Monocrystalline silicon slicing system

Abstract

The utility model discloses a monocrystalline silicon slicing system, and relates to the technical field of solar photovoltaic manufacturing. The monocrystalline silicon slicing system comprises a slicing unit, a first detection unit, a first cleaning unit, a second cleaning unit and a second detection unit, the slicing unit comprises a cutting line, and the cutting line is used for slicing a monocrystalline silicon rod; the first detection unit is arranged on one side of the slicing unit, the cutting line passes through the first detection unit, and the first detection unit is used for detecting whether the cutting line is abnormal or not; the first cleaning unit is arranged between the first detection unit and the slicing unit, and the first cleaning unit is used for cleaning the cutting line; the second cleaning unit is arranged on the side, away from the first cleaning unit, of the slicing unit and used for cleaning the cutting line. The second detection unit is arranged on the side, away from the slicing unit, of the second cleaning unit and used for detecting whether the cutting line is abnormal or not. The cutting line can be prevented from being broken, the abnormal misjudgment rate is reduced, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of solar photovoltaic manufacturing technology, and in particular to a single crystal silicon slicing system. Background Art

[0002] Single crystal silicon wafers are used to make solar cells. When processing silicon wafers, the single crystal silicon round rods must first be cut, squared, ground and chamfered into single crystal silicon square rods. Finally, they are sliced ​​using a slicer to cut the single crystal silicon square rods into square silicon wafers with a thickness of 110-160 microns.

[0003] The existing technology usually uses diamond wire for cutting during the slicing process. Diamond wire cutting technology is currently a relatively advanced silicon wafer processing technology. Its principle is to use a high-speed steel wire to drive the diamond blade attached to the steel wire to rub the silicon rod to achieve the purpose of cutting. During the cutting process, the diamond wire frequently reciprocates and cuts, which often leads to stretching deformation, insufficient tension, and diamond blade shedding. In this case, long-term operation is prone to abnormalities such as wire breakage, resulting in significant losses. Utility Model Content

[0004] In view of this, the purpose of the present application is to provide a single crystal silicon slicing system, aiming to solve the technical problems in the prior art.

[0005] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0006] An embodiment of the present application provides a single crystal silicon slicing system, comprising:

[0007] A slicing unit, the slicing unit comprising a cutting line, the cutting line is used to slice the single crystal silicon rod;

[0008] A first detection unit, the first detection unit is arranged at one side of the slicing unit, the cutting line passes through the first detection unit, and the first detection unit is used to detect whether the cutting line is abnormal;

[0009] A first cleaning unit, the first cleaning unit is arranged between the first detection unit and the slicing unit, and the first cleaning unit is used to clean the cutting line;

[0010] a second cleaning unit, the second cleaning unit being arranged on a side of the slicing unit away from the first cleaning unit, and the second cleaning unit being used for cleaning the cutting line;

[0011] a second detection unit, the second detection unit being arranged on a side of the second cleaning unit away from the slicing unit, and the second detection unit being used to detect whether the cutting line is abnormal;

[0012] The cutting line reciprocates between the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit.

[0013] In one embodiment of the present application, the first detection unit includes:

[0014] A first image acquisition device, the first image acquisition device is used to acquire image information of the cutting line;

[0015] A first image processing device is communicatively connected with the first image acquisition device, and the first image processing device is used to receive and process image information acquired by the first image acquisition device, and then determine whether an abnormality occurs in the cutting line.

[0016] In one embodiment of the present application, the first cleaning unit comprises:

[0017] A first shell, wherein the first shell has a first accommodating cavity, and the first accommodating cavity is used to contain a cleaning liquid;

[0018] The first transmission assembly is disposed in the first accommodating chamber, the first transmission assembly is rotatably connected to the first shell, and the first transmission assembly is used to transport the cutting line to the cleaning liquid in the first accommodating chamber for cleaning.

