Glue removing equipment for semiconductor processing

Abstract

The utility model relates to a degumming device for semiconductor processing. Comprising a base, a supporting table used for supporting a semiconductor, a positioning device used for positioning the semiconductor, a supporting column arranged on the base and a cleaning device used for cleaning glue on the surface of the semiconductor. The supporting table is arranged on the base; a plurality of groups of sliding grooves which are arranged in a circumferential array are formed in the supporting table; a positioning device is arranged on each group of sliding chutes; the cleaning device is arranged on the supporting column. The technical problems that in the prior art, due to the fact that a glue removing device is simple in structure and can only fix a semiconductor of a single size, the glue removing device is limited in the using process, and then the semiconductor cleaning efficiency is affected are solved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a glue removal device for semiconductor processing. Background Art

[0002] Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor. Whether from the perspective of science and technology or economic development, the importance of semiconductors is very huge. Nowadays, most electronic products are closely related to semiconductors. At the same time, during the production process of semiconductors, the glue on the surface of semiconductors needs to be removed.

[0003] When using existing silicon-based semiconductor degumming devices, some of the degumming devices need to remove the glue on the semiconductor by water or heating. However, the degumming devices in the existing technical solutions can only fix semiconductors of a single size due to their relatively simple structure. This causes the degumming devices to be limited in use, which in turn affects the cleaning efficiency of the semiconductor. Utility Model Content

[0004] The embodiment of the present application provides a degumming device for semiconductor processing, which solves the technical problem that the degumming device in the prior art solution can only fix semiconductors of a single size due to its relatively simple structure, which leads to limitations in use of the degumming device, thereby affecting the semiconductor cleaning efficiency.

[0005] The technical solution adopted in the embodiment of the present application is as follows:

[0006] A glue removal device for semiconductor processing includes a base, a support table for supporting the semiconductor, a positioning device for positioning the semiconductor, a pillar arranged on the base, and a cleaning device for cleaning the glue on the surface of the semiconductor; the support table is arranged on the base; a plurality of groups of slide grooves arranged in a circular array are provided on the support table; each group of the slide grooves is provided with the positioning device; the cleaning device is arranged on the pillar.

[0007] A further technical solution is: the positioning device includes a bending plate, an arc-shaped baffle plate for abutting against the semiconductor, a slider sliding on the slide groove, a threaded rod for pushing the slider to slide, a spring arranged around the threaded rod and a fixing part for fixing the bending plate; the fixing part is connected to the bending plate and the support platform; the arc-shaped baffle plate is arranged on the slider; the threaded rod is threadedly connected to the bending plate, and one end of the threaded rod abuts against the slider; one end of the spring is connected to the bending plate; and the other end of the spring is connected to the slider.

[0008] A further technical solution is: the cleaning device includes a water injection pipe, a water tank arranged on the support, and a nozzle for spraying water; the water injection pipe is arranged on the top of the water tank; a plurality of groups of nozzles arranged in a rectangular array are arranged at the bottom of the water tank; the water outlet of each group of nozzles faces the support platform.

[0009] A further technical solution is: the positioning device also includes a rubber pad; the rubber pad is arranged on the arc-shaped baffle.

[0010] A further technical solution is: the positioning device also includes a bending handle; the bending handle is arranged at the other end of the threaded rod.

[0011] A further technical solution is: the fixing member is a bolt.

[0012] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0013] 1. Due to the use of the arrangement of a base, a support table, a slide groove, a positioning device, a pillar and a cleaning device, when it is necessary to clean the glue on the surface of the semiconductor, the staff must first place the semiconductor on the support table, and then adjust the three groups of positioning devices in sequence so that the three groups of positioning devices move toward the semiconductor along the corresponding slide grooves respectively. When the three groups of positioning devices are against the semiconductor at the same time, the semiconductor placed on the support table can be fixed at this time, and then water is sprayed toward the surface of the semiconductor through the cleaning device. At this time, the glue attached to the surface of the semiconductor can be cleaned, and then the semiconductor is removed and turned over, and the above operation is repeated to fix it again. At this time, the glue on the other side of the semiconductor can be cleaned by spraying water toward the surface of the semiconductor through the cleaning device. The whole operation process is simple and reliable, and is convenient for the staff to operate. At the same time, the spacing between the three groups of positioning devices can be adjusted according to themselves, so that semiconductors of different sizes can be fixed between the three groups of positioning devices, thereby greatly improving the practicality of the glue removal device to a certain extent.

[0014] 2. Due to the use of the bending plate, arc-shaped baffle, slider, threaded rod, spring and fixing, the threaded rod is threadedly connected to the bending plate, and one end of the threaded rod is against the slider. When the staff rotates the threaded rod, the threaded rod pushes the slider to slide along the slide groove. At this time, the slider will stretch the spring. At this time, the spring in the stretched state will exert a certain pulling force on the slider, so that the slider will always be against the end of the threaded rod during the sliding process. When the semiconductor is placed on the support table, the staff can drive the arc-shaped baffle to move when pushing the slider to slide by rotating the threaded rod. The semiconductor can be fixed by the three groups of arc-shaped baffles simultaneously against the semiconductor. Since the spacing between the three groups of arc-shaped baffles can be automatically adjusted by rotating the threaded rod, semiconductors of different sizes can be fixed between the three groups of arc-shaped baffles.

