Silicon wafer taking and placing device

Abstract

The utility model provides a silicon wafer taking and placing device, and the device comprises a suction cup module which comprises a first suction cup mechanism and a second suction cup mechanism, the first suction cup mechanism is provided with three rows of parallel suction cup assemblies, and the second suction cup mechanism is provided with two rows of parallel suction cup assemblies; the transplanting module comprises a gantry transverse moving mechanism, a first lifting mechanism and a second lifting mechanism, the first suction cup mechanism is connected with the first lifting mechanism, the second suction cup mechanism is connected with the second lifting mechanism, and the first lifting mechanism and the second lifting mechanism are both connected with the gantry transverse moving mechanism. According to the invention, a plurality of silicon wafers can be sucked at the same time, conveying of the plurality of silicon wafers is realized, and the working efficiency is improved.

Description

Technical Field

[0001] The present application relates to a wafer picking and placing device, and in particular to a silicon wafer picking and placing device. Background Art

[0002] Crystalline silicon solar cells refer to solar cells that use silicon as the base material. In the production process of solar cells, the silicon wafers processed in the previous process need to be transferred to the next process section for processing. Therefore, after the silicon wafers are arranged on the transmission, they need to be lifted by the material taking module, and then the silicon wafers are placed in the carrier plate in turn to achieve the transportation of silicon wafers to the carrier plate. At present, most of the silicon wafers are transported by manipulators. The manipulator can generally only hold one silicon wafer at a time, and the transportation efficiency is low. Summary of the invention

[0003] The embodiment of the present application provides a silicon wafer pick-up and placement device to solve the problems existing in the related art. The technical solution is as follows:

[0004] A silicon wafer loading and unloading device, comprising:

[0005] The suction cup module comprises a first suction cup mechanism and a second suction cup mechanism, wherein the first suction cup mechanism is provided with three rows of parallel suction cup assemblies, and the second suction cup mechanism is provided with two rows of parallel suction cup assemblies;

[0006] The transplanting module comprises a gantry transverse movement mechanism, a first lifting mechanism and a second lifting mechanism. The first suction cup mechanism is connected to the first lifting mechanism, the second suction cup mechanism is connected to the second lifting mechanism, and the first lifting mechanism and the second lifting mechanism are both connected to the gantry transverse movement mechanism.

[0007] In one embodiment, it further includes a visual positioning module, which is located above the carrier placement position and can detect the position of the carrier transported to the carrier placement position.

[0008] In one embodiment, the visual positioning module includes a plurality of visual positioning cameras, and the plurality of visual positioning cameras are respectively located on two opposite sides of the gantry transverse movement mechanism, and the shooting directions of the plurality of visual positioning cameras are toward the carrier placement position.

[0009] In one embodiment, the silicon wafer picking and placing device also includes an alignment module, which is connected to the first lifting mechanism and / or the second lifting mechanism. The alignment module includes at least a first alignment mechanism, which is connected to the suction cup assembly of the first suction cup mechanism, and the first alignment mechanism can adjust the position of the suction cup assembly.

[0010] In one embodiment, the alignment module further includes a second alignment mechanism, wherein the second alignment mechanism is connected to the suction cup assembly of the second suction cup mechanism, and the second alignment mechanism can adjust the position of the suction cup assembly of the second suction cup mechanism.

[0011] In one embodiment, the first alignment mechanism and the second alignment mechanism both include an X-axis alignment component, a Y-axis alignment component and an R-axis rotation component, the X-axis alignment component is connected to the suction cup component, the R-axis rotation component is connected to the X-axis alignment component, and the Y-axis alignment component is connected to the Y-axis alignment component.

[0012] In one embodiment, the X-axis alignment assembly includes an X-axis alignment seat, and an X-axis driving cylinder, an X-axis linear guide and an X-axis alignment plate arranged on the X-axis alignment seat, an X-axis slider is slidably arranged on the X-axis linear guide, the X-axis driving cylinder is connected to the X-axis slider, the X-axis alignment plate is connected to the X-axis slider, and the suction cup assembly is connected to the X-axis alignment plate.

