Heat dissipation assembly and computing device

Abstract

The embodiment of the utility model provides a heat dissipation assembly and computing equipment, and the heat dissipation assembly comprises a circuit board which is provided with a plurality of heating components; the radiator is arranged on one side, deviating from the circuit board, of the heating component; the anti-scouring sheet comprises a plurality of first parts arranged between the heating components and the radiator, the plurality of first parts are arranged in one-to-one correspondence with the plurality of heating components, heat dissipation holes are defined in the first parts, and heat dissipation media are arranged in the heat dissipation holes; the second parts are arranged on the peripheries of the first parts, and the second parts are used for connecting the adjacent first parts with each other. According to the technical scheme, the heat dissipation medium and the cooling liquid can be isolated, sealing and protection of the heat dissipation medium are achieved, the heat dissipation medium is prevented from being scoured and dissipated under the long-term soaking condition, and therefore the operation reliability of the computing device can be improved while the heat dissipation effect is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation component and a computing device. Background Art

[0002] With the rise of huge models such as Chat Generative Pre-trained Transformer (ChatGPT), the demand for large-scale computing is increasing, and the development of supercomputing equipment is in full swing. In related technologies, computing boards are usually designed using general-purpose chips or multiple dedicated chips in a series or parallel structure to provide super-large computing power. However, due to the increasing power consumption of the chip, the surface heat flux density of the chip is also increasing, and the demand for heat dissipation of the chip is also increasing. The heat dissipation performance of the chip directly affects the working performance and service life of the chip. Utility Model Content

[0003] Embodiments of the present application provide a heat dissipation component and a computing device to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present application, the embodiment of the present application provides a heat dissipation assembly, including: a circuit board, on which a plurality of heat-generating components are arranged; a heat sink, arranged on a side of the heat-generating components away from the circuit board; an anti-scouring sheet, including a plurality of first parts arranged between the heat-generating components and the heat sink, the plurality of first parts being arranged one-to-one corresponding to the plurality of heat-generating components, the first parts defining heat-dissipating holes, in which a heat-dissipating medium is arranged; and also including a second part arranged on the outer periphery of the first part, the second part being used to connect adjacent first parts to each other.

[0005] In one embodiment, the inner edge of the first portion is spaced apart from the edge of the heat-generating component.

[0006] In one embodiment, the maximum dimension of the heat dissipation hole in the first direction is smaller than the dimension of the heat-generating component in the first direction, and the maximum dimension of the heat dissipation hole in the second direction is smaller than the dimension of the heat-generating component in the second direction; wherein the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the circuit board.

[0007] In one embodiment, the thickness of the first portion is smaller than the thickness of the heat-generating component, and the thickness direction is perpendicular to the surface of the circuit board.

[0008] In one embodiment, the first portion is made of an elastic material.

[0009] In one embodiment, a first adhesive is provided on a surface of the anti-scouring sheet facing the heat-generating component, and the anti-scouring sheet is bonded to the heat-generating component by the first adhesive.

[0010] In one embodiment, a first coating is provided on a surface of the anti-scouring sheet facing the heat generating component, and a first adhesive is provided between the anti-scouring sheet and the first coating.

[0011] In one embodiment, a second adhesive is provided on a surface of the anti-scouring sheet facing the radiator, and the anti-scouring sheet is bonded to the radiator through the second adhesive.

[0012] In one embodiment, a second coating is provided on a surface of the anti-scouring sheet facing the radiator, and a second adhesive is provided between the anti-scouring sheet and the second coating.

[0013] In one embodiment, the anti-scouring sheet is connected to the heat-generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board through a first fastener.

[0014] In one embodiment, the anti-scouring sheet is connected to the heat-generating component, the heat dissipation medium is filled in the heat dissipation hole through the first mesh structure, and the heat sink is connected to the circuit board through the second fastener.

[0015] In one embodiment, the anti-scouring sheet is connected to the heat generating component, the heat dissipation medium is coated on the side of the heat sink facing the circuit board, and the heat sink coated with the heat dissipation medium is connected to the circuit board through a third fastener so that the heat dissipation medium fills the heat dissipation hole.

[0016] In one embodiment, the heat dissipation medium is directly applied to the heat sink; or, the heat dissipation medium is applied to the heat sink through the second mesh structure.

[0017] In one embodiment, the anti-scouring sheet is connected to the heat sink, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink connected to the anti-scouring sheet is connected to the circuit board through a fourth fastener.

[0018] In one embodiment, the anti-scouring sheet is connected to the heat sink, the heat dissipation medium is filled in the heat dissipation holes through the third mesh structure, and the heat sink connected to the anti-scouring sheet is connected to the circuit board through a fifth fastener.

[0019] In one embodiment, the anti-scouring sheet is connected to the radiator, the heat dissipation medium is coated on the side of the heat generating component facing the radiator, and the radiator connected to the anti-scouring sheet is connected to the circuit board through a sixth fastener so that the heat dissipation medium fills the heat dissipation hole.

[0020] In one embodiment, the heat dissipation medium is directly applied to the heat-generating component; or, the heat dissipation medium is applied to the heat-generating component through the fourth mesh structure.

