Multi-core-group ceramic dielectric capacitor

Abstract

The utility model relates to a multi-core-group ceramic dielectric capacitor, which comprises a plurality of ceramic dielectric capacitor chips. The plurality of ceramic dielectric capacitor chips are stacked together along the horizontal direction or the vertical direction; the adjacent ceramic dielectric capacitor chips are bonded together through an adhesive; lead plates are arranged on two opposite side surfaces of a combined body of the plurality of ceramic dielectric capacitor chips which are stacked together; the plurality of ceramic dielectric capacitor chips are welded together with the lead plate through welding flux to form a multi-core-group ceramic dielectric capacitor welding body; the multi-core group ceramic dielectric capacitor welding body is externally wrapped with a plastic shell; silicone rubber is filled between the plastic housing and the multi-core group ceramic dielectric capacitor welding body. The lead plate is electrically connected with a lead; and one end, far away from the lead plate, of the lead penetrates through the silicon rubber and the plastic shell and extends out of the plastic shell. The utility model has the advantages of high structural stability, high external stress resistance, low possibility of cracking and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, in particular to a multi-core ceramic capacitor. Background Art

[0002] The existing multi-core ceramic capacitors are composed of multi-layer ceramic capacitor chips and leads welded to the chips. Most of these multi-core ceramic capacitors are directly exposed to harsh environments (such as tropical humid environments and sea salt spray environments), which can easily cause surface contamination of the exposed chips, thereby reducing the insulation resistance and other electrical performance indicators of the capacitors, resulting in reduced product reliability. In addition, in order to obtain relatively large capacitance, the size of these multi-core ceramic capacitors is generally large. Since the ceramic material itself is brittle, especially for such large-sized products, the ceramic body is very likely to crack or be damaged during welding, electrical assembly, storage and transportation, resulting in product damage.

[0003] In order to solve the above problems, in the Chinese utility model patent with publication number "CN 203521170 U" and name "A potted and encapsulated multi-core ceramic capacitor", a plastic shell is arranged on the periphery of the multi-core ceramic capacitor, and a thermosetting resin is used to pot and encapsulate between the multi-core ceramic capacitor and the plastic shell, so that the lead wire passes through the thermosetting resin encapsulation layer and extends out.

[0004] The above solution uses thermosetting resin to pot and encapsulate the multi-core ceramic capacitor in a plastic housing. Although it avoids direct exposure of the ceramic capacitor to a harsh environment and improves the reliability of the product, the inventor believes that it still has the following shortcomings:

[0005] 1. Because the multi-core ceramic capacitor is composed of multi-layer ceramic capacitor chips, the leads are directly welded on the ceramic capacitor chips, which will produce welding cracks and cause structural instability.

[0006] 2. Multi-core ceramic capacitors are encapsulated in a plastic shell with thermosetting resin. Although the resin has high hardness, it has poor toughness and low ability to absorb external stress (such as mechanical stress caused by vibration, temperature stress caused by high and low temperature changes, etc.), and is prone to cracking and deformation. Utility Model Content

[0007] To this end, the utility model provides a multi-core ceramic capacitor, which mainly solves the technical problems of the prior art that the lead structure of the multi-core ceramic capacitor is unstable, the thermosetting resin encapsulation has a low ability to absorb external stress, and is prone to cracking and deformation.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A multi-core ceramic capacitor comprises a plurality of ceramic capacitor chips; the plurality of ceramic capacitor chips are stacked together in a horizontal direction or a vertical direction; adjacent ceramic capacitor chips are bonded together by an adhesive; lead plates are provided on two opposite sides of the assembly of the plurality of stacked ceramic capacitor chips; the plurality of ceramic capacitor chips are welded together with the lead plates by solder to form a multi-core ceramic capacitor welded body; the multi-core ceramic capacitor welded body is wrapped with a plastic shell; silicone rubber is filled between the plastic shell and the multi-core ceramic capacitor welded body; the lead plate is electrically connected with a lead; the end of the lead away from the lead plate passes through the silicone rubber and the plastic shell and extends out of the plastic shell.

