Microwave integrated packaging assembly

Abstract

The utility model provides a microwave integrated packaging assembly, which comprises a packaging mechanism and a pinch plate, and is characterized in that the packaging mechanism comprises an HTCC substrate, a side frame and a built-in chip; wherein the side frame is fixedly connected to the upper surface of the HTCC substrate, the built-in chip is connected to the interior of the HTCC substrate in a sliding mode, and the built-in chip is connected to the inner side wall of the side frame in a sliding mode; according to the utility model, the built-in chip and the HTCC substrate are packaged by using the side frame and the buckle plate, when the built-in chip needs to be taken out from the HTCC substrate, the buckle plate is moved to drive the buckling slide block to slide in the buckling slide groove by using the convex block, and then the twisted torsion spring is used to drive the rotating shaft to rotate, so that the built-in chip can be taken out from the HTCC substrate. The rotating shaft drives the buckle plate to move through the connecting mechanism, so that the side frame is opened to take out the built-in chip for maintenance or replacement, the whole packaging assembly does not need to be disassembled, the two sides do not need to be pressed at the same time, operation steps are simplified, and the influence on the size of the packaging assembly is reduced.

Description

Technical Field

[0001] The utility model relates to a packaging component, in particular to a microwave integrated packaging component, belonging to the technical field of integrated circuit packaging. Background Art

[0002] HTCC is also known as high temperature co-fired multilayer ceramic. Its manufacturing process is very similar to LTCC. The main difference is that HTCC ceramic powder does not contain glass material. Therefore, HTCC must be dried and hardened into a green embryo at a high temperature of 1300-1600℃. Then, via holes are drilled and filled with screen printing technology and printed circuits. Due to its high co-firing temperature, the choice of metal conductor materials is limited. Its main materials are tungsten, molybdenum, manganese, etc., which have high melting points but poor conductivity. Finally, the layers are sintered and formed.

[0003] Microwave integrated circuits are circuits that operate in microwave and millimeter wave bands and are integrated on a substrate with microwave passive components, active devices, transmission lines and interconnect lines. They have certain functions.

[0004] China's publicly authorized invention: CN216928544U discloses an LTCC integrated SIP packaged millimeter wave component, including a package bottom plate, a package side plate fixedly connected to the upper surface of the package bottom plate, the sides of the package side plates are fixedly connected to side connecting plates, one side of the package side plate is fixedly connected to an axis mounting shell, a rotating shaft is connected through the axis mounting shell, both ends of the rotating shaft are connected to a package top plate, one side of the package top plate is fixedly connected to a loading plate, and a sliding groove is provided in the loading plate.

[0005] However, although the packaging component can be directly repaired without removing the packaging around the substrate, when disassembling it, the sliding locking columns on both sides of the packaging component must be pressed at the same time to open the packaging top plate, which is inconvenient to operate. In addition, the sliding locking column structure is located on both sides of the component, which increases the overall volume of the component. Therefore, a microwave integrated packaging component is proposed. Utility Model Content

[0006] In view of this, the utility model provides a microwave integrated packaging component to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial choice.

[0007] The technical solution of the embodiment of the utility model is implemented as follows: a microwave integrated packaging assembly includes a packaging mechanism and a gusset plate, wherein the packaging mechanism includes an HTCC substrate, a side frame and a built-in chip;

[0008] Wherein, the side frame is fixedly connected to the upper surface of the HTCC substrate, the built-in chip is slidably connected to the inside of the HTCC substrate, the built-in chip is slidably connected to the inner side wall of the side frame, and the buckle plate is arranged on the upper surface of the side frame;

[0009] Among them, four buckling positioning mechanisms are symmetrically arranged between the buckle plate and the side frame, two connecting mechanisms are symmetrically arranged on one side of the buckle plate, and the connecting mechanisms are used to guide the sliding buckle plate, and the inner side wall of the buckle plate is provided with a heat dissipation mechanism;

[0010] Wherein, the four snap-fit ​​positioning mechanisms each include a protrusion, a snap-fit ​​slider and a snap-fit ​​slide groove;

[0011] The protrusion is fixedly connected to the bottom of the buckle plate, the buckling slide is opened on the outer wall of the side frame, the buckling slider is slidably connected to the inner wall of the buckling slide, and one end of the buckling slider is fixedly connected to one side of the protrusion;

[0012] Wherein, a rotating shaft is provided on one side of the two connecting mechanisms close to the side frame, a torsion spring is fixedly connected to the outer wall of the rotating shaft, and one end of the torsion spring away from the rotating shaft is fixedly connected to the inner wall of the side frame.

