Heat dissipation device for high-voltage switch device, high-voltage switch device and switch cabinet
By installing a heat-conducting frame, heat exchange tube and heat-sinking frame heat dissipation device at the static contact part of the high-voltage switch, the heat of the high-voltage switch is quickly transmitted to the air by using the steaming effect of the heat exchange fluid, which solves the problem of heat-prone disconnection switches and improves the operating safety and stability of the power grid.
Patent Information
- Application Number
- CN202421101952.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-20
AI Technical Summary
During operation, high-voltage isolation switches often overheat the contact area due to high load current, which affects the flexibility of the system operation and power supply reliability.
A heat dissipation device is designed, including a heat conduction rack, a heat exchange tube and a heat dissipation rack. The heat exchange tube is filled with heat exchange fluid, close to the static contact of the high-voltage switch, and the other end is connected to the thermal conductor rack and the heat sink. The steamed heat exchange fluid is used to quickly conduct heat to the thermal conductor rack and the heat sink, and further conduct it into the surrounding air.
It effectively reduces the temperature of the heated part of the contact, enhances the safety and stability of the power grid operation, and basically does not need to modify the original high-voltage switch, reducing costs.
Smart Images
Figure CN222547008U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat dissipation device for a large current isolating switch, in particular to a heat dissipation device for a high-voltage switch device, a high-voltage switch device and a switch cabinet. Background Art
[0002] With the development of the power grid and the continuous increase in power supply load, the overload of power equipment is generally high. High-voltage disconnectors bear large load currents for a long time, and the contact parts of the disconnectors often overheat during operation. This affects the flexibility of system operation and the reliability of power supply. Once the power outage is handled by overheating, it will affect the normal power supply and cause great economic losses. If the overheating defect of the disconnector occurs frequently, it will seriously restrict the safe and stable operation of the power grid.
[0003] Therefore, there is a certain demand in the industry to reduce the temperature of the heat-prone contact parts of the isolating switch. Utility Model Content
[0004] The utility model aims to provide a heat dissipation device, which is suitable for a switch device and can at least solve part of the above technical problems.
[0005] The utility model also aims to provide a high-voltage switch device using the improved heat dissipation device.
[0006] According to one aspect of the utility model, a heat dissipation device for a high-voltage switch device is provided, wherein the high-voltage switch device has a static contact, and the heat dissipation device comprises: a heat-conducting frame; a heat exchange tube, which is arranged on the heat-conducting frame and has an inner cavity for accommodating a heat exchange fluid, and the heat exchange tube has a tube section extending out of the heat-conducting frame and can be attached to the static contact; and a heat dissipation frame, which is connected to the heat-conducting frame and has a heat dissipation structure that is extended away from the heat-conducting frame and the heat exchange tube.
[0007] Through the heat dissipation device provided by this scheme, without changing the original large current high-voltage switch body size, the heat conduction and heat dissipation structure is added to the contact part that is easy to heat up, which can effectively reduce the temperature of the contact heating part and enhance the safety of power grid operation. Specifically, a heat exchange tube with a heat exchange fluid that can be converted between liquid and vapor states can be installed at one end close to the static contact of the high-voltage switch, especially can be installed near the static contact to be engaged with the moving contact, the other end of the heat exchange tube is connected to the heat conduction frame, especially can be close to the heat dissipation frame, so that the vaporized heat exchange fluid can quickly transfer heat to the heat conduction frame and the heat dissipation frame, and further conduct it to the surrounding air. The heat dissipation device of this scheme has a simple structure and is easy to implement. While being able to effectively reduce the temperature of the contact heating part, it basically does not need to adapt the original high-voltage switch, thereby reducing costs.
[0008] In some embodiments, the heat dissipation device includes a support connected to the heat-conducting frame, and the tube section of the heat exchange tube that can be close to the static contact is supported by the support.
[0009] In some embodiments, the support has a supporting portion, the supporting portion has a straight surface section and two inclined surface sections located on opposite sides of the straight surface section, the tube section of the heat exchange tube that can be close to the static contact is bent and wrapped around the supporting portion, and is supported by the straight surface section.