[0021] In one embodiment, a plurality of heat generating components are connected in parallel to form a parallel device group, a plurality of first parts are connected through a second part to form a parallel anti-scour sheet group, and the parallel anti-scour sheet group is arranged corresponding to the parallel device group.

[0022] In one embodiment, a plurality of heating components are connected in series to form a series device group, a plurality of first parts are connected through second parts to form a series anti-scouring sheet group, and the series anti-scouring sheet group is arranged corresponding to the series device group.

[0023] In one embodiment, the second portion is an integral structure with the first portion.

[0024] In one embodiment, the thickness of the second portion is equal to the thickness of the first portion.

[0025] In one embodiment, the second portion is provided with a positioning structure corresponding to the heat sink and / or the circuit board.

[0026] In one embodiment, a fastener avoidance hole and / or a component avoidance hole is formed on the second portion.

[0027] In one embodiment, the anti-scour sheet is made of oil-resistant material.

[0028] In one embodiment, the heat sink includes a heat dissipation substrate and a plurality of heat dissipation fins arranged at intervals, the anti-scouring sheet is located between the heat generating component and the heat dissipation substrate, and the plurality of heat dissipation fins are arranged on a side of the heat dissipation substrate away from the anti-scouring sheet.

[0029] As another aspect of an embodiment of the present application, an embodiment of the present application provides a computing device, comprising a heat dissipation assembly according to any of the above-mentioned implementations.

[0030] The embodiment of the present application adopts the above-mentioned technical solution to prevent the heat dissipation medium from being washed away and dissipated under long-term immersion conditions, while ensuring the heat dissipation effect and improving the operating reliability of the computing device.

[0031] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0033] Figure 1A schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application is shown;

[0034] Figure 2 A cross-sectional schematic diagram of a heat dissipation assembly according to an embodiment of the present application is shown;

[0035] Figure 3 A schematic diagram showing a first portion of an anti-scour sheet according to an embodiment of the present application;

[0036] Figure 4 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0037] Figure 5 A schematic diagram showing an anti-scour sheet according to an embodiment of the present application;

[0038] Figure 6 A schematic diagram showing a circuit board according to an embodiment of the present application;

[0039] Figure 7 A schematic diagram showing an anti-scour sheet according to another embodiment of the present application;

[0040] Figure 8 A schematic diagram showing the cooperation between the anti-scouring sheet and the radiator according to an embodiment of the present application is shown.

[0041] Description of reference numerals:

[0042] 10: heat dissipation assembly; 100: circuit board; 110: heat generating components; 120: parallel device group; 130: series device group; 200: radiator; 210: heat dissipation substrate; 220: heat sink; 300: anti-scouring sheet; 310: first part; 311: heat dissipation hole; 312: heat dissipation medium; 320: second part; 321: fastener avoidance hole; 322: device avoidance hole; 330: parallel anti-scouring sheet group; 340: series anti-scouring sheet group. DETAILED DESCRIPTION

[0043] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0044] At present, the common chip heat dissipation methods are air cooling and immersion liquid cooling. For air cooling, the chip surface is usually coated with heat dissipation media such as silicone grease or gel, and the chip contacts the radiator through the heat dissipation medium to reduce the contact thermal resistance. However, due to the low convection heat transfer coefficient of air, the heat dissipation capacity of air cooling is limited, which will limit the improvement of the overall performance of the computing device. For immersion liquid cooling, the circuit board is usually immersed in the coolant, and the coolant is directly in contact with the chip and other devices on the circuit board for heat dissipation. Compared with the air cooling method, the heat dissipation capacity can be improved. However, due to the excessive heat flux density on the surface of some chips, it is still necessary to install a radiator or other heat-conducting structure on the chip surface. Since the heat dissipation medium between the chip and the heat-conducting structure such as the radiator is usually silicone grease or gel, the heat dissipation medium is easily eroded and dissipated under long-term immersion conditions, which is not conducive to the long-term operation of the computing device.

[0045] Combine the following Figure 1-Figure 5 A heat dissipation assembly according to an embodiment of the first aspect of the present application is described.

[0046] Figure 1 A schematic structural diagram of a heat dissipation assembly according to an embodiment of the present application is shown; Figure 2 A cross-sectional schematic diagram of a heat dissipation assembly according to an embodiment of the present application is shown.

[0047] like Figure 1 and Figure 2 As shown, the heat dissipation assembly 10 includes a circuit board 100, a heat sink 200 and an anti-scouring sheet.

[0048] Figure 3 A schematic diagram showing a first portion of an anti-scour sheet according to an embodiment of the present application. Figure 1-Figure 3 , a plurality of heat generating components 110 are arranged on the circuit board 100. The heat sink 200 is arranged on the side of the heat generating component 110 away from the circuit board 100. The anti-scouring sheet includes a first portion 310 arranged between the heat generating component 110 and the heat sink 200, and the plurality of first portions 310 are arranged one by one corresponding to the plurality of heat generating components 110, and the first portion 310 defines a heat dissipation hole 311, and a heat dissipation medium 312 is arranged in the heat dissipation hole 311. Figure 4 A schematic structural diagram of a heat dissipation assembly 10 according to another embodiment of the present application is shown; Figure 5 A schematic diagram of an anti-scour sheet 300 according to an embodiment of the present application is shown. Figure 4 and Figure 5The anti-scouring sheet 300 further includes a second portion 320 disposed between the circuit board 100 and the heat sink 200, the second portion 320 is connected to the first portion 310, the second portion 320 is disposed at the periphery of the first portion 310, and the second portion 320 is used to connect adjacent first portions 310 to each other. The anti-scouring sheet is one or more. In the description of this application, "multiple" means two or more.