[0019] In one embodiment of the present application, the first transmission assembly includes:

[0020] A first transmission roller, which is disposed in the first accommodating chamber and is located at a cleaning liquid level in the first accommodating chamber, and is rotatably connected to the first shell;

[0021] a second transmission roller, the second transmission roller being arranged in the first accommodating chamber, the second transmission roller being located on a side of the first transmission roller close to the slicing unit, and the distance between the second transmission roller and the cleaning liquid level in the first accommodating chamber being equal to the distance between the first transmission roller and the cleaning liquid level in the first accommodating chamber;

[0022] a third transmission roller, the third transmission roller being arranged in the first accommodating chamber, the third transmission roller being located below the cleaning liquid level in the first accommodating chamber, and the third transmission roller being located between the first transmission roller and the second transmission roller;

[0023] Wherein, the cutting line is arranged around the first transmission roller, the second transmission roller and the third transmission roller in sequence, the first transmission roller is used to transmit the cutting line to the third transmission roller or the first detection unit, the second transmission roller is used to transmit the cutting line to the slicing unit or the third transmission roller, and the third transmission roller is used to clean the cutting line and transmit the cutting line to the second transmission roller or to the first transmission roller.

[0024] In one embodiment of the present application, the slicing unit includes:

[0025] a second transmission assembly, wherein the second transmission assembly is disposed between the first cleaning unit and the second cleaning unit, the cutting wire is disposed around the second transmission assembly, and the cutting wire is wrapped around the second transmission assembly to form a wire net;

[0026] A feeding assembly is arranged on a side of the second transmission assembly adjacent to the first cleaning unit, and the feeding assembly is arranged close to the wire mesh, and the feeding assembly is used to drive the single crystal silicon rod to approach the wire mesh.

[0027] In one embodiment of the present application, the second transmission assembly includes:

[0028] a first main roller, the first main roller being arranged on a side of the second transmission assembly close to the first cleaning unit, and the first main roller being located on a side of the second transmission assembly close to the feeding assembly;

[0029] a second main roller, the second main roller being arranged on a side of the first main roller away from the first cleaning unit, and the second main roller being located on a side of the second transmission assembly close to the feeding assembly;

[0030] a third main roller, the third main roller being disposed between the first main roller and the second main roller, and the third main roller being located on a side of the first main roller and the second main roller away from the feeding assembly;

[0031] The cutting line is arranged around the first main roller, the second main roller and the third main roller, the first main roller, the second main roller and the third main roller are used to jointly drive the cutting line, and the wire net is formed between the first main roller and the second main roller.

[0032] In one embodiment of the present application, the first main roller, the second main roller and the third main roller are distributed in a triangle.

[0033] In one embodiment of the present application, the cutting line comprises:

[0034] a steel wire, the steel wire being passed through the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit;

[0035] A diamond blade, wherein the diamond blade is arranged on the steel wire, and the steel wire is used to drive the diamond blade to reciprocate between the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit, and the diamond blade is used to slice the single crystal silicon rod.

[0036] In one embodiment of the present application, the second cleaning unit comprises:

[0037] A second shell, the second shell having a second accommodating cavity, the second accommodating cavity being used to contain cleaning liquid;

[0038] The second transmission assembly is arranged in the second accommodating chamber, the second transmission assembly is rotatably connected to the second shell, and the second transmission assembly is used to transport the cutting line to the cleaning liquid in the second accommodating chamber for cleaning.

[0039] In one embodiment of the present application, the second detection unit includes:

[0040] A second image acquisition device, the second image acquisition device is used to acquire image information of the cutting line;

[0041] The second image processing device is communicatively connected with the second image acquisition device, and the second image processing device is used to receive and process image information acquired by the second image acquisition device, and then determine whether an abnormality occurs in the cutting line.

