Wafer carrying mechanism and wafer thinning equipment

Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer carrying mechanism and wafer thinning equipment, the wafer carrying mechanism comprises a base, a clamping assembly and an adsorption assembly, the clamping assembly is arranged on the base, at least two power output ends of the clamping assembly can be close to each other to clamp a wafer, and the adsorption assembly is arranged on the base. Or can be far away from each other to release the wafer; the adsorption end of the adsorption assembly can adsorb a wafer, and in the vertical direction, the adsorption end of the adsorption assembly and the power output end of the clamping assembly are located on the two sides of the base respectively. By means of the arrangement, the wafer carrying mechanism has the clamping function and the adsorption function at the same time, the occupied space is small, the wafer carrying mechanism can be conveniently installed in wafer thinning equipment which is more compact in structural layout, and miniaturization of the wafer thinning equipment can be achieved easily.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer transport mechanism and wafer thinning equipment. Background Art

[0002] Wafer thinning is an important process in the chip packaging process. It can effectively reduce the chip packaging volume and improve the chip's thermal diffusion efficiency. In the wafer thinning equipment, the dry wafers to be processed need to be moved in and placed on the processing work surface, and the wet wafers that have been processed need to be moved out. For the movement of dry wafers, no positional offset is allowed during the process of grabbing and putting down; for the movement of processed wet wafers, a large amount of chemicals and / or wafer abrasive particles are attached to their surface, and a reasonable method is required to carry them. At present, the general method is to perform the above operations through two manipulators. The two manipulators occupy a large space and the space utilization rate is not high. It is easy to cause the overall size of the equipment to be larger, and higher requirements are put on the overall framework of the equipment, resulting in high overall costs. It cannot be adapted to wafer thinning equipment with a more compact functional structure layout.

[0003] Based on this, a reasonable transport structure and method are urgently needed to solve the problems mentioned above. Utility Model Content

[0004] The utility model aims to provide a wafer transport mechanism and a wafer thinning device to solve the problem in the prior art that sufficient installation space cannot be provided for two manipulators in a wafer thinning device with a more compact functional structure layout.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A wafer transport mechanism, comprising:

[0007] Pedestal;

[0008] A clamping assembly, the clamping assembly is disposed on the base, and at least two power output ends of the clamping assembly can move closer to each other to clamp the wafer, or can move away from each other to release the wafer;

[0009] The adsorption component has an adsorption end capable of adsorbing the wafer. In the vertical direction, the adsorption end of the adsorption component and the power output end of the clamping component are located on both sides of the base.

[0010] In some embodiments, the clamping assembly comprises:

[0011] A fixed clamping jaw, wherein the fixed clamping jaw is fixed to the base;

[0012] The movable clamping jaw is movably arranged on the base and can be close to or away from the fixed clamping jaw.

[0013] In some embodiments, the clamping assembly includes a clamping drive member, the clamping drive member is disposed on the base, and the movable clamping jaw is disposed at an output end of the clamping drive member.

[0014] In some embodiments, the movable jaws are provided with at least two, the base includes a basic portion, the basic portion extends along a first direction, the movable jaws are provided on the basic portion, and each of the movable jaws is located on both sides of the basic portion along a second direction, and each of the movable jaws is connected to the output end of the clamping drive member through a transfer member; and / or

[0015] The clamping driving member and the clamping ends of the movable clamping claws are located on two sides of the base.

[0016] In some embodiments, the fixed jaw is columnar, and a fixed groove is provided at one end of the fixed jaw away from the base. The movable jaw is columnar, and a movable groove is provided at one end of the movable jaw away from the base. When the wafer is clamped by the fixed jaw and the movable jaw, it is located in the fixed groove and the movable groove.

[0017] In some embodiments, the clamping assembly includes a positioning member, one end of which is connected to the base, and when the wafer is located in the fixed groove and the movable groove, the wafer abuts against the other end of the positioning member.

[0018] In some embodiments, the adsorption assembly comprises:

[0019] An adsorption member, which is slidably disposed on the base along the vertical direction and can move between an initial position and an adsorption position;

[0020] An elastic member is disposed between the adsorption member and the base, and applies elastic force to the adsorption member to stop the adsorption member at an initial position.

