Board card assembly and computer

Abstract

The utility model provides a board card assembly and a computer. The board card assembly comprises a main board, a back board, an expansion card, a main support and a side vertical support. The side stand support is located above the main support, the main support is detachably connected with the side stand support, the back plate and the expansion card are both fixedly connected with the side stand support, and the back plate is electrically connected with the expansion card; the mainboard and the expansion card are both perpendicular to the backboard. The mainboard is inserted into the back plate so as to be electrically connected with the expansion card through the back plate; the main board is located above the main support, the main support is in sliding connection with the main board, and the main support is used for supporting the main board. The main board dismounting device can improve the dismounting efficiency of the main board.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a board component and a computer. Background Art

[0002] Existing computer motherboards are directly fixed to the bottom plate of the chassis by screws, and the expansion card is plugged into the expansion slot of the motherboard from top to bottom. At the same time, a fixed bracket is fixedly provided on one side of the motherboard, and one end of the expansion card is fixedly connected to the bracket by screws to ensure the stability of the connection between the expansion card and the expansion slot.

[0003] However, when the motherboard needs to be disassembled, the screws connecting the fixing bracket to the chassis must be removed first; then the screws on the fixing bracket that are threadedly connected to the expansion card must be removed to remove the fixing bracket from the chassis; then the expansion card must be removed from the motherboard, and finally the motherboard can be removed. This operation is time-consuming and laborious.

[0004] Therefore, how to improve the disassembly efficiency of the mainboard has become a problem that needs to be solved urgently. Utility Model Content

[0005] In order to solve the above problems, the board card assembly and the computer provided by the utility model can improve the efficiency of disassembling the mainboard by arranging a main bracket and a side bracket.

[0006] In a first aspect, the utility model provides a board assembly, the board assembly comprising: a mainboard, a backplane, an expansion card, a main bracket and a side bracket;

[0007] The side stand bracket is located above the main stand bracket, the main stand bracket and the side stand bracket are detachably connected, the back plate and the expansion card are both fixedly connected to the side stand bracket, and the back plate is electrically connected to the expansion card;

[0008] The main board and the expansion card are both perpendicular to the backplane; the main board is plugged into the backplane to be electrically connected to the expansion card through the backplane;

[0009] The mainboard is located above the main bracket, the main bracket is slidably connected to the mainboard, and the main bracket is used to support the mainboard.

[0010] Optionally, the side bracket is provided with at least one expansion opening, the back panel and the expansion card are respectively located on opposite sides of the side bracket, and the expansion slot on the back panel passes through the side bracket via at least one expansion opening and is plugged into the expansion card.

[0011] Optionally, the main support comprises: a base frame and a support frame;

[0012] The support frame and the side support frame are both located above the base frame, and the support frame and the side support frame are both detachably connected to the base frame;

[0013] The main board is located above the support frame and is slidably connected to the support frame.

[0014] Optionally, the mainboard and the support frame are both located on a side of the backplane facing away from the expansion card.

[0015] Optionally, the board assembly further includes: a pull-out plate and a limit slide rail;

[0016] The limiting slide rail is located above the support frame and is fixedly connected to the support frame, the pull-out plate is located above the support frame and is fixedly connected to the main board, and is slidably connected to the limiting slide rail in a direction perpendicular to the back plate;

[0017] Optionally, the board assembly further includes: an auxiliary extraction member;

[0018] The auxiliary pull-out piece is pivotally connected to the draw-out plate, and the auxiliary pull-out piece is used for driving the draw-out plate to move in a direction away from the back plate, so as to separate the main plate from the back plate.

[0019] Optionally, a connector is fixedly arranged on the upper surface of the mainboard, and the board assembly further comprises: an IO board;

[0020] The IO board is located above the main board and is plugged into the connector along the up-down direction so as to be electrically connected to the main board through the connector; the IO board is fixedly connected to the main bracket.

[0021] In a second aspect, the utility model provides a computer, comprising: a chassis and any one of the board and card components as described above, wherein the board and card component is located in the chassis, and a main bracket is fixedly connected to the chassis.

