Computer hardware cooling structure

Abstract

The utility model provides a computer hardware cooling structure, and belongs to the technical field of computers. The computer hardware cooling structure comprises a cooling assembly and an expansion assembly, the cooling assembly comprises a box body, a mesh back plate, a circulating pump, a cooling liquid box, a circulating pipeline and a semiconductor chilling plate, the mesh back plate is arranged on one side of the box body, the expansion assembly comprises a side frame and blades, the side frame is arranged on the side edge of the box body, and the blades are arranged on the side frame. Through the arrangement of the box body, the mesh back plate, the circulating pump, the cooling liquid box, the circulating pipeline and the semiconductor chilling plate, cooling liquid is cooled by the semiconductor chilling plate through the circulating pump and then circulates in the circulating pipeline, and then air entering through the mesh back plate is cooled, so that the heat dissipation and cooling effect on internal hardware is improved; and by arranging the side frames and the blades, the ventilation and heat dissipation area can be expanded as required, and the high-heat heat dissipation and cooling requirements are met.

Description

Technical Field

[0001] The present application relates to the field of computers, and in particular to a computer hardware cooling structure. Background Art

[0002] With the improvement of people's living standards and the rapid development of informatization, computers have become more and more popular. The motherboard, hard disk, CPU, graphics card, and memory stick are all computer hardware, and most of the above hardware is installed inside the chassis, which is different from hardware such as keyboard and mouse. When the computer is in use, the temperature inside the chassis rises. If it is not cooled down, the computer will start the protection mechanism to limit the output power of the CPU and graphics card, affecting the computer.

[0003] The current method of cooling computer hardware is mainly to use fans to speed up the internal air flow to dissipate the internal heat. However, it is difficult to meet the cooling needs when dealing with computers that generate more heat. Usually, one side of the chassis is used to install various hardware, and the other side is a removable side panel for easy maintenance and installation. Air is almost always taken in through the mesh panel on the back, and hot air is exhausted from the top and front, resulting in air flow that is difficult to meet when cooling needs are high in temperature. Utility Model Content

[0004] In order to make up for the above deficiencies, the present application provides a computer hardware cooling structure, aiming to improve the problems raised in the above background technology.

[0005] An embodiment of the present application provides a computer hardware cooling structure including a cooling component and an expansion component.

[0006] The cooling component includes a box body, a mesh back plate, a circulation pump, a coolant tank, a circulation pipe and a semiconductor refrigeration sheet. The mesh back plate is arranged on one side of the box body, the semiconductor refrigeration sheet is embedded in one side of the box body, the coolant tank is installed on the inner side of the box body and fits the cold surface of the semiconductor refrigeration sheet. The circulation pump is connected to the top of the coolant tank, the circulation pipe is arranged on the inner side of the mesh back plate, and the circulation pipe connects the circulation pump and the coolant tank.

[0007] The expansion component comprises a side frame and blades. The side frame is arranged on the side of the box body. A plurality of blades are arranged. The plurality of blades are rotatably arranged in the side frame and are transmission-connected to each other.

[0008] In a specific implementation manner, a dustproof mesh plate is disposed on the top of the box body, and the dustproof mesh plate is also disposed on the other side of the box body.

[0009] In the above implementation process, a dustproof mesh plate is provided to ventilate and dustproof the top and front of the box.

[0010] In a specific implementation, a cooling fan is installed inside the box body, and the cooling fan is close to the dustproof screen.

[0011] In the above implementation process, a cooling fan is provided to accelerate the exchange of air inside and outside the belt.

[0012] In a specific embodiment, the circulation pipeline includes a coil and a straight pipe, the coil is attached to the mesh back plate, and the straight pipe connects the coil and the circulation pump.

[0013] In the above implementation process, the coil and the straight pipe are used, and the coil increases the area of ​​the internal coolant at the mesh back plate, which is conducive to cooling the air before sending it into the interior.

[0014] In a specific implementation manner, a plurality of sockets are provided on one side of the box body, and the sockets are close to the mesh back panel.

[0015] In the above implementation process, a number of sockets are opened to pass through the connection ports required by the internal hardware to make line connections.

[0016] In a specific embodiment, a rotating shaft is provided at the end of the blade and a gear is fixedly sleeved thereon, and a plurality of the gears are meshed with each other.

[0017] In the above implementation process, by setting a plurality of gears to mesh with each other, when a rotating shaft is rotated, each blade can rotate synchronously.

[0018] In a specific implementation, one of the rotating shafts rotates through the side frame and is fixedly connected to a knob, the side frame is provided with a cavity, and the gear is located in the cavity.