[0015] 3. Due to the use of the water injection pipe, water storage tank and nozzle, water can be injected into the water storage tank through the water injection pipe, and then the nozzle works to spray the water in the water storage tank. The glue attached to the semiconductor surface can be cleaned by spraying water toward the semiconductor through the nozzle.

[0016] 4. Due to the setting of the rubber pad, when the arc-shaped baffle is against the semiconductor, the rubber pad on the arc-shaped baffle will contact the semiconductor, thus playing a certain protective role for the semiconductor.

[0017] 5. Due to the setting of the bending handle, the threaded rod can be driven to rotate by turning the bending handle, which makes it more convenient for the staff to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of a debonding device for semiconductor processing in an embodiment of the utility model.

[0019] Figure 2 It is a partial structural schematic diagram for embodying the positioning device in the embodiment of the utility model.

[0020] Figure 3 It is a partial structural schematic diagram for embodying the cleaning device in the embodiment of the utility model.

[0021] In the figure: 1. base; 2. support platform; 21. slide; 3. positioning device; 31. bending plate; 32. arc baffle; 33. slider; 34. threaded rod; 35. spring; 36. fixing part; 37. rubber pad; 38. bending handle; 4. support; 5. cleaning device; 51. water injection pipe; 52. water storage tank; 53. nozzle. DETAILED DESCRIPTION

[0022] The embodiment of the present application provides a degumming device for semiconductor processing, which solves the technical problem that the degumming device in the prior art solution can only fix semiconductors of a single size due to its relatively simple structure, which leads to limitations in use of the degumming device, thereby affecting the semiconductor cleaning efficiency.

[0023] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0024] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0025] A semiconductor processing debonding device, such as Figure 1 As shown, it includes a base 1, a support table 2 for supporting a semiconductor, a positioning device 3 for positioning the semiconductor, a pillar 4 arranged on the base 1, and a cleaning device 5 for cleaning the semiconductor surface glue. The support table 2 is arranged on the base 1. A plurality of groups of slide grooves 21 arranged in a circular array are provided on the support table 2. The positioning device 3 is provided on each group of slide grooves 21. The cleaning device 5 is arranged on the pillar 4.

[0026] The support platform 2 is fixedly connected to the top of the base 1. The top of the base 1 is fixedly connected with four groups of pillars 4 arranged in a circumferential array around the support platform 2. The cleaning device 5 is fixedly connected to the top of the four groups of pillars 4. A positioning device 3 is installed on each group of chutes 21.

[0027] Due to the arrangement of the base 1, the support platform 2, the slide groove 21, the positioning device 3, the pillar 4 and the cleaning device 5, when it is necessary to clean the glue on the surface of the semiconductor, the staff first needs to place the semiconductor on the support platform 2, and then adjust the three groups of positioning devices 3 in sequence so that the three groups of positioning devices 3 move toward the semiconductor along the corresponding slide grooves 21 respectively. When the three groups of positioning devices 3 are against the semiconductor at the same time, the semiconductor placed on the support platform 2 can be fixed at this time, and then water is sprayed toward the surface of the semiconductor through the cleaning device 5. At this time, the glue attached to the surface of the semiconductor can be cleaned, and then the semiconductor is removed and turned over, and the above operation is repeated to fix it again. At this time, the glue on the other side of the semiconductor can be cleaned by spraying water toward the surface of the semiconductor through the cleaning device 5. The whole operation process is simple and reliable, and is convenient for the staff to operate. At the same time, the spacing between the three groups of positioning devices 3 can be adjusted according to themselves, so that semiconductors of different sizes and sizes can be fixed between the three groups of positioning devices 3, thereby greatly improving the practicality of the glue removal device to a certain extent.

[0028] like Figure 2As shown, the positioning device 3 includes a bending plate 31, an arc-shaped baffle plate 32 for abutting against the semiconductor, a slider 33 sliding on the slide groove 21, a threaded rod 34 for pushing the slider 33 to slide, a spring 35 arranged around the threaded rod 34, and a fixing member 36 for fixing the bending plate 31. The fixing member 36 is connected to the bending plate 31 and the support table 2. The arc-shaped baffle plate 32 is arranged on the slider 33. The threaded rod 34 is threadedly connected to the bending plate 31, and one end of the threaded rod 34 abuts against the slider 33. One end of the spring 35 is connected to the bending plate 31. The other end of the spring 35 is connected to the slider 33.

[0029] The fixing member 36 is a bolt. The fixing member 36 passes through the bending plate 31 and is threadedly connected to the support platform 2. The arc baffle 32 is fixedly connected to the slider 33. One end of the spring 35 is fixedly connected to the bending plate 31. The other end of the spring 35 is fixedly connected to the slider 33.