[0010] In some embodiments, the heat conducting frame includes a first plate and a second plate connected to the end of the first plate at an angle, the heat exchange tube is arranged on the first plate, the support is connected to the second plate in parallel and a gasket is sandwiched between the support and the second plate.
[0011] In some embodiments, the heat exchange tube further has a tube section abutting against the heat dissipation frame.
[0012] In some embodiments, the tube section of the heat exchange tube close to the heat dissipation frame is fixed to the heat conducting frame in a bent curved posture and is clamped between the heat dissipation frame and the heat conducting frame.
[0013] In some embodiments, the heat dissipation structure of the heat dissipation frame includes a plurality of heat dissipation fins extending in a direction away from the heat conducting frame and the heat exchange tube.
[0014] In some embodiments, a powder sintered capillary wick is arranged in the heat exchange tube.
[0015] According to another aspect of the utility model, a high-voltage switch device is provided, comprising: a busbar; a static contact installed on the busbar; a moving contact, which can be pivoted relative to the static contact to achieve opening and closing; the switch device also includes: a heat dissipation device, which is the aforementioned heat dissipation device, the heat dissipation device is fixed to the busbar and adjacent to the junction of the static contact and the moving contact, and the heat exchange tube of the heat dissipation device is abutted against the static contact.
[0016] According to another aspect of the utility model, a switch cabinet is provided, comprising the above-mentioned high-voltage switch device.
[0017] Some of the other features and advantages of the present invention will be apparent to those skilled in the art after reading this application, and the other parts will be described in the following specific embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The embodiments of the present invention are described in detail below with reference to the accompanying drawings, wherein:
[0019] Figure 1is a schematic diagram of a heat dissipation device according to an embodiment of the utility model;
[0020] Figure 2 is an exploded schematic diagram of a heat dissipation device according to an embodiment of the utility model;
[0021] Figure 3 It is a schematic diagram of a heat dissipation device according to an embodiment of the utility model being assembled on a high-voltage switch.
[0022] Description of reference numerals:
[0023] 1-heat dissipation device; 2-support; 21-support plate; 22-partition plate; 23-slope section; 24-accommodation space; 3-gasket; 4-heat conduction frame; 41-first plate body; 42-second plate body; 43-installation hole; 44-installation hole; 45-installation hole; 5-heat exchange tube; 51-first tube section; 52-second tube section; 53-third tube section; 54-fourth tube section; 55-fifth tube section; 56-first end; 57-second end; 6-heat dissipation frame; 61-heat dissipation fin; 7-high voltage switch device; 71-static contact; 72-busbar DETAILED DESCRIPTION
[0024] Now, with reference to the accompanying drawings, the schematic schemes of the heat sink for high-voltage switchgear, high-voltage switchgear and switch cabinet disclosed in the utility model are described in detail. Although the drawings are provided to present some embodiments of the utility model, the drawings do not have to be drawn according to the dimensions of the specific embodiments, and certain features may be enlarged, removed or partially cut to better illustrate and explain the disclosure of the utility model. Some components in the drawings can be adjusted in position according to actual needs without affecting the technical effect. The phrase "in the drawings" or similar terms appearing in the specification do not necessarily refer to all drawings or examples.
[0025] Certain directional terms used to describe the drawings below, such as "inside", "outside", "above", "below" and other directional terms, will be understood to have their normal meanings and refer to those directions involved when the drawings are normally viewed. Unless otherwise specified, the directional terms described in this specification are basically in accordance with the conventional directions understood by those skilled in the art.
[0026] The terms "first", "first", "second", "second" and the like used in the present invention do not indicate any order, quantity or importance, but are used to distinguish one component from other components.
[0027] The utility model aims to provide a heat dissipation device which can be applied to a high-voltage switch device, especially a large-current isolating switch. By arranging the heat dissipation device adjacent to the junction of the static contact and the moving contact of the switch device, one end of a heat exchange tube can be close to the static contact of the high-voltage switch device, and the other end can be close to the heat-conducting frame and the heat dissipation frame of the heat dissipation device, so that the high temperature caused by the large contact resistance between the moving contact and the static contact when opening and closing the switch is quickly conducted to the surrounding air by using the heat exchange fluid filled in the heat exchange tube, thereby effectively reducing the contact temperature and improving the stability and safety of the equipment operation.