[0013] In one embodiment, the R-axis rotation assembly includes an R-axis adjustment plate and a rotation motor, the R-axis adjustment plate is connected to the X-axis alignment assembly, the rotation motor is connected to the R-axis adjustment plate, and the rotation motor drives the R-axis adjustment plate to rotate.

[0014] In one embodiment, the Y-axis alignment assembly includes a Y-axis alignment seat and a Y-axis linear module, the Y-axis linear module is connected to the Y-axis alignment seat, and the Y-axis alignment seat is connected to the R-axis rotation assembly.

[0015] In one embodiment, the silicon wafer pick-and-place device further includes a Z-axis moving component, wherein the Z-axis moving component is connected to the third suction cup component of the second alignment mechanism, and the Z-axis moving component is connected to the X-axis alignment seat.

[0016] The advantages or beneficial effects of the above technical solution include at least:

[0017] The present application is provided with a suction cup module and a transfer module on the silicon wafer pick-up and placement device. The first suction cup mechanism is provided with three rows of suction cup assemblies arranged in parallel, and the second suction cup mechanism is provided with two rows of suction cup assemblies arranged in parallel. When transferring the silicon wafer to the carrier, the carrier is first moved to the carrier placement position, and then the gantry transverse movement mechanism drives the transfer module to move above the silicon wafer, and then the first lifting mechanism drives the first suction cup mechanism to move downward to absorb the silicon wafer, and the second lifting mechanism drives the second suction cup mechanism to move downward to absorb the silicon wafer. After the first suction cup mechanism and the second suction cup mechanism absorb the silicon wafer, the gantry transverse movement mechanism drives the suction cup module to move above the carrier placement position and places the silicon wafer in the corresponding position. Since the first suction cup mechanism is provided with three rows of suction cup assemblies arranged in parallel, and the second suction cup mechanism is provided with two rows of suction cup assemblies arranged in parallel, multiple silicon wafers can be sucked at the same time, and the transportation of multiple silicon wafers is realized, thereby improving work efficiency.

[0018] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0020] Figure 1 This is a diagram showing the use status of a silicon wafer pick-and-place device;

[0021] Figure 2 It is a schematic diagram of the structure of a silicon wafer pick-up and placement device;

[0022] Figure 3 It is a schematic diagram of the combination of the alignment module and the suction cup assembly;

[0023] Description of reference numerals:

[0024] 1. Suction cup module; 2. Transfer module; 10. First suction cup mechanism; 11. Second suction cup mechanism; 12. Suction cup assembly; 20. Gantry transverse movement mechanism; 21. First lifting mechanism; 22. Second lifting mechanism; 3. Silicon wafer; 4. Carrier; 101. Suction cup fixing plate; 102. Suction cup; 5. Visual positioning module; 50. Visual positioning camera; 6. Alignment module; 60. X-axis alignment assembly; 61. Y-axis alignment assembly; 62. R-axis rotation assembly; 601. X-axis alignment seat; 602. X-axis driving cylinder; 603. X-axis linear guide; 604. X-axis alignment plate; 620. R-axis adjustment plate; 621. Rotating motor; 610. Y-axis alignment seat; 611. Y-axis linear module; 7. Z-axis moving assembly; 8. Fixed assembly. DETAILED DESCRIPTION

[0025] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0026] like Figures 1 to 3 As shown, an embodiment of the present application provides a silicon wafer pick-up and placement device, which can be used for the pick-up, placement and transfer of half-wafers. The silicon wafer pick-up and placement device includes a suction cup module 1 and a transfer module 2, wherein the suction cup module 1 includes a first suction cup mechanism 10 and a second suction cup mechanism 11, and the first suction cup mechanism 10 is provided with three rows of parallel suction cup assemblies 12, and the second suction cup mechanism 11 is provided with two rows of parallel suction cup assemblies 12. The transfer module includes a gantry transverse movement mechanism 20, a first lifting mechanism 21 and a second lifting mechanism 22. The first suction cup mechanism 10 is connected to the first lifting mechanism 21, the second suction cup mechanism 11 is connected to the second lifting mechanism 22, and the first lifting mechanism 21 and the second lifting mechanism 22 are both connected to the gantry transverse movement mechanism 20.

