Semiconductor device

Abstract

The utility model provides semiconductor equipment which comprises two reaction chambers and two gas pipeline devices, and the two reaction chambers are communicated through the two gas pipeline devices. The gas pipeline device comprises a fixing plate and at least one pipeline body, the fixing plate is arranged on the outer side of the reaction chamber, at least one mounting hole penetrating through the fixing plate is formed in the fixing plate, one end of the pipeline body is connected with the mounting hole in the first side of the fixing plate, and the other end of the pipeline body is communicated with the reaction chamber; the mounting holes in the second sides of the fixing plates of the two gas pipeline devices are oppositely arranged; at least one horizontal adjusting device is further arranged on the fixing plate of at least one gas pipeline device and used for adjusting the horizontal position of the fixing plate so that the mounting holes in the second sides of the two fixing plates can be aligned with each other. According to the utility model, the horizontal butt joint of the two gas pipeline devices is adjusted through the horizontal adjusting device, so that the sealing performance of gas pipeline connection is improved, the problem that the reaction chamber is polluted due to leakage is avoided, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a semiconductor equipment. Background Art

[0002] Chemical vapor deposition is a process that uses some additional energy to grow ideal thin films in a reaction chamber under high vacuum and pure reaction gas environment. With the continuous improvement of process nodes, the requirements for the vacuum degree of the reaction chamber and the purity of the gas are also increasing.

[0003] At present, the air tightness of the reaction chamber is insufficient, which makes the reaction chamber easily contaminated by impurity gases. Utility Model Content

[0004] The utility model aims to provide a semiconductor device, which enables two gas pipeline devices to be horizontally butted together through a horizontal adjustment device, thereby improving the sealing performance of the connection of the gas pipeline devices.

[0005] In order to solve the above technical problems, the utility model provides a semiconductor device, comprising: two reaction chambers and two gas pipeline devices respectively arranged on the two reaction chambers, the two reaction chambers are connected through the two gas pipeline devices; the gas pipeline device comprises a fixing plate and at least one pipeline body, the fixing plate is arranged outside the reaction chamber, the fixing plate is provided with at least one mounting hole penetrating the first side and the second side of the fixing plate, one end of the pipeline body is connected to the mounting hole on the first side of the fixing plate, and the other end of the pipeline body is connected to the reaction chamber; the mounting holes on the second sides of the fixing plates of the two gas pipeline devices are arranged opposite to each other; at least one horizontal adjustment device is also provided on the fixing plate of at least one of the gas pipeline devices, which is used to adjust the horizontal position of the fixing plate so that the mounting holes on the second sides of the two fixing plates are aligned with each other.

[0006] Optionally, the mounting holes on the second side of the fixing plates of the two gas pipeline devices are connected via a sealing ring.

[0007] Optionally, a plurality of level adjustment devices are provided on a fixing plate of at least one of the gas pipeline devices, and the level adjustment devices on the same gas pipeline device are symmetrically arranged.

[0008] Optionally, the horizontal adjustment device includes a screw rod threadedly connected to one of the fixed plates and a motor controlling the rotation of the screw rod, and the relative position of the fixed plate threadedly connected to the screw rod on the screw rod is adjusted by rotating the screw rod, thereby adjusting the relative position of the two fixed plates.

[0009] Optionally, a first extension portion is provided on an edge of one of the fixing plates, and the screw rod is threadedly connected to the first extension portion.

[0010] Optionally, a first through hole with an internal thread is provided on the first extension portion, and the external thread on the screw rod is screwed with the internal thread of the first through hole.

[0011] Optionally, a second extension portion corresponding to the first extension portion is provided on an edge of another of the fixing plates, a second through hole is provided on the second extension portion, the screw rod passes through the second through hole, and a diameter of the second through hole is greater than a diameter of the screw rod.

[0012] Optionally, the semiconductor device further includes a motor controller, and the motor controller is used to control the motor to adjust the rotation of the lead screw according to the adjustment information.