[0021] In some embodiments, the wafer handling mechanism includes a robot, the base is disposed at a terminal power output end of the robot, and the robot drives the base to rotate around a first direction so that the wafer rotates a preset angle.

[0022] A wafer thinning device comprises a positioning component, a processing component, a cleaning component and the above-mentioned wafer transport mechanism.

[0023] The beneficial effects of the utility model are:

[0024] The utility model provides a wafer handling mechanism and wafer thinning equipment. The wafer handling mechanism comprises a base and a clamping component and an adsorption component arranged on both sides of the base, so that a wafer handling mechanism has the functions of clamping and adsorption at the same time, can be turned over for operation on the front and back sides, uses different structures for different processes, has flexible switching, high degree of integration, small size, and convenient operation; occupies little space, is easy to be installed in a wafer thinning equipment with a more compact structural layout, and helps to realize the miniaturization of the wafer thinning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a structural schematic diagram of a wafer transport mechanism from a first viewing angle in an embodiment of the utility model;

[0026] Figure 2 It is a structural schematic diagram of the wafer transport mechanism from a second viewing angle in an embodiment of the utility model;

[0027] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0028] Figure 4 It is a schematic diagram of the structure of the wafer thinning equipment in the embodiment of the utility model.

[0029] In the figure:

[0030] 1000, wafer;

[0031] 100, base; 110, basic part; 111, avoidance hole; 120, branch part;

[0032] 200, clamping assembly; 210, fixed clamping jaw; 211, fixed groove; 220, movable clamping jaw; 230, clamping driving member; 231, power air pipe; 240, positioning member; 241, positioning body; 242, positioning head;

[0033] 300, adsorption assembly; 310, adsorption member; 311, adsorption plate; 312, support tube; 320, elastic member; 330, joint;

[0034] 400. Robots;

[0035] 510, positioning assembly; 520, processing assembly; 530, cleaning assembly; 531, cleaning tray. DETAILED DESCRIPTION

[0036] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] like Figures 1 to 4As shown, the present embodiment provides a wafer transport mechanism, which includes a base 100, a clamping assembly 200 and an adsorption assembly 300, wherein the clamping assembly 200 is arranged on the base 100, and at least two power output ends of the clamping assembly 200 can be close to each other to clamp the wafer 1000, or can be away from each other to release the wafer 1000; the adsorption end of the adsorption assembly 300 can adsorb the wafer 1000, and in the vertical direction, the adsorption end of the adsorption assembly 300 and the power output end of the clamping assembly 200 are separated on both sides of the base 100.

[0041] It should be explained that the wafer 1000 can be divided into the wafer 1000 to be processed and the processed wafer 1000 before and after processing. The clamping assembly 200 clamps the processed wafer 1000. The processed wafer 1000 is wet as a whole, with a large number of fine particles attached to the surface, and needs to be cleaned. The adsorption assembly 300 adsorbs the wafer 1000 to be processed, which is dry and clean as a whole.

[0042] The wafer handling mechanism includes a base 100 and a clamping assembly 200 and an adsorption assembly 300 arranged on both sides of the base 100, so that a wafer handling mechanism has the functions of clamping and adsorption at the same time, can be flipped over on the front and back sides, uses different structures for different processes, has flexible switching, a high degree of integration, a small size, and is easy to operate; it occupies a small space and is easy to be installed in a wafer thinning device with a more compact structural layout, which helps to achieve the miniaturization of the wafer thinning equipment.

[0043] Regarding the structure of the clamping assembly 200, in some embodiments, the clamping assembly 200 includes a fixed jaw 210 and a movable jaw 220, wherein the fixed jaw 210 is fixed to the base 100; the movable jaw 220 is movably arranged on the base 100 and can be close to or away from the fixed jaw 210. The above arrangement allows the clamping process to use the fixed jaw 210 as a reference, thereby ensuring the relative position of the clamped wafer 1000 and the base 100, and improving the handling accuracy of the wafer 1000. The fixed jaw 210 and the movable jaw 220 are made of the same material, both plastic.

