Photoetching glue baking machine

Abstract

The utility model relates to a photoetching glue baking machine, which comprises a workbench, a heating plate, a vacuum pump, a placing plate and a driver, after the photoetching glue baking machine finishes the baking of a wafer, the driver drives the placing plate to drive each thimble to move close to the direction of a first through hole, each thimble ascends and protrudes to the outer side of the first through hole, and the first through hole passes through the first through hole; according to the wafer taking device, the wafer attached to the heating plate is jacked up, so that the wafer is separated from the heating plate, through the structure, the baked wafer can be taken out very conveniently, the risk that the wafer is damaged in the taking process is reduced, and therefore the production quality of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production equipment, in particular to a photolithography glue baking machine. Background Art

[0002] In the field of photolithography, the wafer coated with glue needs to be baked to solidify the wafer film layer. The wafer to be baked is placed on the heating plate of the photolithography glue baking machine and the wafer is baked through the heating plate.

[0003] At present, after the photolithography baking machine on the market completes the wafer baking process, it becomes extremely difficult to remove the wafer from the heating plate due to the thin thickness of the wafer and its adhesion to the heating plate, which increases the risk of damaging the wafer during the removal process and seriously affects the production quality of the wafer. Utility Model Content

[0004] Based on this, it is necessary to provide a photolithography glue baking machine.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] A photolithography glue baking machine, comprising:

[0007] A workbench, wherein a mounting cavity is provided on the workbench;

[0008] A heating plate, the heating plate is arranged on the workbench, the heating plate closes the installation cavity, an adsorption through hole is provided on the heating plate, and a plurality of first through holes are provided on the heating plate;

[0009] A vacuum pump, the vacuum pump is arranged in the installation cavity, the vacuum pump is connected to the side wall of the adsorption through hole through an exhaust pipe, and the vacuum pump is used to extract the gas in the installation cavity of the adsorption through hole together with the exhaust pipe to generate negative pressure at the adsorption through hole;

[0010] A placement plate, wherein a plurality of ejector pins are arranged on a first surface of the placement plate;

[0011] A driver is disposed in the installation cavity, the driver is drivingly connected to the second surface of the placement plate, and the driver drives the placement plate to drive each of the ejector pins to protrude to the outside of each of the first through holes.

[0012] In one embodiment, the width of the adsorption through hole at one end away from the bottom of the installation cavity is smaller than the width of the adsorption through hole at one end close to the bottom of the installation cavity.

[0013] In one embodiment, the number of the adsorption through holes is plural.

[0014] In one embodiment, the adsorption through holes are cross-arranged on the heating plate.

[0015] In one embodiment, the ejector pins are arranged on the first surface of the placement plate at equal intervals.

[0016] In one embodiment, the photolithography glue baking machine further includes: a plurality of limit pins, each of which is arranged on the heating plate.

[0017] In one embodiment, the heating plate is a nano-ceramic heating plate.

[0018] In one embodiment, the photolithography adhesive baking machine further includes: a cover body, and the cover body is covered on the workbench.

[0019] In one embodiment, a heat-insulating layer is provided on the outer surface of the cover body.

[0020] The beneficial effect of the utility model is as follows: the utility model provides a photolithography glue baking machine, after the photolithography glue baking machine completes baking the wafer, the driver drives the placement plate to drive each ejector pin to move in the direction close to the first through hole, each ejector pin rises and protrudes to the outside of the first through hole, lifts up the wafer in contact with the heating plate, and separates the wafer from the heating plate. Through the above structure, the baked wafer can be taken out very conveniently, reducing the risk of damaging the wafer during the taking process, thereby improving the production quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a photolithography glue baking machine according to an embodiment;

[0023] Figure 2 The figure is a schematic cross-sectional structure diagram of a photolithography adhesive baking machine according to an embodiment.

