Buffering gel adhesive tape

Abstract

The utility model discloses a buffer gel adhesive tape which comprises a PI (polyimide) layer, a first gel layer is arranged on one surface of the PI layer, a second gel layer is arranged on the other surface of the PI layer, a copper foil layer is arranged on one surface, far away from the PI layer, of the first gel layer, and a grid release film layer is arranged on the surface, far away from the PI layer, of the second gel layer. The utility model has the advantages of no layering phenomenon after being connected with an electronic product and solving the stamping problem of the electronic product.

Description

Technical Field

[0001] The utility model relates to the field of gel, in particular to a buffer gel tape. Background Art

[0002] The structure of copper foil + acrylic adhesive + foam + mesh double-sided adhesive is a support and buffer product used in the SCF structure of OLED screens. Although the application is relatively mature, the delamination of copper foil + acrylic adhesive and foam occurs from time to time. In order to solve similar delamination phenomena, the method adopted is to thin the structure. However, after the thinning structure, the pure adhesive film is relatively soft and not stiff enough, and it is easy to produce mold marks on electronic products during the application process.

[0003] For example, a Chinese patent with publication number CN213388492U discloses an integrated high-elastic tape for a heat dissipation module, which is composed of a release layer, a first adhesive layer, a high-resilience foam layer, a second adhesive layer and a heat dissipation metal layer that are compounded in sequence, wherein the second adhesive layer is an acrylic pressure-sensitive adhesive layer doped with thermal conductive powder.

[0004] Although the elastic tape does not require additional manual application of copper foil tape during use, thus avoiding the problem of bubbles and wrinkles in the traditional method that affect the photosensitive effect and heat dissipation effect, the copper foil + acrylic adhesive and foam will be delaminated during use.

[0005] In view of this, it is necessary to provide a buffer gel tape. Utility Model Content

[0006] The utility model provides a buffer gel tape, which effectively solves the problem of delamination of the existing electronic buffer tape and the problem of mold print after delamination.

[0007] The technical solution adopted by the utility model is:

[0008] A buffer gel tape comprises a PI layer, wherein a first gel layer is arranged on one side of the PI layer and a second gel layer is arranged on the other side of the PI layer, a copper foil layer is arranged on the side of the first gel layer away from the PI layer, and a grid release film layer is arranged on the side of the second gel layer away from the PI layer.

[0009] Furthermore, the first gel layer is the same as the second gel layer, and the thickness of the first gel layer is in the range of 0.05-0.15 mm.

[0010] Furthermore, the first gel layer is one of silicone, rubber and acrylic glue.

[0011] Furthermore, the copper foil layer has a thickness ranging from 0.018 to 0.1 mm.

[0012] Furthermore, the thickness of the PI layer is in the range of 0.025-0.075 mm.

[0013] Furthermore, the grid release film layer has a thickness ranging from 0.025 to 0.1 mm.

[0014] Beneficial effects of the utility model: a first gel layer is coated under the copper foil layer to connect the copper foil layer and the PI layer, and a second gel layer is coated under the PI layer, so that the material as a whole is sticky on one side, overcoming the stratification phenomenon of foam and acrylic glue, and can be fixed inside electronic products. The copper foil layer has excellent conductivity, shielding, heat dissipation, and support, so that the product has local conductivity, shielding and heat dissipation effects; the PI layer has a certain strength, which can effectively solve the mold printing problem; the gel layer has excellent buffering and shock absorption performance, as well as good viscosity, so that the material can be fixed on the electronic components while resisting buffering and protecting the electronic components. The PI layer has good tensile strength and elastic mold, which can effectively solve the mold printing problem while playing a buffering role. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a buffer gel tape provided in an embodiment of the present application.

[0016] Marked in the figure: 1, copper foil layer; 2, first gel layer; 3, PI layer; 4, second gel layer; 5, grid release film layer. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0020] like Figure 1 A buffer gel tape provided in an embodiment of the present application includes a PI layer 3, a first gel layer 2 is provided on one side of the PI layer 3, a second gel layer 4 is provided on the other side of the PI layer 3, a copper foil layer 1 is provided on the side of the first gel layer 2 away from the PI layer 3, and a grid release film layer 5 is provided on the side of the second gel layer 4 away from the PI layer 3.

