Piece separating and conveying tool for degumming, piece inserting and cleaning all-in-one machine

Abstract

The utility model provides a wafer separating transmission tool for a degumming, wafer inserting and cleaning all-in-one machine, and belongs to the technical field of silicon wafer production. Comprising a side spraying assembly, the side spraying assembly comprises a nozzle, the nozzle section of the nozzle is gradually reduced in the liquid spraying direction, and a plurality of spraying holes are densely and evenly formed in the nozzle; the spray head comprises a lower side spray head and an upper side spray head which are arranged along the transmission direction of the silicon wafer; and the length of the spray hole channel of the lower side spray is smaller than that of the spray hole channel of the upper side spray. According to the utility model, the shape of the nozzle is improved, so that the nozzle has smaller volume and higher spraying pressure, and sprayed liquid is more uniform; the distance between the upper side sprayer and the main plate and the distance between the lower side sprayer and the main plate as well as the length and the aperture of a pore channel are finely designed, so that the silicon wafer can be more effectively separated; and cleaning holes are formed in the spray head, so that the spray head can be cleaned more conveniently.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer production, in particular to a wafer transmission tooling for a debonding wafer cleaning integrated machine. Background Art

[0002] Photovoltaic power generation, as a green energy and a major energy source for sustainable development of mankind, is increasingly valued and developed by countries around the world. With the development of silicon rod cutting technology, the price of raw materials has risen, and the requirements for silicon wafer quality have become higher and higher.

[0003] In silicon wafer production, a degumming wafer cleaning machine is usually used to degumming and clean silicon wafers. The existing degumming wafer cleaning machine uses vertical wafers, which can reduce labor costs and realize automated production. Usually, silicon wafers are sliced ​​through side spray assemblies. During the silicon wafer separation process, a water spray pump sucks water in the wafer slot into the pipe, and then the water pump pressurizes it into the water outlet pipe. The outlet pipe port is connected to the side spray assembly. The spray hole and shape of the side spray assembly will affect the pressure and direction of the water outlet. The water pressure of the existing side spray assembly is not concentrated, and there are gaps between the spray holes, which makes it impossible to separate the silicon wafers evenly. There is a phenomenon of two wafers being loaded at the same time, which affects the man-hour utilization rate of the wafer cleaning machine and increases the workload and maintenance costs of on-site production operators. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a piece transfer tool for a debonding piece cleaning all-in-one machine.

[0005] The technical solution adopted by the utility model is: a chip transmission tooling for a degumming chip cleaning integrated machine, characterized in that: it includes a side spray assembly, the side spray assembly includes a nozzle, the nozzle cross-section of the nozzle gradually decreases along the liquid spraying direction, and the nozzle is densely and evenly arranged with a plurality of spray holes; the nozzle includes a lower side spray and an upper side spray arranged along the transmission direction of the silicon chip; the channel length of the spray hole of the lower side spray is smaller than the channel length of the spray hole of the upper side spray.

[0006] Furthermore, the length of the channel for the upper side spray is 25mm-40mm, and the length of the channel for the lower side spray is 20mm-25mm.

[0007] Furthermore, the number of the spray holes for spraying on the upper side is greater than that of the spray holes for spraying on the lower side.

[0008] Furthermore, the side spray assembly also includes a mounting seat, and the upper side spray and the lower side spray are respectively arranged at two ends of the mounting seat facing each other and are connected to the water absorber of the mounting seat.

[0009] Furthermore, it also includes a main board, a transmission device and an angle adjustment component;

[0010] The transmission device is rotatably connected to the mainboard and is used to transmit the silicon wafer;

[0011] The angle adjustment assembly includes a wedge block and an inclined block, the wedge block is used to fix the main board to the main body of the degumming insert cleaning machine; the inclined block is used to connect the side spray assembly and the main board; the angle adjustment assembly enables the main board to have an inclined installation angle relative to the degumming insert cleaning machine to change the transmission angle of the silicon wafer.

[0012] Furthermore, the wedge block and the inclined block both have a first surface and a second surface that are relative and non-parallel; the angle between the first surface and the second surface is 3°-6°; a through hole is provided between the first surface and the second surface, and a connecting piece is provided in the hole.

