Lead frame with hidden soldering tin pins

Abstract

The utility model discloses a lead frame with hidden soldering tin pins, which relates to the technical field of lead frames and comprises a frame body, the two sides of the lower end of the frame body are provided with pins, the lower end of the frame body is provided with bonding pads, the bonding pads are symmetrically arranged at the lower end of the frame body, and plastic frames are arranged on the peripheries of the bonding pads. The pins are arranged between the frame body and the plastic frame. According to the lead frame with the hidden soldering tin pins, the pins are arranged between the frame body and the plastic frame and are hidden, so that the installation space on a circuit board can be saved, the distance between adjacent elements is reduced, and the number of elements in a unit area is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of lead frames, in particular to a solder foot hidden type lead frame. Background Art

[0002] Lead frame is the basic material for semiconductor IC and device molded packaging. It mainly consists of two parts: chip pad and pin. The chip pad provides mechanical support for the chip during the packaging process, while the pin is the electrical and thermal path connecting the chip to the outside of the package.

[0003] However, the pins on the traditional lead frame are protruding. When the components are installed on the circuit board, the space where the pins protrude will affect the space on the circuit board, so that the number of components in a fixed unit is relatively small, and the protruding pins will cause the solder joints of the pins to fall off, thereby affecting the use of electronic products. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a solder pin hidden lead frame, which solves the problems raised by the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a solder foot hidden lead frame, including a frame body, pins are arranged on both sides of the lower end of the frame body, a soldering pad is arranged at the lower end of the frame body, the soldering pad is symmetrically arranged at the lower end of the frame body, and a plastic frame is arranged around the soldering pad, and the pins are arranged between the frame body and the plastic frame.

[0006] Furthermore, a cup opening is formed at the upper end of the frame body, a cup bottom is formed at the lower end of the frame body, and the cup opening and the cup bottom are inclined.

[0007] Furthermore, the outer end of the pin is arranged flush with the outer end of the plastic frame.

[0008] Furthermore, the lower end surface of the soldering pad is arranged flush with the lower end surface of the plastic frame.

[0009] Furthermore, the two solder pads are separated by a plastic frame.

[0010] Furthermore, the outer end of the frame body is arranged as an inclined surface.

[0011] The utility model provides a solder foot hidden lead frame. Compared with the prior art, it has the following beneficial effects:

[0012] The solder pin hidden lead frame hides the pins by arranging the pins between the frame body and the plastic frame, thereby saving installation space on the circuit board, reducing the spacing between adjacent components, and increasing the number of components per unit area. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the utility model;

[0014] Figure 2 It is a schematic diagram of the structure of the pin, pad and plastic frame of the utility model;

[0015] Figure 3 It is a structural schematic diagram of the frame body, pins and cup bottom of the utility model.

[0016] In the figure: 1. Frame body; 2. Plastic frame; 3. Pins; 4. Solder pads; 5. Cup mouth; 6. Cup bottom. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-3 The utility model provides a technical solution: a solder foot hidden lead frame, comprising a frame body 1, pins 3 are arranged on both sides of the lower end of the frame body 1, and a pad 4 is arranged at the lower end of the frame body 1, the pad 4 is symmetrically arranged at the lower end of the frame body 1, and a plastic frame 2 is arranged at the periphery of the pad 4, and the pin 3 is arranged between the frame body 1 and the plastic frame 2; by arranging the pins 3 on both sides of the lower end of the frame body 1, a plastic frame 2 is arranged at the lower end of the frame body 1, the pad 4 is arranged inside the plastic frame 2, and the pin 3 is arranged between the frame body 1 and the plastic frame 2, the pin 3 can be hidden inside through the combination of the upper and lower layers, so that the pin 3 does not protrude, so that the spacing between adjacent components can be reduced, thereby increasing the number of components per unit area.

