Wet cleaning device suitable for semiconductors
By using the Teflon-coated tank cover and the exhaust treatment mechanism for condensate adsorption in the semiconductor wet cleaning device, the problem of difficult to control the volatility of organic waste gas in the wet cleaning equipment is solved, and the effect of reducing waste gas emissions and reducing operating costs is achieved.
Patent Information
- Application Number
- CN202420469976.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-12
AI Technical Summary
The volatility of organic waste gas generated by existing semiconductor wet cleaning equipment during the process is difficult to control, resulting in increased environmental pollution and enterprise operating costs.
A semiconductor wet cleaning device is designed, including a Teflon-coated 316L stainless steel tank cover and exhaust treatment mechanism. The groove cover is closed throughout the entire process through the handle to reduce the volatility of waste gas; the exhaust treatment mechanism absorbs high-temperature organic waste gas through the condensate to weaken its concentration.
It effectively reduces the volatility of process organic waste gas, reduces the operating costs of enterprises, and achieves green emissions.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to a semiconductor wet cleaning device, belonging to the technical field of semiconductor wet cleaning. Background Art
[0002] Wet cleaning machines are widely used in the semiconductor industry. One type of wet cleaning equipment involves organic chemical reagents, such as isopropyl alcohol, No. 6 cleaning agent, and stripping fluid. The exhaust gases generated by these wet cleaning machines have a significant impact on human health and the environment on which we depend. Therefore, these exhaust gases must pass through specific organic waste gas treatment devices and undergo multiple cycles of treatment to meet emission standards, significantly increasing operating costs. Currently, research on green emissions from wet organic cleaning is focused on how to effectively reduce the volatilization of process organic waste gases in semiconductor wet cleaning equipment. Utility Model Content
[0003] The technical problem to be solved by the present invention is to provide a semiconductor wet cleaning device suitable for the above-mentioned existing technology, which can effectively reduce the volatilization of process organic waste gas, reduce enterprise operating costs, and achieve green emissions.
[0004] The technical solution adopted by the present invention to solve the above-mentioned problems is: a device suitable for semiconductor wet cleaning, comprising a tank body and an exhaust treatment mechanism, wherein a first coil is provided in the tank body, and a tank cover assembly is provided on the top cover of the tank body; the exhaust treatment mechanism comprises an exhaust duct, one end of the exhaust duct is connected to the inner cavity of the tank body, and the other end of the exhaust duct is connected to the power exhaust main pipe, and a second coil assembly is provided at the connection between the exhaust duct and the power exhaust main pipe, the second coil assembly comprises a second coil, the surface of the second coil is wrapped with an inner layer, a middle layer and an outer layer from the inside to the outside in sequence, and an air damper is provided in the second coil; the first coil and the second coil are respectively provided with quick connectors, and the quick connectors are respectively connected to the circulation pipeline of the chiller through connecting pipes.
[0005] The slot cover assembly includes a slot cover, a handle is provided on the outer surface of the slot cover, and baffles are symmetrically provided on the inner surface of the slot cover, and the distance between the two baffles matches the inner diameter of the slot body.
[0006] The outer surface of the tank cover is provided with a Teflon coating.
[0007] The inner layer is a primary filter cotton layer, the middle layer is a high-purity quartz cotton layer, and the outer layer is an aluminum foil glass fiber cloth layer.
[0008] Compared with the existing technology, the advantages of the utility model are: a device suitable for semiconductor wet cleaning equipment, the outer surface of the 316L stainless steel tank cover is sprayed with Teflon coating and a handle is provided on the tank cover, and the tank cover is covered on the tank body by the handle, thereby achieving the requirement of full-process closed cover, reducing the volatilization of waste gas from the process tank body of the organic cleaning equipment from the source; at the same time, the exhaust treatment mechanism adsorbs the high-temperature organic waste gas when it encounters condensate and then weakens the concentration of the organic waste gas, reducing the volatilization of the process waste gas of the organic cleaning equipment from the source, reducing the operating costs of the enterprise, and achieving green emissions. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is a schematic diagram of a semiconductor wet cleaning device according to an embodiment of the present invention;
[0010] Figure 2 for Figure 1 Schematic diagram of the middle tank cover;
[0011] Figure 3 is a schematic diagram of a second coil assembly;
[0012] In the figure, 1 is the chiller, 2 is the connecting pipe, 3 is the second coil assembly, 3.1 is the inner layer, 3.2 is the second coil, 3.3 is the middle layer, 3.4 is the damper, 3.5 is the outer layer, 4 is the power exhaust main pipe, 5 is the exhaust duct, 6 is the tank cover, 6.1 is the handle, 6.2 is the baffle, 7 is the first coil, and 8 is the tank body. DETAILED DESCRIPTION