[0028] Combine the following Figures 1 to 3 The heat dissipation device of the present utility model is described by way of example.
[0029] Figure 1 An embodiment of a heat dissipation device is shown. Figure 2 An exploded schematic diagram of the heat dissipation device is shown. As shown in the figure, the heat dissipation device is indicated in this document by the figure mark 1. The heat dissipation device 1 includes a heat-conducting frame 4 as a mounting base, which is made of, for example, a heat-conducting metal, such as copper or aluminum. In the illustrated embodiment, the heat-conducting frame 4 is constructed in a frame-like configuration, consisting of a straight plate-shaped first plate body 41 and two straight plate-shaped second plate bodies 42 respectively connected at opposite ends of the first plate body 41 at an angle. This three-section structure of the heat-conducting frame 4 can be formed, for example, by bending a heat-conducting metal plate as a whole, and the structure is simple and stable. The angle between the second plate body 42 and the first plate body 41 can be selected according to actual needs, for example, 45°, 90°, etc. Figure 1 and Figure 2 The illustrated embodiment is that the second plate body 41 is perpendicular to the first plate body 41 .
[0030] In order to facilitate the installation of the heat conducting frame 4 to the switch device, the heat conducting frame 4 may be formed with a mounting hole, for example Figure 1 and Figure 2 The mounting holes 45 formed on the two opposite second plates 42 are shown. Each mounting hole 45 extends from the edge of the second plate 42 away from the first plate 41 to the direction close to the first plate 41, thereby forming a configuration with one side open and the other side closed. This semi-open and semi-closed configuration is conducive to easily assembling the heat-conducting frame or the heat dissipation device to the high-voltage switch device or removing it from the high-voltage switch without the need to disassemble the connecting structure of the two, such as bolts. One or more mounting holes 45 can be arranged along the edge of the second plate 42. Two are shown in the figure. When multiple mounting holes 45 are arranged, the installation of the heat-conducting frame 4 can be more temperature-controlled, and the installation position can also be more flexible and easy to adjust.
[0031] A heat exchange tube 5 is provided on the heat conducting frame 4. The heat exchange tube 5 is a hollow tube, the inner cavity of which is sealed and filled with a heat exchange fluid. The heat exchange fluid can be converted into a vapor state when absorbing heat, and converted into a liquid state after releasing heat. A portion of the heat exchange tube 5 is fixed to the heat conducting frame 4, for example, by welding, and can be closely attached to the heat dissipation frame 6 to be described in detail later, while another portion of the heat exchange tube 5 extends from the heat conducting frame 4, and the extended end thereof is used to abut against the static contact 71 of the high-voltage switch device 7, so that heat can be transferred between the heat dissipation frame and the heat generating part of the high-voltage switch device.
[0032] In the illustrated embodiment, the first pipe section 51 of the heat exchange tube 5 extends vertically, the lower half of which is fixed to the heat conducting frame 4, and the upper half extends beyond the heat conducting frame 4. The second pipe section 52 of the heat exchange tube 5 is connected to the upper end of the first pipe section 51 at an angle, and the angle can be, for example, 90°. At the end of the second pipe section 52 away from the first pipe section 51, the third pipe section 53 of the heat exchange tube 5 is connected thereto at an angle. The end of the third pipe section 53 away from the second pipe section 52 serves as the first end 56 of the entire heat exchange tube 5, and the third pipe section 53 or the first end 56 can be used to abut against the static contact 71 of the high-voltage switch 7. The first pipe section 51 and the third pipe section 53 are opposite at opposite ends of the second pipe section 52, thereby forming a bend configuration. The fourth pipe section 54 of the heat exchange tube 5 is connected to the lower end of the first pipe section 51, and the fourth pipe section 54 is configured as an arc pipe section, such as a semicircular pipe section, and is fixed to the heat conducting frame 4. The end of the fourth pipe segment 54 away from the first pipe segment 51 is connected to the fifth pipe segment 55 of the heat exchange tube 5, and the end of the fifth pipe segment 55 away from the fourth pipe segment 54 serves as the second end 57 of the heat exchange tube 5. The fifth pipe segment 55 is fixed to the heat-conducting frame 4, and is opposite to the first pipe segment 51 at the opposite ends of the fourth pipe segment 54, thereby also constructing a bend configuration. However, the plane where the fourth pipe segment 54 is located is at an angle to the plane where the second pipe segment 52 is located. For example, the plane where the fourth pipe segment 54 is located is substantially parallel to the first plate body 41, and the plane where the second pipe body 52 is located is substantially perpendicular to the first plate body 41, so the fifth pipe segment 55 and the third pipe segment 53 are staggered with each other. Here, the lower part of the first pipe segment 51, the fourth pipe segment 54 and the fifth pipe segment 55 can all be attached to the heat dissipation frame 6 to improve the heat exchange efficiency.
