Metal thin film substrate and transparent display comprising same

Abstract

The utility model relates to a metal film substrate and a transparent display comprising the same. The metal film substrate comprises: a glass substrate; an adhesive layer formed on one surface of the glass substrate; and a metal layer formed on one surface of the adhesive layer, and the adhesive layer includes a silicon-based adhesive.

Description

Technical Field

[0001] The utility model relates to a metal film substrate and a transparent display comprising the same. Background Art

[0002] Recently, in the display market, the demand for large-area display devices has been increasing as technology has advanced. Technological development is also underway in the fields of cutting-edge electronic circuits and displays, such as Micro-LED and Mini-LED, which can adjust the brightness of each unit area. Among them, research is underway on photolithography methods for producing electronic devices that simultaneously meet large-area sizes, high resolution, and contrast quality.

[0003] Korean Patent Publication No. 10-2019-0003025 also discloses a circuit board and a method for manufacturing the same using a patterning process for a metal layer on top of a glass substrate.

[0004] However, various methods such as electroplating or vapor deposition of metal thin films have been used as methods for realizing low-resistance metal wiring on glass substrates in the past, but each of these methods has limitations in terms of increasing the area of ​​displays.

[0005] In order to overcome this limitation, attempts have recently been made to develop a technology that patterns the metal thin film using photolithography after bonding the metal thin film to a glass substrate.

[0006] However, the problem with this method of bonding a metal thin film to a glass substrate is that not only is the adhesion between the metal thin film and the glass substrate insufficient, but also the lower adhesive layer exposed after patterning of the metal layer is damaged by contact with a metal etching solution.

[0007] Furthermore, especially when used in electronic devices such as transparent displays that are exposed to the external environment for a long time, heat resistance and reliability in high temperature and high humidity environments are very important. However, acrylic adhesives or epoxy adhesives used for metal films in the past not only have insufficient heat resistance or reliability in high temperature and high humidity environments, but also have the problem of causing curling when transparent displays are implemented in large areas.

[0008] Therefore, there is a need for a metal thin film substrate that not only has excellent adhesion to the glass substrate and chemical resistance to metal layer etching solutions, but also has excellent heat resistance and reliability in high temperature and high humidity environments, and does not curl when applied to large-area glass, so that it can be used in large-area transparent displays.

[0009] Prior art literature

[0010] Patent Literature

[0011] Korean Patent Publication No. 10-2019-0003025 Utility Model Content

[0012] The purpose of the utility model is to provide a metal thin film substrate and a transparent display which not only have excellent adhesion to a glass substrate and wear resistance of an adhesive layer, but also have excellent chemical resistance to etching liquid, heat resistance and reliability, and will not curl when applied to large-area glass, thereby being applicable to large-area transparent displays.

[0013] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme.

[0014] The utility model relates to a metal film substrate, comprising: a glass substrate; an adhesive layer formed on one surface of the glass substrate; and a metal layer formed on one surface of the adhesive layer, and the adhesive layer comprises a silicon-based adhesive.

[0015] In an embodiment of the present invention, the adhesive layer may be formed of an adhesive layer composition including a silicon-based adhesive and a solvent, and includes 40% to 60% of the silicon-based adhesive relative to the total weight of the adhesive layer composition.

[0016] In another embodiment of the present invention, the silicon-based adhesive may include one or more of a silicon compound and a siloxane compound.

[0017] In another embodiment of the present invention, the metal layer may have a thickness of 3 μm to 120 μm.

[0018] In another embodiment of the present invention, the metal layer may include one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti) and tungsten (W).

[0019] In another embodiment of the present invention, the adhesive layer may have a thickness of 5 μm to 50 μm.

[0020] In another embodiment of the present invention, no separate component may be included between the metal layer and the adhesive layer.

[0021] In another embodiment of the present invention, the metal film substrate can be used for a transparent display.

[0022] In addition, the utility model provides a transparent display, comprising: the metal film substrate; and a light emitting diode (LED).

[0023] The metal thin film and metal thin film substrate of the present invention have the following effects: The metal thin film and metal thin film substrate of the present invention have an adhesive layer including a silicon-based adhesive, thereby achieving excellent adhesion to a glass substrate, chemical resistance to etching liquid, heat resistance, and reliability in a high-temperature and high-humidity environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 and Figure 2 2 is a diagram showing a metal film according to one or more embodiments of the present invention.

[0025] Figure 3a This is a diagram showing a metal thin film substrate according to an embodiment of the present invention.

