Heat dissipation device for internal mainboard of communication dispatching equipment with metal shell

Abstract

The utility model discloses an internal mainboard heat dissipation device of communication dispatching equipment with a metal shell, relates to the technical field of terminal heat dissipation devices, and aims to solve the problem that the working performance of the communication dispatching equipment is affected as a heat dissipation device cannot be additionally arranged on an old terminal equipment board. Wherein two first fixing supporting legs are arranged at one end of the top mounting seat and extend to the two sides of a CPU on an equipment mainboard, a plurality of second fixing supporting legs are arranged at one end of the bottom mounting seat, the top mounting seat is fixedly connected with the bottom mounting seat through bolts, and the top mounting seat and the bottom mounting seat are located on the upper side and the lower side of the equipment mainboard. One end of the first fixing support leg is provided with a bending part, the bending part is provided with a mounting hole, one end of the fixing seat is provided with a mounting column, the other end of the fixing seat is fixedly connected with the top mounting seat, and the heat collecting sheet is mounted between the fixing seat and the top mounting seat and is connected with the heat dissipation grid through a heat conduction copper pipe. The utility model provides a heat dissipation device suitable for an old terminal equipment board.

Description

Technical Field

[0001] The utility model relates to the technical field of terminal heat dissipation devices, in particular to a heat dissipation device for a mainboard inside a metal shell communication dispatching device. Background Art

[0002] As the command and dispatch system becomes more powerful and intelligent, it is necessary to add some automatic control systems to the terminal equipment. The core of the automatic control system is the central processing unit (CPU). The CPU shoulders the core of the entire system and is bound to generate a lot of heat during operation. The heat dissipation problem becomes the primary factor of the terminal equipment. The heat generated by the CPU is dissipated through the metal shell of the package. However, since the heat generated by the CPU is very large, relying on its own metal cover cannot meet the heat dissipation requirements, so a strengthened auxiliary heat dissipation system is needed.

[0003] During the multi-faceted test process, it was found that copper tube heat dissipation became the first choice for the terminal equipment. The CPU heat dissipation copper tube is filled with a special heat-conducting liquid, which can quickly transfer the heat generated by the CPU core to the entire external radiator, so that every part of the radiator participates in the heat dissipation and achieves the goal of cooling. However, the terminal equipment board of the existing communication dispatching equipment is a mature structure and cannot meet the installation requirements of the heat dissipation copper tube device. In order to use the heat dissipation copper tube for heat dissipation, it is necessary to redesign the terminal equipment board that meets the requirements of the heat dissipation copper tube installation. In order not to affect the working performance of the communication dispatching equipment, the old terminal equipment board requires a new motherboard heat dissipation device. Utility Model Content

[0004] The utility model aims to provide a mainboard heat dissipation device inside a metal shell communication dispatching device, so as to solve the problem that a heat dissipation device cannot be added to the old terminal device board, thereby affecting the working performance of the communication dispatching device.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] Provided is an internal mainboard heat dissipation device for a metal shell communication dispatching device, comprising a mounting seat, a heat collecting sheet, a heat conducting copper tube, a heat dissipation grid and a heat dissipation fan;

[0007] The mounting seat comprises a top mounting seat, a bottom mounting seat and a fixing seat, one end of the top mounting seat is provided with two first fixing legs, the first fixing legs are symmetrically arranged on the top mounting seat and extend to both sides of the CPU on the device motherboard, the bottom mounting seat is provided with a plurality of second fixing legs at one end in the same direction as the top mounting seat, the second fixing legs are evenly arranged on the bottom mounting seat, the top mounting seat is fixedly connected to the bottom mounting seat by bolts, the top mounting seat and the bottom mounting seat are respectively located at the upper and lower sides of the device motherboard, an upward bending portion is provided at one end of the first fixing leg away from the top mounting seat, a mounting hole is provided on the bending portion, one end of the fixing seat is provided with a mounting column used in conjunction with the mounting hole, the mounting column is inserted into the mounting hole, the other end of the fixing seat is fixedly connected to the top mounting seat by bolts, the heat collecting sheet is installed between the fixing seat and the top mounting seat, the heat collecting sheet is tightly fitted with the CPU, the heat collecting sheet is connected to the heat dissipation grid through the heat-conducting copper tube, and the heat dissipation fan is fixedly installed on the heat dissipation grid.

[0008] Compared with the prior art, the present invention has the following technical effects:

[0009] The top mounting seat and the bottom mounting seat of the mounting seat in the heat dissipation device of the mainboard inside the metal shell communication dispatching device provided by the utility model can support and fix the mainboard of the device on the upper and lower sides of the mainboard of the device, ensuring the stability of the mounting seat after installation. The fixing seat fixes the heat collector on the top mounting seat, which not only fixes the heat collector, but also ensures the close contact between the heat collector and the CPU. Heat can be effectively transferred to the heat collector, increasing the heat dissipation area. At the same time, the heat-conducting copper pipe connected to the heat collector can effectively transfer heat to the heat dissipation grid, and the heat is dissipated as soon as possible through the heat dissipation fan, thereby reducing the operating temperature of the CPU and ensuring the stability of the CPU. The form of support installation does not require redesign of the old terminal equipment board, saving the cost of design and equipment update. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0011] Figure 1 This is a schematic diagram of the assembly of the internal motherboard heat dissipation device in the embodiment of the utility model;

[0012] Figure 2 for Figure 1 Side view of the internal motherboard heat sink;

[0013] Figure 3 for Figure 1 Schematic diagram of the mid-bottom mounting base;

[0014] Figure 4 Schematic diagram of the top mounting base in 1.