[0033] The first end 56 and the second end 57 define the two ends of the heat exchange tube 5. The heat exchange tube 5 as a whole is bent and spiraled between the first end 56 and the second end 57, so that the heat exchange length of the heat exchange tube 5 can be increased within a limited area, and the capacity of the heat exchange fluid can be increased, which is conducive to the rapid conduction of heat. The spiral bending configuration of the heat exchange tube 5 can be formed by integrally bending a long tube, or by welding a plurality of short tubes together. Although the specific form of the heat exchange tube 5 is shown in the figure, those skilled in the art will understand that the specific form of the heat exchange tube 5 can be modified according to actual needs, for example, to adapt to the configuration of a high-voltage switch.
[0034] The heat sink 6 is mounted on the heat conducting frame 4, and a mounting structure may be provided at its bottom for docking with the mounting structure on the heat conducting frame 4. In the illustrated embodiment, the heat conducting frame 4 is provided with a mounting hole 43 on the first plate 41, and a corresponding mounting hole (not shown) is also provided on the bottom of the heat sink 6 facing the heat conducting frame 4. A connecting member, such as a bolt, can pass through the corresponding mounting holes of the heat conducting frame 4 and the heat sink 4 and connect the two together. In addition to the mounting hole, other mounting structures may also be provided between the heat conducting frame 4 and the heat sink 6, for example, one of the heat conducting frame and the heat sink is formed with a mounting groove, and the other of the heat conducting frame and the heat sink is formed with a mounting protrusion that can be plugged into the mounting groove. The heat exchange tube 5 is sandwiched between the heat sink 6 and the heat conducting frame 4, and the heat dissipation fins 61 of the heat sink 6 extend in a direction away from the heat conducting frame 4 and the heat exchange tube 5. On the high voltage switch device 7, the extension direction of the heat dissipation fins 61 is also away from the static contact 71. The heat sink 1 provides an efficient heat conduction path from the first end 56 of the heat exchange tube 5 to the heat sink fin 61 , thereby effectively reducing the temperature of the contact heating portion of the high-voltage switch device 7 .
[0035] In the illustrated embodiment, a groove may be formed on the side of the heat sink 6 facing the heat conducting frame 4, and when the heat sink 6 and the heat conducting frame 4 are butt-jointed and assembled together, the portion of the heat exchange tube 5 fixed to the heat conducting frame 4 is also embedded in the groove of the heat sink 6, so that this portion of the heat exchange tube 5 is almost surrounded by the heat sink 6 and the heat conducting frame 4. In this way, the heat carried by the heat exchange fluid in the heat exchange tube 5 can be more quickly conducted to the surrounding air.
[0036] The figure shows that two heat exchange tubes 5 and two heat dissipation frames 6 are arranged on the heat conducting frame 4, but it can be understood that the number of heat exchange tubes 5 and heat dissipation frames 6 is not limited thereto and can be adjusted based on actual needs, such as the number of static contacts.
[0037] As described above, the second pipe section 52 and the third pipe section 53 of the heat exchange tube 5 extend out of the first plate body 41 of the heat conducting frame 4. In order to prevent the heat exchange tube 5 from deforming, a support 2 may be provided to support the extended portion of the heat exchange tube 5. The support 2 may be a long strip plate mounted on the heat conducting frame 4, and the bent second pipe section 52 and the third pipe section 53 of the heat exchange tube 5 may be wound around the support 2.