[0013] Optionally, the semiconductor device further includes a gas analyzer, which measures the concentration of impurity gas in the reaction chamber to determine the adjustment information and transmits it to the motor controller.

[0014] Optionally, the diameter of the pipe body is 1 / 4 inch, 3 / 8 inch, 1 / 2 inch or 3 / 4 inch.

[0015] Compared with the prior art, the semiconductor device provided by the utility model includes two reaction chambers and two gas pipeline devices respectively arranged on the two reaction chambers, and the two reaction chambers are connected through the two gas pipeline devices; the gas pipeline device includes a fixed plate and at least one pipeline body, the fixed plate is arranged outside the reaction chamber, and the fixed plate is provided with at least one mounting hole penetrating the first side and the second side of the fixed plate, one end of the pipeline body is connected to the mounting hole on the first side of the fixed plate, and the other end of the pipeline body is connected to the reaction chamber; the mounting holes on the second side of the two fixed plates are arranged oppositely; at least one fixed plate of at least one gas pipeline device is also provided with at least one horizontal adjustment device for adjusting the horizontal position of the fixed plate so that the mounting holes on the second side of the two fixed plates are aligned with each other. In the utility model, the horizontal position of the fixed plate is adjusted by arranging a horizontal adjustment device on the fixed plate so that the mounting holes on the second side of the two fixed plates are aligned with each other, so that the two gas pipeline devices are horizontally docked, thereby improving the sealing of the connection of the gas pipeline device, avoiding the pollution of the reaction chamber due to leakage, resulting in the problem of substandard process parameters, and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0017] Figure 1 It is a schematic diagram of a semiconductor device provided by an embodiment of the utility model.

[0018] Figure 2 It is a schematic diagram of a semiconductor device provided by another embodiment of the utility model.

[0019] Description of reference numerals:

[0020] 10, 30-gas pipeline device; 11-fixing plate; 12-pipeline body; 110-mounting hole; 112-first extension portion; 114-second extension portion; 20-horizontal adjustment device; 21-screw rod; 22-motor; 31-fixing plate; 32-pipeline body; 310-mounting hole; 40-sealing ring. DETAILED DESCRIPTION

[0021] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0022] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, unless the content clearly indicates otherwise. As used in the present invention, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise. As used in the present invention, the term "several" is generally used in a sense that includes "at least one", unless the content clearly indicates otherwise. As used in the present invention, the term "at least two" is generally used in a sense that includes "two or more", unless the content clearly indicates otherwise. In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features.

[0023] The connection method between two reaction chambers in the related art is to dock two gas pipeline modules respectively arranged on the two reaction chambers to achieve the sealing requirement. However, since the gas pipeline modules are installed on the reaction chambers, the two gas pipeline modules cannot be guaranteed to be completely docked together horizontally to achieve the ideal sealing requirement. If they cannot be docked horizontally, the connection between the two gas pipeline modules will leak, causing contamination in the reaction chamber, resulting in substandard process parameters.

[0024] Figure 1 This is a schematic diagram of the structure of a semiconductor device provided by an embodiment of the utility model. Figure 1 As shown, the semiconductor device provided in this embodiment includes: two reaction chambers (not shown) and two gas pipeline devices 10 and 30 respectively arranged on the two reaction chambers, and the two reaction chambers are connected through the two gas pipeline devices 10 and 30; one of the gas pipeline devices 10 includes a fixing plate 11 and at least one pipeline body 12, the fixing plate 11 is arranged outside one of the reaction chambers, and the fixing plate 11 is provided with at least one mounting hole 110 that passes through the first side and the second side of the fixing plate 11, one end of the pipeline body 12 is connected to the mounting hole 110 on the first side of the fixing plate 11, and the other end of the pipeline body 12 is connected to the reaction chamber; another gas pipeline device 30 includes a fixing plate 31 and at least one pipeline body 32, the fixing plate 31 is arranged outside the other reaction chamber, and the fixing plate At least one mounting hole 310 is provided on the fixing plate 31, which passes through the first side and the second side of the fixing plate 31; one end of the pipe body 32 is connected to the mounting hole 310 on the first side of the fixing plate 31, and the other end of the pipe body 32 is connected to the reaction chamber; the mounting holes on the second side of the fixing plates of the two gas pipeline devices are arranged relatively to each other; at least one horizontal adjustment device 20 is also provided on the fixing plate 11 of the gas pipeline device 10, which is used to adjust the horizontal position of the fixing plate 11 so that the mounting holes 310 on the fixing plate 31 and the mounting holes 110 on the second side of the fixing plate 11 are aligned with each other; and / or, at least one horizontal adjustment device 20 can also be provided on the fixing plate 31 of another gas pipeline device 30, which is used to adjust the horizontal position of the fixing plate 31 so that the mounting holes 310 on the fixing plate 31 and the mounting holes 110 on the second side of the fixing plate 11 are aligned with each other.