[0015] Reference numerals:

[0016] 10-top mounting seat, 11-first fixed leg, 12-bending portion, 13-limiting hole, 20-bottom mounting seat, 21-second fixed leg, 22-limiting block, 30-fixed seat, 31-extended end, 32-mounting column, 40-heat collecting plate, 50-thermal copper tube, 60-heat dissipation grid, 70-heat dissipation fan. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0018] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0019] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0021] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] like Figures 1 to 3 As shown, the internal mainboard heat dissipation device of the metal shell communication dispatching equipment provided by the utility model includes a mounting seat, a heat collecting sheet 40, a heat conducting copper tube 50, a heat dissipation grid 60 and a heat dissipation fan 70;

[0023] The mounting base includes a top mounting base 10, a bottom mounting base 20 and a fixing base 30. Two first fixing legs 11 are arranged at one end of the top mounting base 10. The first fixing legs 11 are symmetrically arranged on the top mounting base 10 and extend to both sides of the CPU on the device motherboard. A plurality of second fixing legs 21 are arranged at one end of the bottom mounting base 20 in the same direction as the top mounting base 10. The second fixing legs 21 are evenly arranged on the bottom mounting base 20. The top mounting base 10 is fixedly connected to the bottom mounting base 20 by bolts. The top mounting base 10 and the bottom mounting base 20 are respectively located at the device motherboard. On the upper and lower sides, an end of the first fixed leg 11 away from the top mounting seat 10 is provided with an upward bending portion 12, and a mounting hole is provided on the bending portion 12. One end of the fixed seat 30 is provided with a mounting column 32 used in conjunction with the mounting hole, and the mounting column 32 is inserted into the mounting hole. The other end of the fixed seat 30 is fixedly connected to the top mounting seat 10 by bolts. The heat collecting sheet 40 is installed between the fixed seat 30 and the top mounting seat 10. The heat collecting sheet 40 fits tightly with the CPU. The heat collecting sheet 40 is connected to the heat dissipation grid 60 through a heat-conducting copper tube 50, and the heat dissipation fan 70 is fixedly installed on the heat dissipation grid 60.

[0024] The top mounting seat and the bottom mounting seat of the mounting seat in the heat dissipation device of the mainboard inside the metal shell communication dispatching device provided by the utility model can support and fix the mainboard of the device on the upper and lower sides of the mainboard of the device, ensuring the stability of the mounting seat after installation. The fixing seat fixes the heat collector on the top mounting seat, which not only fixes the heat collector, but also ensures the close contact between the heat collector and the CPU. Heat can be effectively transferred to the heat collector, increasing the heat dissipation area. At the same time, the heat-conducting copper pipe connected to the heat collector can effectively transfer heat to the heat dissipation grid, and the heat is dissipated as soon as possible through the heat dissipation fan, thereby reducing the operating temperature of the CPU and ensuring the stability of the CPU. The form of support installation does not require redesign of the old terminal equipment board, saving the cost of design and equipment update.

[0025] As an implementable embodiment, the heat dissipation grid 60 includes a heat dissipation pipe 61 and a plurality of heat dissipation fins 62, the plurality of heat dissipation fins 62 are arranged in parallel, the two side edges of the heat dissipation pipe 61 are arranged perpendicularly to the heat dissipation fins 62, there are two thermal conductive copper tubes 50, the two ends of the thermal conductive copper tube 50 are respectively fixedly connected to the two ends of the heat collecting plate 40 and the heat dissipation pipe 61, and are connected, the heat dissipation fan 70 is fixedly connected to the heat dissipation fins 62 through a mounting frame, and the heat dissipation fan 70 is externally connected to a power supply.

[0026] The heat dissipation grid 60 composed of the heat dissipation pipe 61 and a plurality of heat dissipation fins 62 can dissipate the heat transferred from the heat collecting plate 40 through the heat-conducting copper tube 50 . At the same time, the heat dissipation can be better performed in cooperation with the heat dissipation fan 70 .

[0027] As an implementation method, the fixing seat 30 is a U-shaped structure, the mounting column 32 is arranged at the extension end 31 of the fixing seat 30, the fixing end of the fixing seat is fixedly connected to the top fixing seat 10, and the mounting column 32 is arranged at the end of the extension end 31. Further, the extension end 31 of the fixing seat 30 is an arc-shaped structure protruding upward.

