Circuit board stamping die

By designing a circuit board stamping mold containing bidirectional threaded rods, elastic blocks, long boards and short boards, the problem of circuit boards being easily stuck and side walls being worn during stamping is solved, and the flat mold release and high-quality production of circuit boards are achieved.

CN222553772UActive Publication Date: 2025-03-04FENGSHUN COUNTY JINHONG MOLD MFG CO LTD
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Patent Information

Application Number
CN202420980050.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-08
Publication Date
2025-03-04
Estimated Expiration
2034-05-08

AI Technical Summary

Technical Problem

During use of existing circuit board stamping molds, the circuit board is prone to get stuck in the mold, causing side walls to wear, and easily scratch the side walls during the ejection process, and may even cause layered damage.

Method used

A circuit board stamping mold is designed, including an upper die, a lower die and a bracket. By setting up bidirectional threaded rods, elastic blocks, long plates and short plates, the coupling of gears and racks drives the cross bars and oblique blocks to move, push the vertical bars to approach, reduce friction between the circuit board and the side wall of the mold, and clean the impurities on the surface of the mold through airflow to ensure the flat mold release of the circuit board.

Benefits of technology

It effectively prevents friction damage on the side walls of the circuit board, reduces the friction of the circuit board, ensures that the circuit board is not easily damaged during the mold release process, and improves the overall quality of the circuit board.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a circuit board stamping die, which belongs to the technical field of circuit board processing and comprises an upper die, a lower die and a support, a telescopic rod is arranged on the support, the upper die is mounted at the output end of the telescopic rod, a mounting groove is arranged on the bottom wall of the upper die, two long plates are symmetrically and slidably mounted in the mounting groove, and two short plates are symmetrically and slidably mounted in the mounting groove. The short plate is perpendicular to the long plate, and a driving mechanism matched with the long plate and the short plate is arranged on the upper die. A two-way threaded rod is rotatably mounted in the mounting groove, two cross rods are mounted on the two-way threaded rod in a threaded mode, the cross rods are connected with the long plate, an inclined block is arranged at the end of each cross rod, a vertical rod is slidably mounted in the mounting groove, the vertical rod is connected with the short plate, and the inclined blocks are used for pushing the vertical rods to move; by arranging the bidirectional threaded rod, the elastic block, the long plate and the short plate, the long plate and the short plate can be separated in the upward moving process of the upper mold, so that the circuit board freely falls, the friction force received by the circuit board is reduced, and the side wall of the circuit board is prevented from being damaged by friction.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a circuit board stamping die. Background Art

[0002] Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. With the advancement of science and technology and the increase in various electrical appliances, the demand for circuit boards has gradually increased. In the processing and production of circuit boards, the circuit boards will be punched. Generally, the circuit boards are placed on the lower template, and the upper template moves up and down. The punching needle on the lower surface of the upper template penetrates the circuit board to achieve punching;

[0003] When using the existing circuit board stamping die, the circuit board will get stuck in the die, which will cause the side wall of the circuit board to wear during the ejection process;

[0004] The existing patent (publication number: CN209987062U) discloses a stamping die structure for printed circuit boards, in which the punching needle structure in the stamping die structure is replaced from a traditional wavy structure to a structure with a trapezoidal notch, thereby solving the problem of oil loss caused by the friction between the punching needle and the edge of the board during the stamping process. At the same time, a groove is set on the lower template to avoid the problem of whitening and bursting of the edge of the board caused by the gap between the plate of the printed circuit board and the lower template.

[0005] In response to the above problems, the existing patent reduces the probability of edge bursting by increasing the contact area and improving the supporting effect. However, when the circuit board is separated from the entire large board due to being squeezed by the mold, it is difficult to ensure that all edges of the circuit board are separated from the large board at the same time, so that the first edge to be separated is prone to tilt upward. Therefore, after the stamping process is completed, the circuit board stuck in the mold is not in a horizontal state. Usually, a ejector pin is used to separate the circuit board from the mold. During the ejection process, the side wall of the circuit board and the side wall of the mold rub against each other, which is not only easy to scratch the side wall, but also for a multi-layer circuit board, when the side wall is rubbed, delamination may occur, so that the circuit board is damaged.