[0013] Furthermore, the inclined block is arranged on a side of the main board close to the entrance end of the transmission device, and the mounting seat is connected to the inclined block; the nozzle hole of the upper side spray is closer to the main board than the nozzle hole of the lower side spray; the aperture of the nozzle hole of the lower side spray close to the main board is larger than the aperture of the nozzle hole away from the main board; the aperture of the nozzle hole of the lower side spray close to the main board is larger than the aperture of the nozzle hole away from the main board.

[0014] Furthermore, it also includes a pressing device, which is connected to the mainboard and is used to press the silicon wafer.

[0015] Furthermore, the transmission device comprises a driving wheel, a driven wheel and an auxiliary wheel, and the driving wheel is connected to the driven wheel through a transmission belt.

[0016] Furthermore, the nozzle is provided with a cleaning hole and a cavity connected to the channel for containing the liquid; the cleaning hole is communicated with the cavity for cleaning the cavity; a detachable sealing body is provided in the cleaning hole.

[0017] The advantages and positive effects of the utility model are:

[0018] 1. By improving the shape of the nozzle, the nozzle has a smaller volume and a greater spraying pressure, the sprayed liquid is more uniform, and the silicon wafers can be separated more effectively.

[0019] 2. According to the positions of the upper and lower spray nozzles and their different functions, the distance from the mainboard, the length of the channel and the aperture are refined to separate the silicon wafers more effectively.

[0020] 3. By setting a cleaning hole on the nozzle, the nozzle can be cleaned more conveniently.

[0021] 4. On the basis of the original equipment, wedge blocks and inclined blocks are added to make the mainboard tilt to one side on the original basis, changing the silicon wafer transmission angle, avoiding scratches and damage when the silicon wafer enters the next process, and improving the silicon wafer formation rate; at the same time, the spray angle of the side spray component will not change, achieving a good slicing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a specific implementation of the utility model;

[0023] Figure 2 It is a top view of a nozzle structure of a specific implementation of the utility model;

[0024] Figure 3 It is a side view of a nozzle structure of a specific implementation of the utility model;

[0025] Figure 4 It is a front view of a lower side spray structure of a specific implementation of the utility model;

[0026] Figure 5 It is a side view of a wedge block of a specific implementation of the utility model;

[0027] Figure 6 It is a front view of a wedge block of a specific implementation of the utility model;

[0028] Figure 7 It is a side view of an inclined block of a specific implementation of the utility model;

[0029] Figure 8 It is a front view of an inclined block of a specific implementation of the utility model.

[0030] In the figure:

[0031] 10. Main board 20. Transmission device 21. Driving wheel

[0032] 22, driven wheel 23, auxiliary wheel 30, angle adjustment assembly

[0033] 31, wedge block 32, inclined block 40, clamping device

[0034] 50. Degumming insert cleaning machine body 60. Conveyor belt 70. Side spray assembly

[0035] 71. Mounting seat 72. Sprinkler head 721. Nozzle

[0036] 722, spray hole 723, cavity 724, cleaning hole

[0037] 73, upper side spray 74, lower side spray 80, silicon wafer DETAILED DESCRIPTION

[0038] The embodiments of the present utility model are described below in conjunction with the accompanying drawings.

[0039] First of all, it should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0040] The drawings of this specification are schematic diagrams, which assist in explaining the concept of this application and schematically show the shapes of various parts and their mutual relationships. Please note that in order to clearly show the structures of various components of the embodiments of this application, the drawings are not drawn according to the same scale. The same reference numerals are used to represent the same parts.

[0041] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the utility model provides a piece transfer tooling for a debonding and chip cleaning integrated machine, including a side spray assembly 70, the side spray assembly 70 includes a nozzle 72, the cross-section of a nozzle 721 of the nozzle 72 gradually decreases along the liquid spraying direction, and the nozzle 721 is densely and evenly arranged with a plurality of spray holes 722; the nozzle 72 includes a lower side spray 74 and an upper side spray 73 arranged along the transmission direction of the silicon wafer 80; the channel length of the spray hole 722 of the lower side spray 74 is less than the channel length of the spray hole 722 of the upper side spray 73.