[0013] The present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
[0014] like Figure 1 As shown, one embodiment of the present invention is suitable for semiconductor wet cleaning equipment, including a tank body 8 and an exhaust treatment mechanism. A first coil 7 is provided in the tank body 8. A tank cover assembly is provided on the top of the tank body 8. The tank cover assembly seals the tank body 8 and reduces the volatilization of waste gas from the tank body 8 at the source. The exhaust treatment mechanism includes an exhaust duct 5. One end of the exhaust duct 5 is connected to the inner cavity of the tank body 8, and the other end of the exhaust duct 5 is connected to the power exhaust main 4. Figure 3As shown, a second coil assembly 3 is installed at the junction of the exhaust duct 5 and the power exhaust main duct 4. This second coil assembly 3 comprises a second coil 3.2. The outer surface of second coil 3.2 is wrapped with primary filter cotton, forming an inner layer 3.1; the outer surface of inner layer 3.1 is wrapped with high-purity quartz wool, forming an intermediate layer 3.3; and the outer surface of intermediate layer 3.3 is wrapped with aluminum foil and fiberglass cloth, forming an outer layer 3.5. A damper 3.4 is installed within second coil 3.2 to adjust the exhaust volume. Quick connectors are installed on the first coil 7 and the second coil 3.2, respectively. These quick connectors are connected to the circulation pipeline of the chiller 1 via corresponding connecting pipes 2. The chiller cools the first and second coils to approximately 8°C. The large amount of hot exhaust gas volatilized from the organic cleaning equipment passes through the 8°C first and second coils. A large amount of organic components are adsorbed on the surfaces of the first and second coils. The hot exhaust gas is cooled and converted into wastewater, which is then recycled to the chiller via the connecting pipes. During this process, the lower the temperature of the first coil and the second coil, the faster the condensation speed, the higher the concentration of the recovered waste liquid, and the lower the concentration of the process waste gas of the organic cleaning equipment.
[0015] The connecting pipe is a PU pipe.
[0016] like Figure 2 As shown, the tank cover assembly includes a tank cover 6 made of 316L stainless steel. The entire cover 6 is sprayed with 300°C Teflon, resulting in a Teflon coating on the outer surface. A handle 6.1 is provided on the outer surface of the cover 6, which facilitates positioning the cover 6 on top of the tank body 8. Symmetrical baffles 6.2 are provided on the inner surface of the cover 8. The spacing between the two baffles 6.2 matches the inner diameter of the tank body, ensuring that the cover is securely attached to the tank body, enabling the cover to cover a large area and reducing the emission of organic waste gas.
[0017] Wet organic cleaning equipment includes manual and semi-automatic organic cleaning equipment for non-automatic product transfer.
[0018] The outer surface of the 316L stainless steel tank cover in this application is sprayed with Teflon coating and a handle is provided on the tank cover. The tank cover is covered on the tank body through the handle, thereby achieving the requirement of full-process closed cover, reducing the volatilization of waste gas from the process tank body of the organic cleaning equipment from the source; at the same time, the exhaust treatment mechanism adsorbs the high-temperature organic waste gas when it encounters condensate and then weakens the concentration of the organic waste gas, thereby reducing the volatilization of the process waste gas of the organic cleaning equipment from the source, reducing the operating costs of the enterprise, and achieving green emissions.
[0019] In addition to the above embodiments, the present invention also includes other implementation methods. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the scope of protection of the claims of the present invention.
Claims
1. A semiconductor wet cleaning device, characterized in that: It includes a tank body and an exhaust treatment mechanism, wherein a first coil is arranged in the tank body, and a tank cover assembly is arranged on the top of the tank body; the exhaust treatment mechanism includes an exhaust duct, one end of the exhaust duct is connected to the tank body cavity, and the other end of the exhaust duct is connected to the power exhaust main pipe, and a second coil assembly is arranged at the connection between the exhaust duct and the power exhaust main pipe, the second coil assembly includes a second coil, the surface of the second coil is sequentially wrapped with an inner layer, a middle layer and an outer layer from the inside to the outside, and a damper is arranged in the second coil; the first coil and the second coil are respectively provided with quick connectors, and the quick connectors are respectively connected to the circulation pipeline of the chiller through connecting pipes.
2. The semiconductor wet cleaning device according to claim 1, characterized in that: The slot cover assembly comprises a slot cover, a handle is arranged on the outer surface of the slot cover, baffles are symmetrically arranged on the inner surface of the slot cover, and the distance between the two baffles matches the inner diameter of the slot body.
3. The semiconductor wet cleaning device according to claim 2, characterized in that: The outer surface of the slot cover is provided with a Teflon coating.
4. The semiconductor wet cleaning device according to claim 1, characterized in that: The inner layer is a primary filter cotton layer, the middle layer is a high-purity quartz cotton layer, and the outer layer is an aluminum foil glass fiber cloth layer.