Glue pouring device and inductance glue pouring line

Abstract

The utility model discloses a glue filling device and an inductance glue filling wire, the glue filling device comprises a glue filling mechanism, a vacuumizing mechanism and at least one reserved station, the glue filling mechanism is used for filling glue to a target object; the vacuumizing mechanism is used for vacuumizing the target object; the reserved station is used for additionally arranging a glue filling mechanism or a vacuumizing mechanism; wherein the glue filling mechanism and the vacuumizing mechanism are sequentially connected with each other by taking a reserved station as a reference, and both the glue filling mechanism and the vacuumizing mechanism are of movable modular structures, so that the glue filling mechanism or the vacuumizing mechanism can be quickly removed or changed in position. According to the glue pouring device and the inductor glue pouring line, the movable modular structure enables the number and position of the glue pouring mechanisms and the vacuumizing mechanisms to be adjustable, different glue pouring processes of different products are met, and compatibility is extremely high; the problems of cost waste and land occupation caused by repeated construction of a production line are solved, and the production efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of inductor glue potting, in particular to a glue potting device and an inductor glue potting line. Background Art

[0002] With the rapid development of the energy storage industry, the demand for photovoltaic inverters is increasing day by day. Potting with potting glue is an important means to ensure reliable bonding between the inductor and the product in the inverter, and it is widely used because of its effective electrical isolation.

[0003] Because the energy storage industry has a variety of products, different products have different glue filling processes. For example, first fill a part of the glue, draw a vacuum, and then fill the remaining glue. This process is called a two-fill-one-draw process. There are similar processes such as one-fill-one-draw and two-fill-two-draw. For this reason, in order to produce different products, the factory has to repeatedly build production lines, which not only wastes money, but also requires a large number of maintenance personnel and encroaches on the factory's existing production area. Utility Model Content

[0004] The utility model aims to provide a glue filling device and an inductor glue filling line, which are at least used to solve the problem of complicated switching between different processes, so as to achieve the purpose of reducing costs, reducing space occupation and optimizing production operations.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A glue pouring device, comprising:

[0007] A glue filling mechanism, wherein the glue filling mechanism is used to fill the target object with glue;

[0008] A vacuuming mechanism, the vacuuming mechanism being used to vacuum the target object; and

[0009] At least one reserved station, wherein the reserved station is used to add the glue pouring mechanism or the vacuum pumping mechanism;

[0010] The glue pouring mechanism and the vacuum pumping mechanism are connected in sequence based on the reserved workstations, and both the glue pouring mechanism and the vacuum pumping mechanism are movable modular structures so that the glue pouring mechanism or the vacuum pumping mechanism can be quickly removed or relocated.

[0011] In some embodiments, the reserved workstation is an empty workstation, wherein the glue filling mechanism and the vacuum pumping mechanism are connected in sequence; or,

[0012] The reserved station is additionally provided with a glue pouring mechanism, wherein the glue pouring mechanism, the vacuum pumping mechanism and the glue pouring mechanism are connected in sequence; or,

[0013] There are two reserved workstations, and a glue pouring mechanism and a vacuum pumping mechanism are respectively provided, wherein the glue pouring mechanism, the vacuum pumping mechanism, the glue pouring mechanism and the vacuum pumping mechanism are connected in sequence.

[0014] In some embodiments, the glue filling mechanism and the vacuum pumping mechanism are provided with quick disassembly and assembly units at the front and rear of each.

[0015] In some embodiments, the glue filling mechanism includes a movable glue outlet valve;

[0016] A plurality of glue storage mechanisms are arranged on one side of the glue pouring mechanism, each of the glue storage mechanisms stores a different type of potting glue, and each of the glue storage mechanisms shares one glue outlet valve.

[0017] An inductor glue-filling wire comprises the glue-filling device described above.

[0018] In some embodiments, the inductor glue-filled wire further includes:

[0019] A glue applying mechanism, the glue applying mechanism being used to apply a primer to a target object;

[0020] An air-drying mechanism, the air-drying mechanism is used to air-dry the target object after the primer is applied;

[0021] A baking mechanism, which is used to bake the target object after the glue is poured to solidify it;

[0022] A cooling mechanism, wherein the cooling mechanism is used to cool down the target object after baking;

[0023] The cooling mechanism is horizontally arranged along the downline direction of the target object, and the gluing mechanism, the air-drying mechanism, the glue filling device and the baking mechanism are sequentially erected above the cooling mechanism along the upline direction of the target object.