[0027] Since the first lifting mechanism 21 is connected to the first suction cup mechanism 10, and the second suction cup mechanism 11 is connected to the second lifting mechanism 22, the first lifting mechanism 21 drives the first suction cup mechanism 10 to rise and fall, and the second lifting mechanism 22 drives the second suction cup mechanism 11 to rise and fall. After the first suction cup mechanism 10 and the second suction cup mechanism 11 suck the silicon wafer 3, the gantry transverse movement mechanism 20 can drive the first suction cup mechanism 10 and the second suction cup mechanism 11 to move above the carrier 4.

[0028] The present application provides a suction cup module 1 and a transfer module 2 on the silicon wafer pick-up and placement device, and the first suction cup mechanism 10 is provided with three rows of parallel suction cup assemblies 12, and the second suction cup mechanism 11 is provided with two rows of parallel suction cup assemblies 12. When transferring the silicon wafer 3 to the carrier 4, the carrier 4 is first moved to the carrier placement position, and then the gantry transverse movement mechanism 20 drives the suction cup module 1 to move above the silicon wafer 3, and then the first lifting mechanism 21 drives the first suction cup mechanism 10 to move downward to absorb the silicon wafer 3, and the second lifting mechanism 22 drives the second suction cup mechanism 11 to move downward to absorb the silicon wafer 3. After the first suction cup mechanism 10 and the second suction cup mechanism 11 absorb the silicon wafer 3, the gantry transverse movement mechanism 20 drives the suction cup module 1 to move above the carrier placement position, and the silicon wafer 3 is placed in the corresponding position. Since the first suction cup mechanism 10 is provided with three parallel rows of suction cup assemblies 12 and the second suction cup mechanism 11 is provided with two parallel rows of suction cup assemblies 12, multiple silicon wafers 3 can be sucked up at the same time, thereby realizing the transportation of multiple silicon wafers 3 and improving work efficiency.

[0029] In order to achieve the lateral movement of the first suction cup mechanism 10 and the second suction cup mechanism 11, in one embodiment, the gantry lateral movement mechanism 20 can be an existing linear module, and the first suction cup mechanism 10 and the second suction cup mechanism 11 are driven to lateral movement by the linear module. In order to achieve the lifting and lowering of the first suction cup mechanism 10 and the second suction cup mechanism 11, in one embodiment, the first lifting mechanism 21 and the second lifting mechanism 22 have the same structure, and the first lifting mechanism 21 and the second lifting mechanism 22 can also be existing linear modules, and the first suction cup mechanism 10 and the second suction cup mechanism 11 are driven to lift and lower by the linear module. Preferably, the linear module of the gantry lateral movement mechanism 20 can be driven by a motor, and the linear modules of the first lifting mechanism 21 and the second lifting mechanism 22 can be driven to move by the rotation of a ball screw.

[0030] In one embodiment, in order to achieve the adsorption of the silicon wafer 3, the suction cup assembly 12 of the first suction cup mechanism 10 and the second suction cup mechanism 11 includes a suction cup fixing plate 101 and a plurality of suction cups 102, and the plurality of suction cups 102 are arranged in two rows along the Y-axis direction of the suction cup fixing plate 101. When the silicon wafer 3 is sucked by the suction cup assembly 12, the two rows of suction cups 102 on the suction cup assembly 12 are sucked at the same time, so that the suction cups 102 are sucked more firmly.