[0042] Compared with the prior art, the beneficial effect of the present application is as follows: the present application proposes a single crystal silicon rod slicing system. The single crystal silicon rod slicing system includes a slicing unit, a first detection unit, a first cleaning unit, a second cleaning unit, and a second detection unit. The slicing unit includes a cutting line, and the cutting line is used to slice the single crystal silicon rod. The first detection unit is arranged on one side of the slicing unit, and the cutting line passes through the first detection unit. The first detection unit is used to detect whether the cutting line is abnormal. The first cleaning unit is arranged between the first detection unit and the slicing unit, and the first cleaning unit is used to clean the cutting line. The second cleaning unit is arranged on the side of the slicing unit away from the first cleaning unit, and the second cleaning unit is used to clean the cutting line. The second detection unit is arranged on the side of the second cleaning unit away from the slicing unit, and the second detection unit is used to detect whether the cutting line is abnormal. Wherein, the cutting line reciprocates between the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit. The present application slices the monocrystalline silicon rod through the cutting line of the slicing unit, and monitors the cutting line in the slicing process in real time through the first detection unit and the second detection unit, and handles abnormal situations in time. At the same time, the present application can clean the cutting line before detection through the first cleaning unit and the second cleaning unit, so as to avoid the occurrence of abnormalities such as cutting line breakage during the slicing process, reduce losses, and reduce the misjudgment rate of cutting line abnormalities, thereby further improving its work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0044] Figure 1 A schematic diagram of the structure of a single crystal silicon slicing system from one perspective is shown in the present application;

[0045] Figure 2 Another perspective structural schematic diagram of the single crystal silicon slicing system in the present application is shown;

[0046] Figure 3 Another structural schematic diagram of the single crystal silicon slicing system in the present application is shown;

[0047] Figure 4 A structural schematic diagram of a single crystal silicon slicing system from another viewing angle in the present application is shown.

[0048] Description of main component symbols:

[0049] 100-single crystal silicon slicing system; 110-first detection unit; 120-first cleaning unit; 121-first shell; 1211-first accommodating chamber; 122-first transmission assembly; 1221-first transmission roller; 1222-second transmission roller; 1223-third transmission roller; 130-slicing unit; 131-cutting line; 132-second transmission assembly; 1321-first main roller; 1322-second main roller; 1323-third main roller; 1324-wire net; 133-feeding assembly; 1331-crystal support; 140-second cleaning unit; 150-second detection unit; 160-first air shower unit; 161-first air outlet; 170-second air shower unit; 171-second air outlet; 101-single crystal silicon rod; 102-cleaning liquid. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0051] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0053] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0054] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0055] like Figure 1 As shown, an embodiment of the present application provides a single crystal silicon slicing system 100. The single crystal silicon slicing system 100 includes a slicing unit 130, a first detection unit 110, a first cleaning unit 120, a second cleaning unit 140 and a second detection unit 150.

[0056] The slicing unit 130 includes a cutting line 131, and the cutting line 131 is used to slice the single crystal silicon rod 101. In addition, the first detection unit 110 is arranged on one side of the slicing unit 130, and the cutting line 131 passes through the first detection unit 110, and the first detection unit 110 is used to detect whether the cutting line 131 is abnormal.

[0057] Specifically, the abnormal conditions of the cutting wire 131 include, for example, tensile deformation of the cutting wire 131 , insufficient tension, falling off of diamond blade material, and the like.

[0058] In addition, the first cleaning unit 120 is disposed between the first detection unit 110 and the slicing unit 130, and is used to clean the cutting line 131. The second cleaning unit 140 is disposed on a side of the slicing unit 130 away from the first cleaning unit 120, and is used to clean the cutting line 131.

[0059] Specifically, the second detection unit 150 is disposed on a side of the second cleaning unit 140 away from the slicing unit 130 , and the second detection unit 150 is used to detect whether the cutting line 131 is abnormal.

[0060] It should be noted that the cutting line 131 reciprocates between the first detecting unit 110 , the first cleaning unit 120 , the slicing unit 130 , the second cleaning unit 140 and the second detecting unit 150 .

[0061] In the related technology, a high-speed steel wire is generally used to drive the diamond blade attached to the steel wire to rub the silicon rod to achieve the purpose of cutting. During the cutting process, the diamond wire frequently reciprocates and cuts, which often leads to stretching deformation, insufficient tension, and diamond blade shedding. These problems cannot be discovered in time through manual observation. In this case, long-term operation is prone to abnormalities such as wire breakage, which can cause significant losses.