[0043] like Figure 1 , Figure 2 As shown, the function of the side spray assembly 70 is to separate the silicon wafer 80. By designing the cross-section of the nozzle 721 of the nozzle 72 to be a gradually decreasing shape along the liquid spraying direction, the water pressure in the nozzle 72 is increased without changing the original water pump pressure, so that the liquid has a greater impact force when it is sprayed from the spray hole 722, and the silicon wafer 80 can be separated more effectively; at the same time, this shape makes the nozzle 72 have a smaller volume, which is easier to install and cooperates well with other components of the degumming insert cleaning machine.

[0044] In this embodiment, the lower side spray 74 and the upper side spray 73 are arranged along the transmission direction of the silicon wafer 80, that is, the silicon wafer 80 passes through the lower side spray 74 first and then the upper side spray 73 during the transmission process; the upper side spray 73 and the lower side spray 74 are densely provided with a plurality of spray holes 722, so that the liquid can be sprayed more evenly; wherein the lower side spray 74 is used to pre-separate the silicon wafer 80 and maintain the angle of the silicon wafer 80, and the main board 10 at its installation position cannot be provided with a water absorption hole, so the channel length of the spray hole 722 of the lower side spray 74 is smaller than the channel length of the spray hole 722 of the upper side spray 73, so that the nozzle 721 is further away from the silicon wafer 80, so as to avoid the silicon wafer 80 being blown away from the transmission device 20 due to its too close distance to the silicon wafer 80.

[0045] In a preferred embodiment, the channel length of the spray hole 722 of the upper spray 73 is 25mm-40mm, and the channel length of the spray hole 722 of the lower spray 74 is 20mm-25mm. At the same time, the channel length of the spray hole 722 of the lower spray 74 is smaller than the channel length of the spray hole 722 of the upper spray 73.

[0046] In a preferred embodiment, Figure 4 As shown, the aperture of the spray hole 722 of the lower side spray 74 close to the main board 10 is larger than the spray hole 722 far away from the main board 10, so that the pressure of the liquid sprayed by the lower side spray 74 becomes smaller as it gets closer to the main board 10, so as to avoid affecting the silicon wafer 80 entering the transmission device 20 and being adsorbed by the main board 10, while having a good separation effect on the silicon wafer 80 entering later.

[0047] In a specific embodiment, the number of nozzle holes 722 of the upper nozzle 73 is greater than the number of nozzle holes 722 of the lower nozzle 74, ensuring that the upper nozzle 73 can effectively separate the silicon wafer 80 and transfer the silicon wafer 80 adsorbed on the mainboard 1 upward to avoid stacking.

[0048] Furthermore, if Figure 1 As shown, the side spray assembly 70 also includes a mounting seat 71, and the upper side spray 73 and the lower side spray 74 are respectively arranged at the two ends of the mounting seat 71 opposite to each other and are connected to the water absorber of the mounting seat 71; in addition to being used for mounting the side spray assembly 70, the mounting seat 71 also has water absorption and water spraying functions, and the water absorber of the mounting seat 71 is connected to the nozzle 72, which sucks the liquid in the insert slot into the nozzle 72 and sprays it through the nozzle 721. The nozzles 72 arranged opposite to each other keep the silicon wafer 80 located on the transmission device 20 in the middle position and will not deviate to one side; specifically, the liquid pressure sprayed by the relative upper side spray 73 is the same to prevent the silicon wafer 80 from tilting to one side, and the liquid pressure of the relative lower side spray 74 is also the same.

[0049] Furthermore, if Figure 1 , Figure 5 , Figure 6 , Figure 7 , Figure 8As shown, the utility model proposes a slice transmission tool for a degumming insert cleaning machine, which also includes a main board 10, a transmission device 20 and an angle adjustment assembly 30; wherein the main board 10 has an adsorption hole for adsorbing a silicon wafer 80; the transmission device 20 is rotatably connected to the main board 10 for transmitting the silicon wafer 80; the angle adjustment assembly 30 includes a wedge block 31 and an inclined block 32, the wedge block 31 is used to fix the main board 10 to the degumming insert cleaning machine body 50, so that the main board 10 has an inclined installation angle relative to the degumming insert cleaning machine body 50, so as to change the transmission angle of the silicon wafer 80; the inclined block 32 is used to connect the side spray assembly 70 with the main board 10.