[0049] In this embodiment, by providing the second part 320, the connection reliability between the first part 310 and the heat generating component 110 and / or the heat sink 200 can be improved through the connection between the second part 320 and the circuit board 100 and / or the heat sink 200. In addition, in the case where there are multiple heat generating components 110 and first parts 310, the second part 320 can be used to connect multiple first parts 310, so that multiple first parts 310 can be connected to corresponding heat generating components 110 and / or heat sinks 200 at the same time, effectively improving the processing efficiency of the heat dissipation assembly 10.

[0050] The heat generating component 110 may include a chip, and the chip may be located on one side surface of the circuit board 100 in the thickness direction. The chip may include a core area and a packaging area. The core area is an area where tiny circuits and transistors made of silicon wafers are integrated. The core area is the most important part of the chip, including a processor, memory, etc.

[0051] The package area is the external area of ​​the chip, which is mainly used to protect the core area. The package area is usually made of materials such as plastic or ceramic, which has good insulation and heat resistance. The package area also includes circuit connection parts such as pins and pads, which are used to connect the chip to the external circuit to achieve data transmission and control.

[0052] Exemplarily, the outer contour of the first portion 310 of the anti-scouring sheet may be adapted to the outer contour of a heat-generating component such as a chip.

[0053] For example, when the outer contour of the heat generating component is a rectangle, the outer contour of the first part 310 of the anti-scouring sheet is also a rectangle. The first part 310 of the anti-scouring sheet can be formed into a ring structure, thereby defining a heat dissipation hole 311. The heat dissipation hole 311 can correspond to the core area of ​​the chip. The shape of the heat dissipation hole 311 can be a polygon such as a circle, a rectangle, or other irregular shapes. The heat dissipation medium 312 can be silicone grease or gel.

[0054] Exemplarily, the anti-scour sheet may be made of oil-resistant material.

[0055] For example, the anti-scour sheet can be a polyethylene terephthalate (PET) sheet, or a plastic sheet such as polycarbonate (PC), polypropylene (PP), acrylonitrile butadiene styrene (ABS), or a metal sheet such as a copper sheet or a steel sheet. The present application does not limit the specific material of the anti-scour sheet, as long as it is an oil-resistant material. The oil-resistant material refers to a material that has good corrosion resistance, immersion resistance, and scour resistance in a liquid environment such as cooling oil.

[0056] According to the heat dissipation assembly 10 of the embodiment of the present application, by disposing the first portion 310 of the anti-scouring sheet between the heat-generating component 110 and the radiator 200, and defining the heat dissipation hole 311 in which the heat dissipation medium 312 is disposed, the first portion 310 of the anti-scouring sheet can effectively protect the heat dissipation medium 312. When the heat dissipation assembly 10 is immersed in the coolant, the first portion 310 can isolate the heat dissipation medium 312 and the coolant to a certain extent, thereby sealing the heat dissipation medium 312, thereby preventing the heat dissipation medium 312 from being scour or dissipated under long-term immersion conditions. While ensuring the heat dissipation effect, the operating reliability of the computing device can be improved.

[0057] In one embodiment, the inner edge of the first portion 310 is spaced apart from the edge of the heat-generating component 110 .

[0058] For example, the first portion 310 may be formed as a ring structure, the outer edge of the first portion 310 may correspond to the edge of the heat generating component 110 , and the inner edge of the first portion 310 is spaced apart from the edge of the heat generating component 110 .

[0059] The inner edge of the first part 310 is the edge of the heat dissipation hole 311. Therefore, by setting the inner edge of the first part 310 and the edge of the heat-generating component 110 at a distance, the heat dissipation hole 311 can be set at a distance from the edge of the heat-generating component 110, so that when the heat dissipation assembly 10 is immersed in the coolant, it is ensured that the heat dissipation medium 312 in the heat dissipation hole 311 can be sealed in the first part 310, further improving the operating reliability of the computing device.

[0060] In one embodiment, the maximum dimension of the heat dissipation hole 311 in the first direction is smaller than the dimension of the heat-generating component 110 in the first direction, and the maximum dimension of the heat dissipation hole 311 in the second direction is smaller than the dimension of the heat-generating component 110 in the second direction; wherein the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the circuit board 100.

[0061] Exemplarily, the circuit board 100 may be formed in a rectangular shape. There may be a plurality of heat generating components 110, and the plurality of heat generating components 110 may be arranged in an array of X rows and Y columns, where X and Y are both greater than 1. The row direction of the array of heat generating components 110 may be the width direction of the circuit board 100, and the column direction of the array of heat generating components 110 may be the length direction of the circuit board 100. Among them, the first direction may be the width direction of the circuit board 100, and the second direction may be the length direction of the circuit board 100. Each heat generating component 110 may be a rectangle. Two edges of the heat generating component 110 may be parallel to the first direction, and the other two edges of the heat generating component 110 may be parallel to the second direction.