[0062] In this embodiment, the monocrystalline silicon slicing system 100 includes a slicing unit 130, a first detection unit 110, a first cleaning unit 120, a second cleaning unit 140, and a second detection unit 150. In this embodiment, the monocrystalline silicon rod 101 is sliced ​​by the cutting line 131 of the slicing unit 130, and the first detection unit 110 and the second detection unit 150 monitor the cutting line 131 in the slicing process in real time, and handle abnormal situations in time, so as to avoid the occurrence of abnormalities such as the breaking of the cutting line 131 during the slicing process, thereby reducing losses. At the same time, in this embodiment, the first cleaning unit 120 and the second cleaning unit 140 can clean the cutting line 131 before detection, reduce the misjudgment rate of abnormalities of the cutting line 131, and further improve its work efficiency.

[0063] Optionally, the cutting wire 131 includes a steel wire and a diamond blade.

[0064] The steel wire is passed through the first detection unit 110 , the first cleaning unit 120 , the slicing unit 130 , the second cleaning unit 140 and the second detection unit 150 .

[0065] In addition, the diamond blade is arranged on the steel wire. In this embodiment, the single crystal silicon rod 101 is sliced ​​by the diamond blade.

[0066] Specifically, in this embodiment, the diamond blade is driven by the steel wire to reciprocate at high speed among the first detection unit 110 , the first cleaning unit 120 , the slicing unit 130 , the second cleaning unit 140 and the second detection unit 150 .

[0067] In this embodiment, the cutting line 131 can move at high speed through the first detection unit 110, the first cleaning unit 120, the slicing unit 130, the second cleaning unit 140 and the second detection unit 150 in sequence, or move at high speed through the second detection unit 150, the second cleaning unit 140, the slicing unit 130, the first cleaning unit 120 and the first detection unit 110 in sequence, and the cutting line 131 alternates back and forth in these two directions and moves at high speed.

[0068] Optionally, the first detection unit 110 includes a first image acquisition device and a first image processing device.

[0069] In this embodiment, the image information of the cutting line 131 passing through the first detection unit 110 is collected by the first image collection device.

[0070] Optionally, the first image acquisition device is, for example, a high-speed camera.

[0071] In addition, the first image processing device is communicatively connected to the first image acquisition device, wherein the communication connection is, for example, a WIFI (Wireless Fidelity) connection or a Bluetooth connection.

[0072] Specifically, in this embodiment, the first image processing device receives the image information of the cutting line 131 acquired by the first image acquisition device, processes the image information, and then determines whether an abnormality occurs in the cutting line 131. The abnormality of the cutting line 131 includes, for example, stretching deformation of the cutting line 131, insufficient tension, and falling off of diamond blade material.

[0073] In this embodiment, the first image processing device will alarm after detecting that the cutting line 131 is abnormal, so that the staff can promptly discover the abnormality of the cutting line 131 and deal with the abnormality in time, thereby avoiding or reducing the occurrence of abnormalities such as broken cutting line 131 of the single crystal silicon rod 101 slicing system in this embodiment.

[0074] This embodiment uses the first detection unit 110 to obtain image information of the cutting line 131 during operation in real time, monitors the slicing process of the single crystal silicon rod 101 in real time, and compares the image of the current cutting line 131 with the image of the initial cutting line 131, thereby determining the state and abnormal position of the cutting line 131, thereby promptly discovering its abnormal state and performing maintenance in a timely manner.

[0075] Optionally, the first image processing device comprises, for example, image processing software.

[0076] Alternatively, if Figure 2As shown, the first cleaning unit 120 includes a first housing 121 and a first transmission assembly 122 .

[0077] The first housing 121 has a first accommodating chamber 1211 , and the first accommodating chamber 1211 is used to contain the cleaning liquid 102 .

[0078] In addition, the first transmission assembly 122 is disposed in the first accommodating chamber 1211, the first transmission assembly 122 is rotatably connected to the first housing 121, and the first transmission assembly 122 is used to transport the cutting line 131 to the cleaning liquid 102 in the first accommodating chamber 1211 for cleaning, and to transport the cleaned cutting line 131 to the first detection unit 110 or the slicing unit 130. In this embodiment, the cutting line 131 is cleaned to reduce the misjudgment rate of abnormal cutting line 131.

[0079] Alternatively, if Figure 3 As shown, the first transmission assembly 122 includes a first transmission roller 1221 , a second transmission roller 1222 and a third transmission roller 1223 .

