Composite double-sided adhesive tape for vacuum sputtering

Abstract

The utility model relates to a composite double-sided adhesive tape for vacuum sputtering, which comprises a PI (polyimide) base material layer, a first anti-static coating is arranged on one side of the PI base material layer, a first silica gel layer is arranged on one side, deviating from the PI base material layer, of the first anti-static coating, and a fluoroplastic release film layer is arranged on one side, deviating from the first anti-static coating, of the first silica gel layer. A second anti-static coating is arranged on the other face of the PI base material layer, a second silica gel layer is arranged on the face, away from the PI base material layer, of the second anti-static coating, a high-temperature-resistant foam layer is arranged on the face, away from the second anti-static coating, of the second silica gel layer, and a UV viscosity-reducing adhesive layer is arranged on the face, away from the second silica gel layer, of the high-temperature-resistant foam layer. And a release film layer is arranged on one surface, deviating from the high-temperature-resistant foam layer, of the UV viscosity-reducing adhesive layer. The composite double-sided adhesive tape has good stickiness and buffering performance, is excellent in anti-static performance and has a good protection effect on tin point parts.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum sputtering, in particular to a composite double-sided adhesive tape used for vacuum sputtering. Background Art

[0002] With the rapid development of the electronics industry and the continuous upgrading of consumer electronics products, the production process is also developing, and various new technologies and processes are constantly being developed. In the related processing, new requirements are constantly being put forward for the protective film and adhesive tape for process protection, transfer and waste discharge. Protective film and high-temperature resistant adhesive tape are key materials for high-temperature processes of various optoelectronic products, which are of great significance to the quality and production efficiency of optoelectronic products.

[0003] The double-sided tape in the prior art has poor adhesion and buffering properties, does not have anti-static properties, cannot be applied to LGAs with tin spots on the bottom, and cannot provide good protection for the tin spots. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a composite double-sided adhesive tape for vacuum sputtering, which has good adhesion and buffering properties, excellent anti-static performance, and plays a good protective role on tin point parts.

[0005] The utility model solves its technical problem by adopting the following technical solution: a composite double-sided adhesive tape for vacuum sputtering, comprising a PI substrate layer, a first antistatic coating is arranged on one side of the PI substrate layer, a first silicone layer is arranged on the side of the first antistatic coating away from the PI substrate layer, and a fluoroplastic release film layer is arranged on the side of the first silicone layer away from the first antistatic coating.

[0006] A second antistatic coating is arranged on the other side of the PI substrate layer, a second silicone layer is arranged on the side of the second antistatic coating facing away from the PI substrate layer, a high-temperature resistant foam layer is arranged on the side of the second silicone layer facing away from the second antistatic coating, a UV anti-viscosity adhesive layer is arranged on the side of the high-temperature resistant foam layer facing away from the second silicone layer, and a release film layer is arranged on the side of the UV anti-viscosity adhesive layer facing away from the high-temperature resistant foam layer.

[0007] In one of the embodiments, the release film layer of the composite double-sided adhesive tape for vacuum sputtering is a PET single silicon release film layer, and the thickness of the PET single silicon release film layer is 0.025 mm-0.05 mm.

[0008] In one of the embodiments, the thickness of the UV anti-viscosity adhesive layer of the composite double-sided adhesive tape for vacuum sputtering is 0.01 mm-0.03 mm.

[0009] In one of the embodiments, the thickness of the high temperature resistant foam layer of the composite double-sided tape for vacuum sputtering is 0.02 mm-0.06 mm.

[0010] In one of the embodiments, the thickness of the second silicone layer of the composite double-sided tape for vacuum sputtering is 0.015-0.04 mm.

[0011] In one embodiment, the thickness of the first antistatic coating layer and the second antistatic coating layer of the composite double-sided adhesive tape for vacuum sputtering are both 0.1-1 μm.

[0012] In one embodiment, the thickness of the PI substrate layer of the composite double-sided tape for vacuum sputtering is 0.025-0.1 mm.

[0013] In one of the embodiments, the thickness of the first silicone layer of the composite double-sided tape for vacuum sputtering is 0.02-0.06 mm.

[0014] In one of the embodiments, the thickness of the fluoroplastic release film layer of the composite double-sided adhesive tape for vacuum sputtering is 0.025-0.075 mm.