[0026] Figure 3b This is a diagram showing an example of a transparent display according to an embodiment of the present invention.

[0027] Figure 4 It is a diagram showing a method for manufacturing a metal thin film substrate according to an embodiment of the present invention.

[0028] Figure 5 This is a diagram showing a method for patterning a metal thin film substrate according to an embodiment of the present invention.

[0029] Figure 6 This is a diagram showing a method for manufacturing a transparent display according to an example of the present invention.

[0030] Reference numerals

[0031] 10: metal layer, 20: adhesive layer, 30: protective film, 40: glass substrate, 50: photoresist pattern, 60: light emitting diode. DETAILED DESCRIPTION

[0032] The utility model relates to a metal film having an adhesive layer including a silicon-based adhesive, and a metal film substrate.

[0033] In more detail, the utility model relates to a metal film substrate, the metal film substrate comprises a metal film, the metal film comprises: a metal layer; and an adhesive layer formed on one side of the metal layer, the adhesive layer comprises a silicon-based adhesive,

[0034] In addition, the utility model relates to a metal film substrate, which includes: a glass substrate; an adhesive layer formed on one side of the glass substrate; and a metal layer formed on one side of the adhesive layer, and the adhesive layer includes a silicon-based adhesive.

[0035] The embodiments of the present invention are described in more detail below with reference to the accompanying drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and serve to further understand the technical concept of the present invention together with the contents of the aforementioned utility model, so the present invention should not be interpreted only in terms of the matters recorded in such drawings.

[0036] The terms used in this specification are used to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless otherwise stated in the context. For example, the "protective film" used in this specification may refer to at least one of the first protective film and the second protective film.

[0037] The terms "comprises" and / or "comprising" used in this specification are used as meanings that do not exclude the existence and addition of one or more other constituent elements, steps, actions and / or devices other than the constituent elements, steps, actions and / or devices mentioned. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0038] Spatially relative terms such as "below", "bottom", "lower part", "above", "top", "upper part", etc. can be used to facilitate the description of the relationship between one device or component and another device or component as shown in the figure. Spatially relative terms should be understood as terms that include different directions of the devices when in use or operation in addition to the directions shown in the drawings. For example, when the device shown in the figure is turned over, an element described as "below" or "lower part" of another element can be placed "above" another device. Therefore, the exemplary term "below" can include both downward and upward directions. The device can be oriented in other directions, so the spatially relative terms can be interpreted based on the orientation.

[0039] The term “substantially” used in this specification may be interpreted as including not only being physically identical or even identical, but also being within the error range of measurement or even manufacturing process, for example, an error range of less than 0.1%.

[0040] <Metal Film Substrate>

[0041] The utility model covers a metal film and a metal film substrate including the metal film.

[0042] The metal film of the utility model includes a metal layer and an adhesive layer, the adhesive layer includes a silicon-based adhesive, and the metal film substrate of the utility model may include a metal film formed on one side of a glass substrate. More specifically, the metal film substrate of the utility model may include: a glass substrate; an adhesive layer formed on one side of the glass substrate; and a metal layer formed on one side of the adhesive layer. In particular, the adhesive layer of the utility model is characterized in that it includes a silicon-based adhesive, and therefore has not only excellent adhesion to the glass substrate and wear resistance of the adhesive layer, but also excellent chemical resistance to etching liquid, heat resistance and reliability, and will not curl when applied to large-area glass, so that it can be applied to large-area transparent displays.

[0043] Figure 1 and Figure 2 2 is a diagram showing a metal film according to one or more embodiments of the present invention.

[0044] Reference Figure 1 and Figure 2 The metal film of one or more embodiments of the present invention includes a metal layer 10 and an adhesive layer 20, and may further include a protective film 30 as needed.

[0045] The metal layer 10 can be used as an electrode in an electronic device such as a display device including the metal thin film.

[0046] There is no particular limitation on the metal layer 10 as long as it has conductivity. For example, it may include one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti) and tungsten (W).

[0047] The metal layer 10 can be formed by a well-known metal thin film process, for example, it can be formed by at least one of electroless deposition, electrolytic gold plating, sputtering, thermal evaporation and electron beam evaporation. Preferably, it can be electrolytic gold plating, but it is not limited to this.

[0048] The thickness of the metal layer 10 may be 3 μm to 120 μm, preferably 3 μm to 110 μm, and more preferably 18 μm to 105 μm. When the thickness of the metal layer 10 is less than 3 μm, it may not be easy to form a uniform film or even a pattern, and when the thickness exceeds 120 μm, there may be a problem that it cannot be applied to electronic devices with thin film structures.