[0080] The first transmission roller 1221 is disposed in the first accommodating chamber 1211, and the first transmission roller 1221 is located on the cleaning liquid 102 in the first accommodating chamber 1211, that is, the first transmission roller 1221 is located above the surface of the cleaning liquid 102 in the first accommodating chamber 1211. The first transmission roller 1221 is rotatably connected to the first housing 121.

[0081] In addition, the second transmission roller 1222 is arranged in the first accommodating cavity 1211, the second transmission roller 1222 is located on the side of the first transmission roller 1221 close to the slicing unit 130, and the distance between the second transmission roller 1222 and the surface of the cleaning liquid 102 in the first accommodating cavity 1211 is equal to the distance between the first transmission roller 1221 and the surface of the cleaning liquid 102 in the first accommodating cavity 1211, that is, the second transmission roller 1222 is also located above the surface of the cleaning liquid 102 in the first accommodating cavity 1211.

[0082] Among them, the third transmission roller 1223 is arranged in the first accommodating cavity 1211, and the third transmission roller 1223 is located below the surface of the cleaning liquid 102 in the first accommodating cavity 1211, that is, the third transmission roller 1223 is immersed in the cleaning liquid 102 in the first accommodating cavity 1211, and the third transmission roller 1223 is located between the first transmission roller 1221 and the second transmission roller 1222.

[0083] It should be noted that the cutting line 131 is sequentially arranged around the first transmission roller 1221 , the second transmission roller 1222 and the third transmission roller 1223 .

[0084] Among them, the first transmission roller 1221 is used to transmit the cutting line 131 to the third transmission roller 1223 or the first detection unit 110, the second transmission roller 1222 is used to transmit the cutting line 131 to the slicing unit 130 or the third transmission roller 1223, and the third transmission roller 1223 is used to clean the cutting line 131 and transmit the cutting line 131 to the second transmission roller 1222 or to the first transmission roller 1221.

[0085] Specifically, when the cutting line 131 moves from the first detection unit 110 to the second detection unit 150, the cutting line 131 outputted from the first detection unit 110 is transmitted to the third transmission roller 1223 through the first transmission roller 1221, and the cutting line 131 is cleaned through the third transmission roller 1223, and the cleaned cutting line 131 is transmitted to the second transmission roller 1222. Further, the cutting line 131 is transmitted to the slicing unit 130 through the second transmission roller 1222.

[0086] In addition, when the cutting line 131 moves along the second detection unit 150 toward the first detection unit 110, the cutting line 131 output by the slicing unit 130 is transmitted to the third transmission roller 1223 through the second transmission roller 1222, and the cutting line 131 is cleaned by the third transmission roller 1223, and the cleaned cutting line 131 is transmitted to the first transmission roller 1221. Further, the cutting line 131 is transmitted to the first detection unit 110 through the first transmission roller 1221.

[0087] Alternatively, if Figure 2 As shown, the slicing unit 130 includes a second transmission assembly 132 and a feeding assembly 133 .

[0088] The second transmission assembly 132 is disposed between the first cleaning unit 120 and the second cleaning unit 140 , and the cutting line 131 is disposed around the second transmission assembly 132 .

[0089] It should be noted that if Figure 3 As shown, the cutting wire 131 is wrapped around the second transmission assembly 132 to form a wire net 1324 .

[0090] In this embodiment, the feeding assembly 133 is disposed on a side of the second transmission assembly 132 adjacent to the first cleaning unit 120 , and the feeding assembly 133 is disposed close to the wire mesh 1324 .

[0091] In this embodiment, the feeding assembly 133 drives the single crystal silicon rod 101 to approach the wire mesh 1324 , so that the high-speed running wire mesh 1324 slices the single crystal silicon rod 101 .

[0092] Alternatively, if Figure 3 As shown, the second transmission assembly 132 includes a first main roller 1321 , a second main roller 1322 and a third main roller 1323 .

[0093] The first main roller 1321 is disposed on a side of the second transmission assembly 132 close to the first cleaning unit 120 , and the first main roller 1321 is located on a side of the second transmission assembly 132 close to the feeding assembly 133 .