[0022] Optionally, the chassis includes: a chassis frame and a shell;

[0023] The outer shell is wrapped around the outer side of the box frame to enclose a closed space; the outer shell is fixedly connected to the box frame, and the material strength of the box frame is greater than the material strength of the outer shell.

[0024] Optionally, the chassis includes an upper cover and heat dissipation fins;

[0025] The heat dissipation fins are located on the outer side of the upper cover and are fixedly connected to the upper cover. An inner groove is provided on the outer surface of the upper cover. The height of the heat dissipation fins located in the inner groove is greater than the height of the heat dissipation fins outside the inner groove.

[0026] Optionally, the computer further comprises a heat sink, a first insulating component and a second insulating component, the heat sink is located in the chassis, one surface of the heat sink is in contact with the power device on the mainboard, and the other surface of the heat sink is in contact with the chassis;

[0027] The heat sink is fixedly connected to the mainboard in an insulated manner via a first insulating component, and the main bracket is fixedly connected to the chassis in an insulated manner via a second insulating component.

[0028] Optionally, a signal ground component and a chassis ground component are provided on the chassis;

[0029] The signal ground component and the chassis ground component both penetrate the chassis, the signal ground component is insulated and fixedly connected to the chassis through the third insulating component, the signal ground component is electrically connected to the board component, and the chassis ground component is electrically connected to the chassis;

[0030] The signal ground component and the chassis ground component are both used to electrically connect to the external ground wire.

[0031] The board and card assembly and computer provided by the embodiment of the utility model define the relative positions of the main board, the back board and the expansion card by setting a main bracket and a side bracket, so that there is no need to remove the back board and the expansion card when disassembling the main board, thereby improving the disassembly efficiency of the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A schematic exploded view of a board assembly according to an embodiment of the present application;

[0034] Figure 2 This is a schematic structural diagram of a board assembly according to an embodiment of the present application;

[0035] Figure 3 This is a schematic structural diagram of a partial structure of a board assembly according to an embodiment of the present application;

[0036] Figure 4 This is a schematic structural diagram of a partial structure of a board assembly according to an embodiment of the present application;

[0037] Figure 5 is a schematic cross-sectional view of a computer according to an embodiment of the present application;

[0038] Figure 6 This is a schematic diagram of the internal structure of a computer according to an embodiment of the present application;

[0039] Figure 7 A schematic exploded view of a computer according to an embodiment of the present application;

[0040] Figure 8 A schematic structural diagram of a computer according to an embodiment of the present application;

[0041] Fig. 9 for Figure 2 A schematic partial cross-sectional view at point A;

[0042] Fig.10This is a schematic partial cross-sectional view of the connection position between the bottom frame and the box frame of an embodiment of the present application;

[0043] Fig.11 for Figure 7 A schematic partial cross-sectional view at B in FIG.

[0044] Fig.12 This is a schematic diagram of the internal structure of a computer according to an embodiment of the present application.

[0045] Reference numerals

[0046] 1. Motherboard; 2. Backplane; 3. Expansion card; 4. Main bracket; 41. Bottom frame; 42. Support frame; 5. Side bracket; 51. Avoidance; 61. Pull-out plate; 62. Limiting slide rail; 63. Pull-out aid; 631. Connecting part; 632. Pressing part; 633. Toggle part; 64. IO board; 65. Tripod; 66. Reinforcement frame; 661. Horizontal cutout; 7. Chassis; 71. Box frame; 711. Support frame; 712. Mounting plate; 7121 , avoidance opening; 72, outer shell; 721, upper cover; 7211, inner groove; 722, front panel; 723, lower cover; 724, rear panel; 81, heat sink fins; 82, heat sink; 83, power module; 84, signal ground component; 85, chassis ground component; 86, handle; 91, first insulating sleeve; 92, second insulating sleeve; 93, third insulating sleeve; 931, cylindrical portion; 932, sheet portion; 94, fourth insulating sleeve; 95, grounding pin. DETAILED DESCRIPTION

[0047] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0049] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0050] It should be noted that when an element is referred to as being "fixedly connected" to another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0051] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0052] In a first aspect, an embodiment of the present invention provides a board assembly, see Figure 1-Figure 3 The board assembly includes: a main board 1, a backplane 2, an expansion card 3, a main bracket 4 and a side bracket 5.

