membranes 102 of different batches is easily affected by factors such as production process or raw materials, it is difficult to obtain accurate polishing head area pressure conditions based on the flow rate of gas or liquid in the fluid channel 101a. In addition, in the process of measuring the flow rate in the fluid channel 100a, the polishing head 10 needs to be disassembled, resulting in a complicated detection process and low efficiency.

[0004] Therefore, a new detection method is urgently needed to solve the above technical problems. Utility Model Content

[0005] The utility model aims to provide a chemical mechanical polishing device to solve at least one of the following problems: how to improve the accuracy and efficiency of polishing head pressure detection, and how to reduce the process difficulty of polishing head pressure detection.

[0006] In order to solve the above technical problems, the utility model provides a chemical mechanical polishing device, comprising: a device body and a detection unit;

[0007] The device body includes a polishing head, and a plurality of pressure elements are arranged in the polishing head for applying pressure to the structure to be polished;

[0008] The detection unit is movably connected to the device body; the detection unit includes a plurality of pressure sensors, and when detecting the pressure of the plurality of pressure elements, the plurality of pressure sensors are connected to the pressure surfaces of the plurality of pressure elements to respectively detect the pressure output by each of the pressure elements.

[0009] Optionally, in the chemical mechanical polishing device, the number of the pressure sensors is greater than or equal to the number of the pressure elements, so that when detecting the pressure of the plurality of pressure elements, each of the pressure elements contacts with at least one pressure sensor.

[0010] Optionally, in the chemical mechanical polishing device, when detecting the pressure of the plurality of pressure elements, each of the pressure sensors is evenly distributed on the pressure surface of the corresponding pressure element.

[0011] Optionally, in the chemical mechanical polishing device, the detection unit also includes a supporting bracket; the supporting bracket has two opposite ends, one end of which is provided with a supporting platform, and the plurality of pressure sensors are distributed on the supporting platform; the other end of the supporting bracket is connected to a plurality of first motors, and the plurality of first motors are also connected to the device body, so that the supporting bracket can move along three degrees of freedom relative to the device body, so as to move the plurality of pressure sensors to a position connected with the pressure surfaces of the plurality of pressure elements at least when detecting the pressure of the plurality of pressure elements; and, after the pressure detection is completed, move the plurality of pressure sensors to a non-working area.

[0012] Optionally, in the chemical mechanical polishing device, the detection unit further includes a position sensor; the position sensor is disposed on the supporting bracket and is used to detect and locate the position of the supporting bracket relative to the polishing head.

[0013] Optionally, in the chemical mechanical polishing device, the surface of the support platform facing the pressure element has a plurality of empty grooves, and each of the empty grooves is used to accommodate at least one of the pressure sensors; and, each of the empty grooves is also provided with at least one telescopic member, and the telescopic member is correspondingly connected to the pressure sensor, so that when detecting the pressure of the plurality of pressure elements, the telescopic member can push the corresponding pressure sensor out of the empty groove and connect with the corresponding pressure element; and after the pressure detection is completed, the telescopic member can retract the corresponding pressure sensor into the empty groove.

[0014] Optionally, in the chemical mechanical polishing device, the plurality of pressure sensors are arranged on the surface of the supporting platform facing the pressure element, and at least one of the plurality of first motors is used to drive the supporting bracket to drive the plurality of pressure sensors to move in a direction perpendicular to the pressure surface.

[0015] Optionally, in the chemical mechanical polishing device, at least one of the multiple first motors is used to drive the support platform to rotate, so that when detecting the pressure of the several pressure elements, the support platform can rotate to a preset angle, so that the several pressure sensors are displaced relative to the several pressure elements to detect the pressure at different positions of the pressure surfaces of the several pressure elements.

[0016] Optionally, in the chemical mechanical polishing device, the device body includes a second motor; the second motor is connected to the polishing head, and is at least used to drive the polishing head to rotate, so that when detecting the pressure of the several pressure elements, the polishing head rotates to a preset angle, so that the several pressure sensors are displaced relative to the several pressure elements, so as to detect the pressure at different positions of the pressure surfaces of the several pressure elements.

