Supporting mechanism for wafer photoresist removal

Abstract

The utility model discloses a supporting mechanism for wafer degumming, which comprises a shell, an arc-shaped box and a coupler, a rotating motor is fixed on the outer wall of one side of the shell through a bolt, a driving bevel gear is arranged on an output shaft of the rotating motor, and a rotating rod is rotatably connected on the outer wall of the shell through a rotating shaft. A driven bevel gear is arranged at one end of the rotating rod and meshed with the driving bevel gear, a sliding groove is formed in the arc-shaped box, a sliding column is slidably connected into the sliding groove, a lower fixing clamp is arranged at one end of the sliding column, and an upper fixing clamp is arranged on the outer wall of the top of the lower fixing clamp. The lead screw is inserted into the threaded hole in a threaded mode, the wafer is fixed through the sliding fixing clamp, the function of fixing the wafer is achieved, the sliding column moves in the sliding groove, the sliding column extrudes the sliding spring, impact of the wafer on the inner wall is relieved during rotation, and the function of protecting the wafer is achieved; the driving bevel gear and the driven bevel gear rotate in a meshed mode.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer debonding, in particular to a supporting mechanism for wafer debonding. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Due to its round shape, it is called silicon wafer. The raw material of the wafer is silicon. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to make high-purity polysilicon. The wafer manufacturer then melts the polysilicon, plants seed crystals in the melt, and then slowly pulls them out to form cylindrical single-crystal silicon rods. The silicon rods then go through processes such as segmentation, rolling, and slicing. After packaging, they become the basic raw material for making integrated circuits - silicon wafers. A layer of protective glue needs to be applied to the wafer before dicing to prevent the metallized area on the wafer surface from being corroded by the dicing liquid (usually deionized water) and contaminated by crystal slag. The protective glue needs to be removed cleanly after dicing is completed, and no residue should remain on the surface.

[0003] For example, a non-silicon semiconductor wafer debonding device with the authorization announcement number CN218677055U and the announcement date 2023.03.21 includes: a workbench, the workbench has a debonding area and a cleaning area for use together; an ultrasonic cleaning mechanism, which is arranged in the debonding area; a carrying container is arranged inside the ultrasonic cleaning mechanism, and the carrying container contains a debonding solvent.

[0004] When removing the adhesive attached to the surface of the wafer, after using the adhesive removal solvent to rinse one side of the wafer, the staff needs to turn the wafer over and then use the adhesive removal solvent to rinse the adhesive on the other side of the wafer, which not only wastes manpower but also reduces the efficiency of adhesive removal. Therefore, it is urgent to design a support mechanism for wafer adhesive removal to solve the above problems. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a support mechanism for wafer degumming.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The transmission gear of the present invention is a gear selected from the group consisting of a gearbox and a gearbox, wherein the gearbox has a gear which is adapted to engage with the gears of the gearbox and a gearbox has a gear which is adapted to engage with the gears of the gearbox.

[0008] Furthermore, an expansion groove is provided inside the arc-shaped box, and a telescopic ring is slidably connected inside the expansion groove.

[0009] Furthermore, a rotating short rod is rotatably connected to the outer wall of one side of the coupling via a bearing, and the other end of the rotating short rod away from the coupling is connected to the arc box.

[0010] Furthermore, a fixing block is arranged on the outer wall of the housing away from the rotating motor, and a moving motor is fixed to the rear side of the fixing block by bolts, and a moving rod is arranged on the output shaft of the moving motor.

[0011] Furthermore, the output shaft of the mobile motor is provided with a standard gear, a gear groove is opened on the outer wall of one side of the shell, and a gear plate is slidably connected inside the gear groove, the standard gear is meshed with the gear plate, and one end of the gear plate is connected to the coupling.

[0012] Furthermore, a fan motor is fixed to the outer wall of the rear side of the shell by bolts, and fan blades are arranged on the output shaft of the fan motor, and a metal filter is arranged on the inner wall of the shell.