[0013] Further preferably, the two connecting mechanisms each include an L-shaped plate, a guide slider and a guide slot;

[0014] Among them, the guide slider is fixedly connected to one end of the L-shaped plate, the guide groove is opened at the bottom of the buckle plate, the outer wall of the guide slider is slidably connected to the inner wall of the guide groove, and one end of the rotating shaft is fixedly connected to the side of the L-shaped plate away from the guide slider.

[0015] Further preferably, a micro spring is fixedly connected to one side of the inner wall of the buckle plate, and one end of the micro spring is fixedly connected to one side of the guide slider.

[0016] Further preferably, the heat dissipation mechanism includes a heat dissipation plate and a thermally conductive silicone pad;

[0017] Wherein, the heat dissipation plate is fixedly connected to the middle part of the inner wall of the buckle plate, and the thermal conductive silicone pad is fixedly connected to the bottom of the heat dissipation plate.

[0018] Further preferably, an anti-slip portion is provided on one side of the upper surface of the gusset plate.

[0019] Further preferably, a through slot is provided on one side of the side frame, and the outer side wall of the buckle plate is slidably connected to the inner side wall of the through slot.

[0020] Further preferably, the outer side wall of the HTCC substrate is symmetrically provided with four through holes.

[0021] The embodiment of the utility model has the following advantages due to the adoption of the above technical solution:

[0022] 1. The utility model uses a side frame and a buckle plate to package the built-in chip and the HTCC substrate. When the built-in chip needs to be taken out from the HTCC substrate, the buckle plate is moved to drive the buckle slider to slide in the buckle slot by using the convex block, and then the twisted torsion spring is used to drive the rotating shaft to rotate. The rotating rotating shaft drives the buckle plate to move by using the connecting mechanism, so that the side frame is opened to take out the built-in chip for inspection or replacement. There is no need to dismantle the entire packaging component and there is no need to press both sides at the same time, which simplifies the operation steps and reduces the impact on the volume of the packaging component.

[0023] Second, the utility model utilizes a heat dissipation mechanism to absorb the heat generated by the built-in chip during operation, and conducts the heat to the top of the gusset plate so that the heat can be dissipated by the outside air, thereby improving the heat dissipation performance of the package assembly.

[0024] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural diagram of the utility model;

[0027] Figure 2 It is a schematic cross-sectional structure diagram of the utility model from a first viewing angle;

[0028] Figure 3 It is a cross-sectional structural schematic diagram of the utility model from a second viewing angle;

[0029] Figure 4 For this utility model Figure 3 A schematic diagram of the enlarged structure of region A;

[0030] Figure 5 It is a schematic cross-sectional structural diagram of the utility model from a third viewing angle;

[0031] Figure 6 For this utility model Figure 5 A schematic diagram of the enlarged structure of region B;

[0032] Figure 7 It is an isometric view of the HTCC substrate of the utility model;

[0033] Figure 8 It is a schematic diagram of the structure of the gusset plate of the utility model when viewed from above.

[0034] Figure numerals: 1, packaging mechanism; 2, buckle plate; 3, buckling positioning mechanism; 4, connecting mechanism; 5, heat dissipation mechanism; 6, rotating shaft; 7, torsion spring; 101, HTCC substrate; 102, side frame; 103, built-in chip; 301, bump; 302, buckling slider; 303, buckling slide groove; 401, L-shaped plate; 402, guide slider; 403, guide slide groove; 501, heat dissipation plate; 502, thermal conductive silicone pad; 81, anti-slip portion; 82, through groove; 83, through hole; 84, micro spring. DETAILED DESCRIPTION

[0035] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0036] It should be noted that the terms "first", "second", "symmetrical", "array", etc. are only used to distinguish between description and position description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the definition of "first", "symmetrical", etc. can explicitly or implicitly include one or more of these features; similarly, when the number of certain features is not limited in the form of words such as "two" or "three", it should be noted that this feature also explicitly or implicitly includes one or more feature quantities.