[0024] In some embodiments, the inductor glue-filled wire further includes:

[0025] A thread head lifting mechanism, which is arranged upstream of the glue application mechanism and is used to lift the target object from the ground to a preset height;

[0026] The end-of-line lifting mechanism is arranged downstream of the baking mechanism, and the end-of-line lifting mechanism is used to transfer the target object from the baking mechanism to the cooling mechanism.

[0027] In some embodiments, a manual operation station is provided between the thread head lifting mechanism and the glue application mechanism, and the manual operation station is used to clean the target object and perform loading and unloading processing.

[0028] In some embodiments, a MES scanner is provided on the glue applying mechanism, and the glue applying mechanism, the air-drying mechanism and the glue filling device are all electrically connected to the MES scanner.

[0029] In some embodiments, the cooling mechanism includes a plurality of air cooling tunnels arranged in a row, and an infrared temperature sensing device is provided in each of the air cooling tunnels.

[0030] Compared with the prior art, the beneficial effects of the present invention include at least:

[0031] 1. The movable modular structure makes the number and position of the glue filling mechanism and the vacuum pumping mechanism adjustable, and meets the different glue filling processes of different products, with strong compatibility.

[0032] 2. It solves the cost waste and space-consuming problems caused by repetitive construction of production lines, and effectively improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural schematic diagram of a glue filling device according to an embodiment of the utility model that implements a one-filling-one-drawing process.

[0034] Figure 2 This is a structural diagram of the glue filling device of the utility model embodiment implementing a two-filling and one-drawing process

[0035] Figure 3 This is a structural schematic diagram of the glue filling device of the utility model embodiment implementing a two-filling and two-extraction process

[0036] Figure 4 It is a structural schematic diagram of the glue filling mechanism of an embodiment of the utility model.

[0037] Figure 5 It is a connection diagram of the glue filling mechanism and the glue storage mechanism in an embodiment of the utility model.

[0038] Figure 6 It is a structural schematic diagram of an inductor glue-filled wire according to an embodiment of the utility model.

[0039] Figure 7 yes Figure 6 Enlarged view of part A.

[0040] In the figure: 1. Line head lifting mechanism; 2. Manual operation station; 3. Glue application mechanism; 4. Air drying mechanism; 5. Glue filling mechanism; 501. Glue outlet valve; 502. Motion positioning unit; 6. Vacuum extraction mechanism; 7. Reserved station; 8. Baking mechanism; 9. Cooling mechanism; 901. Air cooling tunnel; 10. Line tail lifting mechanism; 11. Quick disassembly and assembly unit; 12. Glue storage mechanism; 13. MES scanner; 14. Waste gas collection port; 15. Rack; 16. Moving wheel. DETAILED DESCRIPTION

[0041] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0042] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.

[0043] See also Figures 1 to 3 As shown, the utility model discloses a glue pouring device, comprising a glue pouring mechanism 5 , a vacuum pumping mechanism 6 and at least one reserved workstation 7 .

[0044] The glue pouring mechanism 5 is used to pour glue into the target object. In the present application, the glue pouring mechanism 5 is a movable modular structure, and its position can be moved according to the actual production process requirements. As an example, the glue pouring mechanism 5 includes a frame 15, a moving wheel 16 arranged below the frame 15, and a glue outlet valve 501 arranged above the frame 15 (see Figure 4 In this example, the glue filling mechanism 5 can be moved as a whole by the moving wheel 16 , and the glue filling is performed on the target object, such as the inductor, through the glue discharge valve 501 .

[0045] The vacuuming mechanism 6 is used to vacuum the target object. In the present application, the vacuuming mechanism 6 is also a movable modular structure. It can be understood that the structure of the vacuuming mechanism 6 is similar to the glue filling mechanism 5, and it also includes a frame 15, a moving wheel 16 arranged under the frame 15, and a vacuuming system (blocked and not shown). The vacuuming mechanism 6 can also drive the entire mechanism to move through the moving wheel 16, and vacuum the target object, such as the inductor after glue filling, through the vacuuming system. The vacuuming system is a prior art and will not be described here.