[0017] Optionally, in the chemical mechanical polishing device, the device body further includes an operating table; the operating table is connected to the polishing head, and the detection unit is movably connected to the polishing head or the operating table.

[0018] Compared with the prior art, the chemical mechanical polishing device provided by the utility model is additionally provided with a detection unit, and the detection unit includes a plurality of pressure sensors. When detecting the pressure of each of the pressure elements, the plurality of pressure sensors are in contact with the pressure surface of each of the pressure elements to directly detect the pressure and distribution output by each of the pressure elements. The detection accuracy is high, and there is no need to disassemble the polishing head for detection. The operation is simple and the detection efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0020] Figure 1 It is a structural schematic diagram of a chemical mechanical polishing device in the prior art.

[0021] Figure 2 It is a schematic diagram of the internal structure of a polishing head in the prior art.

[0022] Figure 3 It is a structural schematic diagram of a chemical mechanical polishing device in an embodiment of the utility model.

[0023] Figure 4 It is a schematic diagram of the internal structure of the polishing head in the embodiment of the utility model.

[0024] Figure 5 It is a bottom view of a combination type of multiple pressure elements in an embodiment of the utility model.

[0025] Figure 6 It is a bottom view of another combination type of multiple pressure elements in an embodiment of the utility model.

[0026] Figure 7 It is a structural schematic diagram of the detection unit in the embodiment of the utility model.

[0027] Figure 8 It is a schematic diagram of the distribution of each pressure sensor relative to each pressure element in the embodiment of the utility model.

[0028] Fig. 9 It is a schematic diagram of the connection between a pressure sensor and a bearing platform in an embodiment of the utility model.

[0029] Fig.10 This is a schematic diagram of another connection between a pressure sensor and a support platform in an embodiment of the utility model.

[0030] And, in the attached drawings:

[0031] 10-polishing head; 100-housing; 100a-fluid channel; 101-pressure membrane chamber; 102-pressure membrane; 11-polishing pad; 12-polishing liquid;

[0032] 20-device body; 201-polishing head; 2011-housing; 2012-pressure element; 2013-limiting ring; 202-polishing pad; 203-polishing table; 204-dresser; 205-polishing liquid nozzle; 206-operating table;

[0033] 30-detection unit; 301-pressure sensor; 302-carrying bracket; 3021-carrying platform; 3022-bracket body; 303-first motor;

[0034] W-silicon wafer; T-fluid channel; t-connecting port; C-empty groove. DETAILED DESCRIPTION

[0035] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing to be shown is different, and sometimes different proportions are used. It should also be understood that, unless otherwise specified or pointed out, the terms "first", "second", "third" and the like in the specification are only used to distinguish the various components, elements, steps, etc. in the specification, rather than to represent the logical relationship or sequential relationship between the various components, elements, steps, etc. And, the X-axis direction, Y-axis direction and Z-axis direction referred to in the specification of this application are three directions perpendicular to each other in three-dimensional space.

[0036] See also Figure 3 The present embodiment provides a chemical mechanical polishing device, comprising: a device body 20 and a detection unit 30; the device body 20 comprises a polishing head 201, and a plurality of pressure elements are arranged in the polishing head 201 for applying pressure to the structure to be polished; the detection unit 30 is movably connected to the device body 20; the detection unit 30 comprises a plurality of pressure sensors 301, and when detecting the pressure of the plurality of pressure elements, the plurality of pressure sensors 301 are connected to the pressure-applying surfaces of the plurality of pressure elements to respectively detect the pressure output by each of the pressure elements.

[0037] Based on this, the chemical mechanical polishing device provided in this embodiment is additionally provided with a detection unit 30, so as to utilize the plurality of pressure sensors 301 to directly contact the pressure surfaces of the plurality of pressure elements and detect the pressure and distribution output by each of the pressure elements. The detection accuracy is high, and there is no need to disassemble the polishing head 201 for detection. The operation is simple and the detection efficiency is high.

[0038] The following is combined with Figures 3 to 10 The chemical mechanical polishing device provided in this embodiment is specifically described.