[0049] The adhesive layer 20 may be provided to enable the metal thin film to be bonded to another member, such as a glass substrate described later, to serve as a metal thin film substrate.

[0050] The adhesive layer 20 is characterized in that it includes a silicon-based adhesive. Specifically, in the past, the metal thin film of the adhesive layer formed by using an acrylic adhesive or an epoxy adhesive had insufficient adhesion to the glass substrate, or the adhesive layer was damaged by an etching solution used to etch the metal layer formed on the upper part of the adhesive layer. Furthermore, when used in products such as transparent displays that are mainly used outdoors, there is a problem that the adhesion between the adhesive layer and the glass substrate is reduced or the adhesive layer turns yellow, resulting in a defective product.

[0051] In order to solve such problems, the inventors of the present invention conceived the present invention with an eye on the following aspects: when the adhesive layer 20 includes a silicon-based adhesive, it not only has excellent adhesion to the glass substrate, but also has excellent chemical resistance to etching solutions, and has excellent heat resistance and reliability in high temperature and high humidity environments.

[0052] More specifically, the adhesive layer of the present invention can be made of an adhesive layer composition including a silicon-based adhesive, a silicon-based additive and a solvent, and can further include additives.

[0053] The silicon-based adhesive can be selected within a range that does not impair the purpose of the present invention, and may be one or more of a silicon compound and a siloxane compound.

[0054] There is no particular restriction on the use of the silicon compound, as long as it is a compound including silicon (Si) atoms. In addition, the siloxane compound can use a compound including Si-O bonded siloxane without restriction. More specifically, in one example of the utility model, the silicon compound and the siloxane compound can be one or more of trimethylated silica, vinyl terminated polydimethylsiloxane, hexamethyl di siloxane, trisiloxane, and tetrakis (trimethylsilyloxy) silane.

[0055] In particular, the present invention preferably includes 40% to 60% of the silicone adhesive relative to the total weight of the adhesive layer composition. In this way, the silicone adhesive of the present invention can be diluted and added at a lower concentration than the conventional adhesive. Accordingly, when the adhesive layer of the present invention is bonded to a metal layer or a glass substrate, the adhesion to the metal layer or the glass substrate can be maximized, thereby having the advantage of achieving bonding without additional treatment such as UV curing of the adhesive layer.

[0056] The solvent is not particularly limited as long as it can dilute the silicone adhesive, and as an example, it can be toluene, xylene, PGME, and / or PGMEA. The solvent of the utility model preferably includes 40% to 55% of the total weight of the adhesive layer composition in terms of the stability of the adhesive coating thickness under the metal layer.

[0057] The additive may be one or more of an anchoring agent, a cross linker and a catalyst.

[0058] The anchoring agent is added to increase the bonding strength with the metal layer when the adhesive layer is applied, and can prevent the adhesive layer from separating from the metal layer. Generally, any substance used as the anchoring agent is not particularly limited, but preferably does not cause thermal deformation below 200°C.

[0059] The crosslinking agent is a substance added for chemical bonding between components of the adhesive layer composition, and is preferably a product that does not undergo thermal deformation at 200°C.

[0060] The catalyst is a component added for curing the adhesive layer composition, and helps the adhesive layer composition to transform from a liquid phase to a solid phase. Specific examples thereof include platinum catalysts, palladium catalysts, and / or osmium catalysts.

[0061] The additive of the present invention preferably comprises 0.1% to 10% of the total weight of the adhesive layer composition in terms of the stability of the adhesive force.

[0062] The adhesive layer 20 of the present invention may be formed by heating the adhesive layer composition to a temperature of 100° C. to 180° C. and curing the composition.

[0063] The thickness of the adhesive layer 20 may be 5 μm to 50 μm, preferably 5 μm to 30 μm, and preferably 5 μm to 25 μm. When the thickness of the adhesive layer 20 is less than 5 μm, sufficient adhesion to other components cannot be maintained, and when the thickness exceeds 50 μm, there may be disadvantages in increasing the thickness of the product.

