Wafer suction cup for gluing developing machine

Abstract

The utility model discloses a wafer suction cup for a gluing developer, which relates to the technical field of wafer suction cups and comprises a base plate, a mounting pipe is fixedly mounted at the top of the base plate, an outer cover is slidably mounted on the outer side of the mounting pipe, transverse plates are fixedly mounted on two sides of the top of the mounting pipe, electric telescopic rods are fixedly mounted at the bottoms of the transverse plates, and the outer cover is slidably mounted on the outer side of the mounting pipe. The electric telescopic rod is fixedly installed on the base plate, racks are fixedly installed on the two sides of the base plate, and installation grooves are formed in the two sides of the outer cover. After a workpiece is sucked by a rubber suction nozzle, an outer cover can be pushed to move downwards only by starting an electric telescopic rod, so that a transmission gear is meshed with a rack, a rotating shaft and a mounting plate can be driven to rotate, and the workpiece is supported by a supporting plate and a rubber pad from the lower portion of the sucked workpiece instead of being supported from the two sides; and therefore, the situation that the workpiece is damaged when the workpiece is adsorbed can be effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer suction cups, in particular to a wafer suction cup for a glue coating and developing machine. Background Art

[0002] The coating and developing equipment can complete the process of photoresist coating, developing and testing, and is an essential machine for semiconductor manufacturing. The coating and developing equipment refers to the machine used in conjunction with the photolithography machine in the photolithography process. The coating and developing equipment has the functions of baking, coating and developing, which can directly affect the formation of the exposure pattern in the photolithography process, and is mainly used in the manufacture of chips and power devices. The coating and developing equipment mainly includes developers, coating machines, sprayers, etc. In the production process of semiconductors, the coating and developing machine is used in the photolithography process of semiconductor manufacturing, and is the equipment for coating (coating) and developing (developing) the photosensitive agent (photoresist). The coating and developing machine unit consists of multiple system modules, among which the chemical cabinet liquid inlet system is an important part of the coating and developing. The current system-related main components are mainly composed of tanks, vacuum generators, electromagnetic sensors, solenoid valves, diluents, pipelines and other components. In the coating (coating) unit of the equipment, the photosensitive agent on the silicon wafer is first coated, and then sent to the exposure equipment, and the pattern on the MASK is projected onto the silicon wafer through the photolithography machine.

[0003] According to a wafer suction cup for a coating and developing machine with application number 202322066037.1, the workpiece can be effectively adsorbed to reduce shaking of the workpiece. At the same time, the supporting device can effectively prevent the workpiece from falling and breaking, thereby effectively ensuring production safety. The entire equipment also has the function of shock absorption during the adsorption and transportation process, thereby effectively ensuring the stability of the entire production.

[0004] However, the above-mentioned wafer suction cup for glue coating and developing machine has certain shortcomings. The suction cup drives the supporting plate to support the adsorbed wafer from both sides through the cylinder. However, the thickness of existing wafers varies depending on the size and purpose. Therefore, when thicker wafers are supported from both sides, it is very easy to cause the supporting plate and the wafer to come into hard contact, thereby causing damage to the wafer. Moreover, the suction cup cannot adjust the supporting plate and the suction cup according to the thickness of the adsorbed workpiece to support it. Therefore, there are certain shortcomings. For this reason, we propose a wafer suction cup for glue coating and developing machine. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a wafer suction cup for a glue coating and developing machine, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above purpose, the utility model is implemented through the following technical solutions: a wafer suction cup for a glue coating and developing machine, including a chassis, a mounting tube is fixedly installed on the top of the chassis, an outer cover is slidably installed on the outer side of the mounting tube, cross plates are fixedly installed on both sides of the top of the mounting tube, an electric telescopic rod is fixedly installed on the bottom of the cross plate, racks are fixedly installed on both sides of the chassis, mounting grooves are opened inside the two sides of the outer cover, a rotating shaft is rotatably installed inside the mounting groove, a transmission gear is fixedly installed on one end of the rotating shaft, the rack is meshed with the transmission gear, and a mounting gear is fixedly installed on the outer side of the rotating shaft A sleeve, a mounting plate is fixedly installed on one side of the mounting sleeve, a mounting cavity is opened inside the mounting plate, a threaded rod is rotatably installed inside the mounting cavity, a driven bevel gear is fixedly installed on the outside of the threaded rod, a rotating rod is rotatably installed inside the top of the mounting plate, an active bevel gear is fixedly installed on one end of the rotating rod, the active bevel gear is meshed with the driven bevel gear, a rotating button is fixedly installed on the other end of the rotating rod and located on the outside of the mounting plate, a sleeve block is threadedly installed on the outside of the threaded rod, two connecting rods are fixedly installed on one side of the sleeve block, and one end of the connecting rod extends to the outside of the mounting plate and is fixedly installed with a supporting plate.