[0028] The U-shaped fixing seat 30 can fix the heat collecting sheet 40 on both sides of the heat collecting sheet 40, which reduces the shielding of the back of the heat collecting sheet 40 as much as possible and ensures the heat dissipation function of the heat collecting sheet 40. Since the heat collecting sheet 40 itself has a certain thickness, the extended end 31 is set to an arc-shaped structure that bulges upward, which can better support and fix the heat collecting sheet 40.

[0029] As an implementable embodiment, the lower surface of the top mounting seat 10 is a two-level stepped structure, and the height of the steps is the same as the thickness of the device mainboard.

[0030] By setting up the secondary step structure, sufficient installation space is reserved for the device mainboard between the top mounting seat 10 and the bottom mounting seat 20, which ensures the stability of the mounting seat after installation and avoids damage to the device mainboard.

[0031] As an implementable embodiment, a foam pad is provided on the side of the second fixing leg 21 facing the device mainboard.

[0032] The provision of the foam pad reduces the damage caused by the bottom mounting plate to the pins on the back of the device mainboard.

[0033] As an implementable embodiment, a limiting block 22 is provided on a side of the bottom mounting seat 20 facing the top mounting seat 10 , and limiting holes 13 matching the limiting block 22 are provided on the top mounting seat 10 and the fixing seat 30 .

[0034] The setting of the limiting block 22 and the limiting hole 13 plays a guiding role in the installation of the top mounting seat 10 and the fixing seat 30, and can better position the threaded holes on the top mounting seat 10, the fixing seat 30 and the bottom mounting seat 20.

[0035] As an implementable embodiment, the heat dissipation device also includes a water cooling head, a water conduit and a water cooling pipe. The water cooling head is fixedly connected to the top mounting seat 10, the water cooling pipe is fixedly connected to the heat sink 62, the water cooling pipe is arranged parallel to the heat dissipation pipe 61, and the water cooling head is connected to the water cooling pipe through the water conduit.

[0036] The heat dissipation performance of the mainboard heat dissipation device is further improved by arranging the water cooling head, water channel pipe and water cooling pipe.

[0037] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A mainboard heat dissipation device inside a metal shell communication dispatching device, characterized in that: It includes a mounting base, a heat collecting sheet, a heat conducting copper tube, a heat dissipation grid and a heat dissipation fan; The mounting seat comprises a top mounting seat, a bottom mounting seat and a fixing seat, one end of the top mounting seat is provided with two first fixing legs, the first fixing legs are symmetrically arranged on the top mounting seat and extend to both sides of the CPU on the device motherboard, the bottom mounting seat is provided with a plurality of second fixing legs at one end in the same direction as the top mounting seat, the second fixing legs are evenly arranged on the bottom mounting seat, the top mounting seat is fixedly connected to the bottom mounting seat by bolts, the top mounting seat and the bottom mounting seat are respectively located at the upper and lower sides of the device motherboard, an upward bending portion is provided at one end of the first fixing leg away from the top mounting seat, a mounting hole is provided on the bending portion, one end of the fixing seat is provided with a mounting column used in conjunction with the mounting hole, the mounting column is inserted into the mounting hole, the other end of the fixing seat is fixedly connected to the top mounting seat by bolts, the heat collecting sheet is installed between the fixing seat and the top mounting seat, the heat collecting sheet is tightly fitted with the CPU, the heat collecting sheet is connected to the heat dissipation grid through the heat-conducting copper tube, and the heat dissipation fan is fixedly installed on the heat dissipation grid.

2. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1 is characterized in that: The heat dissipation grid includes a heat dissipation tube and a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged in parallel, the two side edges of the heat dissipation tube are arranged perpendicularly to the heat dissipation fins, there are two heat-conducting copper tubes, the two ends of the heat-conducting copper tubes are respectively fixedly connected to the heat collecting plate and the two ends of the heat dissipation tube, and are communicated, the heat dissipation fan is fixedly connected to the heat dissipation fins through a mounting frame, and the heat dissipation fan is externally connected to a power supply.

3. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1 is characterized in that: The fixing seat is a U-shaped structure, the mounting column is arranged at the extended end of the fixing seat, the fixed end of the fixing seat is fixedly connected to the top mounting seat, and the mounting column is arranged at the end of the extended end.

4. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 3 is characterized in that: The extended end of the fixing seat is an arc-shaped structure protruding upward.

5. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1 is characterized in that: The lower surface of the top mounting seat is a two-level stepped structure, and the height of the steps is the same as the thickness of the device mainboard.

6. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1 is characterized in that: A foam pad is provided on the side of the second fixing leg facing the device mainboard.

7. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 1 is characterized in that: A limiting block is arranged on one side of the bottom mounting seat facing the top mounting seat, and limiting holes matching the limiting block are arranged on the top mounting seat and the fixing seat.

8. The internal mainboard heat dissipation device of the metal shell communication dispatching equipment according to claim 2 is characterized in that: The heat dissipation device also includes a water cooling head, a water conduit and a water cooling pipe. The water cooling head is fixedly connected to the top mounting seat, the water cooling pipe is fixedly connected to the heat sink, the water cooling pipe is arranged parallel to the heat dissipation pipe, and the water cooling head is connected to the water cooling pipe through the water conduit.

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