[0064] In one embodiment, the adhesive layer 20 may not include a separate component, such as an intermediate layer or a protective layer, at the contact interface with the metal layer 10. Specifically, in the case of an adhesive layer formed using a conventional acrylic adhesive or epoxy adhesive, there are problems such as damage to the adhesive layer due to the etching solution used to etch the metal layer formed on the upper part of the adhesive layer, for example, in the case of an adhesive layer formed by an epoxy adhesive, the opacity of the adhesive layer increases when in contact with the etching solution. Therefore, conventional metal films further include components of an intermediate layer or a protective layer between the adhesive layer and the metal layer to prevent the adhesive layer from being damaged by the etching solution. However, when a separate component is included in this way, not only does the processability decrease and the manufacturing cost increase due to the addition of the manufacturing process, but there are also disadvantages in the production of the film. However, in the present invention, as described above, by using a silicone adhesive with excellent chemical resistance to etching liquid to form an adhesive layer, damage to the adhesive due to the etching liquid will not occur. Therefore, there is no need to additionally include an intermediate layer or a protective layer component that was previously provided to protect the adhesive. This not only improves processability, but also has advantages in reducing production costs, and further has advantages in thinning the film.

[0065] The protective film 30 can be configured to protect the surface of the metal layer 10 and / or the adhesive layer 20 from external influences. For example, it can be configured to be a first protective film 30-1 formed on one side of the adhesive layer 20 to protect the surface of the adhesive layer 20 and a second protective film 30-2 formed on one side of the metal layer 10 to protect the surface of the metal layer 10.

[0066] In one embodiment, the protective film may be Figure 2 Although shown as a single-layer structure formed as one layer, it is not limited thereto and may be a multi-layer structure in which more than one protective film is continuously stacked.

[0067] In one embodiment, the protective film 30 may be formed by respectively attaching the second protective film 30 - 2 and the first protective film 30 - 1 to one surface of the metal layer 10 and the adhesive layer 20 using a laminator.

[0068] The protective film 30 is not particularly limited as long as it is used to protect the surface of the metal layer 10 and / or the adhesive layer 20. For example, it can include a material selected from polyethylene terephthalate (PET), polyethylene isophthalate (PEI), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), diacetyl cellulose, triacetyl cellulose (TAC), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polymethyl acrylate (PMA), polyimide (PI), polymethyl methacrylate (PMMA), polyethyl acrylate (PEA), polyethyl methacrylate (PEMA), and cyclic olefin polymer (cyclic olefin polymer). In terms of availability and processing convenience, polyethylene terephthalate (PET), triacetylcellulose (TAC), polycarbonate (PC), polyimide (PI), and cyclic olefin polymer (COP) can be preferably used.

[0069] There is no particular limitation on the thickness of the protective film 30 , and for example, the thickness may be 10 μm to 200 μm.

[0070] On the other hand, the above Figure 2The metal film is exemplified by a metal film having a protective film 30 on one side of the metal layer 10 and the adhesive layer 20, but is not limited thereto. For example, it may be a protective film including only a protective film formed on one side of the metal layer and a protective film formed on one side of the adhesive layer.

[0071] Figure 3a This is a diagram showing a metal thin film substrate according to an embodiment of the present invention.

[0072] Reference Figure 3a The metal film substrate of an embodiment of the present invention may include a metal layer 10 , an adhesive layer 20 , and a glass substrate 40 .

[0073] In one embodiment, the metal film substrate may be manufactured using the metal film described above. In this case, the same contents as those described in the metal film may be applied to the metal layer 10 and the adhesive layer 20 .

[0074] The glass substrate 40 is not particularly limited as long as it does not hinder the optical properties of the metal thin film substrate, and may include, for example, oxide glass such as silicate glass, borate glass, phosphate glass, etc. In this case, heat shrinkage does not occur in subsequent processes, and a predetermined hardness can be given to the metal thin film substrate.

[0075] In one or more embodiments, the glass substrate 40 may have a thickness of 1 mm to 20 mm. When the thickness of the glass substrate 40 satisfies the range, the hardness is excellent, thinness can be achieved, and deformation or cracks of the metal layer 10 can be prevented. Specifically, when the thickness is less than 1 mm, it may be difficult to protect the metal layer 10 and other laminated components from external impact; when the thickness exceeds 20 mm, it may be disadvantageous in terms of thinness and even lightness.

[0076] In one or more embodiments, the glass substrate 40 may have a single-layer or multi-layer structure. Figure 3a As shown, it may have a single-layer structure formed of a single glass substrate, but is not necessarily limited thereto, and may also have a multi-layer structure in which a plurality of glass substrates are stacked.

[0077] In one embodiment, the adhesion between the adhesive layer 20 and the glass substrate 40 may be 5B or more. As described above, since the adhesive layer 20 includes a silicon-based adhesive, it has a feature of excellent adhesion between the adhesive layer 20 and the glass substrate 40 .

