Radio frequency PCB, integrated circuit board and electronic device

Abstract

The utility model discloses a radio frequency PCB, an integrated circuit board and an electronic device, the radio frequency PCB comprises a first conductive layer, a laminated structure and a hollowed-out area, and the first conductive layer is provided with a radio frequency wire and a bonding pad; the laminated structure is provided with a plurality of structural layers which are laminated in sequence; the hollowed-out area is arranged in at least one structural layer, adjacent to the first conductive layer, in the laminated structure, the hollowed-out area is provided with a hollowed-out boundary, and the corner of the hollowed-out boundary is in arc transition; the orthographic projection of the hollowed-out area on the first conductive layer covers the first area, and the radio frequency wire and the bonding pad are located in the first area. The radio frequency PCB can be applied to various electronic devices such as FTTR equipment, set top boxes and the like. According to the radio frequency PCB, the technical problems of low characteristic impedance control precision and poor signal transmission quality caused by unreasonable arrangement of the hollowed-out area of the existing radio frequency PCB are solved, and the technical effects of improving the characteristic impedance control precision of the radio frequency PCB and improving the signal transmission quality are achieved by optimizing the hollowed-out area.

Description

Technical Field

[0001] The present application relates to the field of radio frequency PCB design, and in particular to a radio frequency PCB board, an integrated circuit board and an electronic device. Background Art

[0002] RF PCB boards are widely used in the communication of various electronic devices, in which the characteristic impedance of RF traces and pads directly affects the quality of communication signal transmission. In order to control the characteristic impedance, the existing technology usually adopts the method of setting a hollow area under the RF traces and pads. However, there are still many shortcomings in the existing hollow area. The existing hollow area is usually generated according to the AntiEtch copper pouring method, which simply copies the shape of the RF trace without considering the special requirements of the pad, resulting in incomplete and discontinuous hollow areas at the pad (refer to Figure 1 ), affecting the signal transmission impedance; in addition, the hollow edge generated by this method is too close to the pad (refer to Figure 2 ), in actual production, impedance deviation may occur due to process tolerance. Some existing hollowed-out areas are generated by SKILL routing method, which requires designers to manually operate line segments and pads one by one to generate forbidden areas, and the generated forbidden areas are sharp right angles (refer to Figure 3 ), which will affect the signal transmission quality.

[0003] It can be seen that the hollowing area of ​​the existing RF PCB is not set reasonably, not only the characteristic impedance control accuracy is difficult to ensure, but also the signal transmission quality is affected. Therefore, it is necessary to provide an improved RF PCB to solve the above technical problems. Utility Model Content

[0004] The main purpose of this application is to provide a radio frequency PCB board, an integrated circuit board and an electronic device, aiming to solve the technical problem that the hollowed-out area of ​​the existing radio frequency PCB board is unreasonable, resulting in low characteristic impedance control accuracy and poor signal transmission quality.

[0005] To achieve the above-mentioned purpose, the present application provides a radio frequency PCB board, comprising a first conductive layer, a stacked structure and a hollowed-out area. The first conductive layer is provided with a radio frequency trace and a pad; the stacked structure is located on one side of the first conductive layer, and the stacked structure has a plurality of structural layers stacked in sequence; the hollowed-out area is arranged in at least one structural layer adjacent to the first conductive layer in the stacked structure, the hollowed-out area has a hollowed-out boundary, and the corner of the hollowed-out boundary is an arc transition; the orthographic projection of the hollowed-out area on the first conductive layer covers the first area, the radio frequency trace and the pad are located in the first area, and there is a preset spacing between the edge of the first area and the reference edge, and the reference edge is formed by the outer edges of the radio frequency trace and the pad.

[0006] Optionally, the preset spacing is the sum of a first spacing and a second spacing, wherein the first spacing is the distance that the reference edge extends outward to form a first edge, the second spacing is the distance that the first edge extends outward to form a second edge, and the second edge is the edge of the first area.

[0007] Optionally, the first spacing is greater than or equal to 2 mil.

[0008] Optionally, it is characterized in that the ratio of the first spacing to the second spacing is 1:1 to 1:3.