[0021] In the above design, the first gel layer 2 is coated under the copper foil layer 1 to connect the copper foil layer 1 and the PI layer 3, and the second gel layer 4 is coated under the PI3, so that the buffer gel tape is sticky on one side as a whole, overcoming the stratification phenomenon of foam and acrylic glue, and can be fixed inside the electronic product. The copper foil layer 1 has excellent conductivity, shielding, heat dissipation, and support, so that the product has the effects of local conductivity, shielding and heat dissipation; the PI layer 3 has a certain strength, which can effectively solve the mold printing problem; the gel layer has excellent buffering and shock absorbing performance, as well as good viscosity, so that the material can be fixed on the electronic components while resisting buffering and protecting the electronic components. The PI layer 3 has good tensile strength and elastic mold, which can effectively solve the mold printing problem while playing a buffering role.

[0022] Specifically, the first gel layer 2 is the same as the second gel layer 4, and the thickness of the first gel layer 2 is in the range of 0.05-0.15 mm.

[0023] In the above design, the first gel layer 2 and the second gel layer 4 are the same, so that the adhesion on both sides of the PI layer 3 can be the same. The thickness range of the first gel layer 2 and the second gel layer 4 can meet the adhesion between the copper foil and the PI layer 3, and the PI layer 3 and the electronic product.

[0024] Specifically: the first gel layer 2 is one of silicone, rubber and acrylic glue.

[0025] In the above design, the absorption rate of silicone, rubber and acrylic glue is greater than 50%, the elongation can be greater than 700%, the elastic modulus is greater than 100MPa, and the viscosity is greater than 8N / inch, which can effectively meet the adhesion of the first silicone layer and the second silicone layer.

[0026] Specifically: the copper foil layer 1 has a thickness ranging from 0.018 to 0.1 mm.

[0027] In the above design, based on the conductivity, electromagnetic shielding, heat dissipation and hardness coefficient of copper and the thinness requirement of the product, the product has the effects of local conductivity, shielding and heat dissipation.

[0028] Specifically: the thickness of the PI layer 3 is in the range of 0.025-0.075 mm.

[0029] In the above design, PI has the characteristics of high temperature resistance, and its tensile strength and elastic modulus are also higher than those of general PET substrates, which can effectively solve the problem of mold printing.

[0030] Specifically, the grid release film layer 5 has a thickness ranging from 0.025 to 0.1 mm.

[0031] In the above design, the thickness range of the grid release film layer 5 is based on the thinness requirement of the product and the auxiliary requirement for the adhesion effect of the gel layer.

[0032] To further explain in detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A buffer gel tape, characterized in that: The invention comprises a PI layer (3), wherein a first gel layer (2) is arranged on one side of the PI layer (3), and a second gel layer (4) is arranged on the other side of the PI layer (3); a copper foil layer (1) is arranged on the side of the first gel layer (2) away from the PI layer (3), and a grid release film layer (5) is arranged on the side of the second gel layer (4) away from the PI layer (3).

2. The buffer gel tape according to claim 1, characterized in that: The first gel layer (2) is identical to the second gel layer (4), and the thickness of the first gel layer (2) is in the range of 0.05-0.15 mm.

3. The buffer gel tape according to claim 2, characterized in that: The first gel layer (2) is one of silicone, rubber and acrylic glue.

4. The buffer gel tape according to claim 1, characterized in that: The copper foil layer (1) has a thickness ranging from 0.018 to 0.1 mm.

5. The buffer gel tape according to claim 1, characterized in that: The thickness of the PI layer (3) is in the range of 0.025-0.075 mm.

6. The buffer gel tape according to claim 1, characterized in that: The grid release film layer (5) has a thickness ranging from 0.025 to 0.1 mm.

Images