[0030] Due to the arrangement of the bending plate 31, the arc-shaped baffle plate 32, the slider 33, the threaded rod 34, the spring 35 and the fixing member 36, the threaded rod 34 is threadedly connected to the bending plate 31, and one end of the threaded rod 34 abuts against the slider 33. When the staff rotates the threaded rod 34, the threaded rod 34 pushes the slider 33 to slide along the slide groove 21. At this time, the slider 33 will stretch the spring 35. At this time, the spring 35 in the stretched state will exert a certain pulling force on the slider 33, so that the slider 33 will always abut against the end of the threaded rod 34 during the sliding process. When the semiconductor is placed on the support table 2, the staff can drive the arc-shaped baffle plate 32 to move when the slider 33 is pushed to slide by rotating the threaded rod 34. With three groups of arc-shaped baffle plates 32 abutting against the semiconductor at the same time, the semiconductor can be fixed at this time. Since the spacing between the three groups of arc-shaped baffles 32 can be automatically adjusted by rotating the threaded rod 34 , semiconductors of different sizes can be fixed between the three groups of arc-shaped baffles 32 .

[0031] like Figure 3 As shown, the cleaning device 5 includes a water injection pipe 51, a water storage tank 52 disposed on the support 4, and a nozzle 53 for spraying water. The water injection pipe 51 is disposed on the top of the water storage tank 52. A plurality of groups of nozzles 53 arranged in a rectangular array are disposed at the bottom of the water storage tank 52. The water outlet of each group of nozzles 53 faces the support platform 2.

[0032] The water tank 52 is fixedly connected to the top of the four groups of pillars 4. The water injection pipe 51 is fixedly connected to the top of the water tank 52. The bottom of the water tank 52 is fixedly connected with a plurality of groups of nozzles 53 arranged in a rectangular array.

[0033] Due to the arrangement of the water injection pipe 51, the water storage tank 52 and the nozzle 53, water can be injected into the water storage tank 52 through the water injection pipe 51, and then the nozzle 53 works to spray out the water in the water storage tank 52. The glue attached to the surface of the semiconductor can be cleaned by spraying water toward the semiconductor through the nozzle 53.

[0034] like Figure 2 As shown, the positioning device 3 further includes a rubber pad 37 . The rubber pad 37 is arranged on the arc-shaped baffle plate 32 .

[0035] A plurality of groups of rubber pads 37 arranged in an arc-shaped array are fixedly connected to the arc-shaped baffle plate 32 .

[0036] Due to the provision of the rubber pad 37 , when the arc-shaped baffle 32 abuts against the semiconductor, the rubber pad 37 on the arc-shaped baffle 32 will contact the semiconductor, thus being able to provide a certain degree of protection for the semiconductor.

[0037] like Figure 2 As shown, the positioning device 3 also includes a bending handle 38. The bending handle 38 is arranged at the other end of the threaded rod 34.

[0038] The bending handle 38 is fixedly connected to the other end of the threaded rod 34 .

[0039] Since the bending handle 38 is provided, the threaded rod 34 can be driven to rotate by rotating the bending handle 38, thereby making it more convenient for the staff to operate.

[0040] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0041] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A semiconductor processing degumming device, characterized in that , comprising a base (1), a support platform (2) for supporting a semiconductor, a positioning device (3) for positioning the semiconductor, a pillar (4) arranged on the base (1), and a cleaning device (5) for cleaning glue on the surface of the semiconductor; the support platform (2) is arranged on the base (1); a plurality of groups of slide grooves (21) arranged in a circular array are provided on the support platform (2); the positioning device (3) is provided on each group of the slide grooves (21); the cleaning device (5) is arranged on the pillar (4); The positioning device (3) comprises a bending plate (31), an arc-shaped baffle plate (32) for abutting against the semiconductor, a slider (33) sliding on the slide groove (21), a threaded rod (34) for pushing the slider (33) to slide, a spring (35) arranged around the threaded rod (34), and a fixing member (36) for fixing the bending plate (31); the fixing member (36) is connected to the bending plate (31) and the support platform (2); the arc-shaped baffle plate (32) is arranged on the slider (33); the threaded rod (34) is threadedly connected to the bending plate (31), and one end of the threaded rod (34) abuts against the slider (33); one end of the spring (35) is connected to the bending plate (31); and the other end of the spring (35) is connected to the slider (33).

2. A semiconductor processing debonding device as claimed in claim 1, characterized in that: The cleaning device (5) comprises a water injection pipe (51), a water storage tank (52) arranged on the support (4), and a nozzle (53) for spraying water; the water injection pipe (51) is arranged at the top of the water storage tank (52); a plurality of groups of the nozzles (53) arranged in a rectangular array are arranged at the bottom of the water storage tank (52); the water outlet of each group of the nozzles (53) faces the support platform (2).

3. The semiconductor processing debonding equipment according to claim 1, characterized in that: The positioning device (3) further comprises a rubber pad (37); the rubber pad (37) is arranged on the arc-shaped baffle (32).

4. The semiconductor processing debonding equipment according to claim 1, characterized in that: The positioning device (3) further comprises a bending handle (38); the bending handle (38) is arranged at the other end of the threaded rod (34).

5. The semiconductor processing debonding equipment as claimed in claim 1, characterized in that: The fixing member (36) is a bolt.

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