[0019] In the above implementation process, an external knob is provided to connect the rotating shaft, so that the rotating shaft can be rotated conveniently by turning the knob, thereby facilitating operation.

[0020] In a specific embodiment, a dustproof mesh plate is provided on the inner side of the side frame, and the dustproof mesh plate is located between the box body and the blades.

[0021] In the above implementation process, by providing a dustproof mesh plate, dust prevention is performed when the ventilation area is expanded by rotating the blades.

[0022] Beneficial effect: The present application provides a computer hardware cooling structure, which provides a box body, a mesh back panel, a circulating pump, a coolant tank, a circulating pipe and a semiconductor refrigeration plate. The circulating pump is used to cool the coolant after the semiconductor refrigeration plate is cooled and then circulates in the circulating pipe. Then the air coming in through the mesh back panel is cooled, thereby improving the heat dissipation and cooling effect of the internal hardware. By providing side frames and blades, the ventilation and heat dissipation area can be expanded when needed to meet high heat dissipation and cooling needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the drawings required for use in the implementation methods will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of a computer hardware cooling structure provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the cooling component structure provided in the embodiment of the present application;

[0026] Figure 3 A schematic diagram of the mesh backplane structure provided in the embodiment of the present application;

[0027] Figure 4 A schematic diagram of the expansion component structure provided for the implementation method of this application;

[0028] Figure 5 A schematic diagram of the gear structure provided for an embodiment of the present application.

[0029] In the figure: 100-cooling component; 110-box; 112-socket; 120-mesh backboard; 130-circulating pump; 140-coolant tank; 150-circulating pipe; 151-coil; 152-straight pipe; 170-semiconductor refrigeration plate; 180-dustproof mesh plate; 190-cooling fan; 200-expansion component; 210-side frame; 212-cavity; 220-blade; 221-rotating shaft; 222-gear; 230-dustproof mesh plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0031] See also Figure 1-Figure 5The present application provides a computer hardware cooling structure including a cooling component 100 and an expansion component 200 .

[0032] See also Figure 1 , 2 and 3, the cooling component 100 includes a box body 110, a mesh back plate 120, a circulation pump 130, a coolant tank 140, a circulation pipe 150 and a semiconductor refrigeration sheet 170, the mesh back plate 120 is arranged on one side of the box body 110, the semiconductor refrigeration sheet 170 is embedded in one side of the box body 110, the coolant tank 140 is installed on the inner side of the box body 110 and fits the cold surface of the semiconductor refrigeration sheet 170, the circulation pump 130 is connected and arranged on the top of the coolant tank 140, the circulation pipe 150 is arranged on the inner side of the mesh back plate 120, and the circulation pipe 150 connects the circulation pump 130 and the coolant tank 140.

[0033] A dustproof mesh plate 180 is provided on the top of the box 110, and a dustproof mesh plate 180 is also provided on the other side of the box 110. The dustproof mesh plate 180 is provided to ventilate the top and front of the box 110 to prevent dust.

[0034] In a specific implementation, a cooling fan 190 is installed inside the box 110, and the cooling fan 190 is close to the dustproof screen 180. By providing the cooling fan 190, the exchange of air inside and outside is accelerated.

[0035] Specifically, the circulation pipe 150 includes a coil 151 and a straight pipe 152. The coil 151 is attached to the mesh back plate 120. The straight pipe 152 connects the coil 151 and the circulation pump 130. Through the coil 151 and the straight pipe 152, the coil 151 increases the area of ​​the internal coolant at the mesh back plate 120, which is beneficial to cool the air before sending it into the interior.

[0036] In a specific implementation, a plurality of sockets 112 are provided on one side of the box body 110, and the sockets 112 are close to the mesh back panel 120. The plurality of sockets 112 are provided to pass through the connection ports required by the internal hardware for line connection.

[0037] See also Figure 1 , 2 , 4 and 5, the expansion component 200 includes a side frame 210 and a blade 220, the side frame 210 is arranged on the side of the box body 110, and a plurality of blades 220 are arranged, and the plurality of blades 220 are rotatably arranged in the side frame 210 and are transmission-connected to each other.

[0038] Specifically, a rotating shaft 221 is provided at the end of the blade 220 and a gear 222 is fixedly sleeved thereon, and multiple gears 222 are meshed with each other. By setting multiple gears 222 to mesh with each other, when a rotating shaft 221 is rotated, each blade 220 can rotate synchronously, and the top blade 220 and the bottom blade 220 rotate in opposite directions.