[0013] Furthermore, a drainage hole is provided on the outer wall of the bottom of the shell, and a drainage net is provided on the inner wall of the drainage hole.

[0014] The beneficial effects of the utility model are:

[0015] 1. Through the provision of a shell, a rotating motor, an active bevel gear, a driven bevel gear, a rotating rod, an arc box, a sliding groove, a sliding column, a sliding spring, a fixing clamp, a threaded hole and a lead screw, the lead screw is threadedly inserted in the threaded hole, the sliding fixing clamp fixes the wafer, thereby realizing the function of fixing the wafer, the sliding column moves in the sliding groove, the sliding column squeezes the sliding spring, thereby realizing the function of reducing the impact of the wafer on the inner wall during rotation, thereby realizing the function of protecting the wafer, the rotating motor drives the active bevel gear to rotate, the active bevel gear meshes and rotates with the driven bevel gear, the driven bevel gear drives the rotating rod to rotate, the rotating rod rotates in the shell, and the rotating rod drives the arc box to rotate, so that the wafer does not need to be turned over manually, thereby realizing the function of degumming both sides of the wafer, thereby improving the efficiency of degumming.

[0016] 2. Through the setting of the expansion groove, telescopic ring, coupling, rotating short rod, toothed plate, standard gear, moving rod and moving motor, the moving motor drives the moving rod to rotate, the moving rod drives the standard gear to rotate, the standard gear and the toothed plate engage and move, the toothed plate drives the coupling to move, the coupling drives the rotating short rod to move, the moving short rod drives the arc box to move, and the telescopic ring expands in the expansion groove, thereby realizing the function of fixing wafers of different sizes.

[0017] 3. Through the fan motor, fan blades, metal filter, drainage net and drainage holes, the fan motor drives the fan blades to rotate, and the fan blades drive the air to enter the mechanism through the metal filter, thereby realizing the function of blowing away the degumming solvent attached to the surface of the wafer, and the degumming solvent enters the drainage hole through the drainage net, thereby realizing the function of filtering the degumming solvent. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a wafer debonding support mechanism proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of a top view and cross-sectional structure of a support mechanism for wafer debonding proposed by the utility model;

[0020] Figure 3 This is a schematic diagram of the front view and cross-section structure of a support mechanism for wafer debonding proposed by the utility model;

[0021] Figure 4 This is a schematic diagram of the enlarged structure of a sliding groove of a support mechanism for wafer debonding proposed by the utility model;

[0022] Figure 5 The utility model is a schematic diagram of an enlarged structure of a fixing clamp of a support mechanism for wafer debonding proposed by the utility model.

[0023] In the figure: 1. housing; 2. rotating motor; 3. driving bevel gear; 4. driven bevel gear; 5. arc box; 6. rotating rod; 7. sliding groove; 8. sliding column; 9. sliding spring; 10. lower fixing clip; 11. threaded hole; 12. screw rod; 13. expansion groove; 14. telescopic ring; 15. coupling; 16. rotating short rod; 17. tooth plate; 18. fixing block; 19. moving motor; 20. moving rod; 21. standard gear; 22. fan motor; 23. fan blade; 24. metal filter; 25. drainage net; 26. drainage hole; 27. gear groove; 28. upper fixing clip. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] Reference Figure 1-5A support mechanism for wafer debonding includes a housing 1, an arc box 5 and a coupling 15. A rotating motor 2 is fixed to the outer wall of one side of the housing 1 by bolts, and an active bevel gear 3 is arranged on the output shaft of the rotating motor 2. A rotating rod 6 is rotatably connected to the outer wall of the housing 1 by a rotating shaft, and a driven bevel gear 4 is arranged at one end of the rotating rod 6. The driven bevel gear 4 is meshed with the active bevel gear 3. A sliding groove 7 is opened inside the arc box 5, and a sliding column 8 is slidably connected inside the sliding groove 7. A lower fixed The upper fixing clamp 28 is provided on the outer wall of the top of the lower fixing clamp 10, and the upper fixing clamp 28 and the lower fixing clamp 10 are provided with threaded holes 11 inside, and the internal threads of the threaded holes 11 are inserted with screw rods 12, and the other end of the sliding column 8 away from the lower fixing clamp 10 is connected to the inner wall of the sliding groove 7 with a sliding spring 9, one of the arc boxes 5 is fixed at one end of the rotating rod 6, and the lower fixing clamp 10 and the upper fixing clamp 28 act to clamp the edge of the wafer, and the screw rod 12 is threadedly inserted in the threaded hole 11, thereby realizing the function of fixing the wafer.