[0039] Please continue reading Figure 3The chemical mechanical polishing device provided in this embodiment includes a device body 20 and a detection unit 30. The device body 20 is used to perform a chemical mechanical polishing process on the structure to be polished. The detection unit 30 is used to determine the pressure accuracy and pressure distribution uniformity of the polishing head 201 by detecting the pressure value of the pressure applied by the polishing head 201 to the structure to be polished. Among them, the structure to be polished can be a semiconductor device in the preparation process, or any substrate, bare chip, etc. for carrying semiconductor integrated circuit components known to those skilled in the art, and this embodiment does not specifically limit this.

[0040] See also Figure 3 and Figure 4 The device body 20 includes a polishing head 201, a polishing pad 202, a polishing table 203, a trimmer 204, a polishing liquid nozzle 205 and an operating table 206. The polishing head 201 is used to accommodate the structure to be polished and limit the structure to be polished, and to drive the structure to be polished to rotate and apply variable pressure to the structure to be polished during the polishing process, so as to control the polishing effect of the structure to be polished. The polishing pad 202 is arranged on the polishing table 203, and during the polishing process, the polishing pad 202 contacts the polishing head 201 and the structure to be polished in the polishing head 201, and is used to provide the mechanical and chemical environment required for polishing to the structure to be polished. The polishing table 203 is used to carry the structure to be polished, the polishing head 201, the polishing pad 202 and the trimmer 204. And the polishing table 203 can also rotate during the polishing process to accelerate mechanical grinding and uniform diffusion of the polishing liquid, so as to optimize the polishing effect. The trimmer 204 is disposed on the polishing pad 202, and is used to regularly trim the polishing pad 202 during the polishing process to ensure that the polishing pad 202 has better flatness and grinding effect. The polishing liquid nozzle 205 is located above the polishing pad 202, and is connected to the polishing liquid supply pipeline (not shown), and is used to provide polishing liquid during the polishing process. The operating table 206 is a control machine for the device body 20, and the polishing head 201, the polishing table 203, the trimmer 204, and the polishing liquid supply pipeline are all connected to it. Among them, the operating table 206 is also provided with a cleaning module, a transmission module, and an environmental control module, etc., which are well known to those skilled in the art, and are not described in detail in this embodiment.

[0041] Furthermore, the polishing head 201 includes a shell 2011, a plurality of pressure elements 2012 and a limit ring 2013. The shell 2011 is a support frame of the polishing head 201 and has a first end and a second end relative to each other; the first end can be connected to the operating table 206, and the second end has a circular groove for accommodating and connecting each of the pressure elements 2012. That is, each of the pressure elements 2012 is distributed on the bottom surface of the circular groove. The pressure element 2012 is used to apply pressure to the structure to be polished during the polishing process to optimize the polishing effect. Preferably, each of the pressure elements 2012 is made of an elastic film and forms different morphologies when filled with gas or liquid. Figure 5 As shown, each of the pressure elements 2012 is in a concentric circle structure, and from the outside of the ring to the inside of the ring are: a first pressure element 2012a, a second pressure element 2012b, a third pressure element 2012c, a fourth pressure element 2012d, a fifth pressure element 2012e and a sixth pressure element 2012f. Figure 6 As shown, each of the pressure elements 2012 is fan-shaped and are combined into a circular shape. It should be noted that this embodiment does not limit the specific type, morphology, distribution and quantity of the pressure elements 2012, and when the pressure element 2012 uses the size of the fluid to achieve pressure regulation, a fluid pipeline T is also required to be provided in the shell 2011 to provide liquid or gas to each of the pressure elements 2012. Preferably, the fluid pipeline T has a plurality of connecting ports t, which are respectively connected to each of the pressure elements 2012. The pressure elements 2012 are not connected to each other, so as to facilitate independent pressure regulation of each of the pressure elements 2012. And, as Figure 4 As shown, the limiting ring 2013 is connected to the top of the groove wall of the second end of the housing 2011, and is used to limit the position of the structure to be polished during the polishing process to prevent it from slipping out of the polishing head 201. Preferably, the connection method is a detachable connection to facilitate the maintenance and replacement of the limiting ring 2013. Based on this, during the polishing process, the structure to be polished is placed in the limiting ring 2013, and the polishing surface of the structure to be polished faces the polishing pad 202, and the other opposite surface contacts each of the pressure elements 2012.