[0044] For unloading the processed wet wafer 1000, this embodiment uses a mechanical gripper to grip the wafer 1000. The reason is that a large amount of chemical substances or wafer wear particles are attached to the surface of the processed wafer 1000. When vacuum adsorption is used for gripping, the vacuum adsorption system pipeline may be corroded or the wafer wear particles may clog the vacuum adsorption plate.

[0045] To improve the degree of automation of clamping, in some embodiments, the clamping assembly 200 includes a clamping driver 230, which is disposed on the base 100, and the movable clamping jaw 220 is disposed at the output end of the clamping driver 230. The clamping driver 230 may be a push rod motor or a cylinder.

[0046] In order to reasonably utilize the space and avoid the entire wafer handling mechanism from being too thick, in some embodiments, the clamping drive member 230 and the clamping ends of the movable clamping claw 220 are separated on both sides of the base 100. In this embodiment, the base 100 is a plate-like structure. With the arrangement of the above-mentioned structure, the thickness of the wafer handling mechanism in the direction perpendicular to the base 100 can be reduced as much as possible; in addition, the above-mentioned reduction in thickness can also reduce the weight of the entire wafer handling mechanism, thereby reducing the load of the robot 400 driving process, and further improving the operation accuracy.

[0047] The base 100 is provided with an avoidance hole 111, and a power air pipe 231 of the clamping driving member 230 is passed through the avoidance hole 111, and the other end of the power air pipe 231 and the clamping driving member 230 are separated on both sides of the base 100. The above arrangement can reduce the space requirement on the side of the base 100 where the clamping driving member 230 is provided. The other end of the power air pipe 231 is used to connect to an external air circuit.

[0048] In this embodiment, the clamping end and the adsorption end of the adsorption assembly 300 are located on both sides of the base 100 , that is, the clamping driving member 230 and the adsorption end of the adsorption assembly 300 are located on the same side of the base 100 .

[0049] In some embodiments, at least two movable jaws 220 are provided, the base 100 includes a base portion 110, the base portion 110 extends along a first direction, the movable jaws 220 are provided on the base portion 110, and each movable jaw 220 is located on both sides of the base portion 110 along a second direction, and each movable jaw 220 is connected to the output end of the clamping drive 230 through a transfer member. The above arrangement allows the clamping surface of the movable jaw 220 to be appropriately reduced, thereby reducing the weight of the movable jaw 220, thereby reducing the load of the robot 400 during the driving process, and further improving the operation accuracy. The first direction is perpendicular to the second direction.

[0050] There are at least two fixed jaws 210, and the base 100 includes at least two branches 120, each branch 120 is spaced around the basic axis of the basic part 110 and connected to the basic part 110, each fixed jaw 210 is fixed on the branch 120 accordingly, and when the wafer 1000 is clamped by the fixed jaw 210 and the movable jaw 220, the axis of the wafer 1000 coincides with the basic axis. The above arrangement allows the clamping surface of the fixed jaw 210 to be appropriately reduced. In addition, the volume and weight of the base 100 are reduced as much as possible through the arrangement of the branch 120, thereby reducing the load of the robot 400 during the driving process, making the operation more convenient, and facilitating the movement accuracy of the robot 400. Further, the branch 120 is plate-shaped and has weight-reducing holes, thereby further reducing the material used for the branch 120, reducing the weight, thereby further reducing the load of the robot 400 during the driving process, and further improving the operation accuracy.

[0051] In order to ensure the stability of the movable clamping jaw 220 during the movement process, in some embodiments, the transfer member is slidably disposed on the basic portion 110 along the first direction.

[0052] After clamping, the wafer 1000 needs to be transferred. To prevent the wafer 1000 from slipping, in some embodiments, the fixed jaw 210 is columnar, and a fixed groove 211 is provided at one end of the fixed jaw 210 away from the base 100. The movable jaw 220 is columnar, and a movable groove is provided at one end of the movable jaw 220 away from the base 100. When the wafer 1000 is clamped by the fixed jaw 210 and the movable jaw 220, it is located in the fixed groove 211 and the movable groove. Specifically, the axis of the fixed groove 211 is parallel to the axis of the wafer 1000, and the axis of the movable groove is parallel to the axis of the wafer 1000, and the wafer 1000 is located in the fixed groove 211 and the movable groove.