[0010] Optionally, each layer is composed of at least one ceramic capacitor chip.

[0011] Optionally, the lead wires are welded to the lead plate via solder.

[0012] Optionally, the lead is parallel to the lead plate.

[0013] Preferably, there are multiple leads; the multiple leads are evenly distributed on the lead plate.

[0014] Optionally, the lead is parallel to the lead plate.

[0015] The utility model has at least the following beneficial effects:

[0016] It is provided with a plurality of ceramic capacitor chips, which are stacked together in the horizontal direction or the vertical direction, and the adjacent ceramic capacitor chips are bonded together by an adhesive, and the two opposite sides of the assembly of the stacked ceramic capacitor chips are provided with lead plates, and the plurality of ceramic capacitor chips are welded together with the lead plates by solder to form a multi-core ceramic capacitor welded body, and the multi-core ceramic capacitor welded body is wrapped with a plastic shell, and silicone rubber is filled between the plastic shell and the multi-core ceramic capacitor welded body. The arrangement of the lead plate enables the ceramic capacitor chip to be firstly welded with the lead plate by solder, and the adjacent ceramic capacitor chips are bonded together by an adhesive, which greatly enhances the stability of the structure; at the same time, the plastic shell and the multi-core ceramic capacitor welded body are encapsulated with silicone rubber, which has high stretchability and resilience, can effectively absorb external stresses such as mechanical stress and temperature stress, and is not easy to crack.

[0017] It can be seen that the multi-core ceramic capacitor of the utility model has the advantages of high structural stability, high resistance to external stress, and not easy to crack. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly explain the prior art and the present invention, the following briefly introduces the drawings required for describing the prior art and the present invention. Obviously, the drawings described below are only exemplary, and for ordinary technicians in this field, other drawings can be derived from the provided drawings without creative work.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so that people familiar with this technology can understand and read them. They are not used to limit the conditions under which the present invention can be implemented. Any structural modification, change in proportion or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0020] Figure 1 It is a partial cross-sectional view from the front of the first embodiment of a multi-core ceramic capacitor of the utility model;

[0021] Figure 2 This is an accessory of a multi-core ceramic capacitor of the utility model. Figure 1 AA partial cross-sectional view;

[0022] Figure 3 It is a partial cross-sectional view from the front of the second embodiment of a multi-core ceramic capacitor of the utility model;

[0023] Figure 4 This is an accessory of a multi-core ceramic capacitor of the utility model. Figure 3 A partial cross-sectional view in the direction of BB;

[0024] Description of reference numerals:

[0025] 1. Ceramic capacitor chip; 2. Adhesive; 3. Lead plate; 4. Silicone rubber; 5. Plastic shell; 6. Solder; 7. Lead. DETAILED DESCRIPTION

[0026] The present application is further described below in detail through specific embodiments in conjunction with the accompanying drawings.

[0027] In the description of this application: unless otherwise specified, the meaning of "plurality" is two or more. The terms "first", "second", "third", etc. in this application are intended to distinguish the objects referred to, and do not have special meanings in terms of technical connotations (for example, they should not be understood as emphasizing the importance or order, etc.). Expressions such as "including", "comprising", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).

[0028] The terms such as "upper", "lower", "left", "right", "middle", etc. used in this application are usually used to facilitate intuitive understanding by comparing with the accompanying drawings, and are not absolute limitations on the positional relationship in the actual product. Without departing from the technical concept disclosed in this application, changes in these relative positional relationships should also be regarded as the scope of this application.