[0062] In this embodiment, by making the maximum dimension of the heat dissipation hole 311 in the first direction smaller than the dimension of the heat-generating component 110 in the first direction, and the maximum dimension of the heat dissipation hole 311 in the second direction smaller than the dimension of the heat-generating component 110 in the second direction, the area of ​​the heat dissipation hole 311 can be smaller than the area of ​​the heat-generating component 110, so that the first part 310 of the anti-scouring sheet can better seal the heat dissipation medium 312 in the heat dissipation hole 311, thereby ensuring a better heat dissipation effect on the heat-generating component 110.

[0063] In one implementation, the thickness of the first portion 310 may be smaller than the thickness of the heat generating component 110 , and the thickness direction is perpendicular to the surface of the circuit board.

[0064] Therefore, since the thickness of the first part 310 determines the thickness of the heat dissipation medium 312, the thickness of the first part 310 set in this way can meet actual needs, so that one side surface of the first part 310 can fit tightly with the radiator 200, and the other side surface of the first part 310 can fit tightly with the heat-generating component 110, while ensuring that the heat dissipation holes 311 defined by the first part 310 can effectively accommodate the heat dissipation medium 312, thereby preventing the coolant from contacting the heat dissipation medium 312 through the gap between the radiator 200 and the first part 310 or the gap between the heat-generating component 110 and the first part 310, and further preventing the heat dissipation medium 312 from being washed away and dissipated under long-term immersion conditions.

[0065] In one embodiment, the first portion 310 may be made of an elastic material.

[0066] Among them, elastic material is relative to rigid material, and rigid material refers to a material that does not deform under the action of external force. Elastic material refers to a material that deforms under the action of external force and can return to its original state when the external force disappears. The deformation of elastic material is reversible, that is, when the external force disappears, the material can return to its original state. In this way, the first part 310 can have a certain elasticity, so that the first part 310 can be pressed between the radiator 200 and the heating component 110, ensuring that the first part 310 can fit tightly with both the radiator 200 and the heating component 110, thereby further ensuring the sealing of the heat dissipation medium 312 and effectively improving the long-term reliability of the computing device.

[0067] In one embodiment, a first adhesive is provided on a surface of the anti-scouring sheet 300 facing the heat generating component 110 , and the anti-scouring sheet 300 is bonded to the heat generating component 110 by the first adhesive.

[0068] In one example, the first adhesive is provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the heat sink 200. In this case, the anti-scouring sheet 300 is a single-sided adhesive. During processing, the first portion 310 can be connected to the heat generating component 110, and then the heat dissipation medium 312 is directly filled in the heat dissipation hole 311. Finally, the heat sink 200 is mounted on the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 by a first fastener.

[0069] In this example, the anti-scouring sheet 300 is connected to the heat-generating component 110, the heat dissipation medium 312 is directly filled in the heat dissipation hole 311, and the heat sink 200 is connected to the circuit board 100 through the first fastener. The processing method of this example is simple, the first part 310 of the anti-scouring sheet does not need to be connected to the heat sink 200, and the heat dissipation medium 312 does not need to be coated on the heat sink 200, which can reduce the installation accuracy requirements of the heat sink 200 and improve the installation efficiency of the heat dissipation assembly 10.

[0070] In another example, the first adhesive is provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the heat sink 200. In this case, the anti-scouring sheet 300 is still single-sided adhesive. During processing, the first part 310 can be connected to the heat generating component 110, and then the heat dissipation medium 312 is filled in the heat dissipation hole 311 through the first mesh structure such as a steel mesh. Finally, the heat sink 200 is installed on the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 through a second fastener.

[0071] In this example, the anti-scouring sheet 300 is connected to the heat-generating component 110, the heat-dissipating medium 312 is filled in the heat-dissipating hole 311 through the first mesh structure, and the heat sink 200 is connected to the circuit board 100 through the second fastener. The difference from the above example is that in this example, the heat-dissipating medium 312 is filled in the heat-dissipating hole 311 through the first mesh structure. In the case where there are multiple heat-generating components 110 and the first part 310, the heat-dissipating medium 312 can be quickly filled in multiple heat-dissipating holes 311 through the first mesh structure, thereby improving the filling speed of the heat-dissipating medium 312, and then improving the processing efficiency of the heat-dissipating assembly 10. The first mesh structure mentioned above can be a screen printing process, and the heat-dissipating medium 312 is filled in the position corresponding to the heat-dissipating hole 311.

[0072] In another example, the first adhesive is provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the radiator 200. In this case, the anti-scouring sheet 300 is still single-sided adhesive. During processing, the first part 310 can be connected to the heat generating component 110, and the heat dissipation medium 312 can be coated on the side of the radiator 200 facing the circuit board 100. Finally, the radiator 200 coated with the heat dissipation medium 312 is installed on the circuit board 100. For example, the radiator 200 coated with the heat dissipation medium 312 can be connected to the circuit board 100 through a third fastener, so that the heat dissipation medium 312 fills the heat dissipation hole 311.