[0053] The side bracket 5 is located above the main bracket 4 , the main bracket 4 and the side bracket 5 are detachably connected, the backplane 2 and the expansion card 3 are both fixedly connected to the side bracket 5 , and the backplane 2 and the expansion card 3 are electrically connected.

[0054] The mainboard 1 and the expansion card 3 are both perpendicular to the backplane 2; the mainboard 1 is plugged into the backplane 2 to be electrically connected to the expansion card 3 through the backplane 2. The mainboard 1 is located above the main bracket 4, which is slidably connected to the mainboard 1 and is used to support the mainboard 1.

[0055] It should be noted that the mainboard 1 and the expansion card 3 can be parallel to each other or perpendicular to each other. In addition, the mainboard 1 and the expansion card 3 can be located on the same side of the backplane 2 or on opposite sides of the backplane 2. The backplane 2 can be electrically connected to multiple expansion cards 3 at the same time.

[0056] In this embodiment, the number of expansion cards 3 is three, but not limited to this; the mainboard 1 and the expansion cards 3 are horizontally located on the left and right sides of the backplane 2, respectively, and the backplane 2 is fixed by screws on the side of the side bracket 5 facing the mainboard 1; the three expansion slots on the backplane 2 are connected to the corresponding expansion cards 3 through the avoidance openings 51 on the side bracket 5.

[0057] In the board assembly, a main bracket 4 and a side bracket 5 are provided to limit the relative positions of the main board 1, the backboard 2 and the expansion card 3, so that when disassembling the main board 1, there is no need to disassemble the backboard 2 and the expansion card 3, thereby improving the disassembly efficiency of the main board 1.

[0058] Furthermore, the main support 4 includes a base frame 41 and a support frame 42 .

[0059] The support frame 42 and the side support frame 5 are both located above the bottom frame 41, and are detachably connected to the bottom frame 41 through screws. The mainboard 1 is located above the support frame 42 and is slidably connected to the support frame 42.

[0060] The base frame 41 and the support frame 42 both adopt a hollow design, that is, a plurality of hollow holes are provided on the base frame 41 and the support frame 42, which can effectively reduce the overall weight of the board assembly.

[0061] In this embodiment, the base frame 41 and the support frame 42 are both n-shaped structures formed by bending, and both ends of the bottom are bent outward to form folded edges to facilitate fixing them by screws; the main board 1 and the support frame 42 are both located on the left side of the back panel 2.

[0062] The board assembly further includes: a pull-out plate 61 and a limit rail 62. The limit rail 62 is located above the support frame 42 and is fixedly connected to the support frame 42, and the pull-out plate 61 is located above the support frame 42 and is fixedly connected to the mainboard 1, and is slidably connected to the limit rail 62 in a direction perpendicular to the back plate 2.

[0063] During the process of electrically connecting the main board 1 and the back panel 2, the main board 1 and the pull-out plate 61 form a component, which can be pushed in parallel to enable one end of the main board 1 to engage with the connector of the back panel 2. At this time, the main bracket 4 is used to support and fix the main board 1 and the pull-out plate 61.

[0064] The pull-out plate 61 and the limiting slide rail 62 are provided to facilitate installation and removal of the mainboard 1 , and also to improve the stability of the structure after the mainboard 1 is connected to the backboard 2 , thereby effectively preventing the mainboard 1 from shaking in the front-rear direction.

[0065] Combination Figure 1 and Figure 4 The board assembly further includes an auxiliary pull-out member 63 . The auxiliary pull-out member 63 is pivotally connected to the pull-out plate 61 , and the auxiliary pull-out member 63 is used to drive the pull-out plate 61 to move away from the back plate 2 , so that the main board 1 is separated from the back plate 2 .

[0066] Specifically, the pull-out assisting member 63 includes: a connecting portion 631, a pressing portion 632 and a toggle portion 633. The pressing portion 632 and the toggle portion 633 are respectively located on opposite sides of the connecting portion 631. The connecting portion 631 is pivotally connected to an end of the pull-out plate 61 away from the back plate 2, so that the pull-out assisting member 63 can rotate in the horizontal direction. The pressing portion 632 is used to contact the limiting slide rail 62 or the support frame 42 to drive the pull-out plate 61 to move to the left, thereby separating the main board 1 from the back plate 2. By providing the pull-out assisting member 63, the efficiency of disassembling the main board 1 can be further improved.