[0025] In the utility model, a horizontal adjustment device 20 is provided on the fixed plate 11 of the gas pipeline device 10 to adjust the horizontal position of the fixed plate 11, and / or a horizontal adjustment device 20 is provided on the fixed plate 31 of the gas pipeline device 30 to adjust the horizontal position of the fixed plate 31, so that the mounting holes on the second sides of the two fixed plates are aligned with each other, so that the two fixed plates are horizontally docked, and thus the two gas pipeline devices are horizontally docked, thereby improving the sealing of the connection between the gas pipeline devices, avoiding the problem of non-compliance of process parameters due to contamination of the reaction chamber caused by leakage, and improving the product yield.

[0026] In an embodiment of the present invention, the mounting holes on the second side of the two fixing plates are connected via a sealing ring 40. The sealing ring can increase the air tightness between the mounting holes to prevent gas leakage.

[0027] Figure 2 It is a schematic diagram of a semiconductor device provided by another embodiment of the utility model. Figure 2 Only three pipeline bodies 12 and three pipeline bodies 32 are shown. In other embodiments, the gas pipeline device may also include one, two or more than three pipeline bodies, which is not limited in the present invention.

[0028] In one embodiment of the utility model, a plurality of level adjustment devices 20 may be provided on the fixing plate 11 and / or the fixing plate 31, and the plurality of level adjustment devices 20 are symmetrically arranged on the fixing plate. Figure 2 As shown, two horizontal adjustment devices 20 are provided on the fixed plate 11, and the two horizontal adjustment devices 20 are provided on two opposite sides of the fixed plate 11, so that the horizontal degree of the fixed plate 11 can be adjusted from multiple directions and positions, thereby improving the adjustment range of the fixed plate.

[0029] The horizontal adjustment device 20 includes a screw rod 21 threadedly connected to the fixed plate 11 and a motor 22 for controlling the rotation of the screw rod 21. The relative position of the fixed plate 11 threadedly connected to the screw rod 21 on the screw rod 21 is adjusted by rotating the screw rod 21, thereby adjusting the relative position of the two fixed plates 11. The horizontal position of the fixed plate can be adjusted more accurately through the motor and the screw rod. It should be known that there is no relative displacement between the screw rod 21 and the motor 22, that is, when the motor 22 drives the screw rod 21 to rotate, the screw rod 21 will not move in a direction away from or close to the motor 22. Specifically, a limit device can be set at both ends of the screw rod 21 to achieve this, so that the screw rod 21 only rotates in place, so that the relative position of the fixed plate 11 threadedly connected to the screw rod 21 on the screw rod 21 can be changed.

[0030] The motor 22 can be fixed on the reaction chamber, so that when the screw rod 21 is driven to rotate, the horizontal position of the fixed plate 11 can be changed. At the same time, the fixed plate 11 and the pipeline body 12 are sealed and movablely connected, or the fixed plate 11 can drive the pipeline column 12 and the reaction chamber to move relative to each other, so that the horizontal position of the fixed plate 11 can be changed.