[0024] In the accompanying drawings, 10, photolithography glue baking machine; 100, workbench; 101, installation cavity; 110, heating plate; 111, adsorption through hole; 112, first through hole; 200, vacuum pump; 210, exhaust pipe; 220, suction plate; 221, adsorption cavity; 222, exhaust hole; 223, second through hole; 300, ejector pin; 400, driver; 410, placement plate; 500, limit pin; 600, cover body. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The technical solution of the present invention will be further described below in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0026] It should be understood that the same or similar numbers in the drawings of the embodiments correspond to the same or similar parts. In the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom" and the like indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] In one embodiment, Figure 1 and Figure 2 As shown, a photolithography glue baking machine 10 includes: a workbench 100, a heating plate 110, a vacuum pump 200, a placement plate 410 and a driver 400, the workbench 100 is provided with an installation cavity 101, the heating plate 110 is arranged on the workbench 100, the heating plate 110 closes the installation cavity 101, the heating plate 110 is provided with an adsorption through hole 111, the heating plate 110 is provided with a plurality of first through holes 112, the vacuum pump 200 is arranged in the installation cavity 101, and the vacuum pump 200 is provided through an exhaust pipe 210 is connected to the side wall of the adsorption through hole 101, the vacuum pump 200 is used to cooperate with the exhaust pipe 210 to extract the gas in the installation cavity 101, so as to generate negative pressure at the adsorption through hole 111, a plurality of ejector pins 300 are arranged on the first surface of the placement plate 410, the driver 400 is arranged in the installation cavity 101, the driver 400 is drivingly connected to the second surface of the placement plate 410, and the driver 400 drives the placement plate 410 to drive each of the ejector pins 300 to protrude to the outside of each first through hole 112.

[0028] In this embodiment, the wafer to be baked is placed on the heating plate 110, and the wafer is aligned with the attached through hole 111. When the heating plate 110 heats the wafer, the vacuum pump 200 is used in conjunction with the exhaust pipe 210 to extract the gas in the adsorption through hole 111, so that the air pressure in the adsorption through hole 111 is lower than the external air pressure. Negative pressure is generated in the adsorption through hole 111 to adsorb the wafer. The wafer can fit tightly with the heating plate 110, and the heat emitted by the heating plate 110 is more efficiently transferred to the wafer, thereby improving the effect of baking the wafer.

[0029] In this embodiment, the placement plate 410 is movably arranged in the installation cavity 101, a guide hole is provided on the placement plate 410, a guide column is provided in the installation cavity 101, and the placement plate 410 is slidably arranged on the guide column through the guide hole. When the baking process of the wafer is completed, the driver 400 drives the placement plate 410 to slide on the guide column, and the movement direction of the placement plate 410 can be limited by the guide column, so that the placement plate 410 can better drive each ejector pin 300 to move in the direction close to the first through hole 112, and each ejector pin 300 rises and protrudes to the outside of the first through hole 112, and lifts the wafer that is attached to the heating plate 110, so that the wafer is separated from the heating plate 110. Through the above structure, the baked wafer can be taken out very conveniently, reducing the risk of damaging the wafer during the taking process, and improving the production quality of the wafer.

[0030] In order to improve the adsorption effect of the adsorption through hole 111, in one embodiment, the width of the end of the adsorption through hole 111 away from the bottom of the installation cavity 101 is smaller than the width of the end of the adsorption through hole 111 close to the bottom of the installation cavity 101. In this embodiment, the structural design of the adsorption through hole 111 being wide at the end close to the bottom of the installation cavity 101 and narrow at the end close to the bottom of the installation cavity 101 enables the adsorption through hole 111 to effectively concentrate the suction force, improve the vacuum adsorption force, enable the wafer to better fit the heating plate, and improve the adsorption effect of the adsorption through hole 111 on the wafer.

