Bypass diode with high thermal conductivity

Abstract

A high-thermal-conductivity bypass diode relates to the technical field of diodes. Comprising a diode module, the diode module comprises a frame, a chip and a jumper wire, the chip is arranged on the frame, and the jumper wire is used for connecting the chip and a pin; the LED lamp further comprises a heat conduction module, the heat conduction module is used for being connected with the diode module, the heat conduction module comprises an upper heat dissipation block, a lower heat dissipation block and a plurality of heat dissipation columns, and the heat dissipation columns are arranged in parallel and connected between the upper heat dissipation block and the lower heat dissipation block. The heat dissipation column is a hollow column. Diethyl ether is arranged in the heat dissipation column. In the working process, the heat conduction module is connected to the diode module, the heat conduction module comprises the upper heat dissipation block, the lower heat dissipation block and the heat dissipation columns, the heat conduction function is achieved through the heat conduction module, the reliability of a product is improved, and the service life of the product is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of diodes, in particular to a high thermal conductivity bypass diode. Background Art

[0002] Bypass diodes are often used in the photovoltaic industry, that is, they are used on solar photovoltaic panels. Solar photovoltaic panels are used outdoors, and the outdoor temperature and humidity cannot be controlled. The operating environment of bypass diodes is relatively harsh.

[0003] The existing photovoltaic bypass diode will start the switch when the spot effect occurs to protect the battery. However, the current battery cells are all large current. Under the 20A working environment, the temperature will reach 120~145℃. The chip operating environment is relatively harsh. At the same time, the high temperature causes the thermal conductive adhesive in the junction box to continue to age, reducing product reliability. Utility Model Content

[0004] In view of the above problems, the utility model provides a high thermal conductivity bypass diode with simple structure, convenient heat dissipation and improved reliability.

[0005] The technical solution of the utility model is: a high thermal conductivity bypass diode, comprising a diode module, the diode module comprising a frame, a chip and a jumper, the chip is arranged on the frame, and the jumper is used to connect the chip and the pin;

[0006] It also includes a heat conduction module, which is used to connect the diode module.

[0007] The heat conduction module comprises an upper heat dissipation block, a lower heat dissipation block and a plurality of heat dissipation columns, wherein the plurality of heat dissipation columns are arranged in parallel and connected between the upper heat dissipation block and the lower heat dissipation block.

[0008] The heat dissipation column is a hollow column.

[0009] Ether is arranged in the heat dissipation column.

[0010] The upper heat sink block and the lower heat sink block are respectively made of aluminum oxide.

[0011] The heat dissipation column is made of ceramic material.

[0012] The diode module and the heat conduction module are bonded by silicone grease.

[0013] A sawtooth groove is arranged on the top of the upper heat dissipation block.

[0014] The bottom of the lower heat dissipation block is provided with a sawtooth groove.

[0015] During operation, the utility model connects the heat conduction module to the diode module, wherein the heat conduction module comprises an upper heat dissipation block, a lower heat dissipation block and a plurality of heat dissipation columns. The heat conduction function is performed by the heat conduction module, thereby improving the reliability and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In the drawings, each part is not necessarily drawn according to the actual scale.

[0017] Figure 1 It is a structural schematic diagram of the utility model.

[0018] Figure 2 yes Figure 1 A top view of

[0019] Figure 3 yes Figure 1 Right view of

[0020] In the picture, 1 is the frame, 2 is the chip, 3 is the jumper, and 4 is the pin.

[0021] 5 is a heat conduction module, 51 is an upper heat dissipation block, 52 is a lower heat dissipation block, 53 is a heat dissipation column, and 54 is a sawtooth groove. DETAILED DESCRIPTION

[0022] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0023] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] The utility model Figure 1-3 As shown, a high thermal conductivity bypass diode includes a diode module, wherein the diode module includes a frame 1, a chip 2 and a jumper 3, wherein the chip 2 is arranged on the frame 1, and the jumper 3 is used to connect the chip 2 and the pin 4;

[0026] It also includes a heat conduction module 5, which is used to connect the diode module.