[0015] The beneficial effects of this application are:

[0016] The present application provides a composite double-sided tape for vacuum sputtering, which has good adhesion and buffering properties, excellent anti-static properties, and can provide good protection for the tin-dot area at the bottom of the LGA. After high-temperature vacuum sputtering, the product surface has no overflow, no residual glue, and the debris is controllable. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a vacuum sputtered composite double-sided tape according to an embodiment of the present application;

[0018] in:

[0019] 1. PI substrate layer; 2. First antistatic coating layer; 3. First silicone layer; 4. Fluoroplastic release film layer; 5. Second antistatic coating layer; 6. Second silicone layer; 7. High temperature resistant foam layer; 8. UV viscosity reducing adhesive layer; 9. Release film layer. DETAILED DESCRIPTION

[0020] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0021] like Figure 1As shown, an embodiment of the present application provides a composite double-sided tape for vacuum sputtering, including a PI substrate layer 1, a first antistatic coating 2 is arranged on one side of the PI substrate layer 1, a first silicone layer 3 is arranged on the side of the first antistatic coating 2 facing away from the PI substrate layer 1, and a fluoroplastic release film layer 4 is arranged on the side of the first silicone layer 3 facing away from the first antistatic coating 2.

[0022] A second antistatic coating 5 is arranged on the other side of the PI substrate layer 1, a second silicone layer 6 is arranged on the side of the second antistatic coating 5 facing away from the PI substrate layer 1, a high-temperature resistant foam layer 7 is arranged on the side of the second silicone layer 6 facing away from the second antistatic coating 5, a UV anti-viscosity adhesive layer 8 is arranged on the side of the high-temperature resistant foam layer 7 facing away from the second silicone layer 6, and a release film layer 9 is arranged on the side of the UV anti-viscosity adhesive layer 8 facing away from the high-temperature resistant foam layer 7.

[0023] Specifically, the first antistatic coating 2 and the second antistatic coating 5 are coated on the two surfaces of the PI substrate layer 1 to improve the antistatic performance. The first silicone layer 3 is coated on the side of the first antistatic coating 2 away from the PI substrate layer 1 as a bonding layer with the carrier during the vacuum sputtering process, and then the fluoroplastic release film layer 4 is attached to the side of the first silicone layer 3 away from the first antistatic coating 2 to protect the silicone layer from contamination during transportation and use. The second silicone layer 6 is coated on the side of the second antistatic coating 5 away from the PI substrate layer 1 to paste the high-temperature resistant foam layer 7, and the UV viscosity-reducing adhesive layer 8 is coated on the side of the high-temperature resistant foam layer 7 away from the second silicone layer 6 to fix the relevant modules during the vacuum sputtering process, and then the release film layer 9 is attached to the side of the UV viscosity-reducing adhesive layer 8 away from the high-temperature resistant foam layer 7 to protect the UV viscosity-reducing adhesive layer 8 from contamination and facilitate the winding of the composite double-sided tape. Among them, the high-temperature resistant foam layer 7 can withstand a temperature of 200 degrees Celsius and can be used normally at 180°C (30min-1h).

[0024] The production process is:

[0025] The first step: corona discharge the PI substrate layer 1 so that the tension of the PI substrate layer 1 is ≥46 dynes, the corona power is 1.0 KW to 2.0 KW, and the running speed is 10 m / min.

[0026] Step 2: Use a screen printing roller to apply the antistatic liquid to the two surfaces of the PI substrate layer 1, and put it into an oven for drying. The coating speed is 30 m / min, and the coating thickness is controlled at 0.1-1 μm; the oven length is 30 m, and the maximum oven temperature is 130°C. After drying, the first antistatic coating 2 and the second antistatic coating 5 are formed on the two surfaces of the PI substrate layer 1.

[0027] Step 3: Coat the first antistatic coating 2 of the PI substrate layer 1 with silicone and laminate it with the fluoroplastic release film layer 4, and coat the second antistatic coating 5 of the PI substrate layer 1 with silicone and laminate it with the high-temperature resistant foam layer 7. The coating speed is 5-8m / min, the oven length is 30m, and the maximum oven temperature is 150°C. After drying, the first silicone layer 3 is formed on the first antistatic coating 2, and the second silicone layer 6 is formed on the second antistatic coating 5. Both the first silicone layer 3 and the second silicone layer 6 have permanent high adhesion, excellent weather resistance and high temperature resistance, and there is no residual glue after peeling at high temperature.

