High-strength slide glass disc

By fixing the reinforced ring and designing hook and abutment on the roller disk, the problem of deformation of the roller disk and difficulty in dialing out the wafer is solved, and the high strength of the roller disk and stable fixation of the wafer are achieved and the convenient chip is achieved.

CN222540858UActive Publication Date: 2025-02-28JIANGXI ZHAO CHI SEMICON CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202323403390.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-13
Publication Date
2025-02-28
Estimated Expiration
2033-12-13

AI Technical Summary

Technical Problem

In the prior art, the disk disk is prone to deform during sandblasting cleaning, resulting in the wafer being stuck on the disk disk. Due to the unreasonable distribution of the abutment parts, it is difficult to dial out the wafer, resulting in a high chip rate.

Method used

A high-strength roller disk is designed to increase the overall stiffness by connecting the reinforcement ring on the side of the roller disk body away from the wafer, and connecting the positioning member through the reinforcement. At the same time, the design of the hook and abutment ensures the fixation of the wafer and the convenience of the chipping.

Benefits of technology

It improves the overall stiffness of the slide disk, reduces deformation during sandblasting cleaning, ensures stable fixation and convenient chip removal of the wafer, and reduces the chip rate.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

The utility model provides a high-strength slide glass disc, which comprises a slide glass disc body used for bearing a wafer, a plurality of positioning pieces arranged around the slide glass disc body at intervals, and a spring positioned on one surface, far away from the wafer, of the slide glass disc body, and a reinforcing circular ring is arranged on one surface, far away from the wafer, of the slide glass disc body. A reinforcing piece is fixedly connected between each positioning piece and the reinforcing circular ring, the spring comprises a hook part used for hooking a wafer, two first abutting pieces used for abutting against the wafer are arranged on the slide glass disc body, the middle point of the connecting line of the two abutting pieces is located on the opposite side of the hook part, and a second abutting piece used for guiding the wafer is further arranged on the slide glass disc body. The first abutting piece is located on the first circular arc, the two second abutting pieces are located on the second circular arc, and the radius of the first circular arc is larger than that of the second circular arc, the rigidity of the wafer carrying disc body can be improved, meanwhile, the wafer fixing effect is not affected, wafer discharging is facilitated, and the wafer breaking rate is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of LED chip production and manufacturing, in particular to a chip carrier plate with high strength. Background Art

[0002] Evaporation is a type of physical deposition. It is a process in which the evaporation material is sublimated into gaseous molecular evaporation material in some way. The gaseous molecular evaporation material moves in a vacuum environment and adheres to the surface of the object to be evaporated, thereby forming a thin film on the surface of the object to be evaporated.

[0003] In the prior art, the wafer is generally evaporated by placing the wafer on a carrier plate, and then fixing the carrier plate on the plating pot. However, in actual use, the carrier plate needs to be cleaned by sandblasting, which causes the carrier plate to be easily deformed. Since heating is involved in the evaporation process, the wafer will cool down when it is removed, and thermal expansion and contraction can easily cause the wafer to be stuck on the slightly deformed carrier stage. The wafer is generally supported by three abutments located on the same arc line, making it difficult to pull out the wafer. Forcible pulling out will greatly increase the breakage rate. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a wafer carrier with high strength, aiming to solve the technical problems in the prior art that thermal expansion and contraction can easily cause the wafer to be stuck on the slightly deformed wafer carrier, and the wafer is generally supported by three abutment members located on the same arc line, making it difficult to pull the wafer out, and forced pulling out will greatly increase the breakage rate.

[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0006] A high-strength wafer carrier comprises a wafer carrier body for carrying wafers, a plurality of positioning members arranged at intervals around the wafer carrier body, and a spring located on a side of the wafer carrier body away from the wafer, a reinforcing ring is provided on the side of the wafer carrier body away from the wafer, a reinforcing member is fixedly connected between each of the positioning members and the reinforcing ring, the spring comprises a hook portion for hooking the wafer, two first abutting members for abutting the wafer are provided on the wafer carrier body, the midpoint of the line connecting the two first abutting members is located on the opposite side of the hook portion, a second abutting member for a guide is also provided on the wafer carrier, the first abutting member is located on a first arc, the two second abutting members are located on a second arc, and the radius of the first arc is greater than the radius of the second arc.