[0009] Optionally, the first spacing and the second spacing are both 4 mil.

[0010] Optionally, the number of layers of the hollowed-out area in the stacked structure is determined according to a preset impedance value, and the preset impedance value is the characteristic impedance of the radio frequency PCB board.

[0011] Optionally, the stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer stacked in sequence on one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer.

[0012] Optionally, the stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer stacked in sequence on one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer and the power layer.

[0013] In addition, the present application also provides an integrated circuit board, including the radio frequency PCB board.

[0014] In addition, the present application also provides an electronic device, including the integrated circuit board, and the electronic device is any one of an FTTR device, a set-top box, a router, an optical modem, a PON device, or a 5G CPE.

[0015] The beneficial effects that this application can achieve are as follows:

[0016] By setting a hollowed-out area in at least one layer adjacent to the first conductive layer in the stacked structure and making the orthographic projection of the first conductive layer at the hollowed-out boundary cover the RF trace and the pad, the problem of incomplete hollowing at the pad in the existing AntiEtch copper pouring method is solved, and precise control of the characteristic impedance is achieved.

[0017] By presetting the distance between the edge of the positive projection of the first conductive layer of the hollow boundary and the reference edge formed by the RF trace and the outer edge of the pad, the problem of impedance deviation caused by the hollow edge being too close to the pad in the existing AntiEtch copper pouring method is solved.

[0018] By using arc transition at the corners of the hollowed-out boundary, the problem of sharp right angles at the corners of the existing SKILL wiring method affecting the signal transmission quality is solved, and the electrical performance of the RF PCB board is effectively improved.

[0019] In summary, this application improves the performance of the RF PCB board by optimizing the hollowed-out area, thereby improving the characteristic impedance control accuracy of the RF PCB board and improving the signal transmission quality while taking into account the reliability of the production and manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram showing that the hollowing area at the pad is incomplete and discontinuous due to the AntiEtch copper pouring method in the prior art;

[0021] Figure 2 A schematic diagram of a prior art AntiEtch copper pouring method in which the distance between the hollowing edge and the pad is too close;

[0022] Figure 3 The prior art requires manual operation of line segments and pads one by one in SKILL, and generates a schematic diagram of sharp right angles;

[0023] Figure 4 This is a schematic diagram of laying non-ground copper in the PCB design software during the hollowed-out area design process in this application;

[0024] Figure 5 A schematic diagram of the avoidance treatment of the strata during the design of the hollowing area in this application;

[0025] Figure 6 A schematic diagram of copying the processed copper skin to the stratum during the design of the hollowed-out area in this application;

[0026] Figure 7 This is a schematic diagram of the effect after the hollowed-out area design in this application is completed;

[0027] Figure 8 It is a schematic cross-sectional diagram of the stacked structure of the RF PCB board in this application.

[0028] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain preset posture (as shown in the accompanying drawings). If the preset posture changes, the directional indication will also change accordingly.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0033] The first embodiment of the present application provides a radio frequency PCB board, including a first conductive layer, a stacked structure and a hollowed-out area. The first conductive layer is provided with a radio frequency trace and a pad; the stacked structure is located on one side of the first conductive layer, and the stacked structure has a plurality of structural layers stacked in sequence; the hollowed-out area is arranged in at least one structural layer adjacent to the first conductive layer in the stacked structure, the hollowed-out area has a hollowed-out boundary, and the corner of the hollowed-out boundary is an arc transition; the orthographic projection of the hollowed-out area on the first conductive layer covers the first area, the radio frequency trace and the pad are located in the first area, and there is a preset spacing between the edge of the first area and the reference edge, and the reference edge is formed by the outer edges of the radio frequency trace and the pad.

[0034] Specifically, the first conductive layer is used to arrange RF traces and pads, wherein the RF traces are used to transmit RF signals, and the pads are used to connect RF devices. The stacked structure is located on one side of the first conductive layer, and the stacked structure has a plurality of structural layers stacked in sequence. These structural layers include a plurality of dielectric layers and conductive layers, and the dielectric layers and the conductive layers are alternately arranged. Among them, the dielectric layer can be made of common PCB substrates such as FR-4, and the conductive layer can be made of conductive materials such as copper foil. The stacked structure is used to provide mechanical strength for the PCB board and provide space for circuit wiring at different levels.