[0053] The above arrangement limits the freedom of the wafer 1000 perpendicular to its own axis, thereby ensuring stability during the transfer process.

[0054] The clamping assembly 200 includes a positioning member 240, one end of which is connected to the base 100, and when the wafer 1000 is located in the fixed groove 211 and the movable groove, the wafer 1000 abuts against the other end of the positioning member 240. The above arrangement allows the wafer 1000 to abut against the positioning member 240 first during the process of clamping the wafer 1000, and then the clamping drive member 230 is retracted, so that the movable clamping jaw 220 is close to the fixed clamping jaw 210, and the wafer 1000 can be clamped, so that the wafer 1000 is located in the fixed groove 211 and the movable groove. The fixed groove 211 has a fixed upper ring surface and a fixed lower ring surface that are opposite to each other, and the distance between the fixed upper ring surface and the fixed lower ring surface is greater than the thickness of the wafer 1000. The movable groove has an movable upper ring surface and an movable lower ring surface that are opposite to each other, and the distance between the movable upper ring surface and the movable lower ring surface is greater than the thickness of the wafer 1000. When the wafer 1000 is located in the fixed groove 211 and the movable groove and is not clamped, the wafer 1000 is slightly higher than the fixed upper ring surface and the movable upper ring surface. When the clamping assembly 200 moves upward, the bottom surface of the wafer 1000 abuts against the fixed lower ring surface and the movable lower ring surface. The above arrangement limits the degree of freedom of the wafer 1000 perpendicular to its own axis and the degree of freedom in the vertical direction, thereby ensuring stability during the transfer process.

[0055] In some embodiments, a plurality of positioning members 240 are provided, and each positioning member 240 is arranged at intervals around the basic axis. Specifically, at least three positioning members 240 are provided, so that the stability of the wafer 1000 can be ensured during the limiting process of the wafer 1000. Among them, the positioning member 240 is columnar, one end of the positioning member 240 is screwed to the base 100, and the other end is used to abut and position the wafer 1000. The above arrangement makes the distance between the end of the positioning member 240 abutting against the wafer 100 and the base 100 adjustable, so as to reduce the processing accuracy of the positioning member 240 and reduce the cost under the premise of ensuring accurate positioning of the wafer 1000. Among them, the locking nut is screwed to the positioning member 240, and when the locking nut abuts against the base 100, the positioning member 240 can be locked.

[0056] In some embodiments, the positioning member 240 includes a positioning body 241 and a positioning head 242. One end of the positioning body 241 is connected to the base 100. The positioning head 242 is connected to the positioning body 241. The positioning head 242 abuts against the wafer 1000, and the positioning head 242 is made of plastic. The above arrangement can ensure the connection strength between the positioning member 240 and the base 100, and can also prevent the liquid attached to the wafer 1000 from corroding the positioning member 240 and causing damage such as corrosion.

[0057] Specifically, the other end of the positioning body 241 is provided with an insertion hole, and the positioning head 242 is inserted into the insertion hole. One end of the positioning body 241 is screwed to the base 100. The locking nut is screwed to one end of the positioning body 241 and can cooperate with the base 100 to lock the positioning body 241. The positioning body 241 is made of stainless steel.

[0058] In some embodiments, the positioning end of the positioning member 240 is a ball head structure to ensure point contact with the wafer 1000, reducing the verticality requirement between the positioning member 240 and the base 100. Even if the positioning member 240 is slightly tilted, multiple positioning ends can still be adjusted to be located in the same plane, thereby ensuring positioning capability. In this embodiment, the positioning end is the end of the positioning head 242 away from the positioning body 241.

[0059] In some embodiments, the positioning member 240 includes a fixed portion and a telescopic portion, the fixed portion is fixedly connected to the base 100, the telescopic portion is slidably arranged on the fixed portion along the vertical direction, and can slide between the extended position and the retracted position, and a spring is arranged between the fixed portion and the telescopic portion, and the spring provides elastic force to keep the telescopic portion away from the fixed portion. A position sensor is arranged between the telescopic portion and the fixed portion, and when the telescopic portion moves to the retracted position, the position sensor is triggered, and when all the position sensors are triggered, the clamping drive member 230 is retracted, so that the wafer 1000 is clamped.