[0028] Step 4: The material used for the UV anti-viscosity adhesive layer 8 is an acrylic adhesive, which is formed into a UV anti-viscosity adhesive film by a solvent coating method, and the UV anti-viscosity adhesive film is coated on the release film layer 9, and then dried in an oven, and then bonded with the high-temperature resistant foam layer 7 for aging. After aging, the UV anti-viscosity adhesive film forms a UV anti-viscosity adhesive layer 8. The UV anti-viscosity adhesive layer 8 has strong adhesion to the high-temperature resistant foam layer 7, the adhesion of the UV anti-viscosity adhesive layer 8 to SUS (304) is above 1000g, and the high temperature resistance is good. After the UV anti-viscosity adhesive layer 8 is de-viscosity, the adhesive will not remain on the wafer, and it is easy to peel and tear off.

[0029] The composite double-sided adhesive tape for vacuum sputtering has good adhesion and buffering properties, excellent anti-static properties, and is particularly suitable for LGA with tin spots on the bottom. The tin spots can be embedded in the UV viscosity-reducing adhesive layer 8 and the high-temperature resistant foam layer 7, which plays a good protective role on the tin spots. It also ensures that the surface of the product after high-temperature vacuum sputtering has no overflow, no residual glue, and the debris is controllable.

[0030] like Figure 1 As shown, in one embodiment, the release film layer 9 of the composite double-sided adhesive tape for vacuum sputtering is a PET single silicon release film layer 9, and the thickness of the PET single silicon release film layer 9 is 0.025mm-0.05mm. Among them, the thickness of the PET single silicon release film layer 9 can be 0.025, 0.030, 0.05mm, etc., preferably a 0.3mm PET single silicon release film layer 9. The residual adhesion rate of the release film layer 9 is ≥90%, and the release force of the release film layer 9 is greater than that of the fluoroplastic release film layer 4. The design of light and heavy release force makes it easy for the product to not have anti-release phenomenon during use and easy to peel off the release layer. This setting facilitates the winding of the composite double-sided adhesive and protects the UV viscosity-reducing adhesive layer 8 from contamination.

[0031] like Figure 1As shown, in one embodiment, the thickness of the UV anti-viscosity adhesive layer 8 of the composite double-sided adhesive tape for vacuum sputtering is 0.01mm-0.03mm. Among them, the thickness of the UV anti-viscosity adhesive layer 8 can be 0.01mm, 0.02mm and 0.03mm, etc., preferably 0.02mm. The UV anti-viscosity adhesive layer 8 can fix the relevant module components during the vacuum sputtering process. The UV anti-viscosity adhesive layer 8 has high adhesion, excellent weather resistance and high temperature resistance, and the UV anti-viscosity adhesive layer 8 is exposed to ultraviolet rays after use, and the adhesion will drop sharply, which is convenient for the peeling of the double-sided adhesive, and there is no colloid residue on the corresponding modules and components after peeling.

[0032] like Figure 1 As shown, in one embodiment, the thickness of the high temperature resistant foam layer 7 of the composite double-sided tape for vacuum sputtering is 0.02mm-0.06mm. Among them, the thickness of the high temperature resistant foam layer 7 can be 0.02mm, 0.04mm and 0.06mm, preferably 0.04mm. The high temperature resistant foam layer 7 can provide good buffering performance for the composite double-sided tape. During the high temperature sputtering process, it is particularly suitable for use in large-sized SIP modules, especially LGA with tin dots at the bottom. The tin dots can be embedded in the UV viscosity-reducing adhesive layer 8 and the high temperature resistant foam, which plays a good protective role. After high temperature vacuum sputtering, there is no overflow plating, no residual glue, and the debris on the product surface is controllable.

[0033] like Figure 1 As shown, in one embodiment, the thickness of the second silicone layer 6 of the composite double-sided tape for vacuum sputtering is 0.015-0.04 mm. The thickness of the second silicone layer 6 can be 0.015 mm, 0.028 mm and 0.04 mm, preferably 0.028 mm. The second silicone layer 6 adheres the high temperature resistant foam layer 7 and the PI substrate layer 1, and has permanent high adhesion, excellent weather resistance and high temperature resistance.