[0007] Compared with the prior art, the beneficial effects of the utility model are:

[0008] By fixing a reinforcing ring on the side of the wafer carrier body away from the wafer, and connecting the reinforcing ring to each positioning member through a reinforcing member, the overall rigidity of the entire wafer carrier body can be improved. When the wafer carrier body is sandblasted to clean, the deformation of the wafer carrier body can be reduced. At the same time, two first abutment members are arranged on the side opposite to the hook portion. The hook portion squeezes the wafer on the two first abutment members to ensure the fixing effect of the wafer. At the same time, a second abutment member for the guide is also provided, wherein the second abutment member and the first abutment member are not located on the same arc. Without affecting the convenience of loading the wafer, when the wafer carrier body is deformed, the hook portion can be slightly loosened, and then the wafer can be rotated and rolled down along the first abutment member, thereby preventing the difficulty in pulling out the wafer due to the three abutment members blocking the rotating and rolling path of the wafer on the same arc in the prior art, and the forced pulling out leads to a greatly increased fragmentation rate.

[0009] According to one aspect of the above technical solution, a fixing block is fixedly connected to the hook portion, and the middle portion of the fixing block is recessed inward to form a grabbing groove for easy picking by operators.

[0010] According to one aspect of the above technical solution, the spring also includes a spring body connected to the hook portion, and a connecting portion fixedly connected to the spring body, the connecting portion and the hook portion are arranged at both ends of the spring body, and the connecting portion is used to connect to the wafer carrier body.

[0011] According to one aspect of the above technical solution, the connecting portion includes a ring, and a buckle connected to the ring is fixedly connected to the wafer carrier body. The wafer carrier body is also provided with a strip groove at the hook portion, and the strip groove is used for the hook portion to pass through.

[0012] According to one aspect of the above technical solution, the spring body is mounted on the surface of the reinforcing ring.

[0013] According to one aspect of the above technical solution, the edge portion of the wafer carrier body is recessed to form a wafer taking opening for a suction pen to take the wafer.

[0014] According to one aspect of the above technical solution, the wafer carrier body is recessed to form a placement groove, and the placement groove is arranged close to the strip groove, and the strip groove is used to temporarily place the hook portion.

[0015] According to one aspect of the above technical solution, the reinforcement member and the reinforcement ring are both made of rigid material. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the planar structure of a high-strength wafer carrier in an embodiment of the utility model;

[0017] Figure 2It is a schematic diagram of the vertical structure of a high-strength wafer carrier in an embodiment of the utility model;

[0018] Figure 3 for Figure 2 A magnified view of part A;

[0019] Description of main component symbols:

[0020] Carrier plate body 10 Strip groove 11 Placement slot 12 Suction pen film extraction port 13 Positioning parts 20 Reinforcement 30 Reinforcement ring 35 First abutment member 40 Second abutment member 45 Spring body 50 Hook 51 Connection 52 Fixed block 53 Grab slot 54 Ring 55 Buckle 56

[0021] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] See also Figures 1 to 3, shown is a high-strength wafer carrier in an embodiment of the utility model, comprising a wafer carrier body 10 for carrying wafers, a plurality of positioning members 20 arranged at intervals around the wafer carrier body 10, and a spring located on a side of the wafer carrier body 10 away from the wafer, a reinforcing ring 35 is provided on the side of the wafer carrier body 10 away from the wafer, a reinforcing member 30 is fixedly connected between each of the positioning members 20 and the reinforcing ring 35, the spring comprises a hook portion 51 for hooking the wafer, two first abutting members 40 for abutting against the wafer are provided on the wafer carrier body 10, the midpoint of the line connecting the two first abutting members is located on the opposite side of the hook portion 51, a second abutting member 45 for a guide is also provided on the wafer carrier, the first abutting member 40 is located on a first arc, the two second abutting members 45 are located on a second arc, and the radius of the first arc is greater than the radius of the second arc.