[0038] In the specific embodiment shown, the support 2 includes two support plates 21 arranged opposite to each other, and a partition plate 22 is provided between the two support plates 21. The support plate 21 may be formed with a mounting structure for docking with the mounting structure on the heat-conducting frame 4. In the embodiment shown, the heat-conducting frame 4 is provided with a mounting hole 44 on the second plate body 42, and the support plate 21 is also provided with a corresponding mounting hole. Through a connecting member, such as a bolt, the corresponding mounting holes of the heat-conducting frame 4 and the support plate 21 can be passed through and the two can be connected together. In addition to the mounting hole, other mounting structures may also be provided between the heat-conducting frame 4 and the support plate 21, for example, one of the heat-conducting frame and the support plate is formed with a mounting groove, and the other of the heat-conducting frame support plate is formed with a mounting protrusion that can be plugged into the mounting groove. A cushion sleeve 3 may also be provided between the heat-conducting frame 4 and the support plate 21, so that the support 2 avoids the bending angle between the first plate body 41 and the second plate body 42 of the heat-conducting frame 4, and also makes the support 2 parallel to the heat-conducting frame 4 without an angle difference. In addition, after the heat exchange tube 5 is clamped on the support 2, the presence of the cushion sleeve 3 can make the heat exchange tube as close to the center of the heat dissipation frame 6 as possible by adjusting the angle and position of the support 2, so as to facilitate rapid heat dissipation through heat conduction.
[0039] The size of the partition 22 can be smaller than the size of the support plates 21 on both sides thereof, so that the support plates 21 on both sides and the partition 22 therebetween define together a receiving space 24 for receiving the heat exchange tube 5. The second tube body 52 and the third tube body 53 of the heat exchange tube 5 are arranged in the receiving space 24. The top of the partition 22, or the top of the support 2, as the support part of the heat exchange tube 5, can be adaptively formed into various configurations to better support the heat exchange tube 5. For example, since the heat exchange tube 5 has a rounded transition at the joint of the adjacent tube bodies, the top of the partition 22 can be formed with a flat straight section, and a bevel section is formed at the opposite ends of the straight section, and the bevel section is adapted to the transition fillet of the heat exchange tube 5. When the heat exchange tube 5 is placed on the support 2, the straight section serves as the actual support surface to support the second tube section 52, and the bevel section 23 avoids the transition fillet of the heat exchange tube 5, thereby avoiding interference.
[0040] Such a heat sink 1 is particularly suitable for being assembled in a high-voltage switchgear 1 carrying a large current, such as a high-voltage disconnector. Figure 3Such a high-voltage switch device 7 is shown, which includes a busbar 72 and a stationary contact 71 mounted on the busbar 72. Opposite the stationary contact 71, a pivotable moving contact (not shown in the figure) is provided. The heat dissipation device 1 is mounted on the busbar 72 adjacent to the junction between the stationary contact 71 and the moving contact, for example, it can be docked to the corresponding mounting structure of the busbar 72 through the mounting hole 45 of the heat conducting frame 4. The support 2 extends toward the stationary contact 71, and the third pipe section 53 of the heat exchange tube 5 is abutted against the stationary contact 71.
[0041] The working principle of the heat dissipation device 1 of the present utility model is described in detail below.