[0035] At the same time, in order to control the characteristic impedance of the radio frequency PCB board, a hollow area is set in the stacked structure. First, the hollow area is set in at least one layer adjacent to the first conductive layer in the stacked structure. Among them, at least one layer means that the hollow area can be set in one or more layers according to the characteristic impedance value actually required, so as to achieve more accurate impedance control. Secondly, the hollow area has a hollow boundary, and the corner of the hollow boundary is set to an arc transition. This arc transition design overcomes the defect of sharp right angles in the hollow boundary generated by the SKILL wiring method in the prior art, and effectively avoids the adverse effects of sharp right angles on radio frequency signal transmission. Thirdly, the orthographic projection of the hollow area in the first conductive layer covers the first area, and the radio frequency trace and the pad are located in the first area, which overcomes the defects of incomplete and discontinuous hollow areas at the pads caused by the AntiEtch copper pouring method in the prior art, which is conducive to maintaining the stability of impedance during signal transmission. In addition, the outer edges of the radio frequency trace and the pad constitute a reference edge, and a preset spacing is set between the edge of the first area and the reference edge. By presetting the spacing, the problem of the hollow edge and the pad being too close in the prior art is solved; at the same time, by reasonably setting the preset spacing, sufficient margin can be reserved for process tolerance to avoid the hollow area affecting the RF routing and pad due to processing errors, thereby improving the control accuracy of the characteristic impedance.

[0036] As an optional embodiment, the preset spacing is the sum of a first spacing and a second spacing, wherein the first spacing is the distance that the reference edge extends outward to form a first edge, the second spacing is the distance that the first edge extends outward to form a second edge, and the second edge is the edge of the first area.

[0037] Specifically, the preset spacing is formed by adding the first spacing and the second spacing. Specifically, the reference edge extends outward to form a first edge, and the distance between the first edge and the reference edge is the first spacing; the first edge continues to extend outward to form a second edge, and the distance between the second edge and the first edge is the second spacing, wherein the second edge is the edge of the first area.

[0038] By decomposing the preset spacing into the first spacing and the second spacing, the boundary position of the hollowed-out area can be more accurately controlled. This two-stage extension design is not only convenient for gradual implementation in actual design operations, but also helps to better balance the requirements of process tolerance and signal transmission quality.

[0039] In order to achieve the optimal design of the hollowed-out area, a reasonable layout of the hollowed-out area can be achieved during the PCB design stage. Figure 4-Figure 8 The design phase of the hollowed-out area is described in detail.

[0040] First, if Figure 4 As shown in the figure, a layer of non-ground copper is laid in the PCB design software. The edge of the copper completely overlaps with the outer edge of the RF trace and the pad (i.e., the reference edge). By aligning the edge of the copper with the reference edge, a benchmark is laid for the subsequent outward extension of the preset spacing. Then, as Figure 5 As shown in the figure, the laid copper sheet is treated to avoid the ground copper, and the corners are treated with arc transition during the avoidance process. The treated copper sheet is shown in brighter gray in the figure, thereby determining the initial outline of the hollowed-out area (i.e., the first edge), providing a basis for subsequent boundary optimization. Then, as Figure 6 As shown, the copper pattern after the above treatment is copied to the ground layer as the forbidden area. In this process, the first edge is extended outward (forming the second edge) to form a preset spacing, leaving sufficient margin for process tolerance, which not only ensures the effectiveness of the hollowed-out area, but also avoids problems caused by processing errors. Figure 7 As shown in the figure, the copper foil generated in the intermediate process is deleted, and only the forbidden area of ​​the stratum is retained. During manufacturing, the corresponding copper foil is removed according to the forbidden area, thereby forming an actual hollowing area. At this time, the corners of the hollowing boundary have formed an arc transition, which effectively avoids the adverse effects of sharp right angles on RF signal transmission.