[0073] In this example, the anti-scouring sheet 300 is connected to the heat generating component 110, the heat dissipation medium 312 is coated on the side of the heat sink 200 facing the circuit board 100, and the heat sink 200 coated with the heat dissipation medium 312 is connected to the circuit board 100 through a third fastener, so that the heat dissipation medium 312 fills the heat dissipation hole 311. The heat dissipation medium 312 can be directly coated on the heat sink 200; or, the heat dissipation medium 312 can be coated on the heat sink 200 through a second mesh structure. The second mesh structure mentioned above can be coated on the heat sink 200 at the position of the heat dissipation hole 311 using a screen printing process.

[0074] In one embodiment, a second adhesive is provided on a surface of the anti-scouring sheet 300 facing the radiator 200 , and the anti-scouring sheet 300 is bonded to the radiator 200 by the second adhesive.

[0075] In one example, the second adhesive is provided on the surface of the anti-scouring sheet 300 facing the heat sink 200, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110. In this case, the anti-scouring sheet 300 is a single-sided adhesive. During processing, the anti-scouring sheet 300 can be first connected to the heat sink 200, and then the heat dissipation medium 312 is directly filled in the heat dissipation hole 311. Finally, the heat sink 200 connected to the anti-scouring sheet 300 is connected to the circuit board 100, for example, the heat sink 200 can be connected to the circuit board 100 through a fourth fastener.

[0076] In this example, the anti-scouring sheet 300 is connected to the heat sink 200, the heat dissipation medium 312 is directly filled in the heat dissipation hole 311, and the heat sink 200 connected to the anti-scouring sheet 300 is connected to the circuit board 100 through the fourth fastener. Therefore, the bonding of the anti-scouring sheet 300 and the coating of the heat dissipation medium 312 can be completed at the heat sink 200 end, ensuring that the heat dissipation medium 312 can be filled in the heat dissipation hole 311, thereby improving the processing efficiency of the heat dissipation component 10.

[0077] In another example, the second adhesive is provided on the surface of the anti-scouring sheet 300 facing the radiator 200, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110. In this case, the anti-scouring sheet 300 is still single-sided adhesive. During processing, the anti-scouring sheet 300 can be first connected to the radiator 200, and then the heat dissipation medium 312 is filled in the heat dissipation hole 311 through the third mesh structure. Finally, the radiator 200 connected to the anti-scouring sheet 300 is connected to the circuit board 100, for example, the radiator 200 can be connected to the circuit board 100 through the fifth fastener.

[0078] In this example, the anti-scouring sheet 300 is connected to the radiator 200, the heat dissipation medium 312 is filled in the heat dissipation holes 311 through the third mesh structure, and the radiator 200 connected to the anti-scouring sheet 300 is connected to the circuit board 100 through the fifth fastener. Therefore, in the case where there are multiple heat-generating components 110 and the first part 310, the heat dissipation medium 312 can be quickly filled in multiple heat dissipation holes 311 through the third mesh structure, thereby improving the filling speed of the heat dissipation medium 312, and then improving the processing efficiency of the heat dissipation component 10. The third mesh structure mentioned above can be a screen printing process, and the heat dissipation medium 312 is coated on the radiator 200 corresponding to the position of the heat dissipation hole 311.

[0079] In another example, the second adhesive is provided on the surface of the anti-scouring sheet 300 facing the radiator 200, and the adhesive is not provided on the surface of the anti-scouring sheet 300 facing the heat generating component 110. In this case, the anti-scouring sheet 300 is still single-sided adhesive. During processing, the anti-scouring sheet 300 can be connected to the radiator 200, and the heat dissipation medium 312 is coated on the side of the heat generating component 110 facing the radiator 200. Finally, the radiator 200 connected to the anti-scouring sheet 300 is installed on the circuit board 100, for example, the radiator 200 can be connected to the circuit board 100 through the sixth fastener.

[0080] In this example, the anti-scouring sheet 300 is connected to the radiator 200, the heat dissipation medium 312 is applied to the side of the heat-generating component 110 facing the radiator 200, and the radiator 200 connected to the anti-scouring sheet 300 is connected to the circuit board 100 through the sixth fastener, so that the heat dissipation medium 312 fills the heat dissipation hole 311. The heat dissipation medium 312 is directly applied to the heat-generating component 110; or, the heat dissipation medium 312 is applied to the heat-generating component 110 through the fourth mesh structure. The fourth mesh structure mentioned above can be a screen printing process, and the heat dissipation medium 312 is applied on the heat-generating component 110 corresponding to the position of the heat dissipation hole 311. Optionally, the first fastener, the second fastener, the third fastener, the fourth fastener, the fifth fastener and the sixth fastener can be screws, but are not limited to this.

[0081] In one embodiment, a first adhesive is provided on a surface of the anti-scouring sheet 300 facing the heat generating component 110, and a second adhesive is provided on a surface of the anti-scouring sheet 300 facing the radiator 200. The surface of the anti-scouring sheet 300 facing the heat generating component 110 is bonded to the heat generating component 110 through the first adhesive, and the surface of the anti-scouring sheet 300 facing the radiator 200 is bonded to the radiator 200 through the second adhesive.

