Automobile B column inner plate stamping device

Abstract

The utility model relates to the technical field of stamping devices, and discloses an automobile B column inner plate stamping device which comprises a mounting plate and is characterized in that a stamping mechanism is arranged at the top of the mounting plate, a buffer mechanism is arranged at the top of the mounting plate, and the stamping mechanism comprises an ejection assembly and a stamping assembly. The ejection assembly is arranged at the top of the mounting plate, the stamping assembly is arranged at the top of the mounting plate, and the ejection assembly comprises a lower die. According to the automobile B column inner plate stamping device, in the using process, an upper die descends to drive a limiting plate to slide in a sliding groove of a connecting frame, so that the connecting frame cannot be affected when the upper die descends, after stamping is completed, the upper die ascends, the connecting frame is pulled up through the limiting plate, and then an ejection block can be pushed out through the connecting frame; and a plate is ejected out through the ejection block, so that the plate can be automatically ejected out after stamping is completed, the plate can be prevented from being clamped in the lower die, and the working efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of stamping devices, in particular to a stamping device for an inner plate of a B-pillar of an automobile. Background Art

[0002] The inner panel of the automobile B-pillar is an important automobile component. It is located between the front seat and the rear seat in the car cockpit and extends from the roof to the bottom of the car. During the processing, the inner panel of the automobile B-pillar is stamped by the upper mold and the lower mold to stamp the plate into shape.

[0003] In the prior art, when the upper die and the lower die cooperate to stamp the sheet, the sheet will be squeezed, and the sheet will remain in the lower die after stamping. Since the stamping force is large, it will be difficult to remove the sheet when it is stuck in the lower die. When the sheet is removed with the help of tools, it is easy to cause damage to the sheet. Therefore, it is necessary to improve a stamping device for the inner panel of the automobile B-pillar to solve the above problem. Utility Model Content

[0004] The utility model aims to provide a punching device for an inner plate of a B-pillar of an automobile, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a vehicle B-pillar inner panel stamping device, comprising a mounting plate, a stamping mechanism is arranged on the top of the mounting plate, and a buffer mechanism is arranged on the top of the mounting plate.

[0006] The punching mechanism comprises an ejection assembly and a punching assembly, wherein the ejection assembly is arranged on the top of the mounting plate, and the punching assembly is arranged on the top of the mounting plate.

[0007] Preferably, the ejection assembly includes a lower mold, the lower mold is fixedly connected to the top of the mounting plate, a connecting plate is slidably connected to the interior of the lower mold, a first spring is fixedly connected between the connecting plate and the lower mold, an ejection block is fixedly connected to the top of the connecting plate, the ejection block is slidably connected to the interior of the lower mold, and a connecting frame is fixedly connected to the top of the connecting plate. After the stamping of the lower mold and the upper mold is completed, the ejection block can be driven by the connecting frame to eject the plate, and the plate does not need to be taken out manually with the help of tools.

[0008] Preferably, the lower mold is provided with sliding grooves at corresponding positions of the ejector block and the connecting plate, and the connecting plate and the ejector block slide in the sliding grooves respectively, and the ejector block and the connecting plate are limited by the sliding grooves to prevent the ejector block and the connecting plate from moving and offsetting, thereby ensuring the accuracy of the position.

[0009] Preferably, the stamping assembly includes a support frame, which is fixedly connected to the top of the mounting plate, a hydraulic telescopic rod is fixedly connected to the interior of the support frame, an upper mold is fixedly connected to the bottom of the hydraulic telescopic rod, a limit plate is fixedly connected to the left and right sides of the upper mold, the limit plate is slidably connected to the interior of the connecting frame, a slider is fixedly connected to the back of the upper mold, and the slider is slidably connected to the interior of the support frame, the upper mold is driven downward by the hydraulic telescopic rod, and the upper mold cooperates with the lower mold to stamp the sheet material with high precision.

[0010] Preferably, the support frame is provided with a slide groove at a corresponding position of the slider, and the slider slides inside the slide groove, and the slide groove is used to limit the slider, so that the position of the upper mold can be stabilized by the slider to prevent the upper mold from shifting, so that the upper mold and the lower mold can be accurately matched.

[0011] Preferably, the connecting frame is provided with a slide groove at a corresponding position of the limit plate, and the limit plate slides inside the slide groove. By sliding the limit plate in the slide groove, the plate can be ejected while the upper mold rises, thereby achieving a linkage effect and improving the processing efficiency of the plate.

[0012] Preferably, the buffer mechanism includes a hollow cylinder, which is fixedly connected to the top of the mounting plate, a slide plate is slidably connected inside the hollow cylinder, a damping block is fixedly connected between the slide plate and the hollow cylinder, a second spring is fixedly connected between the slide plate and the hollow cylinder, a sliding column is fixedly connected to the top of the slide plate, and a rubber pad is fixedly connected to the top of the sliding column. The rubber pad buffers the downward impact force of the upper mold so that it slowly cooperates with the lower mold, thereby ensuring the stamping accuracy while protecting the device and extending its service life.