[0094] In addition, the second main roller 1322 is disposed on a side of the first main roller 1321 away from the first cleaning unit 120 , and the second main roller 1322 is located on a side of the second transmission assembly 132 close to the feeding assembly 133 .

[0095] Among them, Figure 3 and Figure 4 As shown, the third main roller 1323 is disposed between the first main roller 1321 and the second main roller 1322 , and the third main roller 1323 is located on a side of the first main roller 1321 and the second main roller 1322 away from the feeding assembly 133 .

[0096] Specifically, the cutting line 131 is arranged around the first main roller 1321, the second main roller 1322 and the third main roller 1323, the first main roller 1321, the second main roller 1322 and the third main roller 1323 are used to jointly transmit the cutting line 131, and the wire net 1324 is formed between the first main roller 1321 and the second main roller 1322.

[0097] Optionally, the first main roller 1321 , the second main roller 1322 and the third main roller 1323 are distributed in a triangle shape, so as to further improve the stability of the wire web 1324 .

[0098] It should be noted that the spacing between two adjacent cutting lines 131 in the wire mesh 1324 determines the thickness of the slices of the single crystal silicon rod 101. This embodiment does not limit the spacing between two adjacent cutting lines 131 in the wire mesh 1324. The spacing between two adjacent cutting lines 131 in the wire mesh 1324 can be designed according to actual production conditions.

[0099] Optionally, the feed assembly 133 includes a stepper motor and a crystal support 1331, and the crystal support 1331 is arranged on a side of the feed assembly 133 close to the wire mesh 1324, and the crystal support 1331 is used to fix the single crystal silicon rod 101 to be sliced, that is, the single crystal silicon rod 101 to be sliced ​​is located between the crystal support 1331 and the wire mesh 1324.

[0100] In addition, a stepper motor is arranged on a side of the crystal support 1331 adjacent to the wire mesh 1324, and the stepper motor is connected to the crystal support 1331. In this embodiment, the stepper motor drives the crystal support 1331 to approach the wire mesh 1324, thereby making the single crystal silicon rod 101 on the crystal support 1331 approach the wire mesh 1324, and slicing the single crystal silicon rod 101 through the wire mesh 1324, thereby achieving slicing of the single crystal silicon rod 101.

[0101] Optionally, the second cleaning unit 140 includes a second shell and a second transmission assembly 132 .

[0102] The second shell has a second accommodating chamber, and the second accommodating chamber is used to contain the cleaning liquid 102 .

[0103] In addition, the second transmission assembly 132 is disposed in the second accommodating chamber, the second transmission assembly 132 is rotatably connected to the second housing, and the second transmission assembly 132 is used to transport the cutting line 131 to the cleaning liquid 102 in the second accommodating chamber for cleaning, and to transport the cleaned cutting line 131 to the second detection unit 150 or the slicing unit 130. In this embodiment, the cutting line 131 is cleaned to reduce the misjudgment rate of abnormal cutting line 131.

[0104] It should be noted that the specific structure of the second cleaning unit 140 in this embodiment is consistent with the specific structure of the first cleaning unit 120 .

[0105] Optionally, the second detection unit 150 includes a second image acquisition device and a second image processing device.

[0106] In this embodiment, the image information of the cutting line 131 passing through the second detection unit 150 is collected by the second image collection device.

[0107] Optionally, the second image acquisition device is, for example, a high-speed camera.

[0108] In addition, the second image processing device is communicatively connected to the second image acquisition device, wherein the communication connection is, for example, a WIFI (Wireless Fidelity) connection or a Bluetooth connection.

[0109] Specifically, in this embodiment, the second image processing device receives the image information of the cutting line 131 acquired by the second image acquisition device, processes the image information, and then determines whether an abnormality occurs in the cutting line 131. Optionally, the abnormality of the cutting line 131 includes, for example, stretching deformation of the cutting line 131, insufficient tension, falling off of diamond blade material, etc.

[0110] In this embodiment, the second image processing device will alarm after detecting that the cutting line 131 is abnormal, so that the staff can promptly discover the abnormality of the cutting line 131 and deal with the abnormality in time, thereby avoiding or reducing the occurrence of abnormalities such as broken cutting line 131 of the single crystal silicon rod 101 slicing system in this embodiment.