[0034] like Figure 1 As shown, in one embodiment, the thickness of the first antistatic coating 2 and the second antistatic coating 5 of the composite double-sided tape for vacuum sputtering is 0.1-1 μm. The thickness of the first antistatic coating 2 and the second antistatic coating 5 can be 0.1 μm, 0.5 μm and 1 μm, preferably 0.5 μm. The setting of the first antistatic coating 2 and the second antistatic coating 5 provides a good antistatic effect for the product, and also improves the adhesion between the PI substrate layer 1 and the first silicone layer 3 and the second silicone layer 6.

[0035] like Figure 1As shown, in one embodiment, the thickness of the PI substrate layer 1 of the composite double-sided tape for vacuum sputtering is 0.025-0.1mm. Among them, the thickness of the PI substrate layer 1 can be 0.025mm, 0.06mm and 0.1mm, preferably 0.06mm. The PI substrate layer 1 has a certain tensile strength, which complements the high temperature resistant foam layer 7. When reworked, the toughness of the composite double-sided tape can be increased, and the tape will not be easily broken when the composite double-sided tape is removed. At the same time, the excellent high temperature resistance of the PI substrate layer 1 itself also ensures the overall heat resistance of the composite double-sided tape, and the surface tension of the PI substrate layer 1 is ≥46 dynes. The appropriate thickness enables the substrate layer to meet the use requirements and be strong and reliable, and the appropriate surface tension enables the surface coating of the PI substrate layer 1 to be uniform and defect-free.

[0036] like Figure 1 As shown, in one embodiment, the thickness of the first silicone layer 3 of the composite double-sided tape for vacuum sputtering is 0.02-0.06 mm. The thickness can be 0.02 mm, 0.04 mm and 0.06 mm, preferably 0.04 mm. The first silicone layer 3 is used for bonding with the carrier during the vacuum sputtering process, has permanent high adhesion, excellent weather resistance and high temperature resistance, and no residual glue is peeled off after high temperature.

[0037] like Figure 1 As shown, in one embodiment, the thickness of the fluoroplastic release film layer 4 of the composite double-sided tape for vacuum sputtering is 0.025-0.075mm. The thickness can be 0.025mm, 0.05mm and 0.075mm, preferably 0.05mm. The fluoroplastic release film layer 4 can protect the first silicone layer 3 from contamination during production, transportation and use, and facilitate the winding of the composite double-sided tape. The residual bonding rate of the fluoroplastic release film layer 4 is ≥90%, and its release force requirement is less than that of the release film layer 9. The design of light and heavy release forces makes it easy for the product to be peeled off without reverse release during use.

[0038] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A composite double-sided adhesive tape for vacuum sputtering, characterized in that: comprising a PI substrate layer (1), A first antistatic coating (2) is disposed on one side of the PI substrate layer (1), a first silicone layer (3) is disposed on the side of the first antistatic coating (2) facing away from the PI substrate layer (1), and a fluoroplastic release film layer (4) is disposed on the side of the first silicone layer (3) facing away from the first antistatic coating (2). A second antistatic coating (5) is arranged on the other side of the PI substrate layer (1); a second silicone layer (6) is arranged on the side of the second antistatic coating (5) facing away from the PI substrate layer (1); a high-temperature resistant foam layer (7) is arranged on the side of the second silicone layer (6) facing away from the second antistatic coating (5); a UV anti-viscosity adhesive layer (8) is arranged on the side of the high-temperature resistant foam layer (7) facing away from the second silicone layer (6); and a release film layer (9) is arranged on the side of the UV anti-viscosity adhesive layer (8) facing away from the high-temperature resistant foam layer (7).

2. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The release film layer (9) is a PET single silicon release film layer, and the thickness of the PET single silicon release film layer is 0.025 mm-0.05 mm.

3. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the UV anti-viscosity adhesive layer (8) is 0.01 mm-0.03 mm.

4. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the high temperature resistant foam layer (7) is 0.02 mm-0.06 mm.

5. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the second silica gel layer (6) is 0.015-0.04 mm.

6. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the first antistatic coating (2) and the second antistatic coating (5) are both 0.1-1 μm.

7. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the PI substrate layer (1) is 0.025-0.1 mm.

8. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the first silica gel layer (3) is 0.02-0.06 mm.

9. The composite double-sided adhesive tape for vacuum sputtering according to claim 1, characterized in that: The thickness of the fluoroplastic release film layer (4) is 0.025-0.075 mm.

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