Running machine PCB mounting structure

By designing a treadmill PCB board installation structure including mounting plate, positioning plate, threaded column and locking nut, combined with an efficient heat dissipation mechanism, the problems of loose and poor heat dissipation of the treadmill PCB board are solved, and stable installation and efficient The heat dissipation extends the service life and ensures working performance.

CN222532079UActive Publication Date: 2025-02-25SUZHOU CHOENGGROW ELECTRONIC CO LTD
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Patent Information

Application Number
CN202421246896.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-03
Publication Date
2025-02-25
Estimated Expiration
2034-06-03

AI Technical Summary

Technical Problem

The PCB board of existing treadmills loose or fall due to jitter, which affects the service life and poor heat dissipation effect, resulting in overheating of electronic components.

Method used

A treadmill PCB board installation structure is designed, including mounting plate, positioning plate, threaded column and locking nut. Combined with a heat dissipation mechanism, the heat dissipation mechanism consists of a lower heat conduction plate, a heat dissipation fin, an upper heat conduction plate and a heat absorbing cotton. The glue layer and flexible support mechanism further enhance the stability and heat dissipation effect.

Benefits of technology

It realizes stable installation and efficient heat dissipation of the treadmill PCB board, extends the service life of the PCB board, and ensures the normal working performance of the treadmill.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222532079U_ABST
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Abstract

The utility model belongs to the technical field of treadmills, and particularly relates to a treadmill PCB (printed circuit board) mounting structure which comprises a mounting plate, two positioning plates, threaded columns and locking nuts, the two positioning plates are symmetrically fixed on the mounting plate, the threaded columns are fixed on the positioning plates, the treadmill PCB mounting structure further comprises a heat dissipation mechanism, and the heat dissipation mechanism comprises a lower heat conduction plate, an upper heat conduction plate and a lower heat conduction plate. The lower heat conducting plate is fixed on the mounting plate; the multiple heat dissipation fins are fixed to the top face of the lower heat conduction plate at equal intervals; the upper heat conducting plate is fixed at the top ends of the radiating fins; the heat absorption cotton is bonded and fixed on the top surface of the upper heat conduction plate; according to the running machine PCB, the heat dissipation mechanism is arranged, the heat dissipation mechanism has good ventilation performance, heat generated when the running machine PCB works can be rapidly absorbed, the heat is conducted to the installation plate, then the heat is conducted to the shell of the running machine and dissipated out, the heat dissipation efficiency is high, and the working performance of the running machine PCB is guaranteed.
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Description

Technical Field

[0001] The utility model belongs to the technical field of treadmills, and in particular relates to a PCB board installation structure for a treadmill. Background Art

[0002] Treadmills are common fitness equipment in homes and gyms, and are the simplest type of home fitness equipment today. They are the best choice for home fitness equipment. The control circuit board is an important part of the treadmill, and the safe operation of the treadmill is inseparable from the control of the control circuit board.

[0003] At present, the PCB board of a treadmill is usually fixed inside the treadmill with screws. Although the installation is stable, when the user uses the treadmill to exercise, the treadmill will inevitably shake. Over time, the PCB board is prone to loosening and even the risk of falling, affecting the service life of the PCB board.

[0004] Based on the above technical problems, it was retrieved that in the prior art, a Chinese utility model patent with authorization announcement number CN217363563U disclosed "a reed switch circuit board structure for a treadmill", including a main board body, a reed switch, a connector and a mounting plate. A circuit chip is connected to one side of the main board body, and the main board body and the circuit chip are fixedly connected. A reed switch is connected to one side of the main board body, and the main board body and the reed switch are welded. A resistor is connected to one side of the main board body, and the main board body and the resistor are fixedly connected. The force applied to the main board body is reduced by a spring to ensure the overall stability of the main board body and reduce the loss received by the main board body.