[0042] See also Figure 3 , Figure 4 and Figure 7, because the prior art indirectly determines the pressure state of each of the pressure elements 2012 by detecting the flow rate in the fluid channel T, and its detection accuracy is limited, the chemical mechanical polishing device provided in this embodiment is provided with a detection unit 30 to directly measure the output pressure of each of the pressure elements 2012 to avoid interference with the detection result due to the quality difference of the elastic membrane of the pressure element 2012 or other factors. Specifically, the detection unit 30 includes a plurality of pressure sensors 301 and a supporting bracket 302. The pressure sensor 301 is used to directly measure the pressure of the pressure surface of each of the pressure elements 2012. The pressure surface in this embodiment refers to the surface of the pressure element 2012 that is used to contact the structure to be polished. The supporting bracket 302 is used to carry each of the pressure sensors 301 and is connected to the device body 20.

[0043] Furthermore, the pressure sensor 301 may be a resistive pressure sensor, a capacitive pressure sensor, a piezoresistive pressure sensor, or a resonant pressure sensor, etc., and this embodiment does not limit its specific type. In order to accurately obtain the pressure state of each pressure element 2012, each pressure element 2012 is connected to at least one pressure sensor 301, and the number of pressure sensors 301 needs to be greater than or equal to the number of pressure elements 2012. For example, Figure 8 As shown, except for the pressure element 2012 located at the center of the circle, three pressure sensors 301 are correspondingly arranged for each of the other pressure elements 2012. This embodiment does not limit the specific number of the pressure sensors 301 corresponding to each of the pressure elements 2012, which can be one, two, three or more than four, and the number of the pressure sensors 301 corresponding to each of the pressure elements 2012 can be the same or different. It should be noted that the corresponding arrangement of the pressure sensor 301 and the pressure element 2012 in this embodiment means that during pressure detection, the pressure sensor 301 can contact the corresponding pressure surface of the pressure element 2012. Based on this, when detecting pressure, each of the pressure sensors 301 needs to contact the corresponding pressure surface of the pressure element 2012, so as to directly measure the pressure value, and the detection accuracy is high. And, preferably, when each of the pressure elements 2012 corresponds to a plurality of the pressure sensors 301 , the pressure sensors 301 are evenly distributed on the corresponding pressure surface of the pressure element 2012 , so as to obtain the pressure distribution on the pressure surface of the pressure element 2012 .

[0044] Based on the contact detection method of the pressure sensor 301, the support bracket 302 is movably connected to the device body 20, so that when performing pressure detection, each of the pressure sensors 301 is moved toward the pressure element 2012, and each of the pressure sensors 301 is moved to a position in contact with the pressure surface of each of the pressure elements 2012; and after the pressure detection is completed, each of the pressure sensors 301 is moved to a non-working area without affecting the operation of other modules in the chemical mechanical polishing device. Preferably, as Figure 3 and Figure 7 As shown, the bearing bracket 302 has two opposite ends, one end of which is provided with a bearing platform 3021, and each of the pressure sensors 301 is distributed on the bearing platform 3021. The other end is connected to a plurality of first motors 303. And the plurality of first motors 303 are also connected to the device body 20, so that the bearing bracket 302 can move relative to the device body 20 along three degrees of freedom (X-axis direction, Y-axis direction and Z-axis direction). Exemplarily, the first motor 303 is connected to the shell of the operating table 206, or connected to the shell 2011 of the polishing head 201, so that the detection unit 30 can move relative to the operating table 206 or the polishing head 201 along the X-axis direction, the Y-axis direction and the Z-axis direction. Optionally, the bracket body 3022 between the two ends of the bearing bracket 302 is L-shaped, I-shaped or other arbitrary shapes, which is not specifically limited in this embodiment, and can be determined according to the spatial area used to accommodate the detection unit 30 in the chemical mechanical polishing device.