[0050] In the prior art, the mainboard 10 of the degumming insert cleaning machine is usually fixed to the degumming insert cleaning machine body 50 in the vertical direction; during use, the mainboard 10 and the transmission device 20 are in a liquid environment, and the negative pressure of the liquid flow is used to adsorb the silicon wafer 80, so that the silicon wafer 80 is transmitted from bottom to top along the transmission device 20. The inventors of the present application discovered that, in the process of upward transmission of the silicon wafer 80 to the sponge wheel of the next process, because the transmission plane of the sponge wheel and the transmission plane of the silicon wafer 80 on the transmission device 20 are not on the same plane, the transmission direction of the silicon wafer 80 changes, and the silicon wafer 80 tilts to the side close to the sponge wheel. At this time, the silicon wafer 80 rotates, and its tail is tilted to the other side, which is easy to collide or scratch with the next silicon wafer 80, thereby causing damage to the silicon wafer 80; in this embodiment, by providing a wedge block 31, the main board 10 has an inclined installation angle, without changing the original structure of the degumming insert cleaning all-in-one machine body 50, the main board 10 is transformed from a vertical state to an inclined state along a fixed angle, thereby changing the transmission angle of the silicon wafer 80, achieving a reduction in the rotation angle of the silicon wafer 80 in the process of entering the sponge wheel, thereby avoiding the phenomenon of scratching with the next silicon wafer 80 and causing damage.

[0051] In this embodiment, the side spray assembly 70 is installed on the main board 10 through the inclined block 32 of the angle adjustment assembly 30; because the wedge block 31 changes the installation angle of the main board 10, if the side spray assembly 70 is directly installed on the main board 10, the spraying angle of the side spray assembly 70 will also change, thereby affecting the spraying effect of the side spray assembly 70. Therefore, the inclined block 32 is provided to prevent the spraying angle of the side spray assembly 70 from changing, thereby ensuring that the side spray assembly 70 has a good effect of separating silicon wafers.

[0052] like Figure 5 , Figure 6 , Figure 7 , Figure 8As shown, the wedge block 31 and the inclined block 32 have a first surface and a second surface that are opposite and non-parallel; the angle between the first surface and the second surface is 3°-6°. Specifically, the first surface of the wedge block 31 is attached to the main board 10, and the second surface is attached to the debonding insert cleaning machine body 50, so that the installation angle of the main board 10 is changed; at the same time, the first surface of the inclined block 32 is attached to the main board 10, and the second surface is attached to the side spray assembly 70, so that the side spray assembly 70 can maintain its original installation angle; when in use, the silicon wafer 80 still enters the transmission device 20 along its original direction. Because the transmission device 20 and the main board 10 both have an inclined installation angle, the direction in which the silicon wafer 80 enters is different from the transmission device 20. An angle is also formed, in which one of the silicon wafers 80 is attached to the main board 10 under the adsorption effect of the main board 10, and is transmitted upward under the drive of the transmission device 20; but the other silicon wafers 80 arranged behind it still maintain their original posture when entering, and the side spray assembly 70 is required to separate it from the previous silicon wafer 80; at this time, by setting the inclined block 32, the spraying direction of the side spray assembly 70 will not change, and the nozzle 72 of the side spray assembly 70 can still spray perpendicular to the silicon wafer 80, thereby effectively separating the silicon wafers 80 arranged behind it one by one.

[0053] The inventors of the present application discovered that when the installation angle of the mainboard 10 is tilted 3°-6° toward the side close to the sponge wheel, it can effectively prevent the silicon wafer 80 from scratching the next silicon wafer 80 when entering the sponge wheel. When the installation angle is smaller than this range, the effect of preventing the silicon wafer 80 from scratching is not obvious. When the installation angle is larger than this range, it will affect the stable transmission of the silicon wafer 80.