[0013] Preferably, the hollow cylinder is provided with a limiting groove at a corresponding position of the slide, and the slide slides inside the limiting groove. The slide is limited by the slide groove so that the slide slides inside the slide groove, thereby preventing the slide from sliding and getting stuck, and ensuring smooth movement of the slide.

[0014] Compared with the prior art, the utility model provides a vehicle B-pillar inner panel stamping device, which has the following beneficial effects:

[0015] 1. The automobile B-pillar inner panel stamping device, during use, drives the limit plate to slide inside the slide groove of the connecting frame by descending the upper mold, so that the connecting frame will not be affected when the upper mold descends. After the stamping is completed, the upper mold rises and pulls up the connecting frame through the limit plate, and the ejection block can be pushed out through the connecting frame, and the plate can be ejected through the ejection block, so that the plate can be automatically ejected after the stamping is completed, and the plate can be prevented from being stuck in the lower mold, which effectively improves the work efficiency.

[0016] 2. During use, the automobile B-pillar inner panel stamping device drives the slider to contact the rubber pad when the upper mold is lowered, so that the damping block and the second spring absorb the impact of the upper mold descending, so that the upper mold slowly cooperates with the lower mold, so that the upper mold and the lower mold can be accurately matched, and the device can be protected from impact damage and the service life can be extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative labor:

[0018] Figure 1 This is a schematic diagram of the appearance structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the ejector assembly of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the punching assembly of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the buffer mechanism of the utility model;

[0022] Figure 5 It is a schematic cross-sectional structure diagram of the buffer mechanism of the utility model.

[0023] In the figure: 1. mounting plate; 2. stamping mechanism; 21. ejector assembly; 211. lower mold; 212. connecting plate; 213. first spring; 214. ejector block; 215. connecting frame; 22. stamping assembly; 221. support frame; 222. hydraulic telescopic rod; 223. upper mold; 224. limit plate; 225. slider; 3. buffer mechanism; 31. hollow cylinder; 32. slide plate; 33. damping block; 34. second spring; 35. sliding column; 36. rubber pad. DETAILED DESCRIPTION

[0024] See also Figure 1-5 The utility model provides a technical solution: a stamping device for an inner panel of a B-pillar of an automobile, comprising a mounting plate 1, a stamping mechanism 2 is arranged on the top of the mounting plate 1, and a buffer mechanism 3 is arranged on the top of the mounting plate 1.

[0025] In this embodiment, the stamping mechanism 2 includes an ejection assembly 21 and a stamping assembly 22. The ejection assembly 21 is arranged on the top of the mounting plate 1, and the stamping assembly 22 is arranged on the top of the mounting plate 1. The ejection assembly 21 includes a lower mold 211, and the lower mold 211 is fixedly connected to the top of the mounting plate 1. A connecting plate 212 is slidably connected inside the lower mold 211, and a first spring 213 is fixedly connected between the connecting plate 212 and the lower mold 211. An ejection block 214 is fixedly connected to the top of the connecting plate 212, and the ejection block 214 is slidably connected to the inside of the lower mold 211. The top is fixedly connected with a connecting frame 215. After the lower mold 211 and the upper mold 223 are stamped, the ejection block 214 can be driven by the connecting frame 215 to eject the plate, without the need for manual tools to take out the plate. The lower mold 211 is provided with a slide groove at the corresponding position of the ejection block 214 and the connecting plate 212, and the connecting plate 212 and the ejection block 214 slide in the slide groove respectively. The ejection block 214 and the connecting plate 212 are limited by the slide groove to prevent the ejection block 214 and the connecting plate 212 from moving and deviating, thereby ensuring the accuracy of the position. The stamping assembly 22 includes a support frame 221, a support frame 222, and a support frame 223. 21 is fixedly connected to the top of the mounting plate 1, the support frame 221 is fixedly connected to the inside of the hydraulic telescopic rod 222, the bottom of the hydraulic telescopic rod 222 is fixedly connected to the upper mold 223, the left and right sides of the upper mold 223 are fixedly connected to the limit plate 224, the limit plate 224 is slidably connected to the inside of the connecting frame 215, the back of the upper mold 223 is fixedly connected to the slider 225, the slider 225 is slidably connected to the inside of the support frame 221, the upper mold 223 is pressed down by the hydraulic telescopic rod 222, and the upper mold 223 cooperates with the lower mold 211 to stamp the plate with high precision. The support frame 221 is provided with a slide groove at the corresponding position of the slider 225, and the slider 225 slides inside the slide groove, and the slider 225 is limited by the slide groove, so that the position of the upper mold 223 can be stabilized by the slider 225 to prevent the upper mold 223 from shifting, so that the upper mold 223 and the lower mold 211 can be accurately matched, and the connecting frame 215 is provided with a slide groove at the corresponding position of the limiting plate 224, and the limiting plate 224 slides inside the slide groove. By sliding the limiting plate 224 in the slide groove, the plate can be ejected while the upper mold 223 rises, thereby realizing a linkage effect and higher processing efficiency of the plate.