[0078] In one embodiment, the adhesion between the adhesive layer 20 and the glass substrate 40 may be evaluated by measuring the standard ISO 2409: Standard Test Methods for Measuring Adhesion by Tape Test.

[0079] <Method for Manufacturing Metal Thin Film Substrate>

[0080] The utility model relates to a method for manufacturing the metal film substrate of the utility model.

[0081] Figure 4 It is a diagram showing a method for manufacturing a metal thin film substrate according to an embodiment of the present invention.

[0082] Reference Figure 4 A method for manufacturing a metal film substrate according to an embodiment of the utility model may include: a step of peeling off a first protective film provided on the metal film; a step of bonding the metal film by configuring an adhesive layer on one side of a glass substrate; and a step of peeling off a second protective film provided on the metal film.

[0083] Specifically, in the step of peeling off the first protective film provided on the metal thin film, the first protective film 30 - 1 disposed under the adhesive layer 20 of the metal thin film may be peeled off.

[0084] The first protective film 30 - 1 may be peeled off in any manner that does not impair the purpose of the present invention, and a method used in a conventional process of peeling off a release film may be adopted.

[0085] In the step of bonding the metal thin film so as to arrange the adhesive layer on one surface of the glass substrate, the surface of the adhesive layer 20 exposed to the outside after the first protective film 30 - 1 is peeled off can be bonded to one surface of the glass substrate 40 .

[0086] The bonding of the adhesive layer 20 and the glass substrate 40 can be appropriately performed within a range that does not impair the purpose of the present invention. For example, the bonding can be performed using a laminator or the like.

[0087] In the step of peeling off the second protective film provided on the metal thin film, the second protective film 30 - 2 disposed on the upper surface of the metal layer 10 of the metal thin film may be peeled off.

[0088] The peeling of the second protective film 30 - 2 may be performed by substantially the same method as the peeling of the first protective film 30 - 1 .

[0089] On the other hand, the above Figure 4 The method for manufacturing the metal thin film substrate is to use Figure 2 The method for manufacturing a metal thin film substrate using a metal thin film as an example is described, but the present invention is not necessarily limited to this.

[0090] For example, in another embodiment of the present invention, when the metal film does not include the second protective film 30 - 2 , the step of peeling off the second protective film provided on the metal film may be omitted.

[0091] <Method for patterning metal thin film substrate>

[0092] The utility model relates to a patterning method for a metal film substrate, comprising: a step of forming a metal pattern on a metal layer of the metal film substrate of the utility model.

[0093] The patterning method of the metal film substrate of the utility model comprises: the step of forming a photoresist pattern on one side of the metal layer arranged on the metal film substrate; the step of etching the area exposed by the photoresist pattern; and the step of stripping the photoresist pattern.

[0094] Figure 5 This is a diagram showing a method for patterning a metal thin film substrate according to an embodiment of the present invention.

[0095] Reference Figure 5 A patterning method for a metal film substrate according to an embodiment of the utility model comprises: a step of forming a photoresist pattern on one side of a metal layer provided on the metal film substrate; a step of etching an exposed area in the metal layer through the photoresist pattern; and a step of stripping the photoresist pattern.

[0096] Specifically, the step of forming a photoresist pattern on one side of the metal layer provided on the metal film substrate may include: a process of coating a composition for forming a photoresist pattern on the metal layer 10 by spin coating, slit coating, inkjet printing, etc., a process of drying and heat treating the composition for forming the coated photoresist pattern to form a photoresist film, and a process of forming a photoresist pattern 50 by selectively exposing and developing the photoresist film to dissolve and remove the photoresist film corresponding to the exposure area or the non-exposure area.

[0097] The step of forming the photoresist pattern 50 can be performed by a known method, and the details are omitted here.

[0098] The step of etching the exposed region of the metal layer through the photoresist pattern is not particularly limited and may be performed by a dry etching process or a wet etching process.

[0099] In one embodiment, the wet etching process can be performed using one or more etching solutions selected from the group consisting of nitric acid, phosphoric acid, acetic acid, cupric chloride, ferrous chloride and ferric chloride. As described above, the bonding layer 20 is characterized in that it includes a silicon-based adhesive, which has excellent chemical resistance to one or more etching solutions selected from the group consisting of nitric acid, phosphoric acid, acetic acid, cupric chloride, ferrous chloride and ferric chloride. Therefore, when the etching process is performed by wet etching of one or more etching solutions selected from the group consisting of nitric acid, phosphoric acid, acetic acid, cupric chloride, ferrous chloride and ferric chloride, not only is the etching performance of the metal layer 10 excellent, but even if the bonding layer 20 located at the bottom of the metal layer 10 is exposed to the etching solution, damage to the bonding layer 20 (physical and chemical damage and white turbidity) will not occur.