[0007] Preferably, a negative pressure chamber is opened inside the chassis, a plurality of air holes are opened inside the chassis and below the negative pressure chamber, a rubber suction nozzle is fixedly installed at the bottom of the chassis and below the plurality of air holes, a negative pressure fan is fixedly installed inside the mounting tube, and an input end of the negative pressure fan is connected with the inside of the negative pressure chamber.

[0008] Preferably, a rubber pad is fixedly mounted on one side of the support plate.

[0009] Preferably, a groove matching with the chassis is formed inside the outer cover.

[0010] Preferably, a hole cooperating with the mounting tube is opened inside the top of the chassis.

[0011] Preferably, a hole cooperating with the rotating rod is opened inside the mounting plate, and a hole cooperating with the connecting rod is opened inside one side of the mounting plate.

[0012] The utility model provides a wafer suction cup for a glue coating and developing machine, which has the following beneficial effects:

[0013] 1. The wafer suction cup for the glue coating and developing machine cooperates with the electric telescopic rod, rack, mounting groove, rotating shaft and transmission gear. When the rubber suction nozzle sucks the workpiece, it only needs to open the electric telescopic rod to push the outer cover down so that the transmission gear and the rack are engaged to drive the rotating shaft and the mounting plate to rotate, so that the support plate and the rubber pad can support the adsorbed workpiece from the bottom instead of supporting the workpiece from both sides, thereby effectively avoiding the damage of the workpiece when adsorbing the workpiece.

[0014] 2. The wafer suction cup for the glue coating and developing machine is matched with the mounting cavity, threaded rod, driven bevel gear, rotating rod, driving bevel gear, rotating knob, sleeve block and connecting rod. During use, the length of the connecting rod extending from the mounting plate can be adjusted according to the workpieces of different sizes and thicknesses, so that it can cooperate with workpieces of different thicknesses to hold them, and there will be no situation where the rubber pad cannot contact the workpiece or the rubber pad holds the workpiece and applies too much force, and the compatibility is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the working state of the utility model;

[0017] Figure 3 It is a cross-sectional view of the utility model;

[0018] Figure 4 For this utility model Figure 3 A in the enlarged view;

[0019] Figure 5 For this utility model Figure 3 Enlarged view of point B in .

[0020] In the figure: 1. chassis; 2. mounting tube; 3. outer cover; 4. cross plate; 5. electric telescopic rod; 6. rack; 7. mounting groove; 8. rotating shaft; 9. transmission gear; 10. mounting sleeve; 11. mounting plate; 12. mounting cavity; 13. threaded rod; 14. driven bevel gear; 15. rotating rod; 16. driving bevel gear; 17. rotating knob; 18. sleeve block; 19. connecting rod; 20. supporting plate; 21. rubber pad; 22. negative pressure cavity; 23. air hole; 24. rubber suction nozzle; 25. negative pressure fan. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] See also Figures 1 to 5The utility model provides a technical solution: a wafer suction cup for a glue coating and developing machine, comprising a chassis 1, a mounting tube 2 is fixedly installed on the top of the chassis 1, an outer cover 3 is slidably installed on the outer side of the mounting tube 2, a hole matching with the mounting tube 2 is provided inside the top of the chassis 1, a groove matching with the chassis 1 is provided inside the outer cover 3, cross plates 4 are fixedly installed on both sides of the top of the mounting tube 2, an electric telescopic rod 5 is fixedly installed on the bottom of the cross plate 4, racks 6 are fixedly installed on both sides of the chassis 1, mounting grooves 7 are provided inside both sides of the outer cover 3, a rotating shaft 8 is rotatably installed inside the mounting groove 7, a transmission gear 9 is fixedly installed on one end of the rotating shaft 8, the rack 6 meshes with the transmission gear 9, a mounting sleeve 10 is fixedly installed on the outer side of the rotating shaft 8, a mounting plate 11 is fixedly installed on one side of the mounting sleeve 10, a mounting cavity 12 is provided inside the mounting plate 11, and a rotating shaft 8 is rotatably installed inside the mounting cavity 12. A threaded rod 13 is provided, and a driven bevel gear 14 is fixedly installed on the outside of the threaded rod 13. A rotating rod 15 is rotatably installed inside the top of the mounting plate 11. A hole matching the rotating rod 15 is provided inside the mounting plate 11. An active bevel gear 16 is fixedly installed on one end of the rotating rod 15, and the active bevel gear 16 meshes with the driven bevel gear 14. A rotating knob 17 is fixedly installed on the other end of the rotating rod 15 and is located on the outside of the mounting plate 11. A sleeve block 18 is threadedly installed on the outside of the threaded rod 13, and two connecting rods 19 are fixedly installed on one side of the sleeve block 18. One end of the connecting rod 19 extends to the outside of the mounting plate 11 and is fixedly installed with a support plate 20. A hole matching the connecting rod 19 is provided inside one side of the mounting plate 11, and a rubber pad 21 is fixedly installed on one side of the support plate 20, wherein the function of the rubber pad 21 is to prevent the support plate 20 from hard contact with the adsorbed workpiece, and it also plays an anti-slip role.