[0041] At the same time, combined with the cross-sectional view of the PCB stacking structure, the composition of the preset spacing can be more intuitively understood. Next, take the cross-sectional view of a hollowed-out area and RF routing as an example to illustrate. Figure 8 As shown in the figure, the RF PCB board adopts a multi-layer structure design, which includes from top to bottom: Solder Top layer, TOP01 layer, PREPREG layer, GND02 layer, Core layer, PWR03 layer, PREPREG layer, BOTTOM04 layer and Solder Bot layer. Among them: Solder Top layer and Solder Bot layer are solder mask layers; TOP01 layer is used to lay out RF traces and pads; PREPREG layer is an insulating medium layer; GND02 layer is a ground layer; Core layer is a core board layer; PWR03 layer is a power supply layer; BOTTOM04 layer is a bottom conductive layer. The multi-layer structure design meets the needs of circuit wiring, and by setting a hollow area in the GND02 layer, a good transmission environment is provided for RF signals, effectively ensuring the quality of signal transmission.

[0042] For example, an RF trace with a width of C is set on the TOP01 layer, where C is 16 mil. The RF trace has a first spacing A with a reference copper foil on the same layer, where A is 4.5 mil, and this spacing constitutes the coplanar reference distance. In the GND02 layer, the boundary of the hollowed-out area is further extended outward by a second spacing B relative to the first spacing A, where B is 4 mil. In this way, the total distance between the orthographic projection edge of the first conductive layer of the hollowed-out area and the reference edge is the preset spacing (A+B).

[0043] Through this hollowing area design method, the tedious process of manually operating the line segments and pads one by one in the SKILL wiring method is abandoned. The design of the hollowing area can be completed through simple copper foil settings, avoidance and copying operations, without relying on SKILL, which improves the design efficiency. At the same time, it overcomes the defects of incomplete and discontinuous hollowing areas at pads caused by the traditional AntiEtch copper pouring method. By covering the RF traces and pads with the orthographic projection of the hollowing area, and controlling the hollowing boundary by preset spacing, the integrity and continuity of the hollowing area can be effectively guaranteed. Thirdly, the arc transition method is used to process the corners of the hollowing boundary during the design process, avoiding the sharp right angles generated in the traditional SKILL wiring method, which can effectively reduce the adverse effects on RF signal transmission, thereby effectively improving the characteristic impedance control accuracy and signal transmission quality of the RF PCB board.

[0044] As an optional implementation, the first spacing is greater than or equal to 2 mil.

[0045] Specifically, the first spacing has a restriction constraint. Specifically, the first spacing is greater than or equal to 2 mil. This design requirement ensures that there is enough margin from the pad, thereby avoiding the signal transmission quality being affected by the distance between the RF trace and the reference copper skin being too close due to processing tolerance or other factors. For example, in the above embodiment, the first spacing A is selected to be 4.5 mil, which meets the restriction requirement of not less than 2 mil, and can effectively ensure the processing reliability and signal transmission performance of the RF PCB board.

[0046] As an optional implementation, the ratio of the first spacing to the second spacing is 2:1 to 1:3.

[0047] Specifically, the ratio of the first spacing to the second spacing is set in the range of 2:1 to 1:3, that is, the ratio of the first spacing to the second spacing can be gradually reduced from 2:1 to 1:3. Such a design not only ensures the effectiveness of the boundary of the hollowed-out area, but also provides a flexible design space for the PCB processing process.

[0048] like Figure 8 As shown, the first spacing (A) and the second spacing (B) can select different ratios according to actual application requirements. For example, when the ratio is 2:1, the first spacing can be set to 4mil and the second spacing can be set to 2mil, thereby forming a preset spacing of 6mil; when the ratio is 1:1, the first spacing and the second spacing can be set to 3mil, thereby forming a preset spacing of 6mil; when the ratio is 1:3, the first spacing can be set to 2mil and the second spacing can be set to 6mil, thereby forming a preset spacing of 8mil.

