Circuit board electroplating machine capable of improving purity of copper plate

Abstract

The utility model discloses a circuit board electroplating machine capable of improving the purity of a copper plate, which comprises a cleaning pool, and an electroplating pool is fixed on the right side of the cleaning pool; vertical plates are fixed to the upper end faces of the outer sides of the cleaning pool and the electroplating pool, the upper ends of the vertical plates are fixed to a mounting box, meanwhile, a servo motor is fixed to the left side of the mounting box through bolts, and the output end of the servo motor is fixed to a reciprocating lead screw; the right end of the reciprocating lead screw is in bearing connection with the inner wall of the right side of the mounting box, and meanwhile the outer side face of the reciprocating lead screw is in threaded connection with a sliding block. The electroplating machine for the circuit board capable of improving the purity of the copper plate not only achieves the effect of cleaning dust on the surface of the circuit board so as to prevent the dust attached to the surface of the circuit board from influencing the electroplating effect, so that the purity and the quality of a copper plating layer are better, and the copper plating layer is more tightly attached to the circuit board; and the circuit board can be conveniently fed into an electroplating pool for electroplating, and meanwhile, the circuit board can be conveniently clamped and fixed.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating machines, in particular to an electroplating machine for circuit boards which can improve the purity of copper plates. Background Art

[0002] In the process of circuit board production, copper needs to be plated on the circuit board by electroplating. After the circuit board is fixed by using the electroplating device, the circuit board is sent into the electroplating pool by the cylinder lifting, so as to achieve the electroplating effect. For example, in the patent number "CN220767223U" and the patent name "A circuit board electroplating device", the electroplating electric cylinder drives the electric cylinder telescopic rod to slide, the sliding of the electric cylinder telescopic rod drives the electroplating slider to slide, the sliding of the electroplating slider drives the starting gear to slide, the starting gear slides to the starting rack position to drive the starting gear to rotate, the starting gear rotation drives the starting shaft rotation, the starting shaft rotation drives the connecting gear rotation, the connecting gear rotation drives the meshing vibration gear rotation, the vibration gear rotation drives the vibration shaft rotation, the vibration shaft rotation drives the vibration cam rotation, the vibration cam rotation drives the slide block to slide, the slide block slides and drives the vibration slide to slide, the electroplating hook hangs the circuit board, the vibration slide slide slides and drives the electroplating hook to slide, the vibration slide slide drives the vibration spring to expand and contract, so as to vibrate the excess water of the circuit board. However, the above structure still has the following problems in actual use:

[0003] The above structure drives the telescopic rod of the electric cylinder to slide through the electroplating electric cylinder, and then sends the circuit board into the electroplating tank for electroplating. However, the circuit board will inevitably be contaminated with dust during the transportation and packing process, and the above structure electroplates the circuit board without cleaning the circuit board. The dust attached to the surface of the circuit board will inevitably affect the purity and quality of the copper plating layer, and it is also easy to cause the copper plating layer to not fit tightly enough.

[0004] Therefore, we proposed a circuit board electroplating machine that can improve the purity of copper plates and can solve the above problems well. Utility Model Content

[0005] The utility model aims to provide a circuit board electroplating machine capable of improving the purity of copper plates, so as to solve the problem raised by the above-mentioned background technology that the circuit boards are electroplated without being cleaned in the current market, so that the dust attached to the surface of the circuit boards will inevitably affect the purity and quality of the copper plating layer, and also easily lead to the phenomenon that the copper plating layer is not tightly attached.

[0006] To achieve the above object, the utility model provides the following technical solution: a circuit board electroplating machine capable of improving the purity of a copper plate, comprising a cleaning tank, a plating tank being fixed to the right side of the cleaning tank;

[0007] It also includes: the upper end surfaces of the outer sides of the cleaning tank and the electroplating tank are both fixed with vertical plates, and the upper ends of the vertical plates are fixed to the installation box, and the left side of the installation box is bolted with a servo motor, and the output end of the servo motor is fixed to the reciprocating screw rod;

[0008] The right end of the reciprocating screw is connected to the right inner wall bearing of the mounting box, and the outer side of the reciprocating screw is threadedly connected to a sliding block, and the lower end bearing of the sliding block is connected to a sleeve, and the internal thread of the sleeve is connected to a threaded rod, and the lower end of the threaded rod is fixed to the upper surface of the connecting plate.