[0005] Although the treadmill circuit board structure in the prior art including the above has the function of buffering and shock resistance, the heat dissipation effect is poor. After the treadmill runs for a long time, the electronic components on the PCB board will inevitably generate high heat. If the heat is not discharged in time, the working performance of the PCB board will be affected.

[0006] In order to solve the above problems, a treadmill PCB board installation structure is proposed in the present application. Utility Model Content

[0007] In order to solve the above problems existing in the prior art, the utility model provides a treadmill PCB board installation structure, which has the characteristics of being easy to use and easy to dissipate heat.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a treadmill PCB board mounting structure, comprising a mounting plate, a positioning plate, a threaded column and a locking nut, wherein two positioning plates are symmetrically fixed on the mounting plate, the threaded column is fixed on the positioning plate, the locking nut is mounted on the threaded column by screwing, and further comprising a heat dissipation mechanism, and the heat dissipation mechanism comprises:

[0009] A lower heat conducting plate, wherein the lower heat conducting plate is fixed to the mounting plate;

[0010] Heat dissipation fins, a plurality of heat dissipation fins are fixed at equal intervals on the top surface of the lower heat conducting plate;

[0011] An upper heat conducting plate, wherein the upper heat conducting plate is fixed to the top of the heat dissipating fin;

[0012] Heat absorbing cotton, the heat absorbing cotton is bonded and fixed to the top surface of the upper heat conducting plate.

[0013] As a preferred technical solution of the utility model, it also includes:

[0014] The lower heat conducting plate is bonded and fixed to the top surface of the mounting plate by means of the third adhesive layer.

[0015] As a preferred technical solution of the utility model, it also includes:

[0016] The first adhesive layer, the mounting plate is bonded and fixed in the treadmill by using the first adhesive layer.

[0017] As a preferred technical solution of the utility model, it also includes:

[0018] The second adhesive layer is used to bond and fix the positioning plate to the mounting plate.

[0019] As a preferred technical solution of the utility model, it also includes a flexible support mechanism, which is fixed on the positioning plate and is used to support the PCB board, and the flexible support mechanism includes:

[0020] A supporting plate, the supporting plate is located directly above the positioning plate;

[0021] A support spring is fixed between the positioning plate and the supporting plate.

[0022] As a preferred technical solution of the utility model, the flexible support mechanism also includes:

[0023] Upper auxiliary connecting arms, two groups of upper auxiliary connecting arms are symmetrically distributed, and the upper auxiliary connecting arms are hinged on the bottom surface of the supporting plate;

[0024] The lower auxiliary connecting arms, the two groups of lower auxiliary connecting arms are symmetrically distributed, and the lower auxiliary connecting arms are hinged on the top surface of the positioning plate, and the top ends of the lower auxiliary connecting arms are hinged to the upper auxiliary connecting arms.

[0025] As a preferred technical solution of the present utility model, the lower heat conducting plate, the heat dissipating fins and the upper heat conducting plate are all aluminum plates, and the lower heat conducting plate, the heat dissipating fins and the upper heat conducting plate are an integrally formed structure.

[0026] Compared with the prior art, the beneficial effects of the utility model are:

[0027] In the utility model, the heat dissipation mechanism is set up, which not only has good ventilation performance, but also can quickly absorb the heat generated by the PCB board of the treadmill during operation, and conduct the heat to the mounting plate, and then conduct the heat to the outer shell of the treadmill and dissipate it. The heat dissipation efficiency is high, ensuring the working performance of the PCB board of the treadmill.

[0028] Other additional advantages and beneficial effects of the present application will be given in part in the following description, and in part will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0030] Figure 1 It is a schematic diagram of the structure of the utility model;

[0031] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure of the heat dissipation mechanism;

[0032] Figure 3 For this utility model Figure 1 Schematic diagram of the enlarged structure of the flexible support mechanism.