[0026] In this embodiment, the buffer mechanism 3 includes a hollow cylinder 31, which is fixedly connected to the top of the mounting plate 1. A slide plate 32 is slidably connected inside the hollow cylinder 31. A damping block 33 is fixedly connected between the slide plate 32 and the hollow cylinder 31. A second spring 34 is fixedly connected between the slide plate 32 and the hollow cylinder 31. A sliding column 35 is fixedly connected to the top of the slide plate 32. A rubber pad 36 is fixedly connected to the top of the sliding column 35. The rubber pad 36 buffers the downward pressure impact force of the upper mold 223 so that it slowly cooperates with the lower mold 211, thereby ensuring the stamping accuracy and protecting the device to extend its service life. A limiting groove is provided at the corresponding position of the slide plate 32 in the hollow cylinder 31, and the slide plate 32 slides inside the limiting groove. The slide plate 32 is limited by the slide groove so that the slide plate 32 slides inside the slide groove to prevent the slide plate 32 from sliding and getting stuck, thereby ensuring smooth movement of the slide plate 32.

[0027] In actual operation, when the device is used, the hydraulic telescopic rod 222 pushes the upper mold 223 to descend, and the upper mold 223 drives the limit plate 224 and the slider 225 to descend at the same time, and then the slider 225 first contacts the rubber pad 36, the rubber pad 36 drives the sliding column 35, the sliding column 35 drives the slide plate 32, the slide plate 32 compresses the damping block 33 and the second spring 34, and the damping block 33 and the second spring 34 absorb the impact of the slider 225 descending, and then the upper mold 223 cooperates with the lower mold 211 to press the plate The stamping is carried out. After the stamping is completed, the hydraulic telescopic rod 222 drives the upper mold 223 to rise. At the same time, the limit plate 224 slides inside the slide groove of the connecting frame 215. After reaching the top of the slide groove, it continues to rise, and it will drive the connecting frame 215 through the limit plate 224. The connecting frame 215 pulls the connecting plate 212, and the connecting plate 212 drives the ejection block 214 to extend, and at the same time compresses the first spring 213. The ejection block 214 extends to eject the stamped sheet. The first spring 213 is used to reset the connecting plate 212.

Claims

1. A vehicle B-pillar inner panel stamping device, comprising a mounting plate (1), characterized in that: A stamping mechanism (2) is provided on the top of the mounting plate (1), and a buffer mechanism (3) is provided on the top of the mounting plate (1); The punching mechanism (2) comprises an ejection assembly (21) and a punching assembly (22), wherein the ejection assembly (21) is arranged on the top of the mounting plate (1), and the punching assembly (22) is arranged on the top of the mounting plate (1); The ejection assembly (21) comprises a lower mold (211), the lower mold (211) is fixedly connected to the top of the mounting plate (1), a connecting plate (212) is slidably connected inside the lower mold (211), a first spring (213) is fixedly connected between the connecting plate (212) and the lower mold (211), an ejection block (214) is fixedly connected to the top of the connecting plate (212), the ejection block (214) is slidably connected to the inside of the lower mold (211), and a connecting frame (215) is fixedly connected to the top of the connecting plate (212).

2. The automobile B-pillar inner panel stamping device according to claim 1, characterized in that: The lower mold (211) is provided with sliding grooves at corresponding positions of the ejection block (214) and the connecting plate (212), and the connecting plate (212) and the ejection block (214) slide inside the sliding grooves respectively.

3. The automobile B-pillar inner panel stamping device according to claim 1, characterized in that: The punching assembly (22) comprises a support frame (221), the support frame (221) is fixedly connected to the top of the mounting plate (1), a hydraulic telescopic rod (222) is fixedly connected inside the support frame (221), an upper mold (223) is fixedly connected to the bottom of the hydraulic telescopic rod (222), a limit plate (224) is fixedly connected to the left and right sides of the upper mold (223), the limit plate (224) is slidably connected to the inside of the connecting frame (215), and a slider (225) is fixedly connected to the back of the upper mold (223), and the slider (225) is slidably connected to the inside of the support frame (221).

4. The automobile B-pillar inner panel stamping device according to claim 3, characterized in that: The support frame (221) is provided with a sliding groove at a position corresponding to the sliding block (225), and the sliding block (225) slides inside the sliding groove.

5. The automobile B-pillar inner panel stamping device according to claim 3, characterized in that: The connection frame (215) is provided with a sliding groove at a position corresponding to the limiting plate (224), and the limiting plate (224) slides inside the sliding groove.

6. The automobile B-pillar inner panel stamping device according to claim 1, characterized in that: The buffer mechanism (3) comprises a hollow cylinder (31), the hollow cylinder (31) is fixedly connected to the top of the mounting plate (1), a slide plate (32) is slidably connected inside the hollow cylinder (31), a damping block (33) is fixedly connected between the slide plate (32) and the hollow cylinder (31), a second spring (34) is fixedly connected between the slide plate (32) and the hollow cylinder (31), a sliding column (35) is fixedly connected to the top of the slide plate (32), and a rubber pad (36) is fixedly connected to the top of the sliding column (35).

7. The automobile B-pillar inner panel stamping device according to claim 6, characterized in that: The hollow cylinder (31) is provided with a limiting groove at a position corresponding to the slide plate (32), and the slide plate (32) slides inside the limiting groove.

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