[0082] Exemplarily, the side of the anti-scouring sheet 300 facing the heat generating component 110 may be provided with a first coating, and the first adhesive is located between the anti-scouring sheet 300 and the first coating. The side of the anti-scouring sheet 300 facing the radiator 200 may be provided with a second coating, and the second adhesive is located between the anti-scouring sheet 300 and the second coating. During processing, the second coating may be peeled off first, and the anti-scouring sheet 300 may be bonded to the radiator 200 through the second adhesive, and then the heat dissipation medium 312 may be filled in the heat dissipation hole 311. Finally, the first coating may be peeled off, and the anti-scouring sheet 300 may be bonded to the heat generating component 110 through the first adhesive.

[0083] In this embodiment, the anti-scour sheet 300 has double-sided adhesive, which makes the connection between the anti-scour sheet 300 and the heat-generating component 110 and the anti-scour sheet 300 and the radiator 200 more secure, further ensuring the sealing performance of the heat dissipation medium 312, so that the heat dissipation medium 312 can be enclosed between the anti-scour sheet 300, the radiator 200 and the heat-generating component 110, avoiding scouring and dissipation of the heat dissipation medium 312 under long-term immersion conditions.

[0084] In one embodiment, Figure 6 A schematic diagram of a circuit board according to an embodiment of the present application is shown, wherein a plurality of heat generating components 110 are connected in parallel to form a parallel component group 120, and a plurality of first parts 310 are connected through a second part 320 to form a parallel anti-scouring sheet group 330, such as Figure 7 As shown, the parallel anti-scouring sheet group 330 is arranged corresponding to the parallel device group 120 .

[0085] In this embodiment, there may be multiple heating components 110 on the circuit board 100, and the multiple heating components 110 may be arranged in an array on the circuit board 100, wherein multiple heating components 110 in the same row or column and adjacent to each other may be connected in parallel to form a parallel device group 120, and then the multiple parallel device groups 120 are connected in series or in parallel to complete the electrical connection of all heating components 110 for operation. A parallel anti-scouring sheet group 330 may be separately provided for the parallel device group 120, and multiple first parts 310 are connected through the second part 320, so that the multiple parallel heating components 110 may be directly covered as a whole to achieve sealing of the heat dissipation medium 312. By providing the second part 320, multiple first parts 310 are connected together, avoiding the time-consuming installation of a single first part 310 and a single heating component 110, and increasing the structural stability of the entire anti-scouring sheet 300.

[0086] The plurality of parallel device groups 120 may be connected in series or in parallel, and a single parallel anti-scour sheet group 330 may be provided corresponding to the plurality of parallel device groups 120 .

[0087] In one embodiment, Figure 6 A schematic diagram of a circuit board according to an embodiment of the present application is shown, wherein a plurality of heating components 110 are connected in series to form a series device group 130, and a plurality of first parts 310 are connected through a second part 320 to form a series anti-scouring sheet group 340, such as Figure 7 As shown, the series anti-scouring sheet group 340 is arranged corresponding to the series device group 130 .

[0088] In this embodiment, there may be multiple heating components 110 on the circuit board 100, and the multiple heating components 110 may be arranged in an array on the circuit board 100, wherein multiple heating components 110 in the same row or column and adjacent to each other may be connected in series to form a series device group 130, and then multiple series device groups 130 are connected in series or in parallel to complete the electrical connection of all heating components 110 for operation. A series anti-scouring sheet group 340 may be separately provided for the series device group 130, and multiple first parts 310 are connected through the second part 320, so that the multiple series heating components 110 may be directly covered as a whole to achieve sealing of the heat dissipation medium 312. By providing the second part 320, multiple first parts 310 are connected together, avoiding the time-consuming installation of a single first part 310 and a single heating component 110, and increasing the structural stability of the entire anti-scouring sheet 300.

[0089] A plurality of series device groups 130 may be connected in series or in parallel, and a single series anti-scouring sheet group 340 may be provided corresponding to a plurality of series device groups 130 .

[0090] Of course, in another embodiment, there may be multiple heating components 110 on the circuit board 100. For overall consistency, the corresponding multiple first parts 310 may be connected through the second part 320 to form a whole, and the anti-scouring sheet 300 formed in this way may cover all the heating components 110. After the anti-scouring sheet 300 is positioned relative to the circuit board 100 or the heat sink 200, all the first parts 310 are arranged corresponding to the heating components 110, which reduces the installation time.

[0091] For example, the second part 320 and the first part 310 may be an integrated structure. The integrated structure facilitates the processing of the anti-scouring sheet 300, and can directly produce an integrated anti-scouring sheet 300 corresponding to the parallel anti-scouring sheet group 330 or the series anti-scouring sheet group 330 or all the heating components 110.

[0092] For example, Figure 8As shown, the second part 320 is connected to the heat sink 200. The second part 320 and the first part 310 form a whole. The first part 310 is connected between the heat generating component 110 and the heat sink 200. There is a gap between the heat sink 200 and the circuit board 100. The second part 320 can be connected to the heat sink 200. The first part 310 and the second part 320 can be provided with a second coating on the side facing the heat sink 200. The second adhesive is located between the first part 310 and the second coating. During processing, the second coating is peeled off, and the connection position relationship between the anti-scouring sheet 300 and the heat sink 200 is quickly found through the positioning structure. The purpose is to align the heat dissipation hole 311 with the heat generating component 110 after the final installation. Then, the first part 310 and the second part 320 are bonded to the heat sink 200 through the second adhesive, and then the heat dissipation medium 312 is filled in the heat dissipation hole 311. Finally, fasteners are used to connect the heat sink 200 to the circuit board 100.