[0019] like Figure 1As shown, the upper end of the frame body 1 is provided with a cup mouth 5, and the lower end of the frame body 1 is provided with a cup bottom 6, and the cup mouth 5 and the cup bottom 6 are arranged obliquely; the shape design of the cup mouth 5 and the cup bottom 6 can increase the filling volume inside the frame body 1, and can increase the packaging material to fill the internal space of the frame body 1, so that this can not only better wrap and protect the LED chip, prevent mechanical impact and environmental factors from damage, but also provide better optical performance, such as light refraction, scattering and focusing effects; and the larger cup bottom 6 can increase the contact area with the heat sink, help improve the heat transfer path, reduce the heat accumulation generated when the LED is working, thereby improving the heat dissipation efficiency, and is conducive to extending the service life of the LED and stabilizing the working state; with the development of LED chip technology, the chip size may gradually increase to improve the luminous efficiency or power. The larger cup mouth 5 and cup bottom 6 can adapt to the packaging of LED chips of larger sizes and meet the application requirements of higher brightness and power.

[0020] like Figure 1 As shown, the outer end of the pin 3 is flush with the outer end of the plastic frame 2; the pin 3 is arranged between the plastic frame 2 and the frame body 1, and the outer end face of the pin 3 is flush with the outer end of the plastic frame 2, which can reduce the risk of solder joint breakage due to mechanical stress, improve the vibration resistance and durability of the electronic product, and at the same time, reduce the problem of poor electrical contact caused by deformation of the pin 3; and the flushness of the pin 3 with the LED body can reduce potential electromagnetic interference, because the flush design usually means less exposed metal parts, which helps to improve the electromagnetic compatibility of the entire circuit board.

[0021] like Figure 2 As shown, the lower end surface of the soldering pad 4 is flush with the lower end surface of the plastic frame 2; the setting of the plastic frame 2 can provide additional mechanical support for the solder joints to prevent the solder joints from being damaged or broken due to force during operation, transportation or installation, thereby increasing the stability of the package, and the plastic frame 2 is flush with the lower end surface of the soldering pad 4, which can effectively block moisture and prevent oxidation corrosion of the solder joints, while providing good insulation performance to ensure electrical safety.

[0022] like Figure 2 As shown, two pads 4 are separated by a plastic frame 2; the plastic frame 2 can prevent solder from flowing beyond a predetermined area, thereby keeping the pads 4 clean and the shape of the solder joints, and ensuring the welding quality. The plastic frame 2 is made of a polymer resin, and the plastic frame 2 made of a polymer resin can improve the component's tolerance to high temperatures, and protect the solder joints and surrounding circuits from being damaged by high temperatures during the welding process.

[0023] like Figure 1As shown, the outer end of the frame body 1 is set as an inclined surface. The outer end of the frame body 1 is set inclined, which can facilitate the operation from top to bottom when welding the pins 3, thereby improving the welding efficiency of the pins 3.

[0024] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A solder foot hidden lead frame, comprising a frame body (1), characterized in that: Pins (3) are arranged on both sides of the lower end of the frame body (1), a soldering pad (4) is arranged at the lower end of the frame body (1), the soldering pad (4) is symmetrically arranged at the lower end of the frame body (1), and a plastic frame (2) is arranged at the periphery of the soldering pad (4), and the pins (3) are arranged between the frame body (1) and the plastic frame (2).

2. The solder foot hidden lead frame according to claim 1, characterized in that: The upper end of the frame body (1) is provided with a cup opening (5), the lower end of the frame body (1) is provided with a cup bottom (6), and the cup opening (5) and the cup bottom (6) are arranged obliquely.

3. The solder foot hidden lead frame according to claim 1, characterized in that: The outer end of the pin (3) is arranged flush with the outer end of the plastic frame (2).

4. The solder foot hidden lead frame according to claim 1, characterized in that: The lower end surface of the welding pad (4) is arranged flush with the lower end surface of the plastic frame (2).

5. The solder foot hidden lead frame according to claim 1, characterized in that: The two welding pads (4) are separated by a plastic frame (2).

6. The solder foot hidden lead frame according to claim 1, characterized in that: The outer end of the frame body (1) is arranged as an inclined surface.

Images