[0033] In the figure: 1. Mounting plate; 11. Adhesive layer No. 1; 2. Positioning plate; 21. Adhesive layer No. 2; 3. Threaded column; 4. Locking nut; 5. Heat dissipation mechanism; 51. Lower heat conduction plate; 511. Adhesive layer No. 3; 52. Heat dissipation fins; 53. Upper heat conduction plate; 54. Heat absorbing cotton; 6. Flexible support mechanism; 61. Support plate; 62. Support spring; 63. Upper auxiliary connecting arm; 64. Lower auxiliary connecting arm. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] See also Figure 1-Figure 3 The utility model provides the following technical solutions: a treadmill PCB board mounting structure, including a mounting plate 1, a positioning plate 2, a threaded column 3 and a locking nut 4, two positioning plates 2 are symmetrically fixed on the mounting plate 1, the threaded column 3 is fixed on the positioning plate 2, and the locking nut 4 is installed on the threaded column 3 by threaded engagement, and also includes a heat dissipation mechanism 5, and the heat dissipation mechanism 5 includes: a lower heat conduction plate 51, heat dissipation fins 52, an upper heat conduction plate 53 and heat absorbing cotton 54.

[0036] Further, by Figure 1 and Figure 2 As shown, in this embodiment, the lower heat conducting plate 51 is fixed on the mounting plate 1, a plurality of heat dissipating fins 52 are fixed at equal intervals on the top surface of the lower heat conducting plate 51, the upper heat conducting plate 53 is fixed on the top of the heat dissipating fins 52, and the heat absorbing cotton 54 is bonded and fixed to the top surface of the upper heat conducting plate 53. After adopting the above scheme, when in use, the mounting plate 1 is first fixed in the treadmill, and then the positioning plate 2 is fixed on the mounting plate 1, so that the threaded column 3 passes through the mounting hole of the treadmill PCB board, and the locking nut 4 is tightened on the protruding end of the threaded column 3 to achieve stable installation of the treadmill PCB board. At this time, the heat absorbing cotton 54 is close to the bottom surface of the treadmill PCB board, and the heat generated by the treadmill PCB board is absorbed and conducted by the heat absorbing cotton 54 and the upper heat conducting plate 53. A ventilation channel is formed between the plurality of heat dissipating fins 52, which is conducive to ventilation and heat dissipation. The heat is quickly conducted to the lower heat conducting plate 51, and the heat is conducted to the mounting plate 1, and then conducted to the outer shell of the treadmill and dissipated. The heat dissipation efficiency is high, and the working performance of the treadmill PCB board is guaranteed.

[0037] Preferably, by Figure 1 and Figure 2 As shown, in this embodiment, it also includes: a third adhesive layer 511, and the lower heat conducting plate 51 is bonded and fixed to the top surface of the mounting plate 1 by using the third adhesive layer 511. After adopting the above scheme, the lower heat conducting plate 51 is bonded and fixed by using the third adhesive layer 511, and the installation is stable and convenient.

[0038] It should be noted that the above embodiments are only preferred implementation schemes of the present invention and are not used to limit the present invention. In actual use, the lower heat conduction plate 51 can also be fixed in other ways, such as using bolts, but holes need to be opened. This embodiment uses a No. 3 adhesive layer 511 to fix the lower heat conduction plate 51, without the need for opening holes, and the installation position can also be changed according to actual use needs.

[0039] Preferably, by Figure 1As shown, in this embodiment, it also includes: a No. 1 adhesive layer 11, and the mounting plate 1 is bonded and fixed in the treadmill using the No. 1 adhesive layer 11. After adopting the above scheme, the mounting plate 1 is bonded and fixed using the No. 1 adhesive layer 11, and the installation is stable and convenient.

[0040] It should be noted that the above embodiments are only preferred implementation schemes of the present invention and are not used to limit the present invention. In actual use, the mounting plate 1 may also be fixed in other ways, such as using bolts, but holes need to be opened. This embodiment uses a No. 1 adhesive layer 11 to fix the mounting plate 1 without opening holes, and the installation position can also be changed according to actual use needs.