[0031] In one embodiment, in order to make the position of the silicon wafer 3 placed on the carrier 4 more accurate, the silicon wafer placement device also includes a visual positioning module 5. The visual positioning module 5 is located above the carrier placement position, and the visual positioning module 5 can detect the position of the carrier 4 transported to the carrier placement position. Further, the visual positioning module 5 includes a plurality of visual positioning cameras 50, and the plurality of visual positioning cameras 50 are respectively located on opposite sides of the gantry transverse movement mechanism 20, and the shooting directions of the plurality of visual positioning cameras 50 are toward the carrier placement position. Preferably, the above-mentioned visual positioning camera 50 is an existing CCD industrial camera, and the placement position of the carrier 4 is detected by the CCD industrial camera, and the position of the silicon wafer 3 can be adjusted according to the detection result.

[0032] In order to adjust the position of the silicon wafer 3 after suction, the silicon wafer placement device further includes an alignment module 6, which is connected to the first lifting mechanism 21 and / or the second lifting mechanism 22. The alignment module 6 includes at least a first alignment mechanism, which is connected to the suction cup assembly 12 of the first suction cup mechanism 10, and the first alignment mechanism can adjust the position of the suction cup assembly 12. The alignment module 6 also includes a second alignment mechanism, which is connected to the suction cup assembly 12 of the second suction cup mechanism 11, and the second alignment mechanism can adjust the position of the suction cup assembly 12 of the second suction cup mechanism 11.

[0033] The alignment module 6 can adjust the position of the suction cup assembly 12 in the X-axis, Y-axis and Z-axis directions. In order to achieve the adjustment in the X-axis, Y-axis and Z-axis directions, the first alignment mechanism and the second alignment mechanism of the present application both include an X-axis alignment assembly 60, a Y-axis alignment assembly 61 and an R-axis rotation assembly 62. The X-axis alignment assembly 60 is connected to the suction cup assembly 12, the R-axis rotation assembly 62 is connected to the X-axis alignment assembly 60, and the Y-axis alignment assembly 61 is connected to the R-axis rotation assembly 62. The X-axis alignment assembly 60 adjusts the position of the suction cup assembly 12 in the X-axis direction, the R-axis rotation assembly 62 drives the suction cup assembly 12 to rotate, and the Y-axis alignment assembly 61 adjusts the position of the suction cup assembly 12 in the Y-axis direction.

[0034] In order to achieve the adjustment in the X-axis direction, the X-axis alignment assembly 60 includes an X-axis alignment seat 601, and an X-axis driving cylinder 602, an X-axis linear guide 603 and an X-axis alignment plate 604 arranged on the X-axis alignment seat 601. Among them, an X-axis slider is slidably arranged on the X-axis linear guide 603, the X-axis driving cylinder 602 is connected to the X-axis slider, the X-axis alignment plate 604 is connected to the X-axis slider, the suction cup assembly 12 is connected to the X-axis alignment plate 604, and the X-axis driving cylinder 602 drives the X-axis alignment plate 604 to move on the X-axis linear guide 603 through the X-axis slider.

[0035] One of the suction cup assemblies 12 of the second lifting mechanism 22 is connected to the X-axis alignment plate 604, and the other suction cup assembly 12 is connected to the suction cup assembly 12 via a fixing assembly 8. In one embodiment, the fixing assembly 8 includes two fixing seats, and the two fixing seats are respectively connected to the two suction cup assemblies 12, and the two suction cup assemblies 12 are fixedly connected via screws.

[0036] The first lifting mechanism 21 has three suction cup assemblies 12, which may be the first suction cup assembly 12, the second suction cup assembly 12 and the third suction cup assembly 12 in sequence. The X-axis alignment plate 604 is connected to the first suction cup assembly 12, and the first suction cup assembly 12 and the second suction cup assembly 12 are fixedly connected via the fixing assembly 8. When the X-axis alignment assembly 60 is started, the positions of the first suction cup assembly 12 and the second suction cup assembly 12 in the X-axis direction can be adjusted.