[0023] A negative pressure chamber 22 is opened inside the chassis 1, and a plurality of air holes 23 are opened inside the chassis 1 and below the negative pressure chamber 22. A rubber suction nozzle 24 is fixedly installed at the bottom of the chassis 1 and below the plurality of air holes 23. A negative pressure fan 25 is fixedly installed inside the mounting tube 2, and an input end of the negative pressure fan 25 is connected with the inside of the negative pressure chamber 22.

[0024] Among them, this application has the same use as the prior art of a wafer suction cup for a glue coating and developing machine with application number 202322066037.1, and is used in the technical field of glue coating and developing machines.

[0025] In summary, when the wafer suction cup for the glue coating and developing machine is used, the suction cup device is driven by the robot to move to the top of the workpiece to be sucked, and then the rubber suction nozzle 24 is brought into contact with the workpiece, and the negative pressure blower 25 is turned on to create a negative pressure in the negative pressure chamber 22 so that the rubber suction nozzle 24 generates suction to suck the workpiece to be sucked, and then the robot drives the suction cup to move up and turns on the electric telescopic rod 5, and then the outer cover 3 can be pushed down by the electric telescopic rod 5, and the outer cover 3 moves down and the transmission gear 9 is meshed with the rack 6, and then the rotating shaft 8 and the mounting plate 11 can be driven to rotate at the same time, so that the support plate 20 and the rubber pad 21 can be driven to rotate. The shaft 8 is axially rotated to support the adsorbed workpiece from below, thereby effectively preventing the workpiece from falling off during movement. Finally, when the length of the connecting rod 19 extending from the mounting plate 11 needs to be adjusted according to the size changes of the workpiece to be adsorbed, the rotating rod 15 and the active bevel gear 16 can be rotated by simply turning the knob 17. The active bevel gear 16 engages with the driven bevel gear 14 to drive the threaded rod 13 to rotate, thereby driving the sleeve block 18 to adjust the length of the connecting rod 19 and the thickness spacing supported by the support plate 20 and the rubber pad 21 through thread displacement. The adjustment is convenient and quick.

[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer suction cup for a glue coating and developing machine, comprising a base plate (1), characterized in that: A mounting tube (2) is fixedly mounted on the top of the chassis (1), an outer cover (3) is slidably mounted on the outer side of the mounting tube (2), horizontal plates (4) are fixedly mounted on both sides of the top of the mounting tube (2), an electric telescopic rod (5) is fixedly mounted on the bottom of the horizontal plate (4), racks (6) are fixedly mounted on both sides of the chassis (1), mounting grooves (7) are provided inside both sides of the outer cover (3), a rotating shaft (8) is rotatably mounted inside the mounting groove (7), a transmission gear (9) is fixedly mounted on one end of the rotating shaft (8), the rack (6) meshes with the transmission gear (9), a mounting sleeve (10) is fixedly mounted on the outer side of the rotating shaft (8), a mounting plate (11) is fixedly mounted on one side of the mounting sleeve (10), and the mounting plate (11) is opened inside A mounting cavity (12) is provided, a threaded rod (13) is rotatably mounted inside the mounting cavity (12), a driven bevel gear (14) is fixedly mounted on the outside of the threaded rod (13), a rotating rod (15) is rotatably mounted inside the top of the mounting plate (11), a driving bevel gear (16) is fixedly mounted on one end of the rotating rod (15), the driving bevel gear (16) is meshed with the driven bevel gear (14), a rotating knob (17) is fixedly mounted on the other end of the rotating rod (15) and located on the outside of the mounting plate (11), a sleeve block (18) is threadedly mounted on the outside of the threaded rod (13), two connecting rods (19) are fixedly mounted on one side of the sleeve block (18), and one end of the connecting rod (19) extends to the outside of the mounting plate (11) and is fixedly mounted with a supporting plate (20).

2. The wafer chuck for a glue coating and developing machine according to claim 1, characterized in that: A negative pressure chamber (22) is provided inside the chassis (1), a plurality of air holes (23) are provided inside the chassis (1) and below the negative pressure chamber (22), a rubber suction nozzle (24) is fixedly installed at the bottom of the chassis (1) and below the plurality of air holes (23), a negative pressure fan (25) is fixedly installed inside the mounting tube (2), and an input end of the negative pressure fan (25) is connected to the inside of the negative pressure chamber (22).

3. The wafer chuck for a glue coating and developing machine according to claim 1, characterized in that: A rubber pad (21) is fixedly mounted on one side of the support plate (20).

4. The wafer chuck for a glue coating and developing machine according to claim 1, characterized in that: The outer cover (3) is provided with a groove inside which matches the chassis (1).

5. The wafer chuck for a glue coating and developing machine according to claim 1, characterized in that: A hole matching the mounting tube (2) is provided inside the top of the chassis (1).

6. The wafer chuck for a glue coating and developing machine according to claim 1, characterized in that: A hole cooperating with the rotating rod (15) is provided inside the mounting plate (11), and a hole cooperating with the connecting rod (19) is provided inside one side of the mounting plate (11).

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