[0049] By setting the ratio range, the preset spacing can be flexibly adjusted according to actual application requirements, ensuring the processing allowance while avoiding excessive occupation of the PCB board space. At the same time, since the ratio of the first spacing to the second spacing is limited to a reasonable range, it can ensure that the hollowed-out area maintains an appropriate distance from the RF trace and the pad, effectively controlling the characteristic impedance.

[0050] As an optional implementation, the first spacing and the second spacing are both 4 mil.

[0051] Specifically, based on practical application experience, the first spacing and the second spacing are both specifically set to 4 mil. Figure 8 As shown, the reference edge extends outwardly by a first spacing (A) of 4 mils to form a first edge, and the first edge further extends outwardly by a second spacing (B) of 4 mils to form a second edge, thereby forming a total preset spacing of 8 mils.

[0052] By setting both the first spacing and the second spacing to 4 mils, not only the problem of impedance deviation caused by incomplete hollowing out of the pad and the hollowing edge being too close to the pad in the AntiEtch copper pouring method is solved, but also the processing reliability of the hollowing area is ensured, thereby effectively controlling the characteristic impedance of the RF PCB board.

[0053] As an optional implementation manner, the number of layers of the hollowed-out area in the stacked structure is determined according to a preset impedance value, and the preset impedance value is the characteristic impedance of the radio frequency PCB board.

[0054] Specifically, the number of layers of the hollowed-out area of ​​the RF PCB is not fixed, but is determined according to a preset impedance value, wherein the preset impedance value is the characteristic impedance required by the RF PCB.

[0055] In practical applications, different RF PCBs may require different characteristic impedance values. By adjusting the number of layers in the hollowed-out area, the characteristic impedance of the RF PCB can be flexibly controlled. For example, when a higher characteristic impedance is required, the number of layers in the hollowed-out area can be increased; when a lower characteristic impedance is required, the number of layers in the hollowed-out area can be reduced. By determining the number of hollowed-out layers according to the preset impedance value, a means of flexibly adjusting the characteristic impedance is provided, so that the RF PCB can adapt to different application requirements and has strong practicality.

[0056] As an optional embodiment, the stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer stacked in sequence on one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer.

[0057] Specifically, the stacked structure has a plurality of structural layers stacked in sequence, and a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer are stacked in sequence on one side of the first conductive layer. Figure 8 In the figure, TOP01 layer is the first conductive layer, PREPREG layer is the first insulating layer, GND02 layer is the ground layer, Core layer is the core layer, PWR03 layer is the power layer, PREPREG layer below is the second insulating layer, and BOTTOM04 layer is the second conductive layer.

[0058] In this embodiment, the hollowed-out area is set in the stratum. Since the stratum is adjacent to the first insulating layer and is closest to the first conductive layer where the RF wiring is set, setting the hollowed-out area in the stratum can effectively control the characteristic impedance of the RF PCB board, provide a good transmission environment for the RF signal, and thus effectively ensure the quality of signal transmission.

[0059] As an optional embodiment, the stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer stacked in sequence from one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer and the power layer.

[0060] Specifically, a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer are stacked in sequence from one side of the first conductive layer. Figure 8 In the figure, TOP01 layer is the first conductive layer, PREPREG layer is the first insulating layer, GND02 layer is the ground layer, Core layer is the core layer, PWR03 layer is the power layer, the bottom PREPREG layer is the second insulating layer, and BOTTOM04 layer is the second conductive layer.

[0061] In this embodiment, the hollowed-out area is set in both the ground layer and the power layer. By setting the hollowed-out area in both the ground layer and the power layer at the same time, the characteristic impedance of the RF PCB can be more effectively adjusted to meet the demand for a higher characteristic impedance value in certain specific application scenarios. By double-layer hollowing, a larger impedance adjustment range can be provided to better meet the needs of different application scenarios.

[0062] The second embodiment of the present application provides an integrated circuit board, including the radio frequency PCB board in the first embodiment.