[0093] Exemplarily, the thickness of the second part 320 is equal to the thickness of the first part 310. The second part 320 and the first part 310 form a whole, and for the convenience of processing, the second part 320 and the first part 310 have the same thickness. Of course, the thickness of the second part 320 can be greater than the thickness of the first part 310, so that the structural strength of the second part 320 can be strengthened, but the thickness of the second part 320 should extend toward the surface of the circuit board 100. Of course, the thickness of the second part 320 can also be less than the thickness of the first part 310, in which case the second part 320 only needs to ensure that the adjacent first parts 310 can be connected together.

[0094] For example, Figure 5 As shown, a fastener avoidance hole 321 and / or a component avoidance hole 322 may be formed on the second portion 320 to avoid fasteners and / or other components on the circuit board 100 .

[0095] For example, no adhesive may be provided on both side surfaces of the anti-scouring sheet 300 , and the first portion 310 of the anti-scouring sheet 300 may be pressed between the heat sink 200 and the heat generating component 110 through the connection between the heat sink 200 and the circuit board 100 .

[0096] In one implementation, a positioning structure may be provided on the second portion 320 .

[0097] Exemplarily, the first part 310 and the second part 320 of the anti-scouring sheet 300 can be processed by a sheet metal mold with high processing accuracy. The positioning structure on the second part 320 can be a positioning hole, and the number of the positioning holes is multiple. When the anti-scouring sheet 300 is connected to the radiator 200, a jig can be used to position the radiator 200 / circuit board 100 and the anti-scouring sheet 300. The jig can be provided with a plurality of positioning pins corresponding to the plurality of positioning holes one by one, and the radiator 200 / circuit board 100 and the anti-scouring sheet 300 can be accurately positioned by the cooperation of the positioning pins and the corresponding positioning holes, so that the first part 310 and the second part 320 of the anti-scouring sheet 300 can be quickly bonded to the heat-generating component 110 or the radiator 200 on the circuit board 100.

[0098] In this embodiment, by providing a positioning structure on the second portion 320, the anti-scour sheet 300 can be quickly installed, thereby further improving the installation efficiency of the entire installation assembly.

[0099] In one embodiment, the heat sink 200 includes a heat dissipation substrate 210 and a plurality of heat dissipation fins 220 arranged at intervals, the first portion 310 is located between the heat-generating component 110 and the heat dissipation substrate 210 , and the plurality of heat dissipation fins 220 are arranged on a side of the heat dissipation substrate 210 away from the first portion 310 .

[0100] Exemplarily, a liquid flow channel is formed between two adjacent heat sinks 220. When the heat dissipation assembly 10 is applied to a computing device, the heat dissipation assembly 10 is located in the housing of the computing device. The top wall and the bottom wall of the housing may be provided with liquid flow ports. The arrangement direction of the top wall of the housing and the bottom wall of the housing may be consistent with the extension direction of the heat sink 220, so that the liquid flow port on the top wall of the housing, the liquid flow channel and the liquid flow port on the bottom wall of the housing jointly define a cooling liquid flow channel. The cooling liquid may flow from bottom to top along the cooling liquid flow channel, taking away the heat generated during the operation of the heating component 110, and the cooling liquid may flow back to both sides after gushing out of the liquid flow port on the top wall of the housing. Among them, a boss may be provided on the side surface of the heat dissipation substrate 210 facing the circuit board 100. The first part 310 of the anti-scouring sheet 300 may be pressed between the boss and the heating component 110.

[0101] A computing device according to an embodiment of the second aspect of the present application includes a heat dissipation assembly 10 according to any of the above-mentioned embodiments of the present application.

[0102] Exemplarily, the computing device may further include a housing and a power module. The housing may be provided with a power module accommodating area and a heat dissipation assembly accommodating area. The power module is arranged in the power module accommodating area. The heat dissipation assembly 10 is arranged in the heat dissipation assembly accommodating area. The number of heat dissipation assemblies 10 may be multiple. Multiple heat dissipation assemblies 10 may be arranged on one side of the power module, or may be distributed on both sides of the power module. In the case where multiple heat dissipation assemblies 10 are distributed on both sides of the power module, the number of heat dissipation assemblies 10 located on both sides of the power module may be equal or unequal. Multiple heat dissipation assemblies 10 may also be arranged symmetrically about the power module.

[0103] According to the computing device of the embodiment of the present application, by adopting the above-mentioned heat dissipation component 10, the first part 310 of the anti-erosion sheet 300 can effectively protect the heat dissipation medium 312. When the heat dissipation component 10 is immersed in the coolant, the first part 310 can isolate the heat dissipation medium 312 and the coolant to a certain extent, thereby achieving the sealing of the heat dissipation medium 312, thereby preventing the heat dissipation medium 312 from being eroded and dissipated under the condition of long-term immersion. While ensuring the heat dissipation effect, the operating reliability of the computing device can be improved.