[0031] In order to further improve the effect of baking the wafer by the heating plate 110, in one embodiment, Figure 1 and Figure 2As shown, the number of the adsorption through holes 111 is multiple. In this embodiment, an air suction plate 220 is arranged in the installation cavity 101, the outer surface of the air suction plate 220 is connected to the side wall of the installation cavity 101, an adsorption cavity 221 is provided on the first end of the air suction plate 220, an exhaust hole 222 is provided on the side wall of the adsorption cavity 221, and the exhaust hole 222 is arranged through the second end of the air suction plate 220, the first end of the air suction plate 220 is connected to the heating plate 110, the heating plate 110 closes the adsorption cavity 221, each adsorption through hole 111 is connected to the adsorption cavity 221, and the vacuum pump 200 is connected to the side wall of the exhaust hole 222 through the exhaust pipe 210. Through the above-mentioned arrangement, the vacuum pump 200 cooperates with the exhaust pipe 210 to extract the gas in the adsorption chamber 221 and at the same time can extract the gas in each adsorption through hole 111, so that negative pressure is generated in each adsorption through hole 111, thereby increasing the adsorption area and adsorption force of the heating plate 110 for adsorbing the wafer, improving the bonding effect between the wafer and the heating plate 110, and further improving the effect of the heating plate 110 for baking the wafer.

[0032] In order to enable each ejector pin 300 to smoothly lift the wafer, in one embodiment, Figure 2 As shown, a plurality of second through holes 223 are provided on the side wall of the adsorption chamber 221, and each of the second through holes 222 is arranged through the second end of the air suction plate 220, and the number of the second through holes 223 is equal to the number of the first through holes 112, and each of the second through holes 223 is aligned with and connected to a first through hole 112, and the driver 400 drives the placement plate 410 to drive each of the ejector pins 300 to pass through each of the second through holes 223 and protrude to the outside of each of the first through holes 112. In this embodiment, through the plurality of second through holes 223, it is possible to prevent the driver 400 from driving the placement plate 410 to drive each of the ejector pins 300 to collide with the air suction plate 220 when the ejector pins 300 collide with the air suction plate 220, so that each of the ejector pins 300 can smoothly protrude to the outside of each of the first through holes 112 to lift the baked wafers.

[0033] In order to improve the reliability of the heating plate 110 in baking the wafer, in one embodiment, Figure 1 and Figure 2 As shown, the adsorption through holes 111 are cross-arranged on the heating plate 110. In this embodiment, the cross-arrangement of the adsorption through holes 111 can make the adsorption force evenly distributed on the entire surface of the heating plate 110, and can avoid excessive or insufficient local adsorption force, so that the wafer can be stably placed on the heating plate 110.

[0034] In order to improve the reliability of each ejector pin 300 when lifting the wafer, in one embodiment, Figure 1 and Figure 2As shown, each of the ejector pins 300 is arranged at equal intervals on the first surface of the placement plate 410. In this embodiment, when each ejector pin 300 lifts the wafer, since each ejector pin 300 is arranged at equal intervals, the lifting force of each ejector pin 300 when lifting the wafer can be evenly distributed on the wafer, which can avoid excessive concentration of the lifting force and prevent excessive local pressure during lifting, resulting in damage to the wafer or the wafer sliding or tilting on each ejector pin 300. It should be noted that in addition to being able to bake wafers, the present photolithography glue baking machine 10 can also bake medical or experimental instruments, such as glass, ceramic and metal vessels. After the baking process of these types of vessels is completed, the baked vessels are lifted by each ejector pin 300, thereby increasing the versatility of the photolithography glue baking machine 10.

[0035] In order to limit the position of the wafer on the heating plate 110, in one embodiment, as shown in FIG. Figure 1 and Figure 2 As shown, the photolithography glue baking machine 10 also includes: a plurality of limit pins 500, each of which is arranged on the heating plate 110. In this embodiment, when the wafer is placed on the heating plate 110, one end of the wafer abuts against the surface of the two limit pins 500, which can limit the position of the wafer on the heating plate 110, so that the wafer can be aligned with each ejector pin 300, so that each ejector pin 300 can stably lift the wafer. For example, the position of a six-inch wafer on the heating plate 110 can be limited by each limit pin 500. When the six-inch wafer is placed on the heating plate 110, one end of the six-inch wafer abuts against the outer surface of the two limit pins 500 and is located between the two limit pins 500, so that the six-inch wafer can be located in the center of the heating plate 110, so that the six-inch wafer can be aligned with each ejector pin 300.