[0026] It can be understood that by fixing a reinforcing ring 35 on the side of the wafer carrier body 10 away from the wafer, and connecting the reinforcing ring 35 to each positioning member 20 through the reinforcing member 30, the overall rigidity of the entire wafer carrier body 10 can be improved, and the deformation of the wafer carrier body 10 can be reduced when the wafer carrier body 10 is sandblasted and cleaned. At the same time, two first abutment members 40 are provided on the side opposite to the hook portion 51, and the hook portion 51 squeezes the wafer against the two first abutment members 40 to ensure the fixing effect of the wafer. The second abutment 45 for guiding the wafer is also provided, wherein the second abutment 45 and the first abutment 40 are not located on the same arc. Without affecting the convenience of loading the wafer, when the wafer carrier plate body 10 is deformed, the hook portion 51 can be loosened slightly, and then the wafer can be rotated and rolled along the first abutment 40 to remove the wafer, thereby preventing the difficulty in pulling out the wafer due to the three abutments on the same arc blocking the rotating and rolling path of the wafer in the prior art, and the forced pulling out leads to a greatly increased breakage rate.

[0027] It should be noted that the wafer carrier body 10 has two surfaces, one surface is used to carry the wafer, and the other surface is fixed to the plating pot through the positioning member 20. The first abutment member 40 and the second abutment member 45 are both protruding from the side of the wafer carrier body 10 that carries the wafer. The hook portion 51 hooks the wafer and pushes it toward the two first abutment members 40. The three are used together to fix the wafer.

[0028] Preferably, in this embodiment, there are three positioning members 20 arranged in an equilateral triangle at the edge of the wafer carrier body 10, so that the wafer carrier body is more stable during the operation of the plating pot and is less likely to deform during the sandblasting process.

[0029] Furthermore, a fixing block 53 is fixedly connected to the hook portion 51 , and the middle portion of the fixing block 53 is recessed inward to form a grabbing groove 54 for operators to take the device conveniently.

[0030] It is understandable that since the hook portion 51 is relatively thin, it is difficult for the operator to grasp it while wearing gloves, which makes it difficult to hang the hook portion 51 on the wafer, affecting the operating efficiency. Therefore, a fixing block 53 is fixedly connected to the hook portion 51, and the middle part of the fixing block 53 is recessed inward to form a grasping groove 54 for the operator to take easily. The operator can easily grasp the hook portion 51 through the grasping groove 54.

[0031] Furthermore, the spring also includes a spring body 50 connected to the hook portion 51, and a connecting portion 52 fixedly connected to the spring body 50, the connecting portion 52 and the hook portion 51 are respectively arranged at two ends of the spring body 50, and the connecting portion 52 is used to connect to the wafer carrier body 10.

[0032] It can be understood that when the hook portion 51 and the connecting portion 52 are stretched, the spring body 50 is stretched transversely. Figure 1 shown.

[0033] Furthermore, the connecting portion 52 includes a ring 55, and a buckle 56 connected to the ring 55 is fixedly connected to the wafer carrier body 10. The wafer carrier body 10 is also provided with a strip groove 11 at the hook portion 51, and the strip groove 11 is used for the hook portion 51 to pass through.

[0034] It can be understood that by setting a buckle 56 on the wafer carrier body 10 and then connecting the spring to the buckle 56 through the ring 55, one end of the connecting portion 52 of the spring can be fixed, and then the hook portion 51 of the spring can be hooked onto the wafer, so that both ends of the spring can be fixed, wherein the strip groove 11 is used for the hook portion 51 to pass through, to prevent the hook portion 51 from sliding off along the edge of the wafer carrier body 10.

[0035] Specifically, the spring body 50 is mounted on the surface of the reinforcing ring 35 , which is equivalent to the reinforcing ring 35 being located below the wafer carrier body 10 , and the spring body 50 is also located below the reinforcing ring 35 .

[0036] Furthermore, the edge of the wafer carrier body 10 is recessed to form a wafer taking opening 13 for a suction pen to take the wafer.