[0104] The heat dissipation assembly 10 and other components of the computing device in the above-mentioned embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0105] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0107] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0108] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0109] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0110] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation component, characterized in that: include: A circuit board, wherein a plurality of heat generating components are arranged on the circuit board; A heat sink is arranged on a side of the heat generating component away from the circuit board; The anti-scouring sheet includes a plurality of first parts arranged between the heat-generating components and the radiator, wherein the plurality of first parts are arranged one-to-one corresponding to the plurality of heat-generating components, the first parts define heat-dissipating holes, and heat-dissipating medium is arranged in the heat-dissipating holes; and also includes a second part arranged on the outer periphery of the first part, and the second part is used to connect adjacent first parts to each other.

2. The heat dissipation assembly according to claim 1, characterized in that: The inner edge of the first portion is spaced apart from the edge of the heat generating component.

3. The heat dissipation assembly according to claim 1, characterized in that: The maximum dimension of the heat dissipation hole in the first direction is smaller than the dimension of the heat-generating component in the first direction, and the maximum dimension of the heat dissipation hole in the second direction is smaller than the dimension of the heat-generating component in the second direction; wherein, the first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the surface of the circuit board.

4. The heat dissipation assembly according to claim 1, characterized in that: The thickness of the first part is smaller than the thickness of the heat generating component, and the thickness direction is perpendicular to the surface of the circuit board.

5. The heat dissipation assembly according to claim 1, characterized in that: The first portion is made of elastic material.

6. The heat dissipation assembly according to claim 1, characterized in that: A first adhesive is provided on a surface of the anti-scouring sheet facing the heat generating component, and the anti-scouring sheet is bonded to the heat generating component through the first adhesive.

7. The heat dissipation assembly according to claim 6, characterized in that: A first coating is provided on a surface of the anti-scouring sheet facing the heat generating component, and the first adhesive is provided between the anti-scouring sheet and the first coating.

8. The heat dissipation assembly according to claim 1, characterized in that: A second adhesive is provided on a surface of the anti-scouring sheet facing the radiator, and the anti-scouring sheet is bonded to the radiator through the second adhesive.

9. The heat dissipation assembly according to claim 8, characterized in that: A second coating is provided on a surface of the anti-scouring sheet facing the radiator, and the second adhesive is provided between the anti-scouring sheet and the second coating.

10. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the heat-generating component, the heat dissipation medium is directly filled in the heat dissipation hole, and the heat sink is connected to the circuit board through a first fastener.

11. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the heat-generating component, the heat dissipation medium is filled in the heat dissipation hole through a first mesh structure, and the heat sink is connected to the circuit board through a second fastener.

12. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the heat generating component, the heat dissipation medium is coated on the side of the heat sink facing the circuit board, and the heat sink coated with the heat dissipation medium is connected to the circuit board through a third fastener so that the heat dissipation medium fills the heat dissipation hole.

13. The heat dissipation assembly according to claim 12, characterized in that: The heat dissipation medium is directly applied to the heat sink; or, the heat dissipation medium is applied to the heat sink through a second mesh structure.

14. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the radiator, the heat dissipation medium is directly filled in the heat dissipation holes, and the radiator connected to the anti-scouring sheet is connected to the circuit board through a fourth fastener.

15. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the radiator, the heat dissipation medium is filled in the heat dissipation holes through a third mesh structure, and the radiator connected to the anti-scouring sheet is connected to the circuit board through a fifth fastener.

16. The heat dissipation assembly according to claim 1, characterized in that: The anti-scouring sheet is connected to the radiator, the heat dissipation medium is coated on the side of the heat generating component facing the radiator, and the radiator connected to the anti-scouring sheet is connected to the circuit board through a sixth fastener so that the heat dissipation medium fills the heat dissipation hole.

17. The heat dissipation assembly according to claim 16, characterized in that: The heat dissipation medium is directly applied to the heat-generating component; or, the heat dissipation medium is applied to the heat-generating component through a fourth mesh structure.

18. The heat dissipation assembly according to claim 1, characterized in that: A plurality of the heat generating components are connected in parallel to form a parallel device group, a plurality of the first parts are connected through the second parts to form a parallel anti-scour sheet group, and the parallel anti-scour sheet group is arranged corresponding to the parallel device group.

19. The heat dissipation assembly according to claim 1, characterized in that: A plurality of the heating components are connected in series to form a series component group, a plurality of the first parts are connected through the second parts to form a series anti-scouring sheet group, and the series anti-scouring sheet group is arranged corresponding to the series component group.

20. The heat dissipation assembly according to claim 1, characterized in that: The second part and the first part are an integral structure, and / or the thickness of the second part is equal to the thickness of the first part.

21. The heat dissipation assembly according to claim 1, characterized in that: The second part is provided with a positioning structure corresponding to the heat sink and / or the circuit board, and / or the second part is formed with a fastener avoidance hole and / or a component avoidance hole.

22. The heat dissipation assembly according to claim 1, characterized in that: The anti-scour sheet is made of oil-resistant material.

23. The heat dissipation assembly according to any one of claims 1 to 22, characterized in that: The heat sink comprises a heat dissipation substrate and a plurality of heat dissipation fins arranged at intervals, the anti-scouring sheet is located between the heat generating component and the heat dissipation substrate, and the plurality of heat dissipation fins are arranged on a side of the heat dissipation substrate away from the anti-scouring sheet.

24. A computing device, characterized in that Comprising a heat dissipation assembly according to any one of claims 1-23.

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