[0028] In one embodiment provided by the present utility model, Figure 2 and Figure 4 As shown, an enlarged groove 13 is provided inside the arc-shaped box 5, and a telescopic ring 14 is slidably connected inside the enlarged groove 13. The telescopic ring 14 slides in the enlarged groove 13 to achieve the function of fixing wafers of different diameters.

[0029] In another embodiment provided by the present utility model, Figure 2 As shown, a rotating short rod 16 is rotatably connected to the outer wall of one side of the coupling 15 through a bearing, and the other end of the rotating short rod 16 away from the coupling 15 is connected to the arc box 5, one end of the coupling 15 is rotatably connected to the rotating rod 6 through a bearing, and the other end is welded with a tooth plate 17, so that the tooth plate 17 can drive the rotating arc box 5 to move.

[0030] In another embodiment provided by the present utility model, Figure 2 and Figure 3 As shown, a fixed block 18 is provided on the outer wall of the housing 1 on the other side away from the rotating motor 2, and a moving motor 19 is fixed to the rear side of the fixed block 18 by bolts, and a moving rod 20 is provided on the output shaft of the moving motor 19. The moving motor 19 drives the moving rod 20 to rotate, and the moving rod 20 drives the standard gear 21 to rotate, thereby realizing the function of moving the tooth plate 17.

[0031] In one embodiment provided by the present utility model, Figure 2 and Figure 3As shown, the output shaft of the mobile motor 19 is provided with a standard gear 21, a gear groove 27 is opened on the outer wall of one side of the housing 1, and the gear groove 27 is internally slidably connected with a toothed plate 17, the standard gear 21 is meshed with the toothed plate 17, and one end of the toothed plate 17 is connected to the coupling 15, the standard gear 21 drives the toothed plate 17 to move, and the toothed plate 17 moves in the gear groove 27, thereby realizing the function of magnifying the arc box 5.

[0032] In another embodiment provided by the present utility model, Figure 2 and Figure 3 As shown, a fan motor 22 is fixed to the outer wall on the rear side of the outer shell 1 by bolts, and a fan blade 23 is arranged on the output shaft of the fan motor 22, and a metal filter 24 is arranged on the inner wall of the outer shell 1. The fan motor 22 drives the fan blade 23 to rotate, thereby realizing the function of drying the degumming solvent attached to the surface of the wafer on the arc box 5.

[0033] In another embodiment provided by the present utility model, Figure 3 As shown, a drainage hole 26 is provided on the outer wall of the bottom of the housing 1, and a drainage net 25 is provided on the inner wall of the drainage hole 26. The debonding solvent enters the drainage hole 26 through the drainage net 25, thereby filtering the debonding solvent.