[0060] The position sensor is communicatively connected with the controller, and the controller controls the clamping drive member 230 to retract after receiving all the trigger signals.

[0061] In some embodiments, the adsorption component 300 includes an adsorption member 310 and an elastic member 320, wherein the adsorption member 310 is slidably disposed on the base 100 along the vertical direction and can move between an initial position and an adsorption position; the elastic member 320 is disposed between the adsorption member 310 and the base 100, and applies elastic force to the adsorption member 310 to stop the adsorption member 310 at the initial position.

[0062] By means of the above-mentioned structure, when the adsorption member 310 is located at the adsorption position, the elastic member 320 is compressed, so that the adsorption member 310 and the wafer 1000 are pressed tightly, so that the adsorption is more firm.

[0063] Among them, the adsorption member 310 includes an adsorption plate 311 and a support tube 312. The support tube 312 is slidably arranged on the base 100 along the vertical direction, and the adsorption plate 311 is arranged at one end of the support tube 312. The base 100 is provided with a sliding hole, and the support tube 312 is slidably arranged in the sliding hole, and both ends are located outside the sliding hole. The joint 330 is connected to the other end of the support tube 312 and is used to connect an external air circuit. The axis of the sliding hole coincides with the basic axis. The other end of the support tube 312 is on the same side as the clamping end of the movable clamp 220, that is, the joint 330 is on the same side as the clamping end of the movable clamp 220. In this embodiment, the elastic member 320 is a spring, and the spring is sleeved on the support tube 312, and one end abuts the base 100, and the other end abuts the adsorption plate 311.

[0064] When the suction plate 311 is in adsorption contact with the wafer 1000, a certain pressure needs to be applied to facilitate complete contact between the suction plate 311 and the surface of the wafer 1000. However, in this case, there is a risk of crushing the wafer 1000 (made of silicon and relatively brittle). Under the action of the support tube 312 and the spring, soft contact between the suction plate 311 and the wafer 1000 is achieved to avoid crushing the wafer 1000.

[0065] Combined with the above-mentioned arrangement of the power air pipe 231 of the clamping drive 230 , the connector 330 and the other end of the power air pipe 231 are located on the same side of the base 100 , thereby facilitating communication with an external air circuit and reducing the need for pipelines.

[0066] Regarding the structure of the adsorption disk 311 , specifically, the adsorption disk 311 is a porous ceramic disk; the porous ceramic disk is fixedly disposed on a base in a cavity, and the bottom of the base is connected to the support tube 312 through-connection.

[0067] For the movement of the dry wafer 1000, this embodiment adopts an adsorption method to realize the grabbing and placing of the wafer 1000, which can ensure good precision, so that the center of the wafer 1000 coincides with the center of the workbench on the processing component 520 after the centering process, so as to meet the process requirements of high-precision processing. The process requirements do not allow position deviation, otherwise the processing of the wafer 1000 cannot meet the requirements and cause waste.

[0068] In order to realize the transfer of the wafer 1000 between various workstations, in some embodiments, the wafer handling mechanism includes a robot 400, and the base 100 is arranged at the end power output end of the robot 400. The robot 400 drives the base 100 to rotate around a first direction so that the wafer 1000 rotates a preset angle. Considering that the wafer handling mechanism is used in a wafer thinning device, the preset angle is 90°. In other embodiments, the preset angle can also be 30° or 60°. Among them, the robot 400 can be a five-axis or six-axis manipulator.

[0069] This embodiment also provides a wafer thinning device, which includes a positioning component 510, a processing component 520, a cleaning component 530 and the above-mentioned wafer handling mechanism. With the above-mentioned structure, the wafer 1000 can be transferred between various stations by a wafer handling mechanism, and the adsorption component 300 can not only meet the requirement of accurately placing the wafer 1000 to be processed on the processing component 520, but also clamp the processed wafer 1000 through the clamping component 200 to prevent chemical substances and abrasive particles of the wafer from entering the adsorption component 300, such as preventing the corrosive liquid used in the processing component 520 from being sucked into the pipeline of the adsorption component 300 to cause pipeline corrosion; or preventing the abrasive particles of the wafer 1000 from entering the porous ceramic suction cup of the adsorption component 300, blocking the porous ceramic suction cup, and causing the porous ceramic suction cup to fail.