[0045] See also Fig. 9, this embodiment does not limit the specific connection mode between the pressure element 2012 and the carrier 3021. Exemplarily, the surface of the carrier 3021 facing the pressure element 2012 has several empty slots C, and each of the empty slots C is used to accommodate at least one of the pressure sensors 301. And, each of the empty slots C is also provided with at least one telescopic member (not shown), and the telescopic member is connected to the pressure sensor 301 accordingly, so that when the pressure of each of the pressure elements 2012 is detected, the telescopic member can push the corresponding pressure sensor 301 out of the empty slot C and connect with the corresponding pressure element 2012; and after the pressure detection is completed, the telescopic member can retract the corresponding pressure sensor 301 into the empty slot C. Optionally, the telescopic member is a small cylinder or other retractable device. Based on this, it can be understood that the empty slot C provided in the carrier 3021 can store the pressure sensor 301 in the non-detection state, protect the pressure sensor 301, and extend the service life of the device. Furthermore, the telescopic member can independently adjust the relative position between each pressure sensor 301 and the corresponding pressure element 2012 in the Z-axis direction during pressure detection, which is conducive to the pressure sensor 301 fully contacting the pressure element 2012 to achieve accurate detection. Fig.10 As shown, the surface of the support platform 3021 facing the pressure element 2012 is an integral plane, and each of the pressure sensors 301 can be directly set on the corresponding surface without setting the empty slot C and each of the telescopic parts, thereby reducing costs. However, in order to ensure that the pressure sensor 301 can perform contact detection, at least one of the first motors 303 is used to drive the support bracket 302 to drive the pressure sensor 301 to move in a direction perpendicular to the pressure surface (Z-axis direction), so that when detecting pressure, each of the pressure sensors 301 can move toward each of the pressure elements 2012 and connect with the corresponding pressure surface of the pressure element 2012; and, after the pressure detection is completed, each of the pressure sensors 301 can move in a direction away from the pressure element 2012.

[0046] In order to ensure that the first motor 303 moves the position of the supporting bracket 302 more accurately each time the detection is performed, the detection unit 30 further includes a position sensor (not shown). The position sensor is disposed on the supporting bracket 302 and is used to detect and locate the position of the supporting bracket 302 relative to the polishing head 201. The present embodiment does not limit the specific type of the position sensor, which may be an ultrasonic position sensor, a photoelectric position sensor, or an electromagnetic position sensor.

[0047] Further, in the process of pressure detection, in order to accurately obtain the pressure distribution of each of the pressure elements 2012, at least one of the first motors 303 provided in this embodiment can be used to drive the bearing platform 3021 to rotate, so that when detecting pressure, the bearing platform 3021 can rotate to a preset angle, so that each of the pressure sensors 301 and the corresponding pressure elements 2012 are displaced and changed, so that the pressure at different positions of the pressure application surface of each of the pressure elements 2012 can be detected, and more abundant pressure distribution information can be obtained. Optionally, the driving end of the first motor 303 used to drive the bearing platform 3021 to rotate extends through the inside of the bracket body 3022 to the bottom of the bearing platform 3021, and is connected to the bearing platform 3021, thereby driving the bearing platform 3021 to rotate. Alternatively, during the process of pressure detection, the position of each of the pressure sensors 301 remains unchanged, and the polishing head 201 rotates relative to the bearing platform 3021. Specifically, the device body 20 also includes a second motor (not shown). The second motor is connected to the housing 2011 of the polishing head 201, and is used to drive the polishing head 201 to rotate, so that when detecting pressure, the polishing head 201 rotates to a preset angle, and also causes each of the pressure sensors 301 and the corresponding pressure elements 2012 to change their displacement, so as to detect the pressure at different positions of the pressure surface of each of the pressure elements 2012. It should be noted that this embodiment does not limit the number of times the support platform 3021 or the polishing head 201 rotates during the detection process, and the range of the preset angle of each rotation. Preferably, in order to obtain a more accurate pressure output and distribution of each of the pressure elements 2012, during the pressure detection process, the flow rate in the fluid channel T can be adjusted to detect the pressure value of each of the pressure elements 2012 under different flow conditions.