[0027] The heat conduction module comprises an upper heat dissipation block 51, a lower heat dissipation block 52 and a plurality of heat dissipation columns 53. The plurality of heat dissipation columns are arranged in parallel and connected between the upper heat dissipation block and the lower heat dissipation block.

[0028] The utility model conducts heat by connecting the heat conduction module to the diode module, so the heat conduction effect is obvious and the reliability and service life of the product are improved.

[0029] The heat dissipation column 53 is made of ceramic material and is a hollow column. Ether is provided in the heat dissipation column.

[0030] The bypass diode is in a non-working state under normal conditions, and the temperature is close to room temperature. At this time, the ether in the heat dissipation column is in liquid state and concentrated at the bottom. When the light spot effect occurs, the diode will work briefly, and the chip temperature will begin to rise. At this time, the ether will begin to vaporize as the temperature rises. After vaporization, it will contact the bottom of the upper heat dissipation block, and transfer heat to the air through the upper heat dissipation block, thereby reducing the chip temperature. After the light spot disappears, the diode will stop working, the temperature will drop accordingly, and the ether will re-liquefy and flow into the bottom of the heat dissipation column for recycling.

[0031] The upper heat sink 51 and the lower heat sink 52 are made of aluminum oxide, so they have the characteristics of fast heat conduction and no electricity.

[0032] The diode module and the heat conduction module are bonded by silicone grease.

[0033] After the two are combined, the assembly will be wrapped with epoxy resin (excluding the upper thermal block and pin parts).

[0034] A sawtooth groove 54 is formed on the top of the upper heat dissipation block.

[0035] In this way, the heat conduction area is increased and the use effect is improved.

[0036] The bottom of the lower heat dissipation block is provided with a sawtooth groove.

[0037] In this way, the heat conduction area is increased and the use effect is improved.

[0038] The high thermal conductivity bypass diode in this utility model increases the chip's ability to continuously pass large currents; maintains a low-temperature working environment for the chip, greatly prolongs the chip's life, and prevents the chip switch from being affected by temperature increases; and reduces the effect of heat on the thermal conductive adhesive in the junction box through a new type of high thermal conductivity bypass diode. There are a few more points to note about the content disclosed in this case:

[0039] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0040] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0041] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A high thermal conductivity bypass diode, comprising a diode module, wherein the diode module comprises a frame, a chip and a jumper, wherein the chip is arranged on the frame, and the jumper is used to connect the chip and the pin; It is characterized in that It also includes a heat conduction module, which is used to connect the diode module. The heat conduction module comprises an upper heat dissipation block, a lower heat dissipation block and a plurality of heat dissipation columns, wherein the plurality of heat dissipation columns are arranged in parallel and connected between the upper heat dissipation block and the lower heat dissipation block.

2. A high thermal conductivity bypass diode according to claim 1, characterized in that: The heat dissipation column is a hollow column.

3. A high thermal conductivity bypass diode according to claim 2, characterized in that: Ether is arranged in the heat dissipation column.

4. A high thermal conductivity bypass diode according to any one of claims 1 to 3, characterized in that: The upper heat sink block and the lower heat sink block are respectively made of aluminum oxide.

5. A high thermal conductivity bypass diode according to claim 4, characterized in that: The heat dissipation column is made of ceramic material.

6. The high thermal conductivity bypass diode according to claim 1, characterized in that: The diode module and the heat conduction module are bonded by silicone grease.

7. The high thermal conductivity bypass diode according to claim 1, characterized in that: The top of the upper heat dissipation block is provided with a sawtooth groove.

8. The high thermal conductivity bypass diode according to claim 1, characterized in that: The bottom of the lower heat dissipation block is provided with a sawtooth groove.

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