[0039] In a specific implementation scheme, a rotating shaft 221 rotates through the side frame 210 and is fixedly connected to a knob. The side frame 210 is provided with a cavity 212, and the gear 222 is located in the cavity 212. By setting an external knob to connect the rotating shaft 221, it is convenient to turn the knob to drive the rotating shaft 221 to rotate, which is convenient for operation.

[0040] In this embodiment, a dustproof mesh plate 230 is provided inside the side frame 210, and the dustproof mesh plate 230 is located between the box body 110 and the blades 220. By providing the dustproof mesh plate 230, dust prevention is performed when the ventilation area is expanded by rotating the blades 220.

[0041] The working principle of the computer hardware cooling structure is as follows: during use, the circulation pump 130 is started, and the circulation pump 130 draws the coolant in the coolant tank 140, circulates in the coil 151 and the straight pipe 152 and then returns to the coolant tank 140, and the cold surface of the semiconductor refrigeration plate 170 contacts the coolant tank 140 to cool the internal cold night, and its hot surface is located on the outside and away from the mesh back plate 120. At the same time, the cooling fan 190 is turned on to drive the air flow, and the air enters the contact coil 151 from the mesh back plate 120 to be cooled and then enters the internal contact hardware, thereby improving the heat dissipation and cooling effect of the internal hardware. Further, when high-heat computer hardware heat dissipation and cooling is required, the knob is turned to drive the shaft 221 to rotate, and the shaft 221 drives the gear 222 to rotate. The multiple gears 222 are engaged with each other to synchronously drive each blade 220 to rotate, so as to expand the ventilation and heat dissipation area to meet the high-heat heat dissipation and cooling needs.

[0042] It should be noted that the specific models and specifications of the circulation pump 130, semiconductor cooling plate 170 and cooling fan 190 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0043] The power supply and principle of the circulation pump 130, the semiconductor cooling sheet 170 and the cooling fan 190 are clear to those skilled in the art and will not be described in detail here.

[0044] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A computer hardware cooling structure, characterized in that: include A cooling component (100), the cooling component (100) comprising a box (110), a mesh back plate (120), a circulation pump (130), a cooling liquid tank (140), a circulation pipe (150) and a semiconductor cooling sheet (170), the mesh back plate (120) being arranged on one side of the box (110), the semiconductor cooling sheet (170) being embedded in one side of the box (110), the cooling liquid tank (140) being installed on the inner side of the box (110) and being in contact with the cold surface of the semiconductor cooling sheet (170), the circulation pump (130) being arranged in communication with the top of the cooling liquid tank (140), the circulation pipe (150) being arranged on the inner side of the mesh back plate (120), and the circulation pipe (150) being connected with the circulation pump (130) and the cooling liquid tank (140); An expansion component (200) comprises a side frame (210) and blades (220), wherein the side frame (210) is arranged on the side of the box body (110), and a plurality of blades (220) are arranged, and the plurality of blades (220) are rotatably arranged in the side frame (210) and are mutually transmission-connected.

2. A computer hardware cooling structure according to claim 1, characterized in that: A dustproof screen plate (180) is arranged on the top of the box body (110), and the dustproof screen plate (180) is also arranged on the other side of the box body (110).

3. A computer hardware cooling structure according to claim 2, characterized in that: A cooling fan (190) is installed inside the box body (110), and the cooling fan (190) is close to the dustproof screen plate (180).

4. A computer hardware cooling structure according to claim 1, characterized in that: The circulation pipeline (150) comprises a coil (151) and a straight pipe (152); the coil (151) is attached to the mesh back plate (120); and the straight pipe (152) connects the coil (151) and the circulation pump (130).

5. A computer hardware cooling structure according to claim 1, characterized in that: A plurality of sockets (112) are provided on one side of the box body (110), and the sockets (112) are close to the mesh back plate (120).

6. A computer hardware cooling structure according to claim 1, characterized in that: The end of the blade (220) is provided with a rotating shaft (221) and is fixedly sleeved with a gear (222), and a plurality of the gears (222) are meshed with each other.

7. A computer hardware cooling structure according to claim 6, characterized in that: A rotating shaft (221) rotatably passes through the side frame (210) and is fixedly connected to a knob. The side frame (210) is provided with a cavity (212), and the gear (222) is located in the cavity (212).

8. A computer hardware cooling structure according to claim 1, characterized in that: A dustproof mesh plate (230) is provided inside the side frame (210), and the dustproof mesh plate (230) is located between the box body (110) and the blade (220).

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