[0100] The dry etching process or the wet etching process may be performed by a known method, and the details are omitted here.

[0101] The step of stripping the photoresist pattern may be performed by depositing the substrate having the resist pattern 50 formed thereon in a resist stripping solution, or by spraying the stripping solution on the substrate, etc. In this case, a physical treatment such as ultrasonic irradiation or contact with a rotating or oscillating brush may be used in combination.

[0102] In one embodiment, the stripping conditions of the resist include a temperature of about 15°C to 100°C, preferably 30°C to 70°C, and a deposition or spraying time of preferably about 1 minute to 20 minutes, but not limited thereto, and can be appropriately modified according to user needs.

[0103] In one embodiment, after the resist stripping liquid treatment, a cleaning process may be further performed to remove the stripping liquid remaining on the substrate. The cleaning process may be performed in the same manner as the stripping process described above, except that water or isopropyl alcohol is used instead of the stripping liquid.

[0104] <Transparent display and manufacturing method>

[0105] The utility model comprises a transparent display manufactured by utilizing the metal film substrate of the utility model and a manufacturing method thereof.

[0106] Specifically, the utility model relates to a transparent display, comprising the above-mentioned metal film substrate; and a light emitting diode (LED). Figure 3b 1 is a diagram showing an example of a transparent display according to the present invention. Figure 3bThe transparent display of the present invention is in the form of a light emitting diode 60 (LED) formed on a patterned metal layer 10 of a metal film substrate. More specifically, a solder layer (not shown) may be further included on the patterned metal layer 10 of the metal film substrate, and the light emitting diode 60 (LED) may be mounted through the solder layer. There is no special limitation on the configuration spacing or density of the light emitting diodes (LEDs), which may be configured in a grid form. In this case, the upper, lower, left, and right spacings may be 1 to 50 mm, and the spacings of multiple light emitting diodes (LEDs) may be the same or different. When a light emitting diode (LED) is formed on the metal film substrate of the present invention, it has the advantage of being a transparent display capable of outputting and playing images on a substrate having transparency.

[0107] In addition, the manufacturing method of the transparent display of the utility model includes the steps of forming a metal pattern on one side of the metal layer provided on the metal film substrate; and mounting a light emitting diode (LED). Figure 6 A method for manufacturing a transparent display according to an example of the present invention is a diagram showing a step of mounting a light emitting diode 60 (LED) on a patterned metal layer 10 of a metal thin film substrate according to the present invention.

[0108] In the present invention, the method of forming the light emitting diode (LED) on the patterned metal layer of the metal film substrate of the present invention may be a method of surface mounting (SMT: Surface Mount Technology) of the device by welding, etc., but is not limited thereto.

[0109] The utility model further includes a structure and method of an outer coating covering the upper part of the light emitting diode (LED) or the entire transparent display. The outer coating can be made of any known material without limitation, and its thickness is not particularly limited, as long as it is a level commonly used by those skilled in the art.

[0110] Since the metal film to metal film substrate of the present invention exhibits the above-mentioned characteristics, it can be suitable for use in display devices that require a large area and low resistance, and is particularly suitable for use in devices such as transparent displays that are exposed to the external environment for a long time due to its excellent heat resistance and reliability in high temperature and high humidity environments.

[0111] Hereinafter, experimental examples including specific embodiments and comparative examples are proposed to help understand the present invention, but this is only to illustrate the present invention and does not limit the scope of the appended claims. It is obvious to those skilled in the art that various changes and modifications can be made to the embodiments within the scope of the present invention and the technical concept, and such deformation and modification naturally fall within the scope of the appended patent claims. In addition, unless otherwise specified, the "%" and "parts" indicating the content below are based on weight.

[0112] Embodiment and comparative example: preparation of metal thin film substrate

[0113] (1) Embodiment 1

[0114] In silicone adhesive (DOWSIL TM 96-083Silicone Adhesive Kit, DOW; solid powder content 70%) was added with 4 kg of 99% toluene to produce a composition with a content of 50% of the silicone adhesive, and then stirred with a stirrer (5 horsepower) and further mixed with an anchoring agent (SYL-OFF TM SL-9250, DOW) 0.5g, cross-linking agent (SYL-OFF TM 7678, DOW) 0.8 g, and a platinum catalyst 1 g to prepare an adhesive layer composition.