[0046] The reserved station 7 is used to add a glue pouring mechanism 5 or a vacuum pumping mechanism 6. In the initial state, the reserved station 7 is empty and its position remains basically unchanged. The glue pouring mechanism 5 and the vacuum pumping mechanism 6 are sequentially connected with the reserved station 7 as a reference to form a glue pouring device. By adjusting the number and position of the glue pouring mechanism 5 and the vacuum pumping mechanism 6, different glue pouring processes for different products can be met.

[0047] For example Figure 1As shown, the reserved station 7 in the structure is empty, and the reserved station 7 can be located upstream of the glue filling mechanism 5, or downstream of the vacuum pumping mechanism 6. In this example, the glue filling mechanism 5 and the vacuum pumping mechanism 6 are connected in sequence, and the glue filling device formed can be used for a one-filling and one-evacuation process.

[0048] Or Figure 2 As shown, in this structure, the reserved station 7 can be located downstream of the vacuum pumping mechanism 6, and the reserved station 7 is additionally provided with a glue pouring mechanism 5. In the example, the glue pouring mechanism 5, the vacuum pumping mechanism 6 and the glue pouring mechanism 5 are connected in sequence, and the glue pouring device formed can be used for the two-pouring-one-pumping process.

[0049] Another example Figure 3 As shown, there are two reserved workstations 7 in the structure, and both of the two reserved workstations 7 can be located upstream of the glue pouring mechanism 5, or both are located downstream of the vacuum pumping mechanism 6. The two reserved workstations 7 are respectively provided with a glue pouring mechanism 5 and a vacuum pumping mechanism 6. In this example, the glue pouring mechanism 5, the vacuum pumping mechanism 6, the glue pouring mechanism 5 and the vacuum pumping mechanism 6 are connected in sequence, and the glue pouring device composed can be used for the two-pouring and two-extracting process.

[0050] See also Figure 4 As shown, the glue filling mechanism 5 is provided with a quick disassembly unit 11 at the front and rear, and similarly, the vacuum pumping mechanism 6 is provided with a quick disassembly unit 11 at the front and rear (blocked, not shown). The quick disassembly unit 11 can be fixed on the frame 15 of the corresponding mechanism. By removing the quick disassembly unit 11, the glue filling mechanism 5 or the vacuum pumping mechanism 6 can be quickly removed from the original position, or moved to another position, so as to achieve the control of the number and position of the glue filling mechanism 5 and the vacuum pumping mechanism 6, and then switch the glue filling process.

[0051] Exemplarily, the quick disassembly unit 11 is a connecting beam, which can be fixed at the target position by means of bolt connection, snap fit, magnetic adsorption, etc., and by removing the connecting beam, the glue filling mechanism 5 and / or the vacuum mechanism 6 can be quickly separated, thereby facilitating the relocation of their own position or the addition of a new mechanism for cooperation.

[0052] See also Figure 3 As shown, in some embodiments, the glue pouring mechanism 5 includes a movable glue outlet valve 501. In addition, a plurality of glue storage mechanisms 12 are provided on one side of the glue pouring mechanism 5, each glue storage mechanism 12 stores a different type of potting glue, and each glue storage mechanism 12 shares a glue outlet valve 501, so as to facilitate switching of different types of potting glue and realize the production of different products.

[0053] Exemplarily, the glue dispensing valve 501 is mounted on the motion positioning unit 502 on the frame 501. Driven by the motion positioning unit 502, the glue dispensing valve 501 can move along the X-axis, Y-axis and Z-axis to adapt to the glue filling of different products. There are four glue storage mechanisms 12, which are arranged side by side on the rear side of the frame 501. Each glue storage mechanism 12 can independently supply glue to the glue dispensing valve 501 to avoid mixing of glue and affecting production.

[0054] See also Figure 6 As shown, the utility model also discloses an inductor glue-filling wire, including the above-mentioned glue-filling device.