[0067] A reinforcement frame 66 is also fixedly disposed on the bottom frame 41, and the reinforcement frame 66 is located on the side of the side support 5 away from the mainboard 1. The reinforcement frame 66 has a plurality of horizontal cutouts 661, and the reinforcement frame 66 is plugged with the expansion cards 3 at different heights through the horizontal cutouts 661 to support the expansion cards 3.

[0068] Furthermore, a connector is fixedly arranged on the upper surface of the mainboard 1, and the board assembly further comprises: an IO board 64. The IO board 64 is located above the mainboard 1 and plugged with the connector in the up-down direction to be electrically connected to the mainboard 1 through the connector; the IO board 64 is fixedly connected to the main bracket 4.

[0069] In this embodiment, the IO board 64 is fixedly arranged at the front end of the main board 1. By arranging the IO board 64, more interfaces can be brought out on the main board 1.

[0070] The board assembly provided in this embodiment has a simple structure, wherein the main bracket 4 and the side bracket 5 are spliced, so that the board assembly can be flexibly adjusted inside the chassis 7 according to actual needs, including the optional use of the backplane 2 and the expansion card 3. When the backplane 2 or the expansion card 3 needs to be adjusted, only the structural design of the side bracket 5 needs to be adjusted. In addition, when the computer does not need to use the backplane 2 and the expansion card 3, the side bracket 5, the pull-out plate 61 and the support frame 42 can be removed, and the motherboard 1 can be directly fixed on the top of the bottom frame 41.

[0071] In a second aspect, the utility model provides a computer, referring to Figure 4 and Figure 5The computer comprises: a chassis 7 and the board assembly in the first aspect, the board assembly is located in the chassis 7, and the main bracket 4 is fixedly connected to the chassis 7.

[0072] Combination Figure 5 , Figure 6 and Figure 7 The case 7 includes: a case frame 71 and a shell 72. The shell 72 is wrapped around the outer side of the case frame 71 to enclose a closed space; the shell 72 is fixedly connected to the case frame 71, and the material strength of the case frame 71 is greater than the material strength of the shell 72. The case frame 71 is used to support the shell 72 to increase the stability of the case 7 structure.

[0073] In this embodiment, the chassis 7 is a hexahedral structure, and the box frame 71 includes a support frame 711 of a rectangular parallelepiped structure and a mounting plate 712. The mounting plate 712 is fixedly arranged at the bottom of the support frame 711, and a hollow hole is opened on the mounting plate 712 to reduce the weight of the box frame 71. The shell 72 includes: an upper cover 721, a front panel 722, a lower cover 723 and a rear panel 724. The overall shape of the lower cover 723 is U-shaped, which is used to serve as the bottom plate, left side plate and right side plate of the shell 72. Among them, the support frame 711 and the mounting plate 712 are made of steel plates, electrolytic plates or galvanized plates with excellent hardness and rigidity under the premise of meeting the vibration and impact resistance of the computer, but are not limited to this; the front panel 722, the lower cover 723 and the rear panel 724 are made of aluminum alloy materials with low density to achieve the lightness of the computer, but are not limited to this. Two tripods 65 are fixedly arranged below the lower cover 723. Handles 86 are fixedly provided at the left and right ends of the front panel 722 .

[0074] Combination Figure 4 and Figure 7 The chassis 7 further includes heat dissipation fins 81. The heat dissipation fins 81 are located outside the upper cover 721 and are fixedly connected to the upper cover 721. The materials of the upper cover 721 and the heat dissipation fins 81 include but are not limited to aluminum alloy materials.

[0075] Furthermore, an inner groove 7211 is provided on the upper surface of the upper cover 721. The height of the heat sink fin 81 located in the inner groove 7211 is greater than the height of the heat sink fin 81 outside the inner groove 7211, and the top of the heat sink fin 81 located in the inner groove 7211 is flush with the top of the heat sink fin 81 outside the inner groove 7211. This embodiment provides an inner sunken heat sink fin 81, which can extend the heat sink space of the heat sink fin 81 through the inner groove 7211 without increasing the overall volume of the computer, thereby improving the heat dissipation efficiency of the computer.