[0054] In a preferred embodiment, the angle between the first surface and the second surface of the wedge block 31 and the bevel block 32 is 5°, that is, when the main board 1 and the transmission device 2 are installed at an angle of 5° to the vertical direction, while preventing the silicon wafer 80 from being scratched, it can have a good transmission and compression effect and has little impact on other functional structures.

[0055] In this embodiment, the first surface and the second surface of the wedge block 31 and the inclined block 32 are both provided with through holes, and the main board 10 and the side spray assembly 70 are provided with corresponding holes. The main board 10 is fixed to the degumming insert cleaning machine body 50 and the side spray assembly 70 is installed on the main board 10 by arranging a connecting piece passing through the hole; preferably, the connecting piece is a bolt, so that the wedge block 31 and the inclined block 32 can be detachably connected.

[0056] In a specific embodiment, the wedge block 31 and the inclined block 32 include relative vertical surfaces and inclined surfaces, the inclined surface is the first surface, and the vertical surface is the second surface. The cross-sectional shape of the wedge block 31 and the inclined block 32 along their thickness direction is a trapezoid, and also includes upper and lower end surfaces that are parallel to each other, so that the wedge block 31 and the inclined block 32 are easier to process and manufacture.

[0057] Furthermore, the inclined block 32 is arranged on a side of the mainboard 10 close to the entrance end of the transmission device 20, and the mounting seat 71 is connected to the inclined block 32, so that the mounting seat 71 is fixed close to the entrance end of the transmission device 20, so as to better realize the separation of the silicon wafer 80 by the side spray assembly 70; the spray hole 722 of the upper side spray 73 is closer to the mainboard than the spray hole 722 of the lower side spray 74, that is, the spray hole 722 of the lower side spray 74 is closer to the mainboard 10 than the upper side spray 73, so as to avoid blowing the silicon wafer 80 away from the transmission device 20 due to its too close distance to the mainboard 10.

[0058] In a preferred embodiment, the aperture of the spray hole 722 of the lower side spray 74 close to the main board 10 is larger than the spray hole 722 far away from the main board 10, so that the pressure of the liquid sprayed by the lower side spray 74 becomes smaller as it gets closer to the main board 10, so as to avoid affecting the silicon wafer 80 entering the transmission device 20 and being adsorbed by the main board 10, while having a good separation effect on the silicon wafer 80 entering later.

[0059] Furthermore, the utility model proposes a slice transfer tooling for a debonding and wafer cleaning machine, which also includes a clamping device, and also includes a clamping device 40, which is connected to the mainboard 10 and is used to clamp the silicon wafer 80, and its position is set above the transmission device 20.

[0060] Furthermore, the transmission device 20 includes a driving wheel 21, a driven wheel 22 and an auxiliary wheel 23. The driving wheel 21 is connected to the driven wheel 22 through a transmission belt to drive the silicon wafer 80 to move upward. At the same time, the auxiliary wheel 23 rotates under the drive of the silicon wafer 80 to assist the silicon wafer 80 to move upward.

[0061] The pressing device 40 in this embodiment enables the silicon wafer 80 to be closely attached to the conveying belt 60 during the upward conveying process, thereby preventing the silicon wafer 80 from moving and falling off.

[0062] Furthermore, if Figure 6 , Figure 7 , Figure 8 As shown, the nozzle 72 is provided with a cleaning hole 724 and a cavity 723 connected to the hole, the cavity 723 is used to contain liquid; the cleaning hole 724 is connected to the cavity 723 and is used to clean the cavity 723; a removable sealing body is provided in the cleaning hole 724; in this embodiment, the bottom end of the nozzle 72 is the entrance end of the liquid, the cleaning hole 724 is arranged at the upper part of the nozzle 72, and is connected to the cavity 723, and the cleaning tool can enter the cavity 723 through the cleaning hole 724 more conveniently to clean the inside of the cavity 723.

[0063] In a preferred embodiment, the wedge block 31 is made of metal material and has good rigidity, so that the connection between the main board 10 and the degumming insert cleaning machine body 50 is more stable. At the same time, the inclined block 32 is made of polymer material and has a certain flexibility, so that the mounting seat 71 is fixed to the main board 10 without being easily worn.