[0041] Preferably, by Figure 1 As shown, in this embodiment, it also includes: a second adhesive layer 21, and the positioning plate 2 is bonded and fixed to the mounting plate 1 using the second adhesive layer 21. After adopting the above scheme, the positioning plate 2 is bonded and fixed using the second adhesive layer 21, and the installation is stable and convenient.

[0042] It should be noted that the above embodiments are only preferred implementation schemes of the present invention and are not used to limit the present invention. In actual use, the positioning plate 2 can also be fixed in other ways, such as using bolts, but holes need to be opened. This embodiment uses the second adhesive layer 21 to fix the positioning plate 2, without the need for opening holes, and the installation position can also be changed according to actual use needs.

[0043] Optionally, by Figure 1 and Figure 3 As shown, in this embodiment, it also includes a flexible support mechanism 6, which is fixed on the positioning plate 2 and is used to support the PCB board, and the flexible support mechanism 6 includes: a support plate 61 and a support spring 62, the support plate 61 is located directly above the positioning plate 2, and the support spring 62 is fixed between the positioning plate 2 and the support plate 61. After adopting the above scheme, the support plate 61 supports the treadmill PCB board through the elastic force of the support spring 62, and the locking nut 4 is placed on the treadmill PCB board, which improves the bite force of the thread between the locking nut 4 and the threaded column 3, further improves the installation stability of the treadmill PCB board, and the support spring 62 can also buffer and shock-proof the treadmill PCB board. The heat-absorbing cotton 54 can not only absorb the heat generated by the treadmill PCB board, but the flexibility of the heat-absorbing cotton 54 can also buffer and shock-proof the treadmill PCB board.

[0044] Preferably, by Figure 1 and Figure 3As shown, in this embodiment, the flexible support mechanism 6 also includes: an upper auxiliary connecting arm 63 and a lower auxiliary connecting arm 64. The two groups of upper auxiliary connecting arms 63 are symmetrically distributed, and the upper auxiliary connecting arms 63 are hinged to the bottom surface of the support plate 61. The two groups of lower auxiliary connecting arms 64 are symmetrically distributed, and the lower auxiliary connecting arms 64 are hinged to the top surface of the positioning plate 2. The top end of the lower auxiliary connecting arm 64 is hinged to the upper auxiliary connecting arm 63 to ensure the stability of the support plate 61 and prevent the support plate 61 from tilting and affecting the support effect.

[0045] Optionally, by Figure 1 and Figure 2 As shown, in this embodiment, the lower heat conducting plate 51, the heat dissipating fins 52 and the upper heat conducting plate 53 are all aluminum plates, and the lower heat conducting plate 51, the heat dissipating fins 52 and the upper heat conducting plate 53 are an integrally formed structure with high structural strength. In this embodiment, aluminum plates are selected as heat conducting components, which have better thermal conductivity.

[0046] Components not described in detail herein are prior art.

[0047] Working principle and use process of the utility model: When using the treadmill PCB board installation structure of the utility model, firstly, the installation board 1 is fixed in the treadmill by using the first adhesive layer 11, and the positioning board 2 is fixed on the installation board 1 by using the second adhesive layer 21 according to the position of the PCB board installation hole;

[0048] The threaded column 3 is passed through the mounting hole of the treadmill PCB board, and the locking nut 4 is tightened on the protruding end of the threaded column 3 to achieve stable installation of the treadmill PCB board. At this time, the heat-absorbing cotton 54 is close to the bottom surface of the treadmill PCB board, and the heat generated by the treadmill PCB board is absorbed and conducted by the heat-absorbing cotton 54 and the upper heat-conducting plate 53. A ventilation channel is formed between the multiple heat-dissipating fins 52, which is conducive to ventilation and heat dissipation. The heat is quickly conducted to the lower heat-conducting plate 51, and the heat is conducted to the mounting plate 1, and then conducted to the outer shell of the treadmill and dissipated. The heat dissipation efficiency is high, and the working performance of the treadmill PCB board is guaranteed;