[0009] Preferably, a gear is fixed on the outer side surface of the sleeve, and the outer side surface of the gear is meshed with a gear block, and the gear block is fixed to the inner wall of the mounting box.

[0010] Preferably, the tooth blocks are provided in two groups, each group is provided with three sections, and the two groups of tooth blocks are distributed in a staggered manner.

[0011] Preferably, the tooth blocks are respectively fixed to the front and rear inner walls of the installation box, and there is a gap in the middle of each section of the tooth block.

[0012] Preferably, a telescopic rod is fixed to the upper end surface of the connecting plate, and the upper end of the telescopic rod is fixed to the lower surface of the sliding block.

[0013] Preferably, a bidirectional screw rod is arranged on the front side of the connecting plate, and the rear end of the bidirectional screw rod penetrates into the connecting plate and is connected to its bearing, and a clamping plate is threadedly connected to the outer side surface of the bidirectional screw rod.

[0014] Preferably, two groups of the clamping plates are provided, and an anti-sliding block is bonded to the inner side of the lower end of the clamping plate.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the circuit board electroplating machine that can improve the purity of the copper plate can not only achieve the effect of cleaning the dust on the surface of the circuit board, thereby preventing the dust attached to the surface of the circuit board from affecting the electroplating effect, so that the purity and quality of the copper plating layer are better, and the fit between the circuit board and the circuit board is tighter, and it is convenient to send the circuit board into the electroplating tank for electroplating, and it is also convenient to clamp and fix the circuit board. The specific contents are as follows:

[0016] Through the meshing between the gear and the tooth block, the gear moves and rotates at the same time, and also drives the sleeve to rotate together, so that the sleeve drives the threaded rod downward, so that the threaded rod drives the connecting plate downward together, so that the connecting plate drives the clamped circuit board into the cleaning tank for cleaning, so as to achieve the effect of cleaning the dust on the surface of the circuit board, thereby preventing the dust attached to the surface of the circuit board from affecting the effect of electroplating, so that the purity and quality of the copper plating are better, and the fit between the copper plating and the circuit board is more closely;

[0017] When the connecting plate descends, it also drives the telescopic rod to extend and retract, so that the connecting plate is limited, so that the connecting plate does not rotate, and then the sleeve can drive the threaded rod to move downward;

[0018] The servo motor drives the reciprocating screw to rotate, thereby driving the sliding block to move left and right, thereby driving the sleeve connected to the bearing on its lower end face to move together, thereby driving the connecting plate and the circuit board clamped by it to move from the cleaning tank to the electroplating tank;

[0019] When the sliding block continues to drive the sleeve to move to the right, the sleeve drives the gear to mesh with the tooth block on the rear side again, so that the sleeve rotates and drives the threaded rod downward again, so that the threaded rod drives the connecting plate and the circuit board clamped thereunder to move into the electroplating bath, and the electroplating effect is achieved through the electroplating bath;

[0020] By rotating the bidirectional screw rod, the bidirectional screw rod drives the two sets of clamps to approach each other, and then the clamps drive the anti-sliding block to contact the circuit board, thereby achieving the clamping effect. In addition, through the setting of the anti-sliding block, an anti-slip effect is achieved, which can make the clamping more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0022] Figure 2 This is a front structural schematic diagram of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the installation box of the utility model when viewed from above;

[0024] Figure 4 For this utility model Figure 3 The enlarged structural diagram at A in the middle;

[0025] Figure 5 This is a schematic diagram of the structure of the gear and sleeve connected in a bottom view of the utility model;

[0026] Figure 6 This is a bottom view of the structure of the connecting plate of the utility model;

[0027] Figure 7 This is a schematic diagram of the main structure of the connection between the sleeve and the sliding block of the utility model.