[0111] This embodiment uses the second detection unit 150 to obtain image information of the cutting line 131 during operation in real time, monitors the slicing process of the single crystal silicon rod 101 in real time, and compares the image of the current cutting line 131 with the image of the initial cutting line 131, and then determines the state and abnormal position of the cutting line 131, so as to timely discover its abnormal state and perform maintenance in time.

[0112] Optionally, the second image processing device includes, for example, image processing software.

[0113] Optionally, the single crystal silicon slicing system 100 further includes a first air shower unit 160 , wherein the first air shower unit 160 is disposed between the first detection unit 110 and the first cleaning unit 120 , and the cutting line 131 passes through the first air shower unit 160 .

[0114] In this embodiment, the first air shower unit 160 is used to dry the cutting line 131 after cleaning by the first cleaning unit 120, that is, the cleaning liquid 102 on the cutting line 131 is blown away, so as to avoid the cleaning liquid 102 attached to the cutting line 131 affecting the detection result of the cutting line 131 by the first detection unit 110, thereby further improving the detection accuracy of the single crystal silicon slicing system 100.

[0115] Optionally, the first air shower unit 160 has a first air outlet 161, and the first air outlet 161 is arranged on a side of the first air shower unit 160 adjacent to the first detection unit 110. The first air outlet 161 is used to discharge the gas in the first air shower unit 160, and form an air flow channel in the first air shower unit 160, and avoid excessive air pressure in the first air shower unit 160, thereby improving its safety.

[0116] Optionally, the single crystal silicon slicing system 100 further includes a second air shower unit 170 , wherein the second air shower unit 170 is disposed between the second detection unit 150 and the second cleaning unit 140 , and the cutting line 131 passes through the second air shower unit 170 .

[0117] In this embodiment, the second air shower unit 170 is used to dry the cutting line 131 after cleaning by the second cleaning unit 140, that is, the cleaning liquid 102 on the cutting line 131 is blown away, so as to avoid the cleaning liquid 102 attached to the cutting line 131 affecting the detection result of the cutting line 131 by the second detection unit 150, thereby further improving the detection accuracy of the single crystal silicon slicing system 100.

[0118] Optionally, the second air shower unit 170 has a second air outlet 171, and the second air outlet 171 is arranged on a side of the second air shower unit 170 adjacent to the second detection unit 150. The second air outlet 171 is used to discharge the gas in the second air shower unit 170, form an air flow channel in the second air shower unit 170, and avoid excessive air pressure in the second air shower unit 170, thereby improving its safety.

[0119] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0120] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A single crystal silicon slicing system, characterized in that: include: A slicing unit, the slicing unit comprising a cutting line, the cutting line is used to slice the single crystal silicon rod; A first detection unit, the first detection unit is arranged at one side of the slicing unit, the cutting line passes through the first detection unit, and the first detection unit is used to detect whether the cutting line is abnormal; A first cleaning unit, the first cleaning unit is arranged between the first detection unit and the slicing unit, and the first cleaning unit is used to clean the cutting line; a second cleaning unit, the second cleaning unit being arranged on a side of the slicing unit away from the first cleaning unit, and the second cleaning unit being used for cleaning the cutting line; a second detection unit, the second detection unit being arranged on a side of the second cleaning unit away from the slicing unit, and the second detection unit being used to detect whether the cutting line is abnormal; The cutting line reciprocates between the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit.

2. The single crystal silicon slicing system according to claim 1, characterized in that: The first detection unit comprises: A first image acquisition device, the first image acquisition device is used to acquire image information of the cutting line; A first image processing device is communicatively connected with the first image acquisition device, and the first image processing device is used to receive and process image information acquired by the first image acquisition device, and then determine whether an abnormality occurs in the cutting line.

3. The single crystal silicon slicing system according to claim 1, characterized in that: The first cleaning unit comprises: A first shell, wherein the first shell has a first accommodating cavity, and the first accommodating cavity is used to contain a cleaning liquid; The first transmission assembly is disposed in the first accommodating chamber, the first transmission assembly is rotatably connected to the first shell, and the first transmission assembly is used to transport the cutting line to the cleaning liquid in the first accommodating chamber for cleaning.