[0037] It can be understood that when the wafer carrier body 10 is not deformed, the wafer can be removed by a suction pen through the suction pen wafer removal port 13 .

[0038] Furthermore, the wafer carrier body 10 is recessed to form a placement groove 12 , and the placement groove 12 is arranged close to the strip groove 11 , and the strip groove 11 is used to temporarily place the hook portion 51 .

[0039] It can be understood that when taking the wafer, the hook portion 51 needs to be stretched to release the pressure on the wafer. In order to prevent the hook portion 51 from shaking, a placement groove 12 is provided, and the hook portion 51 can be temporarily placed in the placement groove 12. After the next wafer is loaded, the hook portion 51 can be taken out of the placement groove 12 to continue clamping the wafer.

[0040] Preferably, the reinforcement member 30 and the reinforcement ring 35 are both made of rigid material.

[0041] In summary, the high-strength wafer carrier in the above-mentioned embodiments of the utility model can improve the overall rigidity of the entire wafer carrier body by fixing a reinforcing ring on the side of the wafer carrier body away from the wafer, and connecting the reinforcing ring to each positioning member through a reinforcing member. When the wafer carrier body is sandblasted to clean the wafer carrier body, the deformation of the wafer carrier body can be reduced. At the same time, two first abutment members are arranged on the side opposite to the hook portion. The hook portion squeezes the wafer on the two first abutment members to ensure the fixing effect of the wafer. At the same time, a second abutment member for guiding the wafer is also provided, wherein the second abutment member and the first abutment member are not located on the same arc. Without affecting the convenience of loading the wafer, when the wafer carrier body is deformed, the hook portion can be slightly loosened, and then the wafer can be rotated and rolled down along the first abutment member, thereby preventing the difficulty in pulling out the wafer due to the three abutment members blocking the rotating and rolling path of the wafer on the same arc in the prior art, and the forced pulling out leads to a greatly increased fragmentation rate.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high-strength wafer carrier, characterized in that: It includes a wafer carrier body for carrying wafers, a plurality of positioning members arranged at intervals around the wafer carrier body, and a spring located on a side of the wafer carrier body away from the wafer, a reinforcing ring is provided on the side of the wafer carrier body away from the wafer, a reinforcing member is fixedly connected between each of the positioning members and the reinforcing ring, the spring includes a hook portion for hooking the wafer, two first abutting members for abutting the wafer are provided on the wafer carrier body, the midpoint of the line connecting the two first abutting members is located on the opposite side of the hook portion, and a second abutting member for a guide is also provided on the wafer carrier, the first abutting member is located on a first arc, the two second abutting members are located on a second arc, and the radius of the first arc is greater than the radius of the second arc.

2. The high-strength wafer carrier according to claim 1, characterized in that: The hook portion is fixedly connected with a fixing block, and the middle portion of the fixing block is recessed inwards to form a grabbing groove for operators to take the device conveniently.

3. The high-strength wafer carrier according to claim 1, characterized in that: The spring also includes a spring body connected to the hook portion, and a connecting portion fixedly connected to the spring body. The connecting portion and the hook portion are arranged at both ends of the spring body, and the connecting portion is used to connect to the wafer carrier body.

4. The high-strength wafer carrier according to claim 3, characterized in that: The connecting portion comprises a collar, a buckle connected to the collar is fixedly connected to the wafer carrier body, and a strip groove is further provided on the wafer carrier body at the hook portion, and the strip groove is used for the hook portion to pass through.

5. The high-strength wafer carrier according to claim 3, characterized in that: The spring body is mounted on the surface of the reinforcing ring.

6. The high-strength wafer carrier according to claim 1, characterized in that: The edge of the wafer carrier body is recessed to form a wafer taking opening for a suction pen to take the wafer.

7. The high-strength wafer carrier according to claim 4, characterized in that: The wafer carrier body is recessed to form a placement groove, and the placement groove is arranged close to the strip groove, and the strip groove is used to temporarily place the hook portion.

8. The wafer carrier with high strength according to claim 1, characterized in that: The reinforcement piece and the reinforcement ring are both made of rigid material.