[0031] The edge of the fixing plate 11 is provided with a first extension portion 112, and the screw rod 21 is threadedly connected to the first extension portion 112. Exemplarily, the first extension portion 112 is provided with a first through hole with an internal thread, and the external thread on the screw rod 21 is screwed with the internal thread of the first through hole. The screw rod is arranged outside the fixing plate for easy disassembly without affecting the alignment between the fixing plates.

[0032] Correspondingly, a second extension portion 114 corresponding to the first extension portion 112 is provided at the edge of the fixing plate 31, and a second through hole is provided on the second extension portion 114. The screw rod 21 passes through the second through hole and the diameter of the second through hole is larger than the diameter of the screw rod 21. Therefore, under the premise of not affecting the screw rod to adjust the fixing plate 11 to be horizontal and keeping the fixing plate 31 stationary, the movement of the other end of the screw rod can be limited to prevent the screw rod from being offset in the horizontal direction parallel to the fixing plate.

[0033] The motor 22 drives the screw rod 21 to rotate, and the screw rod 21 rotates to adjust the relative position of the fixing plate 11 on the screw rod 21 , thereby adjusting the relative position of the fixing plate 11 and the fixing plate 31 .

[0034] In another embodiment of the utility model, the horizontal adjustment device 20 can be provided on both the fixing plate 11 and the fixing plate 31. For example, a horizontal adjustment device is provided on each of the fixing plate 11 and the fixing plate 31, and on one side of the two fixing plates, a screw rod 21 in one horizontal adjustment device 20 is threadedly connected to the fixing plate 11 and passes through a through hole on the extension portion of the fixing plate 31; and on the other side of the two fixing plates, a screw rod 21 in another horizontal adjustment device 20 is threadedly connected to the fixing plate 31 and passes through a through hole on the extension portion of the fixing plate 11.

[0035] In one embodiment of the utility model, the semiconductor device also includes a motor controller (not shown), which is used to control the motor to adjust the rotation of the screw rod according to adjustment information. The adjustment information can be manually input or automatically generated after detecting and analyzing the leakage situation.

[0036] The semiconductor device further includes a gas analyzer, which introduces gas into the reaction chamber at the position of the fixed plate 11 or the fixed plate 31. The gas analyzer measures the concentration of the impurity gas in the reaction chamber to determine the adjustment information and transmits it to the motor controller, and the motor controller obtains the adjustment information of the screw rod 21 according to the concentration of the impurity gas. It can be understood that the gas analyzer measures the impurity gas near the pipeline body 12 in the reaction chamber, and then determines the leakage position of the impurity gas, the concentration of the impurity gas and the concentration change, so as to determine the adjustment position and the number of steps and direction of the adjustment. The impurity gas is, for example, helium.

[0037] Exemplarily, the gas analyzer measures the leakage position, concentration and concentration change of the impurity gas in the reaction chamber, converts it into adjustment information such as the position and number of steps, and transmits it to the motor controller. The motor controller controls the motor 22 to adjust the rotation of the screw 21 according to the adjustment information, thereby adjusting the relative position of the fixed plate 11 and the fixed plate 31. By adjusting the relative positions of the two fixed plates, when the concentration of the impurity gas in the reaction chamber no longer changes, it means that the mounting holes 110 on the second sides of the two fixed plates are aligned with each other, so that the two gas pipeline devices 10 are horizontally docked, thereby improving the sealing of the connection of the gas pipeline device 10, avoiding the problem of substandard process parameters caused by the contamination of the reaction chamber due to leakage, and improving the product yield.

[0038] In one embodiment of the present invention, the diameter of the pipe body 12 is 1 / 4 inch, 3 / 8 inch, 1 / 2 inch or 3 / 4 inch, but is not limited thereto. In this embodiment, the diameter of the pipe body 12 is, for example, 1 / 4 inch.