[0076] Combination Figure 2 and Figure 4The computer further comprises a heat sink 82, a first insulating component and a second insulating component. The heat sink 82 is located in the chassis 7, one surface of the heat sink 82 is in contact with the power device on the motherboard 1, and the other surface of the heat sink 82 is in contact with the chassis 7.

[0077] The heat sink 82 is insulated and fixedly connected to the mainboard 1 via a first insulating component, and the main bracket 4 is insulated and fixedly connected to the chassis 7 via a second insulating component.

[0078] Among them, the insulated fixed connection can be understood as that when device A is fixedly connected to device B, device A is also isolated from device B by an insulating member. The following are five specific methods of insulated fixed connection:

[0079] Connection method 1: Combination Figure 8 and Fig. 9 , the first insulating sleeve 91 is first inserted into the rivet stud on the device A, so that the upper surface of the first insulating sleeve 91 is higher than the rivet stud, and then the device B is placed downward on the upper surface of the first insulating sleeve 91, and then the second insulating sleeve 92 is inserted into the corresponding hole of the device B, and finally the screw is driven into the second insulating sleeve 92 and connected with the rivet stud by thread to fix the device A and the device B. Among them, the materials of the first insulating sleeve 91 and the second insulating sleeve 92 are both insulating materials.

[0080] Connection method 2: One end of the insulating member is bonded to device A, and the other end of the insulating member is bonded to device B, so as to achieve an insulated fixed connection between device A and device B. The insulating member is made of insulating material.

[0081] Connection method three: One end of the insulating column is fixed on the upper surface of device A, device B is installed above the insulating column, and the fixing nail is inserted into the mounting hole on the insulating column through the through hole on device B, wherein the insulating column is made of insulating material, and the fixing nail can be made of insulating material or conductive material.

[0082] Connection method 4: Combination Fig.10 , the third insulating sleeve 93 is inserted into the through hole on device A. Specifically, the third insulating sleeve 93 includes a cylindrical portion 931 and a sheet portion 932. One side of the sheet portion 932 is fixedly connected to one end of the cylindrical portion 931. The sheet portion 932 is located on one side of device A, and the cylindrical portion 931 is sleeved in the through hole. Device B includes a stud and a nut. One end of the stud passes through device A through the cylindrical portion 931 and is threadedly connected to the nut. The head on the other end of the stud is insulated from device A through the sheet portion 932. One end of the stud is also sleeved with a fourth insulating sleeve 94. The fourth insulating sleeve 94 is located on the side of device A facing the nut. The nut is insulated from device A through the fourth insulating sleeve 94. Among them, the materials of the third insulating sleeve 93 and the fourth insulating sleeve 94 are both insulating materials.

[0083] Connection method 5 is similar to connection method 3, except that the third insulating sleeve 93 and the fourth insulating sleeve 94 are fixedly connected.

[0084] Combination Figure 8 It should be noted that the heat sink 82 and the mainboard 1 can be connected in any one of the connection modes 1 to 3. In this embodiment, the heat sink 82 and the mainboard 1 are connected in connection mode 1. The heat sink 82 is device B, and the mainboard 1 is device A; the first insulating component includes a first insulating sleeve 91 and a second insulating sleeve 92. The lower surface of the heat sink 82 fits with the processor on the mainboard 1, and the upper surface of the heat sink 82 fits with the upper cover 721.

[0085] In an optional embodiment, the upper surface of the heat sink block 82 is anodized, and the heat sink block 82 is insulated and fixedly connected to the upper cover 721 using any one of connection methods one to three.

[0086] In this embodiment, the heat sink 82 is insulated and fixedly connected to the upper cover 721 using connection mode 1. The heat sink 82 is device A, and the upper cover 721 is device B; the second insulating assembly includes a first insulating sleeve 91 and a second insulating sleeve 92.

[0087] By insulating and fixing the heat sink 82 to the mainboard 1 , the mainboard 1 and the upper cover 721 can be effectively isolated, and the charge on the upper cover 721 cannot be introduced into the mainboard 1 , thereby improving the ability of the mainboard 1 to prevent signal interference.