[0006] Therefore, a circuit board stamping die is proposed. Utility Model Content

[0007] The utility model aims to provide a circuit board stamping die, which can solve the problem of easily scratching the side wall of the circuit board.

[0008] To achieve the above purpose, the utility model provides the following technical solutions: a circuit board stamping die, comprising an upper die, a lower die and a bracket, the bracket is provided with a telescopic rod, the upper die is installed at the output end of the telescopic rod, a mounting groove is provided on the bottom wall of the upper die, two long plates are symmetrically slidably installed in the mounting groove, two short plates are symmetrically slidably installed in the mounting groove, the short plates are perpendicular to the long plates, and a driving mechanism cooperating with the long plates and the short plates is provided on the upper die;

[0009] A bidirectional threaded rod is rotatably installed in the installation groove, two cross bars are threadedly installed on the bidirectional threaded rod, the cross bars are connected to the long board, and an inclined block is provided at the end of each cross bar. A vertical rod is slidably installed in the installation groove, the vertical rod is connected to the short board, and the inclined block is used to push the vertical rod to move, and an elastic block is installed between the vertical rod and the side wall of the installation groove;

[0010] A gear is arranged on the fixed sleeve of the bidirectional threaded rod, a rack meshing with the gear is arranged on the bracket, an elastic member is arranged between the rack and the bracket, and a cleaning mechanism cooperating with the long plate and the short plate is arranged on the bracket.

[0011] Preferably, the elastic member is made of rubber, and the cleaning mechanism includes a first cavity opened on the elastic member, a conduit extending into the mounting groove is inserted on the side wall of the first cavity, and air holes cooperating with the long plate and the short plate are opened on the side wall of the conduit.

[0012] Preferably, a blocking rod cooperating with the gear is fixedly mounted on the bottom wall of the rack.

[0013] When the telescopic rod is in a contracted state, the elastic member is in a freely extended state; during the working process, the telescopic rod extends and drives the upper mold to move downward. During the downward movement of the upper mold, under the joint action of the elastic member, the gear and the rack, the rack is in a stationary state, and the gear drives the bidirectional threaded rod to rotate, so that the cross bar can move along the bidirectional threaded rod. During the movement of the cross bar, the inclined block is driven to move, and the inclined surface of the inclined block applies a thrust to the vertical rod, so that the two vertical rods can be pushed closer to each other. In this process, the elastic block is stretched;

[0014] When the long board and the short board are tightly fitted, the space between the long board and the short board is the mold cavity. At this time, the gear is located at the bottom end of the rack and contacts the baffle rod. Then the telescopic rod continues to move downward and applies downward pressure to the baffle rod through the gear, so that the rack can move downward and squeeze the elastic member. At this time, the first cavity on the elastic member is squeezed, and the gas in the first cavity is discharged outward through the conduit and the air hole and impacts the surface of the long board and the short board, so that the impurities on the surface of the baffle and the short board can be washed away. Therefore, the friction between the circuit board and the side walls of the long board and the short board can be reduced during the stamping process, which plays a role in protecting the circuit board.

[0015] After the stamping is completed, the telescopic rod contracts. During this process, the reciprocating screw is reversed. At this time, the horizontal rods move away from each other, and the elastic blocks pull the vertical rods away from each other, so that the circuit board stuck in the mold cavity can fall naturally. Compared with using other methods to eject the circuit board from the mold cavity, it prevents the side wall of the circuit board from being damaged due to friction.

[0016] Preferably, a second cavity is provided on the short plate, a third cavity is provided on the elastic block, a through hole is provided on the short plate, both ends of which are connected to the second cavity and the third cavity respectively, an elastic rope is fixedly installed in the through hole, and an impact block is installed on the elastic rope.

[0017] Preferably, small holes matching with the long plate are evenly formed on the side wall of the second cavity.

[0018] When the elastic block is squeezed, the gas in the third cavity flows into the second cavity. At this time, the airflow passes through the through hole, and the airflow passing through the through hole impacts the impact block. Under the action of the elastic rope, the impact block impacts the side wall of the second cavity, thereby shaking off impurities on the surface of the short board, and the gas in the second cavity is discharged through the small hole. The gas discharged from the small hole impacts the side wall of the long board, thereby assisting the impact block to clean up impurities on the surface of the long board and the side wall of the short board, thereby ensuring that the long board can fit tightly with the baffle, thereby ensuring that the long board and the short board can fit tightly with the circuit board.