[0037] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0038] like Figure 1-8 As shown, the embodiment of the utility model provides a microwave integrated packaging assembly, including a packaging mechanism 1 and a buckle plate 2, wherein the packaging mechanism 1 includes a HTCC substrate 101, a side frame 102 and a built-in chip 103;

[0039] The side frame 102 is fixedly connected to the upper surface of the HTCC substrate 101, the built-in chip 103 is slidably connected to the inside of the HTCC substrate 101, the built-in chip 103 is slidably connected to the inner side wall of the side frame 102, and the buckle plate 2 is arranged on the upper surface of the side frame 102;

[0040] Among them, four buckling positioning mechanisms 3 are symmetrically arranged between the gusset plate 2 and the side frame 102, two connecting mechanisms 4 are symmetrically arranged on one side of the gusset plate 2, and the connecting mechanism 4 is used to guide the sliding gusset plate 2, and a heat dissipation mechanism 5 is arranged on the inner side wall of the gusset plate 2;

[0041] The four buckling positioning mechanisms 3 each include a protrusion 301, a buckling slider 302 and a buckling slot 303;

[0042] The protrusion 301 is fixedly connected to the bottom of the buckle plate 2, the buckling slot 303 is provided on the outer wall of the side frame 102, the buckling slider 302 is slidably connected to the inner wall of the buckling slot 303, and one end of the buckling slider 302 is fixedly connected to one side of the protrusion 301;

[0043] The two connection mechanisms 4 are each provided with a rotating shaft 6 on one side close to the side frame 102 , the outer wall of the rotating shaft 6 is fixedly connected with a torsion spring 7 , and one end of the torsion spring 7 away from the rotating shaft 6 is fixedly connected to the inner wall of the side frame 102 .

[0044] In one embodiment, the two connection mechanisms 4 each include an L-shaped plate 401, a guide slider 402, and a guide slot 403;

[0045] Among them, the guide slider 402 is fixedly connected to one end of the L-shaped plate 401, the guide groove 403 is opened at the bottom of the buckle plate 2, the outer wall of the guide slider 402 is slidingly connected to the inner wall of the guide groove 403, one end of the rotating shaft 6 is fixedly connected to the side of the L-shaped plate 401 away from the guide slider 402, and a micro spring 84 is fixedly connected to one side of the inner wall of the buckle plate 2, and one end of the micro spring 84 is fixedly connected to one side of the guide slider 402.

[0046] The guide slider 402 is utilized to slide in the guide slot 403 to guide the moving buckle plate 2, and the moving buckle plate 2 drives the micro spring 84 to be stretched, so that the stretched micro spring 84 can be used to push the buckle plate 2 into the through slot 82 in sequence.

[0047] In one embodiment, the heat dissipation mechanism 5 includes a heat dissipation plate 501 and a thermally conductive silicone pad 502;

[0048] The heat sink 501 is fixedly connected to the middle of the inner wall of the buckle plate 2 , and the thermal conductive silicone pad 502 is fixedly connected to the bottom of the heat sink 501 .

[0049] The upper surface of the built-in chip 103 is pressed by the thermal conductive silicone pad 502 so that the built-in chip 103 is more tightly connected to the HTCC substrate 101, and the thermal conductive silicone pad 502 can cooperate with the heat sink 501 to transfer the heat generated by the built-in chip 103 when it is working.

[0050] In one embodiment, an anti-slip portion 81 is disposed on one side of the upper surface of the pinch plate 2 , and four through holes 83 are symmetrically formed on the outer side wall of the HTCC substrate 101 .

[0051] The anti-slip portion 81 is utilized to push the pinch plate 2 laterally.

[0052] In one embodiment, a through slot 82 is formed on one side of the side frame 102 , and the outer side wall of the gusset plate 2 is slidably connected to the inner side wall of the through slot 82 .

[0053] The through slot 82 is used to limit one side of the buckle plate 2 .

[0054] When the utility model is working: the built-in chip 103 is moved and put into the side frame 102, and then the buckle plate 2 is pressed down to fit with one side of the side frame 102, the moving buckle plate 2 drives the rotating shaft 6 to rotate by using the guide slider 402 and the L-shaped plate 401, and the rotating rotating shaft 6 drives the torsion spring 7 to twist, and then the anti-slip portion 81 is used to pull the buckle plate 2 to make the guide slider 402 slide in the guide slide groove 403, and the moving buckle plate 2 drives the micro spring 84 to stretch, so that the moving buckle plate 2 drives the protrusion 301 and the fastening slider 302 to move to the opening of the fastening slide groove 303, and then the buckle plate 2 is pressed down to drive the fastening slider 302 to slide into the fastening slide groove 303 by using the protrusion 301, and then the stretched micro spring 84 is used to drive the buckle plate 2 to insert into the through groove 82, so as to complete the packaging between the built-in chip 103 and the HTCC substrate 101.