[0055] The inductor glue pouring line can meet different glue pouring processes of different products by only removing or replacing the number and position of the glue pouring mechanism 5 and the vacuum pumping mechanism 6. On the one hand, it can avoid the cost waste and space occupation caused by repeatedly building production lines; on the other hand, the glue pouring device is not a single station design, but is integrated into the inductor glue pouring line, which makes the inductor glue pouring process automatic and continuous, without the need to carry the inductor back and forth on the line, effectively improving production efficiency.

[0056] Or Figure 6 As shown, the inductor glue filling line of the present application also includes a glue application mechanism 3, an air drying mechanism 4, a baking mechanism 8 and a cooling mechanism 9. It should be noted that this is only a principle description and does not limit the specific structure of the above-mentioned mechanisms. The above-mentioned mechanisms can be composed of existing technologies.

[0057] Among them, the glue applying mechanism 3 is used to apply a primer to a target object, such as a photovoltaic inverter housing, so as to improve the adhesion of the coating; specifically, the glue applying mechanism 3 can automatically call the corresponding glue applying program according to the product information of the target object and monitor the glue application amount.

[0058] The air-drying mechanism 4 is used to air-dry the target object after the primer is applied; specifically, the air-drying mechanism 4 can also automatically call the corresponding air-drying program according to the product information of the target object, and automatically adjust the air-drying time according to the amount of primer applied and the ambient temperature.

[0059] The baking mechanism 8 is used to bake the target object after glue filling, such as the semi-finished product consisting of the photovoltaic inverter housing and the inductor to solidify it; specifically, after the glue filling is completed, the target object can be sent to the tunnel furnace for high-temperature baking and solidification. The tunnel furnace adopts a modular design of 2 meters per section, with a total length of about 10 meters, and is equipped with temperature PID control.

[0060] The cooling mechanism 9 is used to cool down the target object after baking; specifically, the cooling mechanism 9 can be cooled by multiple sections of air cooling tunnels 901 arranged in a row, which makes it unnecessary to add an air cooling furnace at the end of the tunnel furnace, thereby saving equipment space. In addition, each air cooling tunnel 901 is equipped with an infrared temperature sensor (hidden inside, not shown) to sense the temperature of the finished product during the reflow process so as to automatically adjust the cooling time.

[0061] In a preferred embodiment, the cooling mechanism 9 is horizontally arranged along the downline direction of the target object, and the gluing mechanism 3, the air-drying mechanism 4, the glue filling device and the baking mechanism 8 are sequentially erected above the cooling mechanism 9 along the upline direction of the target object, which allows the product downline station to be combined with the product upline station, thereby saving equipment space.

[0062] Furthermore, the inductor glue potting line also includes a line head lifting mechanism 1 and a line tail lifting mechanism 10. The line head lifting mechanism 1 is arranged upstream of the glue application mechanism 3, and the line head lifting mechanism 1 is used to lift the target object from the ground to a preset height to facilitate the target object to go online. The line tail lifting mechanism 10 is arranged downstream of the baking mechanism 8, and the line tail lifting mechanism 10 is used to transfer the target object from the baking mechanism 8 to the cooling mechanism 9 to facilitate the product to go offline.

[0063] Furthermore, a manual operation station 2 is provided between the line head lifting mechanism 1 and the glue application mechanism 3, and the manual operation station 2 is used to clean the target object and process the loading and unloading of materials. Preferably, the manual operation station 2 can be located at the exit of the cooling mechanism 9, which makes the loading and unloading positions unified, and only one person is needed to manage the loading and unloading processes, which is convenient for production operations and away from the high temperature influence of the baking mechanism 8, thereby improving the safety of the operation.

[0064] See also Figure 6 and Figure 7 As shown, in some embodiments, the glue applying mechanism 3 is provided with an MES scanner 13, and the glue applying mechanism 3, the air drying mechanism 4 and the glue filling device are all electrically connected to the MES scanner 13. The MES scanner 13 can upload the product, the internal inductor and the subsequent glue filling operation information to the MES system by scanning the SN code on the target object, so as to realize accurate data traceability.

[0065] In some embodiments, a waste gas collection port 14 is provided on the baking mechanism 8, and the waste gas collection port 14 is used to connect to a waste gas treatment system (not shown) to prevent waste gas pollution and save energy and protect the environment.