[0088] Combination Fig. 9 , the bottom frame 41 is insulated and fixedly connected to the box frame 71 through the fourth insulating component. Among them, the connection method between the bottom frame 41 and the box frame 71 can be any one of the connection methods one to three and insulated and fixedly connected to the upper cover 721. In this embodiment, the heat sink 82 adopts the connection method one and is insulated and fixedly connected to the upper cover 721, wherein the box frame 71 is device A and the bottom frame 41 is device B; the fourth insulating component includes a first insulating sleeve 91 and a second insulating sleeve 92. It should be noted that in this embodiment, one end of the bottom frame 41 is insulated and fixedly connected to the support frame 711 through the fourth insulating component, and the other end of the bottom frame 41 is insulated and fixedly connected to the mounting plate 712 through the fourth insulating component.

[0089] Combination Figure 7 and Fig.10 A signal ground component 84 and a chassis ground component 85 are provided on the chassis 7.

[0090] The signal ground component 84 and the chassis ground component 85 both penetrate the front panel 722, the signal ground component 84 is insulated and fixedly connected to the front panel 722 through the third insulating component, the signal ground component 84 is electrically connected to the board component, and the chassis ground component 85 is electrically connected to the chassis 7. The signal ground component 84 and the chassis ground component 85 are both used to be electrically connected to the external ground wire.

[0091] The signal ground component 84 and the chassis ground component 85 can be fixedly connected to the front panel 722 in an insulated manner by using any one of connection modes four or five.

[0092] In this embodiment, the signal ground component 84 and the chassis ground component 85 are both insulated and fixedly connected to the front panel 722 using connection method four, and the third insulating component includes a third insulating sleeve 93 and a fourth insulating sleeve 94. Among them, the signal ground component 84 and the chassis ground component 85 both include device B, and the front panel 722 is device A. An external grounding wire is connected to the internal board assembly through the signal ground component 84, and another external grounding wire is connected to the grounding element through the chassis ground component 85. The grounding element is a device located in the chassis 7 and can be conductive to the chassis 7. In this embodiment, another external grounding wire is connected to the stud on the mounting plate 712 through the chassis ground component 85. In this way, the board assembly and the chassis 7 are independently grounded, insulated from each other, and do not interfere with each other. In this way, a floating ground design for the board assembly is realized, combined with Figure 5 .

[0093] It should be noted that in this field, the design that connects the internal signal to the ground is usually called a common ground design, while the design that isolates the internal signal from the ground is called a floating ground design. The common ground design can allow the external current to flow into the box through the conductive wire through the ground wire, causing certain interference to the internal signal; while the floating ground design isolates the internal signal from the ground, blocks the path of the interference current, and reduces the common-mode interference current.

[0094] In addition, the external grounding wire is connected to the stud in the device B by directly tying one end of the external grounding wire to the other end of the stud extending from the front panel 722, or by fixing the other end of the stud extending from the front panel 722 through other devices. In this embodiment, the signal ground component 84 and the chassis ground component 85 both further include a grounding pin 95, which is threadedly connected to the other end of the stud to achieve a fixed connection between the external grounding wire and the corresponding stud, which will not be described in detail in this embodiment.

[0095] Combination Figure 4 and Fig.11, the computer also includes a power module 83. The power module 83 is located in the chassis 7 and is electrically connected to the mainboard 1. In this embodiment, the base frame 41 covers the power module 83, and the mounting plate 712 is provided with an avoidance opening 7121 adapted to the power module 83, and the bottom end of the power module 83 passes through the avoidance opening 7121 and fits with the lower cover 723. In this way, the heat dissipation efficiency of the power module 83 can be improved, so that the power module 83 can conduct heat dissipation through the bottom in a closed fanless environment. The support frame 42 is an n-type structure, which can lift the mainboard 1 and make the mainboard 1 closer to the upper cover 721, thereby reducing the thickness of the heat dissipation block 82, which can not only improve the heat conduction efficiency on the mainboard 1, but also reduce the weight of the computer and reduce the cost of the computer.