4. The single crystal silicon slicing system according to claim 3, characterized in that: The first transmission assembly comprises: A first transmission roller, which is disposed in the first accommodating chamber and is located at a cleaning liquid level in the first accommodating chamber, and is rotatably connected to the first shell; a second transmission roller, the second transmission roller being arranged in the first accommodating chamber, the second transmission roller being located at a side of the first transmission roller close to the slicing unit, and the distance between the second transmission roller and the cleaning liquid level in the first accommodating chamber being equal to the distance between the first transmission roller and the cleaning liquid level in the first accommodating chamber; a third transmission roller, the third transmission roller being arranged in the first accommodating chamber, the third transmission roller being located below the cleaning liquid level in the first accommodating chamber, and the third transmission roller being located between the first transmission roller and the second transmission roller; Wherein, the cutting line is arranged around the first transmission roller, the second transmission roller and the third transmission roller in sequence, the first transmission roller is used to transmit the cutting line to the third transmission roller or the first detection unit, the second transmission roller is used to transmit the cutting line to the slicing unit or the third transmission roller, and the third transmission roller is used to clean the cutting line and transmit the cutting line to the second transmission roller or to the first transmission roller.

5. The single crystal silicon slicing system according to claim 1, characterized in that: The slicing unit comprises: a second transmission assembly, wherein the second transmission assembly is disposed between the first cleaning unit and the second cleaning unit, the cutting wire is disposed around the second transmission assembly, and the cutting wire is wrapped around the second transmission assembly to form a wire net; A feeding assembly is arranged on a side of the second transmission assembly adjacent to the first cleaning unit, and the feeding assembly is arranged close to the wire mesh, and the feeding assembly is used to drive the single crystal silicon rod to approach the wire mesh.

6. The single crystal silicon slicing system according to claim 5, characterized in that: The second transmission assembly comprises: a first main roller, the first main roller being arranged on a side of the second transmission assembly close to the first cleaning unit, and the first main roller being located on a side of the second transmission assembly close to the feeding assembly; a second main roller, the second main roller being arranged on a side of the first main roller away from the first cleaning unit, and the second main roller being located on a side of the second transmission assembly close to the feeding assembly; a third main roller, the third main roller being disposed between the first main roller and the second main roller, and the third main roller being located on a side of the first main roller and the second main roller away from the feeding assembly; The cutting line is arranged around the first main roller, the second main roller and the third main roller, the first main roller, the second main roller and the third main roller are used to jointly drive the cutting line, and the wire net is formed between the first main roller and the second main roller.

7. The single crystal silicon slicing system according to claim 6, characterized in that: The first main roller, the second main roller and the third main roller are distributed in a triangle.

8. The single crystal silicon slicing system according to any one of claims 1 to 7, characterized in that: The cutting line comprises: a steel wire, the steel wire being passed through the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit; A diamond blade, wherein the diamond blade is arranged on the steel wire, and the steel wire is used to drive the diamond blade to reciprocate between the first detection unit, the first cleaning unit, the slicing unit, the second cleaning unit and the second detection unit, and the diamond blade is used to slice the single crystal silicon rod.

9. The single crystal silicon slicing system according to any one of claims 1 to 7, characterized in that: The second cleaning unit comprises: A second shell, the second shell having a second accommodating cavity, the second accommodating cavity being used to contain cleaning liquid; The second transmission assembly is arranged in the second accommodating chamber, the second transmission assembly is rotatably connected to the second shell, and the second transmission assembly is used to transport the cutting line to the cleaning liquid in the second accommodating chamber for cleaning.

10. The single crystal silicon slicing system according to any one of claims 1 to 7, characterized in that: The second detection unit comprises: A second image acquisition device, the second image acquisition device is used to acquire image information of the cutting line; The second image processing device is communicatively connected with the second image acquisition device, and the second image processing device is used to receive and process image information acquired by the second image acquisition device, and then determine whether an abnormality occurs in the cutting line.

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