[0070] In some embodiments, the positioning assembly 510, the processing assembly 520, and the cleaning assembly 530 are arranged in a triangle, and the robot 400 is located inside the triangle. The above arrangement can reduce the arm length of the robot 400 and reduce the space required for the arm movement of the robot 400, that is, reduce the installation space required for the robot 400, so that the wafer thinning equipment can be applied to more working scenarios.

[0071] The processing assembly 520 includes a carrier, which is used to carry the wafer 1000. The processing assembly 520 also includes a grinding head, which is used to grind the wafer 1000 to reduce its thickness.

[0072] In order to improve the stability of the wafer 1000 processing process, the carrier has a vacuum hole, and the wafer 1000 is placed on the carrier to cover the vacuum hole. When negative pressure gas passes through the vacuum hole, the wafer 1000 is adsorbed, and when positive pressure gas passes through the vacuum hole, the wafer 1000 is blown and is in a suspended state.

[0073] This embodiment also provides a wafer 1000 clamping method, which is applicable to the above-mentioned wafer thinning device. The wafer 1000 clamping method includes the following steps:

[0074] The adsorption assembly 300 adsorbs the wafer 1000 on the positioning assembly 510 and transfers the wafer 1000 to the processing assembly 520 .

[0075] The clamping assembly 200 clamps the wafer 1000 on the processing assembly 520 and transfers the wafer 1000 to the cleaning assembly 530 .

[0076] Among them, since the fixed jaw 210 and the movable jaw 220 of the clamping assembly 200 are respectively provided with movable grooves of the fixed groove 211, when clamping the wafer 1000, the bottom surface of the wafer 1000 needs to be higher than the end positions of the fixed jaw 210 and the movable jaw 220, that is, the bottom surface of the wafer 1000 needs to be slightly higher than the fixed lower annular surface of the fixed groove 211 and the movable lower annular surface of the movable groove. To this end, when clamping the wafer 1000 from the carrier, the following steps are specifically included:

[0077] The clamping ends of the fixed clamping jaw 210 and the movable clamping jaw 220 are both located outside the wafer 1000 and above the wafer 1000 .

[0078] The positive pressure gas passes through the vacuum hole, and the wafer 1000 moves upward and is in a suspended state. Then the movable jaw 220 approaches the fixed jaw 210, so that the wafer 1000 is located in the fixed groove 211 and the movable groove. The above method allows the wafer 1000 to be placed on the carrier as a whole, avoiding the peripheral side from being suspended in order to avoid the jaws, thereby improving the convenience and utilization of the wafer 1000 processing. Among them, when the positive pressure gas passes through the vacuum hole, the wafer 1000 moves upward and is in a suspended state, and the wafer 1000 abuts the positioning member 240. The above arrangement makes it easier to control the gas output of the positive pressure gas, thereby improving the convenience of operation.

[0079] When the movable jaw 220 approaches the fixed jaw 210, so that the wafer 1000 is located in the fixed groove 211 and the movable groove, the wafer 1000 gradually approaches the fixed jaw 210 under the push of the movable jaw 220. When the distance between the notch of the fixed jaw 210 and the notch of the movable jaw 220 is less than the diameter of the wafer 1000, and the distance between the bottom of the groove of the fixed jaw 210 and the bottom of the groove of the movable jaw 220 is greater than the diameter of the wafer 1000, the clamping assembly 200 moves upward, so that the bottom surface of the wafer 1000 abuts against the fixed lower annular surface and the movable lower annular surface, and then the movable jaw 220 is further approached to the fixed jaw 210, so as to clamp and position the wafer 1000. The above method makes the position of the wafer 1000 relative to the clamping assembly 200 unique, thereby ensuring the accuracy of the subsequent placement position.