[0037] In order to realize the rotation of the suction cup assembly 12, the R-axis rotation assembly 62 includes an R-axis adjustment plate 620 and a rotating motor 621, wherein the R-axis adjustment plate 620 is connected to the X-axis alignment seat 601 of the X-axis alignment assembly 60, and the rotating motor 621 is connected to the R-axis adjustment plate 620, and the rotating motor 621 drives the R-axis adjustment plate 620 to rotate. Preferably, the rotating motor 621 can be a servo motor. The third suction cup assembly 12 of the first lifting mechanism 21 is connected to the X-axis alignment seat 601. The rotating motor 621 drives the R-axis adjustment plate 620 to be connected, thereby driving the suction cup assembly 12 to rotate.

[0038] In order to adjust the position of the suction cup assembly 12 in the Y-axis direction, the Y-axis alignment assembly 61 includes a Y-axis alignment seat 610 and a Y-axis linear module 611. The Y-axis linear module 611 is connected to the Y-axis alignment seat 610, and the Y-axis alignment seat 610 is connected to the R-axis rotation assembly 62. The Y-axis linear module 611 drives the Y-axis alignment seat 610 to move in the Y-axis direction, thereby driving the R-axis rotation assembly 62, the X-axis alignment assembly 60 and the suction cup assembly 12 to move in the Y-axis direction. The Y-axis alignment assembly 61 is connected to the transfer module 2. Preferably, there are two Y-axis linear modules 611.

[0039] In one embodiment, the silicon wafer pick-and-place device further includes a Z-axis moving assembly 7, which is connected to the third suction cup assembly 12 of the second alignment mechanism, and the Z-axis moving assembly 7 is connected to the X-axis alignment seat 601. Preferably, the Z-axis moving assembly 7 drives the third suction cup assembly 12 to move in the Z-axis direction through a cylinder and a slide rail.

[0040] The working principle of the silicon wafer pick-and-place device of the present application is as follows:

[0041] First, the carrier 4 is moved to the carrier placement position, and then the position of the carrier 4 is detected by the visual positioning module 5. Then, the gantry transverse movement mechanism 20 drives the suction cup module 1 to move to the predetermined position above the silicon wafer 3, and the first lifting mechanism 21 drives the first suction cup mechanism 10 to move downward, and the second lifting mechanism 22 drives the second suction cup mechanism 11 to move downward. Then, the first and second suction cup assemblies 12 of the first suction cup mechanism 10 suck the silicon wafer 3, and at the same time, the two suction cup assemblies 12 of the second suction cup mechanism 11 also suck the silicon wafer 3, and then the suction cup module 1 is driven by the gantry carrier module 2 to move to the single-row predetermined position above the silicon wafer 3, and the first lifting mechanism 21 drives the first suction cup mechanism 10 to move downward, and then the third suction cup assembly 12 of the first suction cup mechanism 10 sucks the silicon wafer 3, and after the suction cup sucks the silicon wafer 3, the position of the suction cup assembly 12 is adjusted according to the data fed back by the visual positioning module 5, and after the position is adjusted, the suction cup module 1 is moved to the carrier placement position by the gantry transverse movement mechanism 20, and the silicon wafer 3 is placed on the carrier 4. Then repeat the action until the placement of the silicon wafer 3 is completed.

[0042] In the present application, the first suction cup assembly 12 and the second suction cup assembly 12 of the first suction cup mechanism 10 can simultaneously pick up and place wafers, and the third suction cup assembly 12 is used to fill the single-row silicon wafer position in the carrier 4. The present application can improve the placement accuracy of the silicon wafer 3 through visual positioning and position adjustment. Since the automatic placement of the silicon wafer 3 can be realized, the degree of automation is high, and the work efficiency is greatly improved.

[0043] In one embodiment, when the suction cup module 1 sucks the silicon wafer 3, the first suction cup assembly 12 and the second suction cup assembly 12 of the first suction cup mechanism 10 can simultaneously suck the silicon wafer 3 at the first and second silicon wafer placement positions, and the third suction cup assembly 12 sucks the silicon wafer 3 at the third silicon wafer placement position. The suction cup assembly 12 of the second suction cup mechanism 11 simultaneously sucks the silicon wafer 3 at the fifth and sixth silicon wafer placement positions. The silicon wafers 3 at the third silicon wafer placement position and the fourth silicon wafer placement position are taken alternately.