[0064] The advantages and positive effects of the utility model are:

[0065] 1. By improving the shape of the nozzle, improving the upper and lower side sprays, the nozzle has a smaller volume and a greater spray pressure, the sprayed liquid is more uniform, and the silicon wafers can be separated more effectively.

[0066] 2. According to the positions of the upper and lower spray nozzles and their different functions, the distance from the mainboard, the length of the channel and the aperture are refined to separate the silicon wafers more effectively.

[0067] 3. By setting a cleaning hole on the nozzle, the nozzle can be cleaned more conveniently.

[0068] 4. On the basis of the original equipment, wedge blocks and inclined blocks are added to make the mainboard tilt to one side on the original basis, changing the silicon wafer transmission angle, avoiding scratches and damage when the silicon wafer enters the next process, and improving the silicon wafer formation rate; at the same time, the spray angle of the side spray component will not change, achieving a good slicing effect.

[0069] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A piece transfer tool for a degumming and piece cleaning machine, characterized in that: It includes a side spray assembly, a main board, a transmission device and an angle adjustment assembly; The side spray assembly comprises a spray head, the nozzle cross section of the spray head gradually decreases along the liquid spraying direction, and the nozzle is densely and evenly provided with a plurality of spray holes; the spray head comprises a lower spray head and an upper spray head arranged along the transmission direction of the silicon wafer; the nozzle hole length of the lower spray head is smaller than the nozzle hole length of the upper spray head; the nozzle hole length of the upper spray head is 25mm-40mm, and the nozzle hole length of the lower spray head is 20mm-25mm; The transmission device is rotatably connected to the mainboard and is used to transmit the silicon wafer; The angle adjustment assembly includes a wedge block and an inclined block, and the wedge block is used to fix the main board to the main body of the debonding insert cleaning machine; The inclined block is used to connect the side spray assembly and the main board; the angle adjustment assembly enables the main board to have an inclined installation angle relative to the debonding insert cleaning integrated machine to change the transmission angle of the silicon wafer.

2. The piece transfer tool for the integrated degumming and cleaning machine according to claim 1, characterized in that: The number of the nozzle holes for the upper side spray is greater than that of the nozzle holes for the lower side spray.

3. The piece transfer tool for the integrated degumming and cleaning machine according to claim 1 or 2, characterized in that: The side spray assembly also includes a mounting seat, and the upper side spray and the lower side spray are respectively arranged at two ends of the mounting seat facing each other and are connected to the water absorber of the mounting seat.

4. The piece transfer tool for the integrated degumming and cleaning machine according to claim 3 is characterized in that: The wedge block and the inclined block both have a first surface and a second surface that are opposite and non-parallel; the angle between the first surface and the second surface is 3°-6°; a through hole is provided between the first surface and the second surface, and a connecting piece is provided in the hole.

5. The piece transfer tool for the integrated degumming and cleaning machine according to claim 4, characterized in that: The inclined block is arranged on a side of the main board close to the entrance end of the transmission device, and the mounting seat is connected to the inclined block; the nozzle holes of the upper side spray are closer to the main board than the nozzle holes of the lower side spray; the aperture of the nozzle holes of the lower side spray close to the main board is larger than the aperture of the nozzle holes away from the main board.

6. The piece transfer tool for the integrated degumming and cleaning machine according to claim 4, characterized in that: It also includes a pressing device, which is connected to the mainboard and is used to press the silicon wafer.

7. The piece transfer tool for the integrated degumming and cleaning machine according to claim 5 or 6, characterized in that: The transmission device comprises a driving wheel, a driven wheel and an auxiliary wheel, and the driving wheel is connected with the driven wheel through a transmission belt.

8. The piece transfer tool for the integrated degumming and cleaning machine according to claim 1, characterized in that: The nozzle is provided with a cleaning hole and a cavity connected to the channel for containing the liquid; the cleaning hole is communicated with the cavity for cleaning the cavity; a detachable sealing body is provided in the cleaning hole.

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