[0096] The computer provided in this embodiment has the advantages of being light, flexible in expansion, strong in anti-signal interference capability, and adaptable to a closed working environment, while ensuring the requirements for the anti-vibration and anti-impact performance of the reinforced computer. Among them, the floating ground design is adopted for the board components, which can ensure the anti-current interference capability of the mainboard 1, making the computer more capable of preventing external signal interference.

[0097] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0098] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A board assembly, characterized in that: The board assembly includes: a mainboard, a backplane, an expansion card, a main bracket and a side bracket; The side stand bracket is located above the main stand bracket, the main stand bracket is detachably connected to the side stand bracket, the back plate and the expansion card are both fixedly connected to the side stand bracket, and the back plate is electrically connected to the expansion card; The mainboard and the expansion card are both perpendicular to the backplane; the mainboard is plugged into the backplane to be electrically connected to the expansion card through the backplane; The mainboard is located above the main bracket, the main bracket is slidably connected to the mainboard, and the main bracket is used to support the mainboard.

2. The board assembly according to claim 1, characterized in that: The side bracket is provided with at least one expansion opening, the back panel and the expansion card are respectively located on opposite sides of the side bracket, and the expansion slot on the back panel passes through the side bracket through the at least one expansion opening and is plugged into the expansion card.

3. The board assembly according to claim 2, characterized in that: The main support comprises: a base frame and a support frame; The support frame and the side support are both located above the base frame, and the support frame and the side support are both detachably connected to the base frame; The main board is located above the support frame and is slidably connected to the support frame.

4. The board assembly according to claim 3, characterized in that: The mainboard and the supporting frame are both located on a side of the backplane facing away from the expansion card.

5. The board assembly according to claim 3, characterized in that: The board assembly also includes: a pull-out plate and a limit slide rail; The limiting slide rail is located above the support frame and is fixedly connected to the support frame. The pull-out plate is located above the support frame and is fixedly connected to the main board, and is slidably connected to the limiting slide rail along a direction perpendicular to the back plate.

6. The board assembly according to claim 5, characterized in that: The board assembly further comprises: an auxiliary pull-out member; The auxiliary pull-out member is pivotally connected to the pull-out plate, and the auxiliary pull-out member is used to drive the pull-out plate to move in a direction away from the back plate, so that the main plate is separated from the back plate.

7. The board assembly according to any one of claims 1 to 6, characterized in that: A connector is fixedly arranged on the upper surface of the mainboard, and the board assembly further comprises: an IO board; The IO board is located above the main board and is plugged into the connector along the up-down direction so as to be electrically connected to the main board through the connector; the IO board is fixedly connected to the main bracket.

8. A computer, characterized in that: The computer comprises: a chassis and a board assembly as claimed in any one of claims 1 to 7, wherein the board assembly is located in the chassis, and the main bracket is fixedly connected to the chassis.

9. The computer according to claim 8, characterized in that The chassis comprises: a chassis frame and a shell; The shell is wrapped around the outer side of the box frame to enclose a closed space; the shell is fixedly connected to the box frame, and the material strength of the box frame is greater than the material strength of the shell.

10. The computer according to claim 8, characterized in that The chassis comprises an upper cover and heat dissipation fins; The heat dissipation fins are located on the outer side of the upper cover and are fixedly connected to the upper cover. An inner groove is provided on the outer surface of the upper cover. The height of the heat dissipation fins located in the inner groove is greater than the height of the heat dissipation fins outside the inner groove.

11. The computer according to claim 10, characterized in that The computer further comprises a heat sink, a first insulating component and a second insulating component, wherein the heat sink is located in the chassis, one surface of the heat sink is in contact with the power device on the mainboard, and the other surface of the heat sink is in contact with the chassis; The heat sink is insulated and fixedly connected to the mainboard via the first insulating component, and the main bracket is insulated and fixedly connected to the chassis via the second insulating component.

12. The computer according to any one of claims 8 to 11, characterized in that: The chassis is provided with a signal ground component and a chassis ground component; The signal ground component and the chassis ground component both penetrate the chassis, the signal ground component is insulated and fixedly connected to the chassis via a third insulating component, the signal ground component is electrically connected to the board component, and the chassis ground component is electrically connected to the chassis; The signal ground component and the chassis ground component are both used for electrically connecting to an external ground wire.

Images