[0044] It should be noted that the suction cup of the suction cup assembly 12 absorbs the silicon wafer 3 through vacuum adsorption.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A silicon wafer loading and unloading device, characterized in that: include: The suction cup module comprises a first suction cup mechanism and a second suction cup mechanism, wherein the first suction cup mechanism is provided with three rows of parallel suction cup assemblies, and the second suction cup mechanism is provided with two rows of parallel suction cup assemblies; The transplanting module comprises a gantry transverse movement mechanism, a first lifting mechanism and a second lifting mechanism. The first suction cup mechanism is connected to the first lifting mechanism, the second suction cup mechanism is connected to the second lifting mechanism, and the first lifting mechanism and the second lifting mechanism are both connected to the gantry transverse movement mechanism.

2. The silicon wafer loading and unloading device according to claim 1, characterized in that: It also includes a visual positioning module, which is located above the carrier placement position and can detect the position of the carrier transported to the carrier placement position.

3. The silicon wafer loading and unloading device according to claim 2, characterized in that: The visual positioning module includes a plurality of visual positioning cameras, which are respectively located on two opposite sides of the gantry transverse movement mechanism, and the shooting directions of the plurality of visual positioning cameras are toward the carrier placement position.

4. The silicon wafer loading and unloading device according to any one of claims 1 to 3, characterized in that: The silicon wafer picking and placing device also includes an alignment module, which is connected to the first lifting mechanism and / or the second lifting mechanism. The alignment module at least includes a first alignment mechanism, which is connected to the suction cup assembly of the first suction cup mechanism. The first alignment mechanism can adjust the position of the suction cup assembly.

5. The silicon wafer loading and unloading device according to claim 4, characterized in that: The alignment module also includes a second alignment mechanism, which is connected to the suction cup assembly of the second suction cup mechanism, and the second alignment mechanism can adjust the position of the suction cup assembly of the second suction cup mechanism.

6. The silicon wafer loading and unloading device according to claim 5, characterized in that: The first alignment mechanism and the second alignment mechanism both include an X-axis alignment component, a Y-axis alignment component and an R-axis rotation component. The X-axis alignment component is connected to the suction cup component, the R-axis rotation component is connected to the X-axis alignment component, and the Y-axis alignment component is connected to the R-axis rotation component.

7. The silicon wafer loading and unloading device according to claim 6, characterized in that: The X-axis alignment assembly includes an X-axis alignment seat, and an X-axis driving cylinder, an X-axis linear guide and an X-axis alignment plate arranged on the X-axis alignment seat, an X-axis slider is slidably arranged on the X-axis linear guide, the X-axis driving cylinder is connected to the X-axis slider, the X-axis alignment plate is connected to the X-axis slider, and the suction cup assembly is connected to the X-axis alignment plate.

8. The silicon wafer loading and unloading device according to claim 6, characterized in that: The R-axis rotating assembly includes an R-axis adjusting plate and a rotating motor. The R-axis adjusting plate is connected to the X-axis alignment assembly. The rotating motor is connected to the R-axis adjusting plate. The rotating motor drives the R-axis adjusting plate to rotate.

9. The silicon wafer loading and unloading device according to claim 6, characterized in that: The Y-axis alignment assembly includes a Y-axis alignment seat and a Y-axis linear module, the Y-axis linear module is connected to the Y-axis alignment seat, and the Y-axis alignment seat is connected to the R-axis rotation assembly.

10. The silicon wafer loading and unloading device according to claim 7, characterized in that: The silicon wafer pick-and-place device also includes a Z-axis moving component, which is connected to the third suction cup component of the second alignment mechanism, and the Z-axis moving component is connected to the X-axis alignment seat.

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