[0049] The supporting plate 61 supports the treadmill PCB board through the elastic force of the supporting spring 62. The locking nut 4 is pushed onto the treadmill PCB board, thereby improving the engagement force of the threads between the locking nut 4 and the threaded column 3, further improving the installation stability of the treadmill PCB board, and the supporting spring 62 can also provide buffering and shockproofing for the treadmill PCB board. The heat-absorbing cotton 54 can not only absorb the heat generated by the treadmill PCB board, but the flexibility of the heat-absorbing cotton 54 can also provide buffering and shockproofing for the treadmill PCB board.

[0050] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A treadmill PCB board mounting structure, comprising a mounting plate (1), a positioning plate (2), a threaded column (3) and a locking nut (4), wherein the two positioning plates (2) are symmetrically fixed on the mounting plate (1), the threaded column (3) is fixed on the positioning plate (2), and the locking nut (4) is mounted on the threaded column (3) by screwing, characterized in that: It also includes a heat dissipation mechanism (5), and the heat dissipation mechanism (5) includes: A lower heat conducting plate (51), wherein the lower heat conducting plate (51) is fixed on the mounting plate (1); Heat dissipation fins (52), a plurality of heat dissipation fins (52) being fixed at equal intervals on the top surface of the lower heat conducting plate (51); An upper heat conducting plate (53), wherein the upper heat conducting plate (53) is fixed to the top of the heat dissipating fin (52); Heat absorbing cotton (54), the heat absorbing cotton (54) is bonded and fixed to the top surface of the upper heat conducting plate (53).

2. A treadmill PCB board mounting structure according to claim 1, characterized in that: Also includes: A third adhesive layer (511), wherein the lower heat conducting plate (51) is bonded and fixed to the top surface of the mounting plate (1) by using the third adhesive layer (511).

3. A treadmill PCB board mounting structure according to claim 1, characterized in that: Also includes: A first adhesive layer (11), wherein the mounting plate (1) is bonded and fixed in the treadmill by using the first adhesive layer (11).

4. A treadmill PCB board mounting structure according to claim 1, characterized in that: Also includes: A second adhesive layer (21), wherein the positioning plate (2) is bonded and fixed to the mounting plate (1) by using the second adhesive layer (21).

5. The treadmill PCB board mounting structure according to claim 1, characterized in that: It also includes a flexible support mechanism (6), which is fixed on the positioning plate (2) and is used to support the PCB board. The flexible support mechanism (6) includes: A supporting plate (61), the supporting plate (61) being located directly above the positioning plate (2); A support spring (62), wherein the support spring (62) is fixed between the positioning plate (2) and the supporting plate (61).

6. A treadmill PCB board mounting structure according to claim 5, characterized in that: The flexible support mechanism (6) further comprises: Upper auxiliary connecting arms (63), two groups of the upper auxiliary connecting arms (63) are symmetrically distributed, and the upper auxiliary connecting arms (63) are hinged on the bottom surface of the supporting plate (61); Lower auxiliary connecting arms (64), two groups of lower auxiliary connecting arms (64) are symmetrically distributed, and the lower auxiliary connecting arms (64) are hinged on the top surface of the positioning plate (2), and the top ends of the lower auxiliary connecting arms (64) are hinged to the upper auxiliary connecting arms (63).

7. A treadmill PCB board mounting structure according to claim 1, characterized in that: The lower heat conducting plate (51), the heat dissipation fins (52) and the upper heat conducting plate (53) are all aluminum plates, and the lower heat conducting plate (51), the heat dissipation fins (52) and the upper heat conducting plate (53) are an integrally formed structure.

Citation Information

Patent Citations

  • Reed switch circuit board structure for treadmill

    CN217363563U