[0036] In order to improve the baking effect of the heating plate 110 baking the wafer, in one embodiment, the heating plate 110 is a nano-ceramic heating plate. In this embodiment, the thermal conductivity of the nano-ceramic material is high, and heat can be transferred quickly and evenly. The heating plate 110 made of nano-ceramic material can better conduct heat to the wafer, thereby improving the baking effect of the heating plate 110.

[0037] In order to improve the baking effect of the photolithography glue baking machine 10, in one embodiment, Figure 1 As shown, the photolithography adhesive baker 10 further includes: a cover body 600, and the cover body 600 is covered on the workbench 100. In this embodiment, a heat preservation cavity is opened on the cover body 600. After the wafer is placed on the heating plate 110, when the cover body 600 is covered on the heating plate 110, the heating plate 110 is located in the heat preservation cavity, so that the heat emitted by the heating plate 110 is stored in the cover body 600, which can not only improve the effect of the heating plate 110 baking the wafer, but also shorten the time of baking the wafer.

[0038] In order to improve the heat preservation effect of the cover body 600, in one embodiment, a heat preservation layer is provided on the outer surface of the cover body 600. In this embodiment, the heat preservation layer is an aluminum silicate heat preservation layer. Aluminum silicate has low thermal conductivity and is extremely resistant to high temperatures. The heat preservation layer made of aluminum silicate can reduce the heat dissipation of the outer surface of the cover body 600, so that more heat remains inside the cover body 600, so as to improve the overall heat baking effect of the photolithography glue baking machine 10.

[0039] Compared with the prior art, the utility model has at least the following advantages:

[0040] The utility model provides a photolithography glue baking machine. After the photolithography glue baking machine completes baking of a wafer, a driver drives a placement plate to drive each ejector pin to move in a direction close to a first through hole. Each ejector pin rises and protrudes to the outside of the first through hole, and lifts up the wafer in contact with the heating plate, so that the wafer is separated from the heating plate. Through the above structure, the baked wafer can be taken out very conveniently, reducing the risk of damaging the wafer during the taking process, thereby improving the production quality of the wafer.

[0041] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A photolithography glue baking machine, characterized in that: include: A workbench, wherein a mounting cavity is provided on the workbench; A heating plate, the heating plate is arranged on the workbench, the heating plate closes the mounting cavity, an adsorption through hole is provided on the heating plate, and a plurality of first through holes are provided on the heating plate; A vacuum pump, the vacuum pump is arranged in the installation cavity, the vacuum pump is connected to the side wall of the adsorption through hole through an exhaust pipe, and the vacuum pump is used to extract the gas in the adsorption through hole in cooperation with the exhaust pipe to generate a negative pressure at the adsorption through hole; A placement plate, wherein a plurality of ejector pins are arranged on a first surface of the placement plate; A driver is disposed in the installation cavity, the driver is drivingly connected to the second surface of the placement plate, and the driver drives the placement plate to drive each of the ejector pins to protrude to the outside of each of the first through holes.

2. The photolithography glue baking machine according to claim 1, characterized in that: The width of the adsorption through hole at one end away from the bottom of the installation cavity is smaller than the width of the adsorption through hole at one end close to the bottom of the installation cavity.

3. The photolithography glue baking machine according to claim 2, characterized in that: The number of the adsorption through holes is multiple.

4. The photolithography glue baking machine according to claim 3, characterized in that: The adsorption through holes are cross-arranged on the heating plate.

5. The photolithography glue baking machine according to claim 1, characterized in that: The ejector pins are arranged on the first surface of the placement plate at equal intervals.

6. The photolithography glue baking machine according to claim 1, characterized in that: Also includes: A plurality of limit pins are provided, each of the limit pins being arranged on the heating plate.

7. The photolithography glue baking machine according to claim 1, characterized in that: The heating plate is a nano-ceramic heating plate.

8. The photolithography glue baking machine according to claim 1, characterized in that: Also includes: A cover body is disposed on the workbench.

9. The photolithography glue baking machine according to claim 8, characterized in that: A heat-insulating layer is arranged on the outer surface of the cover body.

Images