[0042] During the operation of the high-voltage switchgear 7 with a large load current, when the switch is closed, a large contact resistance will be generated at the junction of the moving contact and the static contact, so the temperature of this part will be significantly higher than other parts of the contact. The increased temperature causes the heat exchange fluid in the heat exchange tube 5 close to the static contact to vaporize into hot steam. The hot steam moves rapidly along the heat exchange tube 5 to the heat conduction frame 4 and the heat dissipation frame 6, and then transmits a large amount of heat to the heat conduction frame 4 and the heat dissipation frame 6, and then spreads to the surrounding air through the heat conduction frame 4 and the heat dissipation frame 6. In the high-voltage power distribution equipment installed with such a high-voltage switchgear 7, such as a switch cabinet, an air duct can be adapted to be formed, and the heat dissipation device 1 is placed in the air duct. The high-voltage power distribution equipment can also be equipped with an air supply mechanism, which can send cold air into the air duct to cool the surrounding area of the heat dissipation device 1, especially the temperature around the heat dissipation frame 6 and the heat conduction frame 4. Thereby, the temperature in the heat exchange tube 5 is reduced, and the heat exchange fluid returns to a liquid state after releasing heat. A tube core with a capillary absorption effect can be formed in the heat exchange tube 5. For example, a metal tube (such as a copper tube) filled with powder (such as copper powder) is sintered in an atmosphere furnace to form a capillary absorption core. The liquid heat exchange fluid can be sent back to the vicinity of the joint between the moving contact and the static contact through the powder tube core in the heat exchange tube 5. Through this uninterrupted circulation, the temperature of the heating part of the contact is effectively reduced.
[0043] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
[0044] The above description is only an illustrative embodiment of the present invention and is not intended to limit the scope of the present invention. Any equivalent changes, modifications and combinations made by any technician in the field without departing from the concept and principle of the present invention shall fall within the scope of protection of the present invention.
Claims
1. A heat dissipation device for a high-voltage switchgear, the high-voltage switchgear having a stationary contact (71), characterized in that: The heat dissipation device comprises: Heat conducting frame (4); A heat exchange tube (5) is arranged on the heat-conducting frame (4) and has an inner cavity for accommodating a heat exchange fluid, the heat exchange tube (5) having a tube section extending out of the heat-conducting frame (4) and capable of being attached to the static contact (71); A heat dissipation frame (6) is connected to the heat-conducting frame (4) and has a heat dissipation structure that is spread out away from the heat-conducting frame (4) and the heat exchange tube (5).
2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device comprises a support (2) connected to the heat-conducting frame (4), and the pipe section of the heat exchange pipe (5) that can be abutted against the static contact (71) is supported by the support (2).
3. The heat dissipation device according to claim 2, characterized in that: The support (2) has a supporting portion, the supporting portion having a straight surface section and two inclined surface sections (23) located on opposite sides of the straight surface section, the tube section of the heat exchange tube (5) that can be close to the static contact (71) is bent and arranged around the supporting portion, and is supported by the straight surface section.
4. The heat dissipation device according to claim 2, characterized in that: The heat-conducting frame (4) comprises a first plate body (41) and a second plate body (42) connected at an angle to the end of the first plate body (41); the heat exchange tube (5) is arranged on the first plate body (41); the support (2) is connected to the second plate body (42) in parallel and a cushion sleeve (3) is sandwiched between the support and the second plate body (42).
5. The heat dissipation device according to claim 1, characterized in that: The heat exchange tube (5) also has a tube section that is attached to the heat dissipation frame (6).
6. The heat dissipation device according to claim 5, characterized in that: The tube section of the heat exchange tube (5) that is in contact with the heat dissipation frame (6) is fixed to the heat conducting frame (4) in a bent curved posture and is clamped between the heat dissipation frame (6) and the heat conducting frame (4).
7. The heat dissipation device according to any one of claims 1 to 6, characterized in that: The heat dissipation structure of the heat dissipation frame (6) comprises a plurality of heat dissipation fins (61) extending in a direction away from the heat conducting frame (4) and the heat exchange tube (5).
8. The heat dissipation device according to any one of claims 1 to 6, characterized in that: A powder-sintered capillary liquid-absorbing tube core is arranged inside the heat exchange tube (5).
9. A high voltage switch device, comprising: Busbar (72); A stationary contact (71) mounted on the busbar (72); A moving contact, which can pivot relative to the stationary contact (71) to achieve opening and closing; Characterized in that the switch device also includes: A heat sink (1) is a heat sink as described in any one of claims 1 to 8, wherein the heat sink is fixed to the busbar (72) and is adjacent to the junction between the stationary contact (71) and the moving contact, and the heat exchange tube (5) of the heat sink (1) is abutted against the stationary contact (71).
10. A switch cabinet, characterized in that: Includes the high-voltage switch device as described in claim 9.