[0066] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the present invention. All of these changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A glue filling device, characterized in that: include: A glue pouring mechanism (5), the glue pouring mechanism (5) being used to pour glue into a target object; A vacuuming mechanism (6), wherein the vacuuming mechanism (6) is used to vacuum the target object; as well as At least one reserved workstation (7), the reserved workstation (7) being used to add the glue pouring mechanism (5) or the vacuum pumping mechanism (6); The glue pouring mechanism (5) and the vacuum pumping mechanism (6) are connected in sequence with the reserved workstation (7) as a reference, and both the glue pouring mechanism (5) and the vacuum pumping mechanism (6) are movable modular structures, so that the glue pouring mechanism (5) or the vacuum pumping mechanism (6) can be quickly removed or replaced.

2. The glue pouring device according to claim 1, characterized in that: The reserved workstation (7) is an empty space, wherein the glue filling mechanism (5) and the vacuum pumping mechanism (6) are connected in sequence; or, The reserved workstation (7) is additionally provided with a glue pouring mechanism (5), wherein the glue pouring mechanism (5), the vacuum pumping mechanism (6) and the glue pouring mechanism (5) are connected in sequence; or, The number of the reserved workstations (7) is two, and a glue pouring mechanism (5) and a vacuum pumping mechanism (6) are respectively provided, wherein the glue pouring mechanism (5), the vacuum pumping mechanism (6), the glue pouring mechanism (5) and the vacuum pumping mechanism (6) are connected in sequence.

3. The glue pouring device according to claim 1, characterized in that: The glue filling mechanism (5) and the vacuum extraction mechanism are provided with quick disassembly and assembly units (11) at the front and rear of each.

4. The glue pouring device according to claim 1, characterized in that: The glue pouring mechanism (5) comprises a movable glue outlet valve (501); A plurality of glue storage mechanisms (12) are arranged on one side of the glue pouring mechanism (5), each of the glue storage mechanisms (12) stores a different type of potting glue, and each of the glue storage mechanisms (12) shares one glue outlet valve (501).

5. An inductor glue-filled wire, characterized in that: It comprises a glue pouring device as described in any one of claims 1 to 4.

6. The inductor glue-filled wire according to claim 5, characterized in that: Also includes: A glue applying mechanism (3), the glue applying mechanism (3) being used to apply a primer to a target object; An air-drying mechanism (4), the air-drying mechanism (4) being used to air-dry the target object after the primer is applied; A baking mechanism (8), the baking mechanism (8) being used to bake the target object after the glue is poured to solidify it; A cooling mechanism (9), the cooling mechanism (9) being used to cool down the target object after baking; The cooling mechanism (9) is arranged horizontally along the downline direction of the target object, and the gluing mechanism (3), the air-drying mechanism (4), the glue filling device and the baking mechanism (8) are sequentially arranged above the cooling mechanism (9) along the upline direction of the target object.

7. The inductor glue-filled wire according to claim 6, characterized in that: Also includes: A thread head lifting mechanism (1), the thread head lifting mechanism (1) being arranged upstream of the glue application mechanism (3), the thread head lifting mechanism (1) being used to lift the target object from the ground to a preset height; An end-of-line lifting mechanism (10), the end-of-line lifting mechanism (10) being arranged downstream of the baking mechanism (8), the end-of-line lifting mechanism (10) being used to transfer a target object from the baking mechanism (8) to the cooling mechanism (9).

8. The inductor glue-filled wire according to claim 7, characterized in that: A manual operation station (2) is provided between the thread head lifting mechanism (1) and the glue application mechanism (3), and the manual operation station (2) is used to clean the target object and perform loading and unloading processing.

9. The inductor glue-filled wire according to claim 6, characterized in that: The glue applying mechanism (3) is provided with an MES code scanner (13), and the glue applying mechanism (3), the air drying mechanism (4) and the glue filling device are all electrically connected to the MES code scanner (13).

10. The inductor glue-filled wire according to claim 6, characterized in that: The cooling mechanism (9) comprises a plurality of air cooling tunnels (901) arranged in a row, and an infrared temperature sensor is arranged in each of the air cooling tunnels (901).

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