[0055] The thermally conductive silicone pad 502 is used to press the upper surface of the built-in chip 103 so that the built-in chip 103 is more tightly connected to the HTCC substrate 101. The thermally conductive silicone pad 502 can be used in conjunction with the heat sink 501 to transfer the heat generated by the built-in chip 103 when it is working, so that the outside air can be used for heat dissipation, thereby improving the heat dissipation performance of the package assembly.

[0056] When the built-in chip 103 needs to be removed from the side frame 102, the anti-slip portion 81 is used to drive the buckle plate 2 to move horizontally, and the moving buckle plate 2 uses the protrusion 301 to drive the locking slider 302 to move to the opening of the locking slot 303. At the same time, one side of the buckle plate 2 slides out of the through slot 82, and then the L-shaped plate 401 is driven to move by the rotating shaft 6 through the twisted torsion spring 7. The moving L-shaped plate 401 drives the buckle plate 2 to move by the guide slider 402, so as to open the side frame 102 and take out the built-in chip 103 for inspection or replacement.

[0057] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A microwave integrated packaging assembly, comprising a packaging mechanism (1) and a buckle plate (2), characterized in that: The packaging structure (1) comprises an HTCC substrate (101), a side frame (102) and a built-in chip (103); The side frame (102) is fixedly connected to the upper surface of the HTCC substrate (101), the built-in chip (103) is slidably connected to the inside of the HTCC substrate (101), the built-in chip (103) is slidably connected to the inner side wall of the side frame (102), and the buckle plate (2) is arranged on the upper surface of the side frame (102); Wherein, four buckling positioning mechanisms (3) are symmetrically arranged between the buckle plate (2) and the side frame (102), two connecting mechanisms (4) are symmetrically arranged on one side of the buckle plate (2), and the connecting mechanisms (4) are used to guide the sliding buckle plate (2), and a heat dissipation mechanism (5) is arranged on the inner side wall of the buckle plate (2); Wherein, the four snap-fit ​​positioning mechanisms (3) each comprise a protrusion (301), a snap-fit ​​sliding block (302) and a snap-fit ​​sliding groove (303); The protrusion (301) is fixedly connected to the bottom of the buckle plate (2), the buckling slide groove (303) is opened on the outer wall of the side frame (102), the buckling slider (302) is slidably connected to the inner wall of the buckling slide groove (303), and one end of the buckling slider (302) is fixedly connected to one side of the protrusion (301); Wherein, a rotating shaft (6) is provided on one side of the two connecting mechanisms (4) close to the side frame (102), a torsion spring (7) is fixedly connected to the outer wall of the rotating shaft (6), and an end of the torsion spring (7) away from the rotating shaft (6) is fixedly connected to the inner wall of the side frame (102).

2. The microwave integrated packaging assembly according to claim 1, characterized in that: The two connection mechanisms (4) each comprise an L-shaped plate (401), a guide slider (402) and a guide slot (403); In which, the guide slider (402) is fixedly connected to one end of the L-shaped plate (401), the guide groove (403) is opened at the bottom of the buckle plate (2), the outer wall of the guide slider (402) is slidably connected to the inner wall of the guide groove (403), and one end of the rotating shaft (6) is fixedly connected to the side of the L-shaped plate (401) away from the guide slider (402).

3. The microwave integrated packaging assembly according to claim 2, characterized in that: A micro spring (84) is fixedly connected to one side of the inner side wall of the buckle plate (2), and one end of the micro spring (84) is fixedly connected to one side of the guide slider (402).

4. The microwave integrated packaging assembly according to claim 1, characterized in that: The heat dissipation mechanism (5) comprises a heat dissipation plate (501) and a heat-conducting silicone pad (502); The heat dissipation plate (501) is fixedly connected to the middle part of the inner wall of the buckle plate (2), and the thermal conductive silicone pad (502) is fixedly connected to the bottom of the heat dissipation plate (501).

5. The microwave integrated packaging assembly according to claim 1, characterized in that: An anti-slip portion (81) is provided on one side of the upper surface of the gusset plate (2).

6. The microwave integrated packaging assembly according to claim 1, characterized in that: A through slot (82) is provided on one side of the side frame (102), and the outer side wall of the buckle plate (2) is slidably connected to the inner side wall of the through slot (82).

7. The microwave integrated packaging assembly according to claim 1, characterized in that: Four through holes (83) are symmetrically formed on the outer side wall of the HTCC substrate (101).

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