[0034] Working principle: When in use, the wafer is placed on the lower fixing clamp 10, the upper fixing clamp 28 presses the wafer, the screw rod 12 is threadedly inserted into the threaded hole 11, and the function of fixing the wafer is realized. The rotating motor 2 is started to drive the active bevel gear 3 to rotate, the active bevel gear 3 and the driven bevel gear 4 mesh and rotate, the driven bevel gear 4 drives the rotating rod 6 to rotate, the rotating rod 6 drives the arc box 5 to rotate, and the arc box 5 drives the rotating short rod 16 to rotate, and the function of removing the glue attached to both sides of the wafer is realized, which avoids the staff from turning over the wafer when removing the glue on the other side of the wafer, so that the degumming solvent removes the glue on the other side, saving manpower and improving the degumming efficiency. When using different wafers When the moving motor 19 drives the moving rod 20 to rotate, the moving rod 20 drives the standard gear 21 to rotate, the standard gear 21 meshes with the tooth plate 17 and moves, the tooth plate 17 slides in the gear groove 27, the tooth plate 17 drives the coupling 15 to move, the coupling 15 drives the arc box 5 to move, the arc box 5 drives the telescopic ring 14 to slide in the expansion groove 13, thereby realizing the function of fixing different wafers, starting the fan motor 22, the fan motor 22 drives the fan blades 23 to rotate, the fan blades 23 drive the air to blow away the degumming solvent attached to the surface of the wafer, thereby realizing the function of air-drying the wafer, and the degumming solvent enters the drainage hole 26 through the drainage net 25, thereby realizing the function of filtering the degumming solvent.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A support mechanism for wafer debonding, comprising a housing (1), an arc box (5) and a coupling (15), characterized in that: A rotating motor (2) is fixed to the outer wall of one side of the housing (1) by bolts, and a driving bevel gear (3) is arranged on the output shaft of the rotating motor (2). A rotating rod (6) is rotatably connected to the outer wall of the housing (1) by a rotating shaft, and a driven bevel gear (4) is arranged at one end of the rotating rod (6), and the driven bevel gear (4) is meshed with the driving bevel gear (3). A sliding groove (7) is provided inside the arc box (5), and a sliding column (8) is slidably connected inside the sliding groove (7). A lower fixing clamp (10) is arranged at one end of the moving column (8), and an upper fixing clamp (28) is arranged on the outer wall of the top of the lower fixing clamp (10), threaded holes (11) are provided inside the upper fixing clamp (28) and the lower fixing clamp (10), and a screw rod (12) is inserted into the internal thread of the threaded hole (11), and a sliding spring (9) is connected to the inner wall of the sliding groove (7) at the other end of the sliding column (8) away from the lower fixing clamp (10), and one of the arc boxes (5) is fixed to one end of the rotating rod (6).

2. A wafer stripping support mechanism according to claim 1, characterized in that: An enlarged groove (13) is provided inside the arc-shaped box (5), and a telescopic ring (14) is slidably connected inside the enlarged groove (13).

3. A wafer stripping support mechanism according to claim 2, characterized in that: A rotating short rod (16) is rotatably connected to the outer wall of one side of the coupling (15) via a bearing, and the other end of the rotating short rod (16) away from the coupling (15) is connected to the arc box (5).

4. The wafer stripping support mechanism according to claim 3, characterized in that: A fixing block (18) is arranged on the outer wall of the housing (1) on the other side away from the rotating motor (2), and a moving motor (19) is fixed to the rear side of the fixing block (18) by bolts, and a moving rod (20) is arranged on the output shaft of the moving motor (19).

5. The wafer stripping support mechanism according to claim 4, characterized in that: The output shaft of the mobile motor (19) is provided with a standard gear (21), a gear groove (27) is provided on the outer wall of one side of the housing (1), and a toothed plate (17) is slidably connected inside the gear groove (27), the standard gear (21) is meshed with the toothed plate (17), and one end of the toothed plate (17) is connected to the coupling (15).

6. The wafer stripping support mechanism according to claim 5, characterized in that: A fan motor (22) is fixed to the outer wall at the rear side of the housing (1) by means of bolts, and a fan blade (23) is arranged on the output shaft of the fan motor (22), and a metal filter (24) is arranged on the inner wall of the housing (1).

7. The wafer stripping support mechanism according to claim 6, characterized in that: A drainage hole (26) is provided on the outer wall of the bottom of the housing (1), and a drainage net (25) is provided on the inner wall of the drainage hole (26).

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