[0028] In the figure: 1. Cleaning tank; 2. Electroplating tank; 3. Installation box; 4. Servo motor; 5. Reciprocating screw; 6. Sliding block; 7. Sleeve; 8. Gear; 9. Tooth block; 10. Threaded rod; 11. Connecting plate; 12. Telescopic rod; 13. Bidirectional screw; 14. Clamp; 15. Anti-sliding block. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] See also Figure 1-Figure 7 , the utility model provides the following technical solutions:

[0031] Embodiment 1: In order to solve the problem in the prior art that the circuit board is electroplated without being cleaned, the dust attached to the surface of the circuit board will inevitably affect the purity and quality of the copper plating layer, and it is also easy to cause the copper plating layer to not be tightly attached, so the following scheme is disclosed, including a cleaning tank 1, and a plating tank 2 is fixed on the right side of the cleaning tank 1; and further comprising: a vertical plate is fixed on the upper end surface of the outer side of the cleaning tank 1 and the plating tank 2, and the upper end of the vertical plate is fixed to the installation box 3, and at the same time, the left side of the installation box 3 is fixed with a bolt A servo motor 4, and the output end of the servo motor 4 is fixed to the reciprocating screw 5; the right end of the reciprocating screw 5 is connected to the right inner wall bearing of the installation box 3, and at the same time, the outer side of the reciprocating screw 5 is threadedly connected to a sliding block 6, and the lower end bearing of the sliding block 6 is connected to a sleeve 7, and the inner thread of the sleeve 7 is connected to a threaded rod 10, and the lower end of the threaded rod 10 is fixed to the upper surface of the connecting plate 11, and a gear 8 is fixed to the outer side of the sleeve 7, and the outer side of the gear 8 is meshed with a tooth block 9, and the tooth block 9 is fixed to the inner wall of the installation box 3;

[0032] By starting the servo motor 4, the servo motor 4 drives the fixed reciprocating screw 5 to rotate, and the reciprocating screw 5 rotates, which drives the sliding block 6 to move to the right, and the sliding block 6 moves, which drives the sleeve 7 connected to the lower end bearing to move together, and the sleeve 7 moves, which drives the gear 8 to move together, so that the gear 8 is meshed with the rear side gear block 9. When the gear 8 continues to move, the gear 8 will rotate by meshing with the gear block 9, so that the gear 8 drives the sleeve 7 to rotate together, and the sleeve 7 rotates, so that it drives the threaded rod 10 downward, so that the threaded rod 10 drives the connecting plate 11 fixed at its lower end downward, so that the connecting plate 11 drives the clamped circuit board into the cleaning tank 1 for cleaning, so as to achieve the effect of cleaning the dust on the surface of the circuit board, thereby preventing the dust attached to the surface of the circuit board from affecting the electroplating effect, so that the purity and quality of the copper plating layer are better, and the fit between the copper plating layer and the circuit board is tighter, and when the connecting plate 11 descends, it will also drive the telescopic rod 12 to extend and retract. Through the setting of the telescopic rod 12, the connecting plate 11 is limited, so that the connecting plate 11 will not rotate, and then the sleeve 7 can drive the threaded rod 10 to move downward;

[0033] Embodiment 2: Different from Embodiment 1, this embodiment facilitates the feeding of the circuit board into the electroplating bath 2. Figure 1-Figure 5 , two groups of tooth blocks 9 are provided, and each group is provided with three sections, and the two groups of tooth blocks 9 are staggeredly distributed, the tooth blocks 9 are respectively fixed to the inner walls of the front and rear sides of the installation box 3, and there is a gap in the middle of each section of the tooth block 9, and a telescopic rod 12 is fixed to the upper end surface of the connecting plate 11, and the upper end of the telescopic rod 12 is fixed to the lower surface of the sliding block 6;

[0034] When the sliding block 6 continues to drive the sleeve 7 to move to the right, the sleeve 7 will drive the gear 8 to mesh with the tooth block 9 on the front side, and then the gear 8 will drive the sleeve 7 to rotate in the opposite direction, so that the sleeve 7 will drive the threaded rod 10 to rise, and then the threaded rod 10 will drive the connecting plate 11 to rise together, so that the connecting plate 11 will drive the circuit board to move out of the cleaning tank 1, and then the sliding block 6 will continue to drive the sleeve 7 to move to the right, which will drive the sleeve 7 to drive the gear 8 to mesh with the tooth block 9 on the rear side again, so that the sleeve 7 will rotate while driving the threaded rod 10 to rise. The rod 10 moves downward again, so that the threaded rod 10 drives the connecting plate 11 downward together, and the connecting plate 11 drives the circuit board clamped thereunder to move into the electroplating tank 2, and the electroplating effect is achieved through the electroplating tank 2. Finally, when the sliding block 6 continues to drive the sleeve 7 to move to the right, the sleeve 7 drives the gear 8 to mesh with the front tooth block 9 again, so that the sleeve 7 drives the threaded rod 10 to rise, and the threaded rod 10 drives the connecting plate 11 to rise together, so that the connecting plate 11 drives the clamped circuit board to move out of the electroplating tank 2;