[0080] After the wafer 1000 is clamped between the fixed clamping jaw 210 and the movable clamping jaw 220 , the clamping driving member 230 still maintains a tendency to contract, so that the wafer 1000 is clamped.

[0081] When the wafer 1000 moves to the cleaning assembly 530, it is driven by the robot 400 to rotate 90°, so that the wafer 1000 changes from a horizontal state to a vertical state, and then the wafer 1000 is moved to above the cleaning tray 531 of the cleaning assembly 530 and aligned with the V-groove of the cleaning tray 531. The clamping drive 230 is extended, the movable jaw 220 moves away from the fixed jaw 210, and the wafer 1000 slides into the cleaning tray 531.

[0082] It should be noted that the specific structures of the positioning component 510, the cleaning component 530 and the processing component 520 can also be set with reference to the equipment in the prior art, which is not the focus of this application and will not be described in detail here.

[0083] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer transport mechanism, characterized in that: include: Base (100); A clamping assembly (200), the clamping assembly (200) being arranged on the base (100), and at least two power output ends of the clamping assembly (200) being able to move closer to each other to clamp the wafer (1000), or being able to move away from each other to release the wafer (1000); An adsorption component (300), wherein the adsorption end of the adsorption component (300) can adsorb the wafer (1000), and in the vertical direction, the adsorption end of the adsorption component (300) and the power output end of the clamping component (200) are located on both sides of the base (100).

2. The wafer transport mechanism according to claim 1, characterized in that: The clamping assembly (200) comprises: A fixed clamping jaw (210), wherein the fixed clamping jaw (210) is fixed to the base (100); A movable clamping jaw (220) is movably disposed on the base (100) and can move closer to or farther from the fixed clamping jaw (210).

3. The wafer transport mechanism according to claim 2, characterized in that: The clamping assembly (200) comprises a clamping driving member (230), wherein the clamping driving member (230) is arranged on the base (100), and the movable clamping claw (220) is arranged at the output end of the clamping driving member (230).

4. The wafer transport mechanism according to claim 3, characterized in that: At least two movable clamping jaws (220) are provided, the base (100) comprises a basic portion (110), the basic portion (110) extends along a first direction, the movable clamping jaws (220) are provided on the basic portion (110), and each movable clamping jaw (220) is located on both sides of the basic portion (110) along a second direction, and each movable clamping jaw (220) is connected to an output end of the clamping driving member (230) via a transfer member; and / or The clamping drive member (230) and the clamping ends of the movable clamping jaws (220) are located on both sides of the base (100).

5. The wafer transport mechanism according to claim 4, characterized in that: The fixed clamp (210) is columnar, and a fixed groove (211) is provided at one end of the fixed clamp (210) away from the base (100). The movable clamp (220) is columnar, and a movable groove is provided at one end of the movable clamp (220) away from the base (100). When the wafer (1000) is clamped by the fixed clamp (210) and the movable clamp (220), it is located in the fixed groove (211) and the movable groove.

6. The wafer transport mechanism according to claim 5, characterized in that: The clamping assembly (200) comprises a positioning member (240), one end of which is connected to the base (100), and when the wafer (1000) is located in the fixed groove (211) and the movable groove, the wafer (1000) abuts against the other end of the positioning member (240).

7. The wafer transport mechanism according to any one of claims 1 to 6, characterized in that: The adsorption assembly (300) comprises: An adsorption member (310), the adsorption member (310) being slidably disposed on the base (100) along the vertical direction and being movable between an initial position and an adsorption position; An elastic member (320) is disposed between the adsorption member (310) and the base (100) and applies elastic force to the adsorption member (310) so as to stop the adsorption member (310) at an initial position.

8. The wafer transport mechanism according to any one of claims 1 to 6, characterized in that: The wafer handling mechanism comprises a robot (400), the base (100) is arranged at a terminal power output end of the robot (400), and the robot (400) drives the base (100) to rotate around a first direction so that the wafer (1000) rotates a preset angle.

9. A wafer thinning device, characterized in that: It comprises a positioning component (510), a processing component (520), a cleaning component (530) and a wafer transport mechanism as described in any one of claims 1 to 8.

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