[0019] Preferably, the side wall of the inclined block is a mirror surface.

[0020] Since the surface of the mirror is smooth, the friction force received by the vertical rod is reduced under the action of the mirror, which ensures that the vertical rod can move normally.

[0021] Compared with the prior art, the beneficial effects of the utility model are:

[0022] 1. The present application sets up a bidirectional threaded rod, an elastic block, a long plate, and a short plate, so that the long plate and the short plate can be separated during the upward movement of the upper mold, so that the circuit board can fall freely, reducing the friction force received by the circuit board, thereby preventing the side wall of the circuit board from being damaged by friction;

[0023] 2. The present application can clean the surface of the long board and the short board by providing elastic parts and conduits, thereby ensuring that the long board and the short board can fit closely together. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is the first three-dimensional structural view of the utility model;

[0026] Figure 2 This is a second three-dimensional structural view of the utility model;

[0027] Figure 3 For this utility model Figure 2 The enlarged view of point A in the middle;

[0028] Figure 4 This is a bottom view of the upper die of the utility model;

[0029] Figure 5 It is a cross-sectional view of the elastic member of the utility model;

[0030] Figure 6 It is a cross-sectional view of the short plate of the utility model.

[0031] Description of reference numerals:

[0032] 1. Upper mold; 2. Lower mold; 3. Bracket; 4. Telescopic rod; 5. Long board; 6. Short board; 7. Bidirectional threaded rod; 8. Cross bar; 9. Oblique block; 10. Vertical rod; 11. Elastic block; 12. Gear; 13. Rack; 14. Elastic member; 15. First cavity; 16. Conduit; 17. Stop rod; 18. Second cavity; 19. Third cavity; 20. Through hole; 21. Elastic rope; 22. Impact block; 23. Small hole. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] See also Figures 1 to 6 , the utility model provides a technical solution:

[0035] A circuit board stamping die comprises an upper die 1, a lower die 2 and a bracket 3, a telescopic rod 4 is arranged on the bracket 3, the upper die 1 is mounted on the output end of the telescopic rod 4, a mounting groove is provided on the bottom wall of the upper die 1, two long plates 5 are symmetrically slidably mounted in the mounting groove, two short plates 6 are symmetrically slidably mounted in the mounting groove, the short plates 6 are perpendicular to the long plates 5, and a driving mechanism cooperating with the long plates 5 and the short plates 6 is provided on the upper die 1;

[0036] A bidirectional threaded rod 7 is rotatably installed in the installation groove, and two cross bars 8 are threadedly installed on the bidirectional threaded rod 7. The cross bars 8 are connected to the long board 5. An inclined block 9 is provided at the end of each cross bar 8. The side wall of the inclined block 9 is a mirror surface. Since the surface of the mirror surface is smooth, the friction force received by the vertical rod 10 is reduced under the action of the mirror surface, which plays a role in ensuring that the vertical rod 10 can move normally. A vertical rod 10 is slidably installed in the installation groove, and the vertical rod 10 is connected to the short board 6. The inclined block 9 is used to push the vertical rod 10 to move, and an elastic block 11 is installed between the vertical rod 10 and the side wall of the installation groove;

[0037] A gear 12 is fixedly sleeved on the bidirectional threaded rod 7, a rack 13 meshing with the gear 12 is provided on the bracket 3, an elastic member 14 is provided between the rack 13 and the bracket 3, and a cleaning mechanism cooperating with the long plate 5 and the short plate 6 is provided on the bracket 3.

[0038] The elastic member 14 is made of rubber, and the cleaning mechanism includes a first cavity 15 opened on the elastic member 14 . A conduit 16 extending into the mounting groove is inserted on the side wall of the first cavity 15 . An air hole cooperating with the long plate 5 and the short plate 6 is opened on the side wall of the conduit 16 .

[0039] A stop rod 17 cooperating with the gear 12 is fixedly mounted on the bottom wall of the rack 13 .