[0048] In summary, the chemical mechanical polishing device provided in this embodiment is additionally provided with a detection unit 30, so as to utilize each of the pressure sensors 301 to contact with the pressure-applying surface of each of the pressure elements 2012, and directly detect the pressure and distribution of each of the pressure elements 2012, with high detection accuracy, and no need to disassemble the polishing head 201 for detection, which is easy to operate and has high detection efficiency. In addition, the detection unit 30 is movably connected to the device body 20, and in the non-detection state, the detection unit 30 can be moved to a non-working area, without adversely affecting the operation of other modules.

[0049] In addition, it should be recognized that although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A chemical mechanical polishing device, characterized in that: include: Device body and detection unit; The device body includes a polishing head, and a plurality of pressure elements are arranged in the polishing head for applying pressure to the structure to be polished; The detection unit is movably connected to the device body; the detection unit includes a plurality of pressure sensors, and when detecting the pressure of the plurality of pressure elements, the plurality of pressure sensors are connected to the pressure surfaces of the plurality of pressure elements to respectively detect the pressure output by each of the pressure elements.

2. The chemical mechanical polishing device according to claim 1, characterized in that: The number of the pressure sensors is greater than or equal to the number of the pressure elements, so that when the pressure of the plurality of pressure elements is detected, each of the pressure elements contacts correspondingly at least one of the pressure sensors.

3. The chemical mechanical polishing device according to claim 2, characterized in that: When detecting the pressure of the plurality of pressure elements, the pressure sensors are evenly distributed on the pressure surfaces of the corresponding pressure elements.

4. The chemical mechanical polishing device according to claim 1, characterized in that: The detection unit also includes a supporting bracket; the supporting bracket has two opposite ends, one end of which is provided with a supporting platform, and the plurality of pressure sensors are distributed on the supporting platform; the other end of the supporting bracket is connected to a plurality of first motors, and the plurality of first motors are also connected to the device body, so that the supporting bracket can move along three degrees of freedom relative to the device body, so as to move the plurality of pressure sensors to a position connected with the pressure surfaces of the plurality of pressure elements at least when detecting the pressure of the plurality of pressure elements; and, after the pressure detection is completed, move the plurality of pressure sensors to a non-working area.

5. The chemical mechanical polishing device according to claim 4, characterized in that: The detection unit further comprises a position sensor; the position sensor is arranged on the bearing bracket and is used for detecting and locating the position of the bearing bracket relative to the polishing head.

6. The chemical mechanical polishing device according to claim 4, characterized in that: The surface of the support platform facing the pressure element has a plurality of empty grooves, and each of the empty grooves is used to accommodate at least one of the pressure sensors; and, each of the empty grooves is also provided with at least one telescopic member, and the telescopic member is correspondingly connected to the pressure sensor, so that when the pressure of the plurality of pressure elements is detected, the telescopic member can push the corresponding pressure sensor out of the empty groove and connect with the corresponding pressure element; and after the pressure detection is completed, the telescopic member can retract the corresponding pressure sensor into the empty groove.

7. The chemical mechanical polishing device according to claim 4, characterized in that: The plurality of pressure sensors are disposed on a surface of the support platform facing the pressure element, and at least one of the plurality of first motors is used to drive the support bracket to drive the plurality of pressure sensors to move in a direction perpendicular to the pressure surface.

8. The chemical mechanical polishing device according to claim 4, characterized in that: At least one of the multiple first motors is used to drive the support platform to rotate, so that when detecting the pressure of the multiple pressure elements, the support platform can rotate to a preset angle, so that the multiple pressure sensors are displaced relative to the multiple pressure elements to detect the pressure at different positions of the pressure surfaces of the multiple pressure elements.

9. The chemical mechanical polishing device according to claim 1, characterized in that: The device body includes a second motor; the second motor is connected to the polishing head and is at least used to drive the polishing head to rotate so that when detecting the pressure of the several pressure elements, the polishing head rotates to a preset angle, so that the several pressure sensors are displaced relative to the several pressure elements to detect the pressure at different positions of the pressure surfaces of the several pressure elements.

10. The chemical mechanical polishing device according to claim 1 or 4, characterized in that: The device body also includes an operating table; the operating table is connected to the polishing head, and the detection unit is movably connected to the polishing head or the operating table.

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