[0115] Then, the adhesive layer composition was coated on one side of a copper metal substrate having a thickness of 30 μm by gravure coating, and then cured at 150° C. for 2 minutes to produce a metal thin film having a silicon-based adhesive layer having a thickness of 10 μm formed on one side of the metal substrate.

[0116] After that, the adhesive layer of the metal thin film was disposed on one surface of a glass substrate having a thickness of 2 mm, and then the metal thin film was bonded by a sheet-to-sheet method to produce a metal thin film substrate.

[0117] Afterwards, if Figure 5 As shown, the metal thin film substrate is patterned to manufacture the metal thin film substrate of the embodiment.

[0118] (2) Embodiment 2

[0119] Except that the silicone adhesive (DOWSIL TMThe metal thin film substrate was manufactured in the same manner as in Example 1, except that toluene was added to the 96-083Silicone Adhesive Kit, DOW; solid powder content 70%) for dilution, the adhesive layer composition was coated on one side of the copper metal substrate, then UV-cured at 150 mJ, and cured at 150° C. for 2 minutes.

[0120] (3) Embodiment 3

[0121] A metal thin film substrate was manufactured in the same manner as in Example 1 except that the metal thin film was bonded by a roll to sheet method instead of the sheet to sheet method in Example 1.

[0122] (4) Comparative Example 1

[0123] In addition to using an acrylic adhesive (ROBOND TM The metal thin film substrate of Comparative Example 1 was prepared in the same manner as in Example 1 except that L-98D Water-Borne Adhesive, DOW) was used.

[0124] (5) Comparative Example 2

[0125] A metal thin film substrate of Comparative Example 2 was prepared in the same manner as in Example 1 except that an epoxy adhesive (SCOTCH-WELD DP-410 EPOXYADHESIVE, 3M) was used instead of the silicone adhesive described in Example 1.

[0126] Experimental example

[0127] (1) Evaluation of adhesion to glass substrate

[0128] For the metal thin film substrates of the examples and comparative examples, the adhesion between the adhesive layer and the glass substrate was evaluated according to the measurement standard ISO 2409: Standard Test Methods for Measuring Adhesion by Tape Test.

[0129] <Evaluation Criteria>

[0130] ○: Adhesion force 5B or above

[0131] △: Adhesion force is above 3B and less than 5B

[0132] Ⅹ: Adhesion force is less than 3B

[0133] (2-1) Evaluation of chemical resistance to etching solution (1)

[0134] The substrate was immersed in an etching solution tank containing a mixture of nitric acid, phosphoric acid, and acetic acid at 40° C. for 15 minutes, and changes in the adhesive layer before and after the immersion were observed.

[0135] <Evaluation Criteria>

[0136] ○: No physical or chemical damage to the adhesive layer or white turbidity

[0137] △: No physical or chemical damage to the adhesive layer, but white turbidity occurs

[0138] Ⅹ: Physical and chemical damage to the adhesive layer occurs

[0139] (2-2) Evaluation of chemical resistance to etching solution (2)

[0140] The substrate was immersed in a 40° C. etching solution tank containing a cupric chloride etching solution for 15 minutes, and the changes in the adhesive layer before and after the immersion were observed.

[0141] <Evaluation Criteria>

[0142] ○: No physical or chemical damage to the adhesive layer or white turbidity

[0143] △: No physical or chemical damage to the adhesive layer, but white turbidity occurs

[0144] Ⅹ: Physical and chemical damage to the adhesive layer occurs

[0145] (3) Heat resistance evaluation

[0146] The metal thin film substrates of the examples and comparative examples were placed in an oven at 200° C. for 30 minutes, and the presence or absence of warping between the glass substrate and the adhesive layer was observed before and after the placement.

[0147] <Evaluation Criteria>

[0148] ○: No warping with respect to the glass substrate

[0149] Ⅹ: Warping phenomenon occurs relative to the glass substrate

[0150] (4) Reliability evaluation

[0151] The metal thin film substrates of the embodiment and the comparative example were placed in a chamber at 85° C. and 85% RH for 500 hours, and then observed for any color change and warping.