[0040] When the telescopic rod 4 is in a contracted state, the elastic member 14 is in a freely extended state; during the working process, the telescopic rod 4 extends and drives the upper mold 1 to move downward. During the downward movement of the upper mold 1, under the joint action of the elastic member 14, the gear 12, and the rack 13, the rack 13 is in a stationary state, and the gear 12 drives the bidirectional threaded rod 7 to rotate, so that the cross bar 8 can move along the bidirectional threaded rod 7. During the movement of the cross bar 8, the inclined block 9 is driven to move, and the inclined surface of the inclined block 9 applies a thrust to the vertical rod 10, so that the two vertical rods 10 can be pushed closer to each other. In this process, the elastic block 11 is stretched;

[0041] When the long board 5 and the short board 6 are tightly fitted, the space between the long board 5 and the short board 6 is the mold cavity. At this time, the gear 12 is located at the bottom end of the rack 13 and contacts the baffle 17. Then the telescopic rod 4 continues to move downward and applies downward pressure to the baffle 17 through the gear 12, so that the rack 13 can move downward and squeeze the elastic member 14. At this time, the first cavity 15 on the elastic member 14 is squeezed, and the gas in the first cavity 15 is discharged outward through the conduit 16 and the air hole and impacts the surface of the long board 5 and the short board 6, so that the impurities on the surface of the baffle and the short board 6 can be washed away. Therefore, the friction between the circuit board and the side walls of the long board 5 and the short board 6 can be reduced during the stamping process, which plays a role in protecting the circuit board.

[0042] After the stamping is completed, the telescopic rod 4 contracts. During this process, the reciprocating screw is reversed. At this time, the cross bars 8 move away from each other, and the elastic block 11 pulls the vertical bars 10 away from each other, so that the circuit board stuck in the mold cavity can fall naturally. Compared with using other methods to eject the circuit board from the mold cavity, it plays a role in preventing the side wall of the circuit board from being damaged due to friction.

[0043] like Figure 6 As shown, a second cavity 18 is provided on the short plate 6, a third cavity 19 is provided on the elastic block 11, and a through hole 20 is provided on the short plate 6, the two ends of which are connected to the second cavity 18 and the third cavity 19 respectively. An elastic rope 21 is fixedly installed in the through hole 20, and an impact block 22 is installed on the elastic rope 21.

[0044] Small holes 23 cooperating with the long plate 5 are evenly formed on the side wall of the second cavity 18 .

[0045] When the elastic block 11 is squeezed, the gas in the third cavity 19 flows into the second cavity 18. At this time, the airflow passes through the through hole 20, and the airflow passing through the through hole 20 impacts the impact block 22. Under the action of the elastic rope 21, the impact block 22 impacts the side wall of the second cavity 18, so that the impurities on the surface of the short plate 6 can be shaken off, and the gas in the second cavity 18 is discharged through the small hole 23. The gas discharged from the small hole 23 impacts the side wall of the long plate 5, so as to assist the impact block 22 to clean up the impurities on the surface of the long plate 5 and the side wall of the short plate 6, thereby ensuring that the long plate 5 can fit tightly with the baffle, thereby ensuring that the long plate 5 and the short plate 6 can fit tightly with the circuit board.

[0046] Working principle: when the telescopic rod 4 is in a contracted state, the elastic member 14 is in a freely extended state; during the working process, the telescopic rod 4 extends and drives the upper mold 1 to move downward. During the downward movement of the upper mold 1, under the joint action of the elastic member 14, the gear 12, and the rack 13, the rack 13 is in a stationary state, and the gear 12 drives the bidirectional threaded rod 7 to rotate, so that the cross bar 8 can move along the bidirectional threaded rod 7. During the movement of the cross bar 8, the inclined block 9 is driven to move. The inclined surface of the inclined block 9 applies a thrust to the vertical rod 10, so that the two vertical rods 10 can be pushed closer to each other. In this process, the elastic block 11 is stretched;

[0047] When the long board 5 and the short board 6 are tightly fitted, the space between the long board 5 and the short board 6 is the mold cavity. At this time, the gear 12 is located at the bottom end of the rack 13 and contacts the baffle 17. Then the telescopic rod 4 continues to move downward and applies downward pressure to the baffle 17 through the gear 12, so that the rack 13 can move downward and squeeze the elastic member 14. At this time, the first cavity 15 on the elastic member 14 is squeezed, and the gas in the first cavity 15 is discharged outward through the conduit 16 and the air hole and impacts the surface of the long board 5 and the short board 6, so that the impurities on the surface of the baffle and the short board 6 can be washed away. Therefore, the friction between the circuit board and the side walls of the long board 5 and the short board 6 can be reduced during the stamping process, which plays a role in protecting the circuit board.