[0035] Embodiment 3: Different from Embodiment 2, this embodiment facilitates clamping of the circuit board. Figure 1-Figure 2 and Figure 6-Figure 7 A bidirectional screw rod 13 is provided on the front side of the connecting plate 11, and the rear end of the bidirectional screw rod 13 penetrates into the connecting plate 11 and is connected to its bearing, and a clamping plate 14 is threadedly connected to the outer side of the bidirectional screw rod 13, and two groups of clamping plates 14 are provided, and an anti-sliding block 15 is bonded to the inner side of the lower end of the clamping plate 14;

[0036] By rotating the bidirectional screw rod 13, the two-way screw rod 13 is rotated and the two sets of clamping plates 14 are driven away from each other, so that the clamping plate 14 drives the anti-sliding block 15 no longer contacts the circuit board. At this time, the limit on the circuit board can be released, and then a new circuit board is placed between the two sets of clamping plates 14. Then, by reversing the bidirectional screw rod 13, the two-way screw rod 13 drives the two sets of clamping plates 14 to approach each other, and then the clamping plate 14 drives the anti-sliding block 15 to contact the circuit board, thereby achieving a clamping effect. In addition, through the setting of the anti-sliding block 15, an anti-slip effect is achieved, which can make the clamping more stable.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board electroplating machine capable of improving the purity of a copper plate, comprising a cleaning tank (1), wherein an electroplating tank (2) is fixed to the right side of the cleaning tank (1); It is characterized in that Also includes: The cleaning tank (1) and the electroplating tank (2) are both fixed with vertical plates on their outer upper end surfaces, and the upper ends of the vertical plates are fixed to the mounting box (3), while the left side of the mounting box (3) is bolted with a servo motor (4), and the output end of the servo motor (4) is fixed to a reciprocating screw rod (5); The right end of the reciprocating screw rod (5) is connected to the right inner wall bearing of the mounting box (3), and the outer side surface of the reciprocating screw rod (5) is threadedly connected to a sliding block (6), and the lower end surface bearing of the sliding block (6) is connected to a sleeve (7), and the inner thread of the sleeve (7) is connected to a threaded rod (10), and the lower end of the threaded rod (10) is fixed to the upper surface of the connecting plate (11).

2. The circuit board electroplating machine capable of improving the purity of copper plate according to claim 1, characterized in that: A gear (8) is fixed on the outer side surface of the sleeve (7), and the outer side surface of the gear (8) is meshed with a gear block (9), and the gear block (9) is fixed to the inner wall of the installation box (3).

3. The circuit board electroplating machine capable of improving the purity of copper plate according to claim 2, characterized in that: The tooth blocks (9) are provided in two groups, each group is provided with three sections, and the two groups of tooth blocks (9) are distributed in a staggered manner.

4. The circuit board electroplating machine capable of improving the purity of copper plate according to claim 2, characterized in that: The tooth blocks (9) are respectively fixed to the inner walls of the front and rear sides of the installation box (3), and there is a gap in the middle of each section of the tooth block (9).

5. The circuit board electroplating machine capable of improving the purity of copper plate according to claim 1, characterized in that: A telescopic rod (12) is fixed to the upper end surface of the connecting plate (11), and the upper end of the telescopic rod (12) is fixed to the lower surface of the sliding block (6).

6. The circuit board electroplating machine capable of improving the purity of copper plates according to claim 1, characterized in that: A bidirectional screw rod (13) is arranged on the front side of the connecting plate (11), and the rear end of the bidirectional screw rod (13) penetrates into the connecting plate (11) and is connected to its bearing, and a clamping plate (14) is threadedly connected to the outer side surface of the bidirectional screw rod (13).

7. The circuit board electroplating machine capable of improving the purity of copper plates according to claim 6, characterized in that: Two groups of the clamping plates (14) are provided, and an anti-sliding block (15) is bonded to the inner side of the lower end of the clamping plates (14).

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