[0029] Embodiment 1 of a multi-core ceramic capacitor of the utility model, as Figure 1 , Figure 2 As shown, a plurality of ceramic capacitor chips 1 are provided, and the plurality of ceramic capacitor chips 1 are stacked together in a horizontal direction. To enhance the stability between the ceramic capacitor chips 1, adjacent ceramic capacitor chips 1 are bonded together by an adhesive 2. Lead plates 3 are provided on two opposite sides of the assembly of the plurality of ceramic capacitor chips 1 stacked together. The plurality of ceramic capacitor chips 1 are welded together by solder 6 and lead plates 3 to form a multi-core ceramic capacitor welded body. A plastic shell 5 is wrapped outside the multi-core ceramic capacitor welded body. The plastic shell 5 and the multi-core ceramic capacitor welded body are potted and packaged with silicone rubber 4. The lead plate 3 is electrically connected with a lead 7. The end of the lead 7 away from the lead plate 3 passes through the silicone rubber 4 and the plastic shell 5 and extends out of the plastic shell 5. The arrangement of a pair of lead plates 3 enables the ceramic capacitor chip 1 to be firstly welded to the lead plates 3 by means of solder 6, and adjacent ceramic capacitor chips 1 are bonded together by means of adhesive 2, which greatly enhances the stability of the structure; at the same time, the plastic shell 5 and the multi-core ceramic capacitor welded body are potted and encapsulated with silicone rubber 4, which has high stretchability and resilience, can effectively absorb external stresses such as mechanical stress and temperature stress, and is not easy to crack.

[0030] Optionally, in order to increase the capacity of the multi-core ceramic capacitor of the present application, each layer is composed of at least one ceramic capacitor chip 1, and the multiple ceramic capacitor chips 1 in each layer are also bonded together with an adhesive 2.

[0031] Optionally, the lead 7 is welded to the lead plate 3 through the solder 6, or they can be integrally formed.

[0032] Optionally, in this embodiment, the lead 7 is parallel to the lead plate 3, and this mode is a pin mode.

[0033] Preferably, there are multiple lead wires 7 , and the multiple lead wires 7 are evenly distributed on the lead plate 3 .

[0034] A second embodiment of a multi-core ceramic capacitor of the utility model is as follows: Figure 3 , Figure 4 As shown,

[0035] This embodiment is based on the first embodiment. Compared with the first embodiment, multiple ceramic capacitor chips 1 of this embodiment are stacked together in the vertical direction. Meanwhile, the lead 7 is perpendicular to the lead plate 3. This mode is a patch mode.

[0036] The above is a relatively specific and detailed description of the present application through general description and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not deviate from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the scope of protection of the claims of the present application.

Claims

1. A multi-core ceramic capacitor, comprising a plurality of ceramic capacitor chips (1), characterized in that: A plurality of the ceramic capacitor chips (1) are stacked together in a horizontal direction or a vertical direction; adjacent ceramic capacitor chips (1) are bonded together by an adhesive (2); lead plates (3) are provided on two opposite sides of the assembly of the plurality of the ceramic capacitor chips (1) stacked together; the plurality of the ceramic capacitor chips (1) are welded together by solder (6) and the lead plates (3) to form a multi-core ceramic capacitor welded body; the multi-core ceramic capacitor welded body is wrapped with a plastic shell (5); silicone rubber (4) is filled between the plastic shell (5) and the multi-core ceramic capacitor welded body; the lead plate (3) is electrically connected with a lead wire (7); the end of the lead wire (7) away from the lead plate (3) passes through the silicone rubber (4), the plastic shell (5) and extends out of the plastic shell (5).

2. A multi-core ceramic capacitor according to claim 1, characterized in that: Each layer is composed of at least one ceramic dielectric capacitor chip (1).

3. The multi-core ceramic capacitor according to claim 1, characterized in that: The lead wire (7) is welded together with the lead plate (3) via solder (6).

4. A multi-core ceramic capacitor according to claim 3, characterized in that: The lead wire (7) is parallel to the lead plate (3).

5. A multi-core ceramic capacitor according to claim 4, characterized in that: There are a plurality of lead wires (7); the plurality of lead wires (7) are evenly distributed on the lead board (3).

6. The multi-core ceramic capacitor according to claim 3, characterized in that: The lead wire (7) is parallel to the lead plate (3).

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