[0039] In summary, the semiconductor device provided by the utility model includes two reaction chambers and two gas pipeline devices respectively arranged on the two reaction chambers, and the two reaction chambers are connected through the two gas pipeline devices; the gas pipeline device includes a fixed plate and at least one pipeline body, the fixed plate is arranged outside the reaction chamber, and the fixed plate is provided with at least one mounting hole penetrating the first side and the second side of the fixed plate, one end of the pipeline body is connected to the mounting hole on the first side of the fixed plate, and the other end of the pipeline body is connected to the reaction chamber; the mounting holes on the second side of the two fixed plates are arranged oppositely; at least one fixed plate of at least one gas pipeline device is also provided with at least one horizontal adjustment device for adjusting the horizontal position of the fixed plate so that the mounting holes on the second side of the two fixed plates are aligned with each other. In the utility model, the horizontal position of the fixed plate is adjusted by arranging a horizontal adjustment device on the fixed plate so that the mounting holes on the second side of the two fixed plates are aligned with each other, so that the two gas pipeline devices are horizontally docked, thereby improving the sealing of the connection of the gas pipeline device, avoiding the problem of the reaction chamber being contaminated due to leakage and causing the process parameters to fail to meet the standards, and improving the product yield.

[0040] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A semiconductor device, characterized in that: include: Two reaction chambers are connected to two gas pipeline devices respectively arranged on the two reaction chambers, and the two reaction chambers are connected through the two gas pipeline devices; the gas pipeline device comprises a fixing plate and at least one pipeline body, the fixing plate is arranged outside the reaction chamber, and at least one mounting hole penetrating the first side and the second side of the fixing plate is arranged on the fixing plate, one end of the pipeline body is connected to the mounting hole on the first side of the fixing plate, and the other end of the pipeline body is connected to the reaction chamber; the mounting holes on the second sides of the fixing plates of the two gas pipeline devices are arranged opposite to each other; at least one horizontal adjustment device is also arranged on the fixing plate of at least one gas pipeline device, which is used to adjust the horizontal position of the fixing plate so that the mounting holes on the second sides of the two fixing plates are aligned with each other.

2. The semiconductor device according to claim 1, wherein: The mounting holes on the second sides of the fixing plates of the two gas pipeline devices are connected via a sealing ring.

3. The semiconductor device according to claim 1, wherein: A plurality of level adjustment devices are arranged on a fixing plate of at least one of the gas pipeline devices, and the level adjustment devices on the same gas pipeline device are arranged symmetrically.

4. The semiconductor device according to any one of claims 1 to 3, characterized in that: The horizontal adjustment device includes a screw threadedly connected to one of the fixing plates and a motor for controlling the rotation of the screw thread. The relative position of the fixing plate threadedly connected to the screw threadedly is adjusted on the screw threadedly by rotating the screw threadedly, thereby adjusting the relative position of the two fixing plates.

5. The semiconductor device according to claim 4, characterized in that A first extension portion is disposed on an edge of one of the fixing plates, and the screw rod is threadedly connected to the first extension portion.

6. The semiconductor device according to claim 5, characterized in that The first extension portion is provided with a first through hole with an internal thread, and the external thread on the screw rod is screwed with the internal thread of the first through hole.

7. The semiconductor device according to claim 5, characterized in that A second extension portion corresponding to the first extension portion is disposed on the edge of the other fixing plate, a second through hole is disposed on the second extension portion, the screw rod passes through the second through hole, and the diameter of the second through hole is greater than the diameter of the screw rod.

8. The semiconductor device according to claim 4, wherein: The semiconductor device further includes a motor controller, which is used to control the motor to adjust the rotation of the lead screw according to the adjustment information.

9. The semiconductor device according to claim 8, characterized in that The semiconductor device further includes a gas analyzer, which measures the concentration of impurity gas in the reaction chamber to determine the adjustment information and transmits the adjustment information to the motor controller.

10. The semiconductor device according to claim 4, wherein: The pipe body has a diameter of 1 / 4 inch, 3 / 8 inch, 1 / 2 inch or 3 / 4 inch.

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