[0048] After the stamping is completed, the telescopic rod 4 contracts. During this process, the reciprocating screw is reversed. At this time, the cross bars 8 move away from each other, and the elastic block 11 pulls the vertical bars 10 away from each other, so that the circuit board stuck in the mold cavity can fall naturally. When the elastic block 11 is squeezed, the gas in the third cavity 19 flows into the second cavity 18. At this time, the airflow passes through the through hole 20, and the airflow passing through the through hole 20 impacts the impact block 22. Under the action of the elastic rope 21, the impact block 22 impacts the side wall of the second cavity 18, so that impurities on the surface of the short plate 6 can be shaken off, and the gas in the second cavity 18 is discharged through the small hole 23. The gas discharged from the small hole 23 impacts the side wall of the long plate 5, so that the impact block 22 can assist in cleaning up the impurities on the surface of the long plate 5 and the side wall of the short plate 6, thereby ensuring that the long plate 5 can fit tightly with the baffle.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A circuit board stamping die, comprising an upper die (1), a lower die (2) and a bracket (3), wherein a telescopic rod (4) is provided on the bracket (3), and the upper die (1) is mounted on the output end of the telescopic rod (4), characterized in that: The bottom wall of the upper mold (1) is provided with an installation groove, in which two long plates (5) are symmetrically slidably installed, and in which two short plates (6) are symmetrically slidably installed, and the short plates (6) are perpendicular to the long plates (5). The upper mold (1) is provided with a driving mechanism that cooperates with the long plates (5) and the short plates (6); A bidirectional threaded rod (7) is rotatably installed in the installation groove, two cross rods (8) are threadedly installed on the bidirectional threaded rod (7), the cross rod (8) is connected to the long plate (5), and an inclined block (9) is provided at the end of each cross rod (8). A vertical rod (10) is slidably installed in the installation groove, the vertical rod (10) is connected to the short plate (6), and the inclined block (9) is used to push the vertical rod (10) to move. An elastic block (11) is installed between the vertical rod (10) and the side wall of the installation groove; A gear (12) is fixedly sleeved on the bidirectional threaded rod (7), a rack (13) meshing with the gear (12) is provided on the bracket (3), an elastic member (14) is provided between the rack (13) and the bracket (3), and a cleaning mechanism cooperating with the long plate (5) and the short plate (6) is provided on the bracket (3).

2. The circuit board stamping die according to claim 1, characterized in that: The elastic member (14) is made of rubber. The cleaning mechanism comprises a first cavity (15) formed on the elastic member (14). A conduit (16) extending into the mounting groove is inserted on the side wall of the first cavity (15). An air hole cooperating with the long plate (5) and the short plate (6) is formed on the side wall of the conduit (16).

3. The circuit board stamping die according to claim 2, characterized in that: A blocking rod (17) matched with the gear (12) is fixedly mounted on the bottom wall of the rack (13).

4. The circuit board stamping die according to claim 3, characterized in that: The short plate (6) is provided with a second cavity (18), the elastic block (11) is provided with a third cavity (19), the short plate (6) is provided with a through hole (20) whose two ends are respectively connected with the second cavity (18) and the third cavity (19), an elastic rope (21) is fixedly installed in the through hole (20), and a collision block (22) is installed on the elastic rope (21).

5. The circuit board stamping die according to claim 4, characterized in that: Small holes (23) matching with the long plate (5) are evenly formed on the side wall of the second cavity (18).

6. The circuit board stamping die according to claim 1, characterized in that: The side wall of the inclined block (9) is a mirror surface.

Citation Information

Patent Citations

  • Stamping die structure for printed circuit board

    CN209987062U