[0152] <Evaluation Criteria for Color Change>

[0153] ○: No color change

[0154] Ⅹ: Yellowing occurs

[0155] <Adhesion Evaluation Criteria>

[0156] ○: No warping with respect to the glass substrate

[0157] Ⅹ: Warping phenomenon occurs relative to the glass substrate

[0158] (5) Wear resistance evaluation

[0159] The metal film substrates of the embodiments and comparative examples were evaluated using an abrasion tester (SHIMADZU; AGS-X). Specifically, after the metal film substrates of the embodiments and comparative examples were fixed on a stage, a rubber stick (Rubber Stick) + 750g was used to repeat 50mm on the left and right to confirm the time point when the adhesive was pushed. The faster the push occurs, the weaker the durability. Specifically, the evaluation was performed according to the following criteria, and the results are shown in Table 1.

[0160] <Abrasion resistance evaluation criteria>

[0161] ○: No wear even after 3,000 reciprocating cycles

[0162] △: Wear occurs after 140 reciprocating cycles

[0163] Ⅹ: Wear occurs after 410 reciprocating cycles

[0164] (6) Curl characteristics evaluation

[0165] For the metal film substrate of the embodiment and the comparative example, after laminating with 1,250mm*1, 100mm size, 1.1T / 1.8T thickness soda glass, it was heated at 90°C for 5 minutes, placed on a stone scribing platform and measured with a gap gauge and an iron ruler to confirm whether curling corresponding to the bending radius occurred. The confirmation was carried out according to the following criteria and is shown in Table 1.

[0166] ○: No curling occurs when the bending radius is 0 mm

[0167] △: Curling occurs when the bending radius is 1.0 mm or more

[0168] Ⅹ: Curling occurs when the bending radius is 1.5 mm or more

[0169]

Table 1

[0170]

[0171]

[0172] Referring to Table 1, it can be seen that the metal film substrates of Examples 1 to 3 including the silicon-based adhesive not only have excellent adhesion to the glass substrate, but also have excellent chemical resistance to etching liquid, heat resistance, and reliability in high temperature and high humidity environments. In addition, it was confirmed that curling would not occur when applied to large-area glass. In particular, in the case of Examples 1 and 3 in which the silicon-based adhesive was diluted for use, the wear resistance evaluation results were very excellent. If the adhesive is easily worn, the adhesive layer exposed after metal etching is easily damaged even by a small thrust or impact, but the metal film substrate of the utility model does not show wear even when reciprocated more than 3,000 times, showing very excellent wear resistance.

[0173] On the contrary, it can be seen that the metal thin film substrate of Comparative Example 1 including the acrylic adhesive has poor adhesion to the glass substrate and poor heat resistance compared to the examples. Furthermore, it can be seen that yellowing and warping from the glass substrate occur in a high temperature and high humidity environment, and thus poor reliability in a high temperature and high humidity environment, and curling occurs when applied to large-area glass.

[0174] Furthermore, it can be seen that the metal thin film substrate of Comparative Example 2 including the epoxy adhesive undergoes yellowing in a high temperature and high humidity environment and warping from the glass substrate, and thus has poor reliability in a high temperature and high humidity environment.

[0175] In view of this, it can be seen that the metal film including the silicon-based adhesive and the metal film substrate manufactured using the same are particularly suitable for use in technical fields such as transparent displays that are mainly used outdoors and require excellent heat resistance and reliability in high-temperature and high-humidity environments. In addition, when applied to large-area glass, no curling occurs, so it has the advantage of being able to be applied to transparent displays.

Claims

1. A metal thin film substrate, characterized in that: include: Glass substrate; an adhesive layer formed on one surface of the glass substrate; as well as a metal layer formed on one side of the adhesive layer, and The adhesive layer includes a silicon-based adhesive.

2. The metal thin film substrate according to claim 1, characterized in that: The metal layer has a thickness of 3 μm to 120 μm.

3. The metal thin film substrate according to claim 1, characterized in that: The metal layer includes at least one selected from the group consisting of copper, aluminum, nickel, chromium, silver, iron, gold, cobalt, titanium, and tungsten.

4. The metal thin film substrate according to claim 1, characterized in that: The adhesive layer has a thickness of 5 μm to 50 μm.

5. The metal thin film substrate according to claim 1, characterized in that: No separate components are included between the metal layer and the adhesive layer.

6. The metal thin film substrate according to claim 1, characterized in that: The metal thin film substrate is used for a transparent display.

7. A transparent display, characterized in that: include: The metal thin film substrate according to any one of claims 1 to 6; as well as Light Emitting Diode.

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