[0063] Specifically, an integrated circuit board is provided, including a radio frequency PCB board as described in any of the above embodiments. The integrated circuit board can be used in various radio frequency communication devices, such as mobile phones, base stations, wireless routers, etc. By adopting the above radio frequency PCB board, the integrated circuit board can ensure the transmission quality of radio frequency signals and achieve good radio frequency performance. In particular, in high-frequency application scenarios, due to the use of an optimized hollowed-out area design, the impedance matching during radio frequency signal transmission is more accurate, effectively reducing signal reflection and loss.

[0064] The third embodiment of the present application provides an electronic device, characterized in that it includes the integrated circuit board in the second embodiment, and the electronic device is any one of FTTR equipment, set-top box, router, optical modem, PON equipment, base station equipment, converged gateway or 5GCPE.

[0065] Specifically, an electronic device is provided, which has an integrated circuit board as described in the above embodiment built in. The integrated circuit board includes a radio frequency PCB board with an optimized hollowed-out area, thereby improving the stability and reliability of radio frequency signal transmission and having a higher impedance matching accuracy.

[0066] When the electronic device is used as an FTTR device, it can ensure high-speed and stable signal transmission to meet the needs of modern families and enterprises for high-speed networks. When the electronic device is used as a set-top box, router or optical modem, it can significantly improve the quality of wireless communication and provide users with a smoother network experience. When the electronic device is used as a PON device, base station device or converged gateway, it can ensure the reliability of signal transmission and reception to meet the needs of large-scale network deployment and complex network environments. When the electronic device is used as a 5G CPE, it can reduce the loss and interference during signal transmission and ensure high-speed and stable network connection.

[0067] By adopting the above-mentioned integrated circuit board with optimized hollowed-out area, electronic devices can provide stable and reliable RF signal transmission performance in different application scenarios, meeting the requirements of various electronic devices for high performance and high stability.

[0068] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A radio frequency PCB board, characterized in that: include: A first conductive layer, wherein the first conductive layer is provided with a radio frequency trace and a pad; A stacked structure, the stacked structure is located on one side of the first conductive layer, and the stacked structure has a plurality of structural layers stacked in sequence; A hollowed-out area, wherein the hollowed-out area is arranged in at least one structural layer adjacent to the first conductive layer in the stacked structure, the hollowed-out area has a hollowed-out boundary, and the corner of the hollowed-out boundary is an arc transition; the orthographic projection of the hollowed-out area on the first conductive layer covers the first area, the RF trace and the pad are located in the first area, and there is a preset distance between the edge of the first area and the reference edge, and the reference edge is formed by the outer edges of the RF trace and the pad.

2. The radio frequency PCB board according to claim 1, characterized in that: The preset spacing is the sum of a first spacing and a second spacing, wherein the first spacing is the distance that the reference edge extends outward to form a first edge, and the second spacing is the distance that the first edge extends outward to form a second edge, and the second edge is the edge of the first area.

3. The radio frequency PCB board according to claim 2, characterized in that: The first spacing is greater than or equal to 2 mil.

4. The radio frequency PCB board according to claim 2, characterized in that: The ratio of the first interval to the second interval is 1:1 to 1:

3.

5. The radio frequency PCB board according to claim 2, characterized in that: The first spacing and the second spacing are both 4 mil.

6. The radio frequency PCB board according to claim 1, characterized in that: The number of layers of the hollowed-out area in the stacked structure is determined according to a preset impedance value, and the preset impedance value is the characteristic impedance of the radio frequency PCB board.

7. The radio frequency PCB board according to claim 6, characterized in that: The stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer which are sequentially stacked on one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer.

8. The radio frequency PCB board according to claim 6, characterized in that: The stacked structure includes a first insulating layer, a ground layer, a core layer, a power layer, a second insulating layer and a second conductive layer which are sequentially stacked on one side of the first conductive layer, wherein the hollowed-out area is located in the ground layer and the power layer.

9. An integrated circuit board, characterized in that: A radio frequency PCB board comprising any one of claims 1 to 8.

10. An electronic device, characterized in that: Including the integrated circuit board as described in claim 9, the electronic device is any one of FTTR equipment, set-top box, router, optical modem, PON equipment or 5G CPE.

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